BD00FA1WEFJ

BD00FA1WEFJ ROHM

Document overview

• Manufacturer or author: Provided By www.digicamel.com(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 19

Technical content

Features

/square6 Built-in high accuracy reference voltage circuit /square6 Built-in Over current protection circuit (OCP) /square6 Built-in Temperature protection circuit (TSD) /square6 Zero µA shutdown mode /square6 Soft start function Key Specifications /square6 Input power supply voltage range: Vo+3.0V to 25.0 V /square6 Output voltage: 3.0V to 12.0V /square6 Output current: 0.1A (Max) /square6 Shutdown current: 0 µA (Typ) /square6 Operating temperature range: -25° C to + 85° C Typical Application Circuit Package W(Typ) D(Typ) H(Max) HTSOP-J8 4.90mm x 6.00mm x 1.00mm

Ordering Information

B D 0 0 F A 1 W E F J - E 2 Part Number Output voltage 00:Variable Input Voltage F:30V Output Current A1:0.1A Shutdown Mode “W”:Included Package EFJ:HTSOP-J8 Packaging and forming specification E2:Emboss tape reel HTSOP-J8 VO VCC EN GND FIN R2 FB COUT CIN CIN , COUT : Ceramic Capacitor

TSZ02201-0GAG0A600010-1-2© 2014 ROHM Co., Ltd. All rights reserved.

1 V O Output pin

2 FB Feedback pin

3 GND GND pin

5 EN Enable pin

8 V CC Input pin

Figure 1. Block Diagram

TSZ02201-0GAG0A600010-1-2© 2014 ROHM Co., Ltd. All rights reserved. www.rohm.com TSZ22111･ 15･ 001 20.Jan.2015 Rev.002 Absolute Maximum Ratings (Ta=25° C) Parameter Symbol Limits Unit Power supply voltage V CC 30.0 * 1 V EN voltage V EN 30.0 V Power dissipation HTSOP-J8 Pd *2 2110 *2 mW Operating temperature range Topr -25 to + 85 ° C Storage temperature range Tstg -55 to + 150 ° C Maximum junction temperature Tjmax +150 ° C *1 Not to exceed Pd. *2 In case Ta ≧ 25° C (When mounted on a two-layer glass epoxy board with 70mm × 70mm × 1.6mm dimension) is reduced by 16.9mW/° C Recommended Operating Conditions (Ta=25° C) Parameter Symbol Min Max Unit Input power supply voltage V CC Vo+3.0 25.0 V EN voltage V EN 0.0 25.0 V Output voltage setting range V O 3.0 12.0 V Output current I O 0.0 0.1 A Recommended Operating Condition Parameter Symbol Min Typ Max Unit Conditions Output Capacitor C OUT 1.0 * 3 2.2 - µF Ceramic capacitor recommended *3 The minimum value of capacitor must met this specification over full operating conditions. (Ex: Temperature, DC bias) Electrical Characteristics (Unless otherwise specified, Vcc=10V, EN=3V, R1=52.5kΩ , R2=10kΩ , Ta=25° C) Parameter Symbol Min Typ Max Unit Conditions Circuit current at shutdown mode I SD - 0 5 µA V EN =0V, OFF mode Bias current I CC - 300 450 µA Line Regulation Reg.I -1 0.5 1 % V CC =( Vo+3V ) → 25.0V Load Regulation Reg I O -1.5 0.5 1.5 % I O=0 → 0.1A Minimum dropout voltage V CO - 2.0 3.0 V I O=0.1A Output reference voltage V FB 0.792 0.800 0.808 V I O=0A EN Low voltage V EN (Low) 0 - 0.8 V EN High voltage V EN (High) 2.4 - 25.0 V EN Bias current I EN 1 3 9 µA

TSZ02201-0GAG0A600010-1-2© 2014 ROHM Co., Ltd. All rights reserved. www.rohm.com TSZ22111･ 15･ 001 20.Jan.2015 Rev.002 Power Dissipation ◎ HTSOP-J8 When considering thermal design, operation should be maintained within the following conditions. (The temperature mentioned below is a guaranteed temperature, therefore, margins must be considered.) 1. Ambient temperature Ta is 85° C and below. 2. Junction temperature Tj is 150° C and below. The junction temperature Tj can be determined as follows: Calculation based on ambient temperature Ta Tj=Ta+ θ j-a× W <Reference Value> Most of the heat loss that occurs in BD00FA1WEFJ is g enerated from the output Pch FET. Power loss is deter mined by the product of voltage drop across Vcc-Vo and the output current. Check the conditions of output voltage an d output current to be used between Vcc-Vo and compare with the power dissipation characteristics. In addition, power dissipation may change significantly due to board conditions because BD00FA1WEFJ uses power package. It is important to consider the board size to be used before proceeding with the design. Power consumption [W] = { Input voltage (Vcc) – Outp ut voltage (Vo) } × Output current (Io: Ave) Power Dissipation :Pd [W] 0 25 50 75 100 125 150 2.0 3.0 4.0 ① 0.50W 1.0 ① 0.50W ② 0.82W ③ 1.10W ④ 2.11W ⑤ 3.76W Ambient Temperature : Ta [ ℃ ] Measurement condition: mounted on a ROHM board PCB size: 70mm × 70mm × 1.6mm (PCB with thermal via) ・ Solder the thermal pad to Ground ① IC only θ j-a=249.5 ℃ /W ② 1-layer （ copper foil : 0mm × 0mm ） θ j-a=153.2 ℃ /W ③ 2-layer （ copper foil : 15mm × 15mm ） θ j-a=113.6 ℃ /W ④ 2-layer （ copper foil : 70mm × 70mm ） θ j-a=59.2 ℃ /W ⑤ 4-layer （ copper foil : 70mm × 70mm ） θ j-a=33.3 ℃ /W 1-layer PCB (copper foil density 0mm × 0mm) 2-layer PCB (copper foil density 15mm × 15mm) 2-layer PCB (copper foil density 70mm × 70mm) 4-layer PCB (copper foil density 70mm × 70mm) PCB size: 70mm × 70mm × 1.6mm (PCB with thermal via) θ j-a: HTSOP-J8 153.2 ℃ /W 113.6 ℃ /W 59.2 ℃ /W 33.3 ℃ /W

TSZ02201-0GAG0A600010-1-2© 2014 ROHM Co., Ltd. All rights reserved. www.rohm.com TSZ22111･ 15･ 001 20.Jan.2015 Rev.002 0.01 0.1 0 20 40 60 80 100 Equivalent Series Resistance: ESR [Ω] Output Current: Io [mA] 安定領域 Input / Output Capacitor It is recommended that a capacitor is placed close to pin between input pin and GND as well as output pin and GND. The input capacitor becomes more necessary when the power supply impedance is high or when the PCB trace has significant length. Moreover, the higher the capacitance of the output capacitor the more stable the output will b e, even with load and line voltage variations. However, please check the actual functionality by mounting on a board for the actual application. Also, ceramic capacitors usually have different ther mal and equivalent series resistance characteristic s and may degrade gradually over continued use. For additional details, please check with the manufacturer and select the best ceramic capacitor for your application. Output Capacitor Equivalent Series Resistance DC Bias Voltage [V] Ceramic Capacitor Capacitance Value ― DC Bias Characteristics (Characteristics Example) -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 1 2 3 4 Rated Voltage: 10V B1 characteristics GRM188B11A105KA61D Rated Voltage: 10V B characteristics Rated Voltage: 6.3 V B characteristics Rated Voltage: 4V X6S characteristics Rated Voltage: 10V F characteristics Capacitance Change [%] To prevent oscillation, please attach a capacitor between VO and GND. Generally, capacitor has ESR (Equivalent Series Resistance). Operation will be stable in ESR-Io range shown in the right. The 2.2µF ceramic capacitor and resistor at output in this characteristic data are connected in series and mea sured. Generally, ESR of ceramic capacitor, tantalum capacit or and electrolytic capacitor is different. Check the ESR of capacitor to be used and use it within the range of stable region. However, please take note that for the same value o f capacitance of different electrolytic capacitor, ESR are not always the same. In addition, ESR characteristics may also change due to wiring impedance of board, input powe r impedance and load impedance; therefore check the behavior in actual application. Stable Area

TSZ02201-0GAG0A600010-1-2© 2014 ROHM Co., Ltd. All rights reserved. www.rohm.com TSZ22111･ 15･ 001 20.Jan.2015 Rev.002 Evaluation Board Circuit Evaluation Board Parts List Board Layout ･ Input capacitor C IN connected to VCC (V IN ) should be placed as close as possible to V CC (V IN ) pin and use wide layout. Output capacitor C OUT should also be placed as close as possible to IC p in. In case connected to inner layer GND plane, please use several through hole. ・ FB pin has comparatively high impedance and can be a ffected by noise, so floating capacitance should be small as possible. Please be careful of this during layout. ・ Please make GND pattern wide enough to handle the power dissipation of the chip. ・ For output voltage setting, Output voltage can be set by FB pin voltage （ 0.800V typ. ） and external resistance R1, R2. （ The use of resistor R2 = 5kΩ to 15k Ω is recommended ） Designation Value Part No. Company Designation Value Part No. Company R2 10k Ω ‐‐ ‐‐ ‐‐ ‐‐ C5 2.2µF CM21CH222J50AT KYOCERA VO = V FB × R1+R2 N.C GND FB N.C N.C. VO VO

1 VCC

( VCC VIN ) CIN R 1 R2 COUT

TSZ02201-0GAG0A600010-1-2© 2014 ROHM Co., Ltd. All rights reserved. www.rohm.com TSZ22111･ 15･ 001 20.Jan.2015 Rev.002 Input/Output Equivalent Circuits 8pin (V CC ) / 1pin (V O) 2pin (FB) 5pin (EN) 2pin (FB) 8pin (V CC ) 1pin (V O) 5pin (EN)

TSZ02201-0GAG0A600010-1-2© 2014 ROHM Co., Ltd. All rights reserved. www.rohm.com TSZ22111･ 15･ 001 20.Jan.2015 Rev.002 Operational Notes (1) Absolute Maximum Value Rate Operating the IC over the absolute maximum ratings may damage the IC. In addition, it is impossible to predict all destructive situations such as short-circuit modes, open circuit modes, etc. Therefore, it is importan t to consider circuit protection measures, like adding a fuse, in case th e IC is operated in a special mode exceeding the ab solute maximum ratings. (2) Reverse connection of power supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse po larity when connecting the power supply, such as mounting an ex ternal diode between the power supply and the IC’s power supply terminals. (3) Power supply line Design the PCB layout pattern to provide low impedanc e ground and supply lines. Separate the ground and s upply lines of the digital and analog blocks to prevent noise i n the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to g round at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. (4) Ground voltage The voltage of the ground pin must be the lowest vo ltage of all pins of the IC at all operating condit ions. Ensure that no pins are at a voltage below the ground pin at any time, even during transient condition. (5) Thermal consideration Use a thermal design that allows for a sufficient m argin by taking into account the permissible power dissipation (Pd) in actual operating conditions. (6) Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approxim ately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. (7) Short between pins and mounting errors Be careful when mounting the IC on printed circuit b oards. The IC may be damaged if it is mounted in a wrong orientation or if pins are shorted together. Short circuit may be caused be conductive particles caught between the pins. (8) Operation under strong electromagnetic field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. (9) ASO Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation (ASO). (10) Thermal shutdown circuit The IC incorporates a built-in thermal shutdown circuit, which is designed to turn off the IC when the internal temperature of the IC reaches a specified value. It is not desi gned to protect the IC from damage or guarantee its operation. Do not continue to operate the IC after this function is a ctivated. Do not use the IC in conditions where thi s function will always be activated. (11) Testing on application boards When testing the IC on an application board, connec ting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors comple tely after each process or step. The IC’s power sup ply should always be turned off completely before connecting o r removing it from the test setup during the inspec tion process. To prevent damage from electro static discharge, groun d the IC during assembly and use similar precaution s during transport and storage. TSD ON Temperature [° C] (typ) Hysteresis Temperature [° C] (typ) BD00FA1WEFJ 175 10

TSZ02201-0GAG0A600010-1-2© 2014 ROHM Co., Ltd. All rights reserved. www.rohm.com TSZ22111･ 15･ 001 20.Jan.2015 Rev.002 (12) Regarding input pins of the IC This monolithic IC contains P+ isolation and P substr ate layers between adjacent elements in order to ke ep them isolated. P-N junctions are formed at the intersect ion of the P layers with the N layers of other eleme nts, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction op erates as a parasitic diode. When GND > Pin B, the P-N junction operates as a par asitic transistor. Parasitic diodes inevitably occur in the structure o f the IC. The operation of parasitic diodes can res ult in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P subs trate) should be avoided. (13) Ground wiring pattern When using both small-signal and large-current GND traces, the two ground traces should be routed sepa rately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that th e GND traces of external components do not cause va riations on the GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance. Resistor Transistor (NPN) N N N P+ P + P P substrate GND Parasitic element Pin A N N P+ P+ P P substrate GND Parasitic element Pin B C B E N GND Pin A Pin B Other adjacent elements E B C GND Parasitic element Parasitic element Example of monolithic IC structure

TSZ02201-0GAG0A600010-1-2© 2014 ROHM Co., Ltd. All rights reserved. www.rohm.com TSZ22111･ 15･ 001 20.Jan.2015 Rev.002 Physical Dimension Tape and Reel Information Marking Diagram (Unit : mm) HTSOP-J8 0.08 S 0.08 M S 1.0MAX 0.85±0.05 1.27 0.08±0.08 0.42 +0.05 -0.04 1.05±0.2 0.65±0.15 4° +6° − 4° 0.17 +0.05 -0.03 2 3 4 568 (MAX 5.25 include BURR) 0.545 (3.2) 4.9±0.1 6.0±0.2 (2.4) 3.9±0.1 1PIN MARK ∗ Order quantity needs to be multiple of the minimum quantity. <Tape and Reel information> Embossed carrier tapeTape Quantity Direction of feed The direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs ( ) Direction of feed Reel 1pin HTSOP-J8 (TOP VIEW) 0 0 F A 1 W Part Number Marking LOT Number 1PIN MARK

TSZ02201-0GAG0A600010-1-2© 2014 ROHM Co., Ltd. All rights reserved. www.rohm.com TSZ22111･ 15･ 001 20.Jan.2015 Rev.002

Revision History

Date Revision Revision contents 2014.10.09 001 New release 2015.01.20 002 In Board Layout, “R1 = 5k Ω to 15k Ω” was changed to “R2 = 5k Ω to 15k Ω” (page 10)

Notice-PGA-E Rev.004 © 2015 ROHM Co., Ltd. All rights reserved. Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment, OA equipment, telecommunicat ion equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability ( such as medical equipment (Note 1), transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( “Specific Applications”), please consult wit h the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsi bilities, adequate safety measures including but not limited to fail -safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below . Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions . If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent v erification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (Exclude cases where no -clean type fluxes is u sed. However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load ( a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on -board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation d epending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow solder ing method must be used on a surface -mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface -mount products , please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification

Notice-PGA-E Rev.004 © 2015 ROHM Co., Ltd. All rights reserved. Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use . Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and stor age so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper name s of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties.

Notice – WE Rev.001 © 2015 ROHM Co., Ltd. All rights reserved. General Precaution 1. Before you use our Products, you are requested to caref ully read this document and fully understand its contents. ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of an y ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this documen t is current as of the issuing date and subject to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative. 3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccura cy or errors of or concerning such information.

Minimum Package Quantity 2500 Packing Type Taping Constitution Materials List inquiry RoHS Yes BD00FA1WEFJ - Web Page