BCX51_11 INFINEON

Document overview

  • Manufacturer or author: Provided By digicamel.com
  • PDF pages: 8

Technical content

PNP Silicon AF Transistors

  • For AF driver and output stages
  • High collector current
  • Low collector-emitter saturation voltage
  • Complementary types: BCX54...BCX56 (NPN)
  • Pb-free (RoHS compliant) package
  • Qualified according AEC Q101 Type Marking Pin Configuration Package BCX51 BCX51-16 BCX52 BCX52-16 BCX53 BCX53-10 BCX53-16 AA AD AE AM AH AK AL 1=B 1=B 1=B 1=B 1=B 1=B 1=B 2=C 2=C 2=C 2=C 2=C 2=C 2=C 3=E 3=E 3=E 3=E 3=E 3=E 3=E SOT89 SOT89 SOT89 SOT89 SOT89 SOT89 SOT89

Parameter Symbol Value Unit Collector-emitter voltage BCX51 BCX52 BCX53 VCEO V Collector-base voltage BCX51 BCX52 BCX53 VCBO 100 Emitter-base voltage VEBO 5 Collector current IC 1 A Peak collector current, tp ≤ 10 ms ICM 1.5 Base current IB 100 mA Peak base current IBM 200 Total power dissipation TS ≤ 120 °C Ptot 2 W Junction temperature Tj 150 °C Storage temperature Tstg -65 ... 150 Thermal Resistance Parameter Symbol Value Unit Junction - soldering point1) RthJS ≤ 15 K/W 1For calculation of RthJA please refer to Application Note AN077 (Thermal Resistance Calculation)

Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. DC Characteristics Collector-emitter breakdown voltage IC = 10 mA, IB = 0 , BCX51 IC = 10 mA, IB = 0 , BCX52 IC = 10 mA, IB = 0 , BCX53 V(BR)CEO V Collector-base breakdown voltage IC = 100 µA, IE = 0 , BCX51 IC = 100 µA, IE = 0 , BCX52 IC = 100 µA, IE = 0 , BCX53 V(BR)CBO 100 Emitter-base breakdown voltage IE = 10 µA, IC = 0 V(BR)EBO 5 - - Collector-base cutoff current VCB = 30 V, IE = 0 VCB = 30 V, IE = 0 , TA = 150 °C ICBO 0.1 µA DC current gain1) IC = 5 mA, VCE = 2 V IC = 150 mA, VCE = 2 V, BCX51...BCX53 IC = 150 mA, VCE = 2 V, BCX53-10 IC = 150 mA, VCE = 2 V, BCX51-16...BCX53-16 IC = 500 mA, VCE = 2 V hFE 100 100 160 250 160 250 Collector-emitter saturation voltage1) IC = 500 mA, IB = 50 mA VCEsat - - 0.5 V Base-emitter voltage1) IC = 500 mA, VCE = 2 V VBE(ON) - - 1 AC Characteristics Transition frequency IC = 50 mA, VCE = 10 V, f = 20 MHz fT - 125 - MHz 1Pulse test: t < 300µs; D < 2%

DC current gain hFE = ƒ(IC) VCE = 2 V 10 10 10 10 BCX 51...53 EHP00440 h mA0 1 34 FE 310 102 010 101 210 100 -50 555 CΙ Collector-emitter saturation voltage IC = ƒ(VCEsat), hFE = 10 0 0.4 0.8 BCX 51...53 EHP00441 VCE sat V mA 104 110 10210 10310 Ι C 100 0.2 0.6 100 -50 Base-emitter saturation voltage IC = ƒ(VBEsat), hFE = 10 10 0 0.6 BCX 51...53 EHP00443 VBE sat mA 100 -50 CΙ Collector current IC = ƒ(VBE) VCE = 2V 10 0 0.6 BCX 51...53 EHP00437 VBE mA 100 -50 CΙ

Collector cutoff current ICBO = ƒ(TA) VCBO = 30 V 10 0 50 100 150 BCX 51...53 EHP00442 TA nA Ι CB0 max typ Transition frequency fT = ƒ(IC) VCE = 10 V 10 10 10 10 BCX 51...53 EHP00439 f mA MHz 01 23 5 T 310 102 110 CΙ Total power dissipation Ptot = ƒ(TS) 0 15 30 45 60 75 90 105 120 °C 150 TS 0.4 0.8 1.2 1.6 W 2.4 Ptot Permissible Pulse Load RthJS = ƒ(tp) 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s tp -1 10 0 10 1 10 2 10 RthJS D = 0,5 0,2 0,1 0,05 0,02 0,01 0,005

Ptotmax/PtotDC = ƒ(tp) 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s tp 0 10 1 10 2 10 3 10 Ptotmax/PtotDC D = 0 0.005 0.01 0.02 0.05 0.1 0.2 0.5

Reel ø180 mm = 1.000 Pieces/Reel Reel ø330 mm = 4.000 Pieces/Reel Package Outline Foot Print Marking Layout (Example) Standard Packing 0.8 0.8 2.0 1.01.2 2.5 0.7 0.45 +0.2 1) Ejector pin markings possible 1.5 3 0.2 -0.1 B 0.25 ±0.05 45˚ 0.15 2.5±0.1 4 ±0.25 M B B 0.15 ±0.10.35 ±0.21 MAX.10˚ 1.5±0.1 ±0.21.6 -0.15 +0.12.75 ±0.14.5 ±0.11 0.2 MAX.1) 123 8 0.2 4.3 1.6 4.6 Pin 1 2005, June Date code (YM) BAW78D Type code Pin 1 Manufacturer

81726 Munich, Germany

 2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (<www.infineon.com >). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.