B3DQ3BRG-05C0001L3U1930

B3DQ3BRG-05C0001L3U1930 HARVATEK

Document overview

• PDF pages: 15

Technical content

Page 1

Harvatek Surface Mount CHIP LEDs Data Sheet

Features

 Support control circuit to be integrated with RGB chips into a single package

 Support signal reshaping to pass control waveforms to next adjacent driver

 Cascading port transmission by a single data line

 Support bi-directional data transfer protocol to feedback LED strip information, including quantity of the cascaded LDE devices and the maximal sink current capability of driver chip (patented)

 Support parallel-connected multi-strip control mechanism (patented)

 Support sleep mode for power saving (patented)

 Optional maximal driving current: 5mA

 256-step gray-scale output to allow 16,777,216-color display

 Support 20Khz (maximum) PWM refresh rate

 Support 32-level dimming control for R/G/B channel.

 Built-in oscillator with 20MHz frequency

 LED driver port maximum withstand Voltage 6.5V

 Built-in power-on-reset

 Built-in Brown-out reset

 Operating voltage 3.3~5.5V



Applications

 Decorative LED lighting

 LED video display

Page 2

DISCLAIMER ......................................................................................................................................... 3 LIFE SUPPORT POLICY ............................................................................................................. 3

PRODUCT SPECIFICATIONS ............................................................................................................. 4

ATTENTION: ELECTROSTATIC DISCHARGE (ESD) PROTECTION ............................................... 4

LABEL SPECIFICATIONS ................................................................................................................... 5

SPECIFICATIONS RANGE .................................................................................................................. 6

PRODUCT FEATURES ......................................................................................................................... 7

ELECTRO-OPTICAL CHARACTERISTICS ...................................................................................... 7 PACKAGE OUTLINE DIMENSION AND RECOMMENDED SOLDERING PATTERN FOR REFLOW

SOLDERING ............................................................................................................................. 7

ELECTRICAL CHARACTERISTICS ................................................................................................. 8 DATA TRANSFER PROTOCOL ..................................................................................................................... 9

PRECAUTION FOR USE .................................................................................................................... 10

PACKAGING .........................................................................................................................................11 TAPE DIMENSION ................................................................................................................... 11 REEL DIMENSION ................................................................................................................... 12 PACKING ............................................................................................................................... 12 DRY PACK ............................................................................................................................ 13

BAKING................................................................................................................................. 13 PRECAUTIONS ....................................................................................................................... 13

REFLOW SOLDERING ...................................................................................................................... 14 REWORKING .......................................................................................................................... 14 CLEANING ............................................................................................................................. 14 CAUTIONS OF PICK AND PLACE .............................................................................................. 15 REVISE HISTORY ................................................................................................................... 15

Page 3

DISCLAIMER

HARVATEK reserves the right to make changes without further notice to any products herein to improve reliability, function or design. HARVATEK does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others.

Life Support Policy HARVATEK’s products are not authorized for use as critical components in life support devices or systems without the express written approval of the President of HARVATEK or HARVATEK INTERNATIONAL. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to

perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.

Page 4

Product Specifications

Page 5

Label Specifications

■Harvatek P/N:

B

3DQ

3 BRG-

05C 0001

L3

■ Lot No.:

Page 6

Specifications Range ■Luminous Intensity (Iv) :

Note: It maintains a tolerance of ±10% on luminous intensity

■Wavelength :

Note: It maintains a tolerance of + 0.5nm on Wavelength Bin

Page 7

Product Features Electro-Optical Characteristics

(TSoldering , 25 oC)

Package Outline Dimension and Recommended Soldering Pattern for Reflow Soldering

(Unit:mm Tolerance: +/-0.1)

Absolute Maximum Ratings (unless otherwise specified, Temperature=25°C)

( TSoldering 25 ℃)

Page 8

Electrical Characteristics

Page 9

Data Transfer Protocol

The single wire data transfer protocol supports 24-bit data for each LED RGB display data refresh. The IC receives 24-bit data and passes the remaining data to next LED. The 24-bit data consist of red, green and blue data, each with 8-bit width, and are transferred with MSB first.

The transferred data are recognized based on the pulse widths received by the IC. A low bit 0 is represented by a 0.3us high pulse followed by a 0.9us low pulse. A high bit 1 is represented by a 0.9us high pulse followed by a 0.3us low pulse. A low pulse ≧ 200us is used to issue a reset command to the IC to start a new cycle of serial commands.

Page 10

Precaution for Use 1. The chips should not be used directly in any type of fluid such as water, oil, organic solvent, etc. 2. When the LEDs are illuminating, the maximum ambient temperature should be first considered before operation. 3. LEDs must be stored in a clean environment. A sealed container with a nitrogen atmosphere is necessary if the storage period is over 3 month after shipping. 4. The LEDs must be used within 168 hours after unpacked. Unused products must be repacked in an anti-electrostatic package, folded to close any opening and then stored in a dry and cool space. 5. The appearance and specifications of the products may be modified for improvement

without further notice. 6. The LEDs are sensitive to the static electricity and surge. It is strongly recommended to use a grounded wrist band and anti-electrostatic glove when handling the LEDs. If a voltage over the absolute maximum rating is applied to LEDs, it will damage LEDs. Damaged LEDs will show some abnormal characteristics such as remarkable increase of leak current, lower turn-on voltage and getting unlit at low current.

Page 11

Packaging Tape Dimension

Page 12

Reel Dimension

Packing

5 or 10 boxes per carton is available depending on shipment quantity.

Page 13

Dry Pack All SMD optical devices are MOISTURE SENSITIVE. Avoid exposure to moisture at all times during transportation or storage. Every reel is packaged in a moisture protected anti-static bag. Each bag is properly sealed prior to shipment.

A humidity indicator will be included in the moisture protected anti-static bag prior to shipment.

The packaging sequence is as follows:

Baking Baking before soldering is recommended when the package has been unsealed for 168 hours. The conditions are as followings: 1. 60±3℃×(12~24hrs)and<5%RH, taped reel type. 2. 100±3℃×(45min~1hr), bulk type. 3. 130±3℃×(15min~30min), bulk type. Precautions 1. Avoid exposure to moisture at all times during transportation or storage. 2. Anti-Static precaution must be taken when handling GaN, InGaN, and AlGaInP products. 3. It is suggested to connect the unit with a current limiting resistor of the proper size. Avoid applying a reverse voltage beyond the specified limit. 4. Avoid operation beyond the limits as specified by the absolute maximum ratings. 5. Avoid direct contact with the surface through which the LED emits light.

1. If possible, assemble the unit in a clean room or dust-free environment.

Page 14

Reflow Soldering Recommend soldering paste specifications: 1. Operating temp.: Above 217℃ ,60 ~150sec. 2. Peak temp.:260 ℃Max.,10sec Max. 3. Reflow soldering should not be done more than two times. 4. Never attempt next process until the component is cooled down to room temperature after reflow. 5. The recommended reflow soldering profile (measured on the surface of the LED terminal) is as following: Lead-free Solder Profile

Reworking  Rework should be completed within 5 seconds under 260 ℃.  The iron tip must not come in contact with the copper foil.  Twin-head type is preferred.

Cleaning Following are cleaning procedures after soldering:  An alcohol-based solvent such as isopropyl alcohol (IPA) is recommended.  Temperature x Time should be 50℃ x 30sec. or <30℃ x 3min  Ultrasonic cleaning: < 15W/ bath; bath volume ≤ 1liter  Curing: 100 ℃ max, <3min

Page 15

Cautions of Pick and Place  Avoid stress on the resin at elevated temperature.  Avoid rubbing or scraping the resin by any object.  Electric-static may cause damage to the component. Please ensure that the equipment is properly grounded. Use of an ionizer fan is recommended.

Revise History