B3DB3

B3DB3 HARVATEK

Document overview

• PDF pages: 17

Technical content

Page 1

Harvatek Surface Mount CHIP LEDs Data Sheet

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DISCLAIMER ......................................................................................................................................... 3 LIFE SUPPORT POLICY ............................................................................................................. 3

PRODUCT SPECIFICATIONS ............................................................................................................. 4

ATTENTION: ELECTROSTATIC DISCHARGE (ESD) PROTECTION ............................................... 4

LABEL SPECIFICATIONS ................................................................................................................... 5

SPECIFICATIONS RANGE .................................................................................................................. 6

PRODUCT FEATURES ......................................................................................................................... 7

ELECTRO-OPTICAL CHARACTERISTICS ...................................................................................... 7 PACKAGE OUTLINE DIMENSION AND RECOMMENDED SOLDERING PATTERN FOR REFLOW

SOLDERING ............................................................................................................................. 7

ELECTRICAL CHARACTERISTICS ................................................................................................. 8 DATA TRANSFER PROTOCOL ..................................................................................................................... 9

PRECAUTION FOR USE .................................................................................................................... 12

PACKAGING ........................................................................................................................................ 13 TAPE DIMENSION ................................................................................................................... 13 REEL DIMENSION ................................................................................................................... 14 PACKING ............................................................................................................................... 14 DRY PACK ............................................................................................................................ 15

BAKING................................................................................................................................. 15 PRECAUTIONS ....................................................................................................................... 15

REFLOW SOLDERING ...................................................................................................................... 16 REWORKING .......................................................................................................................... 16 CLEANING ............................................................................................................................. 16 CAUTIONS OF PICK AND PLACE .............................................................................................. 17 REVISE HISTORY ................................................................................................................... 17

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DISCLAIMER

HARVATEK reserves the right to make changes without further notice to any products herein to improve reliability, function or design. HARVATEK does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others.

Life Support Policy HARVATEK’s products are not authorized for use as critical components in life support devices or systems without the express written approval of the President of HARVATEK or HARVATEK INTERNATIONAL. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to

perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.

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Product Specifications

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Label Specifications

■Harvatek P/N:

B 3DB 3

BRG-

05C- 0001 13

■ Lot No.:

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Specifications Range ■Luminous Intensity (Iv) :

Note: It maintains a tolerance of ±10% on luminous intensity

■Wavelength :

Note: It maintains a tolerance of + 0.5nm on Wavelength Bin

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Product Features Electro-Optical Characteristics

(TSoldering , 25 oC)

Package Outline Dimension and Recommended Soldering Pattern for Reflow Soldering

(Unit:mm Tolerance: +/-0.1)

Absolute Maximum Ratings (unless otherwise specified, Temperature=25°C)

( TSoldering 25 ℃)

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Electrical Characteristics

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Data Transfer Protocol

32 consecutive 0’s denote the start of a command for an RGB LED. After receiving 32 0’s, the IC gets the following 32 bits as the received command, including FLAG, DIMMING, GREEN, BLUE and RED fields.

The serial command is transmitted with MSB first, DIN is latched at the rising edge of CIN clock. COUT and DOUT are re-generated for the next RGB LED. COUT is inverted from CIN. When 32 consecutive 0’s are encountered, the next 1 is expected to start a 32-bit command, i.e., FLAG[2:0]=111. When FLAG[2:0]=111, then DIMMING, GREEN, BLUE and RED fields are latched respectively. while the current 32-bit command is got, the IC passes remaining command bits to the next RGB LED.

After the last one command is issued for the last LED (LED n), the following 32 consecutive 1’s denote the end of the current command for an RGB LED(End of Frame) and wait for next 32 consecutive 0’s to start a new command set.(Note: the IC is workable either with or without “End of Frame” command, but MCU should issue the extra N/2 numbers of clocks signal if there are N LED lamps totally connected in the strip to make sure the data transfer and display of the last one LED lamp is complete and correct).

FLAG[2:0] : 111 to start a 32-bit command DIMMING[4:0] : 32-level current control for R/G/B drivers GREEN [7:0] : 256 gray levels for blue LED BLUE [7:0] : 256 gray levels for green LED RED[7:0] : 256 gray levels for red LED

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Sleep and power saving mode

The IC supports the sleep/wake-up modes for power-saving purpuse. In sleep mode, the built-in oscillator and associated circuitry will be disabled. The quiencent current of the IC is approximately 1uA(typ.).

Command Setup to enable sleep or wake up mode

When recieving 24-bit 0’s GBR data (that is GREEN [7:0]=8h00, BLUE [7:0]=8h00, RED[7:0]=8h00), in the meantime, both of the data in 3-bits’ flag and 5-bits’ DIMMING is 8h’A0’ (that is FLAG[2:0]=3b101 and DIMMING[4:0]=5b00000), the IC will enter sleep mode.

The IC will wake up from sleep mode once receiving the new data with the data of Flag[2:0]、 DIMMING[4:0] is not 8h"A0"; after wake-up,all sleeping circuits in the IC return to normal working mode within 1ms. Since it takes 1ms for a sleeping the IC returning to normal function mode, it is recommended for a host to wait for 1ms to send display data and command after issuing a wake-up command.

Sleeep power-saving mode example:

Case 1:

Case 2:

In case 2, while lamp2 is under sleep mode, in the following data transfer process, the state of lamp 2 will be not changed as long as the 32 bits data for lamp 2 is received with data of Flag[2:0]、DIMMING[4:0] being 8h”A0”. It means lamp2 will keep in sleep mode as well. In the situation, lamp2 can pass through the remaining data to

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lamp 3 (32bits) to change the display data of lamp 3. In other words, the sleeping chip is able to pass the data to the next chips.

Typical Circuit of an RGB LED strip application

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Precaution for Use 1. The chips should not be used directly in any type of fluid such as water, oil, organic solvent, etc. 2. When the LEDs are illuminating, the maximum ambient temperature should be first considered before operation. 3. LEDs must be stored in a clean environment. A sealed container with a nitrogen atmosphere is necessary if the storage period is over 3 months after shipping. 4. The LEDs must be used within 72hours after unpacked. Unused products must be repacked in an anti-electrostatic package, folded to close any opening and then stored in a dry and cool space. 5. The appearance and specifications of the products may be modified for improvement

without further notice. 6. The LEDs are sensitive to the static electricity and surge. It is strongly recommended to use a grounded wrist band and anti-electrostatic glove when handling the LEDs. If a voltage over the absolute maximum rating is applied to LEDs, it will damage LEDs. Damaged LEDs will show some abnormal characteristics such as remarkable increase of leak current, lower turn-on voltage and getting unlit at low current.

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Packaging Tape Dimension

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Reel Dimension

Packing

5 or 10 boxes per carton is available depending on shipment quantity.

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Dry Pack All SMD optical devices are MOISTURE SENSITIVE. Avoid exposure to moisture at all times during transportation or storage. Every reel is packaged in a moisture protected anti-static bag. Each bag is properly sealed prior to shipment.

A humidity indicator will be included in the moisture protected anti-static bag prior to shipment.

The packaging sequence is as follows:

Baking Baking before soldering is recommended when the package has been unsealed for 72hours. The conditions are as followings: 1. 60±3℃×(12~24hrs)and<5%RH, taped reel type. 2. 100±3℃×(45min~1hr), bulk type. 3. 130±3℃×(15min~30min), bulk type. Precautions 1. Avoid exposure to moisture at all times during transportation or storage. 2. Anti-Static precaution must be taken when handling GaN, InGaN, and AlInGaP products. 3. It is suggested to connect the unit with a current limiting resistor of the proper size. Avoid applying a reverse voltage beyond the specified limit. 4. Avoid operation beyond the limits as specified by the absolute maximum ratings. 5. Avoid direct contact with the surface through which the LED emits light.

1. If possible, assemble the unit in a clean room or dust-free environment.

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Reflow Soldering Recommend soldering paste specifications: 1. Operating temp.: Above 220℃ ,60 sec. 2. Peak temp.:260 ℃Max.,10sec Max. 3. Reflow soldering should not be done more than two times. 4. Never attempt next process until the component is cooled down to room temperature after reflow. 5. The recommended reflow soldering profile (measured on the surface of the LED terminal) is as following: Lead-free Solder Profile

Reworking  Rework should be completed within 5 seconds under 260 ℃.  The iron tip must not come in contact with the copper foil.  Twin-head type is preferred.

Cleaning Following are cleaning procedures after soldering:  An alcohol-based solvent such as isopropyl alcohol (IPA) is recommended.  Temperature x Time should be 50℃ x 30sec. or <30℃ x 3min  Ultrasonic cleaning: < 15W/ bath; bath volume ≤ 1liter  Curing: 100 ℃ max, <3min

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Cautions of Pick and Place  Avoid stress on the resin at elevated temperature.  Avoid rubbing or scraping the resin by any object.  Electric-static may cause damage to the component. Please ensure that the equipment is properly grounded. Use of an ionizer fan is recommended.

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