BD4275FP2-C Datasheet PDF & Specifications

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BD4275FP2-C ROHM

Document overview

Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
PDF pages: 23

Technical content

1 VCC Supply Voltage Input

2 RO Reset Output; Open-Collector output. 3 GND Ground; Pin3 internally connected to FIN. 4 CT Reset Delay; connect capaci tor to GND for setting delay time.

5 VO 5 V Output;

FIN FIN FIN; FIN internally connected to Pin3.

29.Nov.2013 Rev.003 www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 BD4275FP2-C BD4275FPJ-C Datasheet TSZ02201-0T2T0AN00110-1-2 Block Descriptions Block Name Function Description of Blocks Reference Reference voltage The Reference generates the Reference Voltage. Error Amplifier Error amplifier The Error Amplifier amplifies the difference between the feed back voltage of the output voltage and the reference voltage. TSD Thermal shutdown protection The TSD protects the device from overheating. If the chip temperature (Tj) reaches ca. 175 °C (Typ), the output is turned off. OCP Over current protection The OCP protects the device from damage caused by over current. UVLO Under voltage lock out The UVLO prevents malfunction of the reset block in case of very low output voltage.

29.Nov.2013 Rev.003 www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 BD4275FP2-C BD4275FPJ-C Datasheet TSZ02201-0T2T0AN00110-1-2 Absolute Maximum Ratings Parameter Symbol Limits Unit VCC Voltage (1) VCC -0.3 to +45.0 V RO Voltage VRO -0.3 to +18.0 V VO Voltage VO -0.3 to +7.0 V Power Dissipation (TO263-5F) (2) Pd 1.9 W (TO252-J5F) (3) Pd 1.3 W Junction Temperature Range Tj -40 to +150 °C Storage Temperature Range Tstg -55 to +150 °C (1) Not to exceed Pd. Recommended Operating Ratings Parameter Symbol Min Max Unit Supply Voltage (IO ≤ 300mA) (1) VCC 5.5 45.0 V Supply Voltage (IO ≤ 500mA) (1) VCC 5.9 45.0 V Start -Up Voltage VCC 3.0 － V Output Current IO 0 500 mA Operating Ratings Temperature Ta -40 125 °C (1) Not to exceed Pd. Thermal Resistance Parameter Symbol Min Max Unit Junction to Ambient (1) θja 15.6 － °C / W Junction to Case (bottom) (1) θjc 1 － °C / W Junction to Ambient (2) θja 19.2 － °C / W Junction to Case (bottom) (2) θjc 1 － °C / W (1) TO263-5F mounted on 114.3 mm × 76.2 mm × 1.6 mmt Glass-Epoxy PCB based on JEDEC. (4-layer PCB: Copper foil on 2 inner layers and the reverse side of PCB:74.2 mm × 74.2 mm) (2) TO252-J5F mounted on 114.3 mm × 76.2 mm × 1.6 mmt Glass-Epoxy PCB based on JEDEC. (4-layer PCB: Copper foil on 2 inner layers and the reverse side of PCB:74.2 mm × 74.2 mm)

Electrical Characteristics

( Unless otherwise specified , Tj = -40 °C to +150 °C, VCC = 13.5 V ) Parameter Symbol Limits Unit Conditions Min Typ Max Circuit Current ICC － 65 150 μA I O = 0 mA Output Voltage 1 VO 4.90 5.00 5.10 V 5 mA ≤ IO ≤ 400 mA

6 V ≤ VCC ≤ 28 V

Output Voltage 2 VO 4.90 5.00 5.10 V 5 mA ≤ IO ≤ 200 mA

6 V ≤ VCC ≤ 40 V

Dropout Voltage ᇞVd － 0.25 0.5 V V CC = 4.75 V, IO = 300 mA Load Regulation Reg.L － 10 30 mV I O = 10 mA to 250 mA Line Regulation Reg.I -15 － 15 mV V CC = 8 V to 16 V, IO = 5 mA Current Limit IOCP 500 －－ mA － Ripple Rejection R.R. － 60 － dB f = 120 Hz, ein = 1 Vrms, IO = 100 mA Thermal Shut Down Temperature TTSD － 175 － °C Electrical Characteristics ( Reset Function) ( Unless otherwise specified , Tj = -40 °C to +150 °C, VCC = 13.5 V ) Parameter Symbol Limits Unit Conditions Min Typ Max Switching Threshold VRT 4.50 4.62 4.75 V － Switching Hysteresis VRHY 20 60 100 mV － Upper Delay Switching Threshold VCTH － 1.18 － V － Lower Delay Switching Threshold VCTL － 0.25 － V － Charge Current ICT － 8.8 － μA V CT = 0.5 V Delay time L→H tPOR 10 14 18 ms C CT = 0.1 μF (1) RO L Voltage VROL －－ 0.4 V RO pull-up resister ≥ 4.7 kΩ VO ≥1V (1) TPOR can be varied by changing the CT capacitance value. ( 0.001µF to 10 µF available ) T POR (ms) ≈ TPOR0 ( the reset delay time at CCT = 0.1 µF ) × CCT (μF) / 0.1 CT capacitor : 0.1µF ≤ CCT ≤ 10 μF example: When CCT= 1µF, 100ms ≤ TPOR ≤ 180 ms T example: When CCT= 0.01µF, 0.9ms ≤ TPOR ≤ 1.9 ms

29.Nov.2013 Rev.003 www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 BD4275FP2-C BD4275FPJ-C Datasheet TSZ02201-0T2T0AN00110-1-2 Thermal Design Refer to the heat mitigation characterist ics illustrated in Figure 21, 22 and the power dissipation under actual operating conditions should be taken into consider ation and a sufficient margin should be allowed for in the thermal design. The amount of heat generated depends on the voltage difference across the input and output, load current, and bias current. Therefore, when actually using the ch ip, ensure that the generated heat does not exceed the Pd rating. Even if the ambient temperature Ta is at 25 °C, it is possible that the junction temperature Tj reaches high temperatures. Keep the whole operating temperature range within Tj ≤ Tjmax. Should by any chance the power dissipation rating be exc eeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 114.3mm × 76.2mm × 1.6mmt glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. The following method is used to calculate the power consumption Pc (W) Pc = ( VCC - VO ) × IO ＋ V CC × ICC Power dissipation Pd ≥ Pc The load current IO is obtained by operating the IC within the power dissipation range. ( R e f e r t o F i g u r e 1 0 f o r t h e I CC.) Thus, the maximum load current IOmax for the applied voltage VCC can be calculated during the thermal design process. The following method is also used to calculate the junction temperature Tj. ■TO263-5F ・Calculation example : with TO263-5F package , Ta = 105 °C, V CC = 13.5 V, VO = 5.0 V, board ③ (Figure 21.) At Ta = 105 °C with Figure 21 ③ condition, the calculation shows that 211 mA of output current is possible at 8.5 V potential difference across input and output. ・Calculation example : with Tc (bottom) = 80 °C, V CC = 13.5 V, VO = 5.0 V, IO = 200 mA, board ③ (Figure 21.) Pc of the IC can be calculated as follows: Pc = ( VCC - VO ) × IO + VCC × ICC Pc = ( 13.5 V - 5.0 V ) × 200 mA + 13.5 V × ICC Pc = 1.7 W ( I CC = 80 µA ) In case the power consumption Pc is 1.7 W, the j unction temperature Tj can be calculated as follows: Tj = Pc × θjc + Tc Tj = 1.7 W × θjc + 80 °C Tj = 81.7 °C ( θjc (bottom) = 1 °C / W Refer to Page 4 Thermal Design) The junction temperature is 81.7 °C, at above condition. VCC : Input Voltage Ta : Ambient Temperature VO : Output Voltage Tc : Case Temperature IO : Load Current, Tj : Junction Temperature ICC : Circuit Current θjc : Thermal Resistance (Junction to Case (bottom)) Pc : Power Consumption IO ≤ Pd - VCC × ICC VCC - VO IO ≤ 1.8 W – 13.5 V × 80 µA

13.5 V – 5 V ( ICC = 80 µA )

Tj = Pc × θjc + Tc 211 mA IO ≤ Pd at over 25 °C is calculated by below. In case of board③ in Figure 21, Ta = 105 °C Pd = 1.8 W

© 2013 ROHM Co., Ltd. All rights reserved. using a capacitor with excellent voltage and temperature characteristics. verification of the final operating environment is needed. DC - biasing characteristics and high voltage tolerance. µF, ESR < 1 Ω) in paralleled to large capacitor (not low ESR).

1 VCC 2 RO

4 CT 5 VO

Figure 23. I / O equivalence circuits

29.Nov.2013 Rev.003 www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 BD4275FP2-C BD4275FPJ-C Datasheet TSZ02201-0T2T0AN00110-1-2 Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital bl ock from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces , the two ground traces should be routed separately but connected to a single ground at the refer ence point of the application board to av oid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground trac es of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceed ed the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give s pecial consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 9. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mount ing the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each ot her especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few.

29.Nov.2013 Rev.003 www.rohm.com © 2013 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 BD4275FP2-C BD4275FPJ-C Datasheet TSZ02201-0T2T0AN00110-1-2 Operational Notes – continued 10. Unused Input Pins Input pins of an IC are oft en connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction th rough the transistor and cause unexpected operation of the IC. So unless otherwise specif ied, unused input pins should be connected to the power supply or ground line. 11. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrat e layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical dam age. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. 12. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 13. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 14. Over Current Protection Circuit (OCP) This IC incorporates an integrated over current protection circuit that is acti vated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit.

Ordering Information

FP2: TO263-5F FPJ: TO252-J5F Packaging and forming specification E2: Embossed tape and reel Marking Diagram TO263-5F (TOP VIEW) BD4275FP2 Part Number Marking LOT Number 1Pin TO252-J5F (TOP VIEW) BD4275J Part Number Marking LOT Number 1Pin

Revision History

5.Apr.2013 001 New Release 25.Sep.2013 002 P5 The condition of RO L Voltage at Electrical Characteristics was changed. P10 The Timing Chart was corrected. P11 The statement of “Reference Data” of Package data of TO263-5F and TO252-J5F was deleted. P13 The information of “Output pin capacitor” was changed. P15 The information of “Operational Notes” was changed. P16 TO263-5F quantity written in “Tape and reel information” was corrected. P17 TO252-J5F physical dimension was corrected. 29.Nov.2013 003 P11 The package data of TO263-5F was corrected. P16 The information of “Operational Notes” was changed.

Notice - SS Rev.002 © 2014 ROHM Co., Ltd. All rights reserved. Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writ ing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅣ CLASS Ⅲ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products ar e exposed to sea wind or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subjec t to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temper ature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperat ure is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlori ne, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification

Notice - SS Rev.002 © 2014 ROHM Co., Ltd. All rights reserved. Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the Products and external components, including transient characteri stics, as well as static characteristics. 2. You agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for Products use. Theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding t he Products maximum rating will not be applied to Products. Please take special care under dry condit ion (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriora te if the Products are stored in the places where: [a] the Products are exposed to sea winds or corros ive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to di rect sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm sol derability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a hum idity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contain ed in this document is for reference only. ROHM does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.: 2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document. Other Precaution 1. This document may not be reprinted or reproduced, in whol e or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any wa y whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties.

Notice – WE Rev.001 © 2014 ROHM Co., Ltd. All rights reserved. General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for failure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information.

Selected Specification

Rohm BD4275FP2-C overview.

Overview

BD4275FP2-C is listed in the Power Management category. Available datasheets include documents from Rohm. DigiCamel provides a local PDF and searchable HTML technical text for online reference.

Summary

500 mA Output LDO Regulator with Voltage Detector

Description

500 mA Output LDO Regulator with Voltage Detector

Source title BD4275FP2-C Datasheet(PDF) - Rohm

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