B1701

B1701 HARVATEK

Document overview

• PDF pages: 14

Technical content

Page 1

Harvatek Surface Mount CHIP LEDs Data Sheet

Page 2

DISCLAIMER ......................................................................................................................................... 3 LIFE SUPPORT POLICY ............................................................................................................. 3

PRODUCT SPECIFICATIONS ............................................................................................................. 4

ATTENTION: ELECTROSTATIC DISCHARGE (ESD) PROTECTION ............................................... 4

LABEL SPECIFICATIONS ................................................................................................................... 5

SPECIFICATIONS RANGE .................................................................................................................. 6

PRODUCT FEATURES ......................................................................................................................... 7

ELECTRO-OPTICAL CHARACTERISTICS ...................................................................................... 7 PACKAGE OUTLINE DIMENSION AND RECOMMENDED SOLDERING PATTERN FOR REFLOW

SOLDERING ............................................................................................................................. 7 ABSOLUTE MAXIMUM RATINGS ................................................................................................. 7 CHARACTERISTICS OF B1701NB ............................................................................................ 8

PRECAUTION FOR USE ...................................................................................................................... 9

PACKAGING ........................................................................................................................................ 10 TAPE DIMENSION ................................................................................................................... 10 REEL DIMENSION ................................................................................................................... 11 PACKING ............................................................................................................................... 11 DRY PACK ............................................................................................................................ 12

BAKING................................................................................................................................. 12 PRECAUTIONS ....................................................................................................................... 12

REFLOW SOLDERING ...................................................................................................................... 13 REWORKING .......................................................................................................................... 13 CLEANING ............................................................................................................................. 13 CAUTIONS OF PICK AND PLACE .............................................................................................. 14 REVISE HISTORY ................................................................................................................... 14

Page 3

DISCLAIMER

HARVATEK reserves the right to make changes without further notice to any products herein to improve reliability, function or design. HARVATEK does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others.

Life Support Policy HARVATEK’s products are not authorized for use as critical components in life support devices or systems without the express written approval of the President of HARVATEK or HARVATEK INTERNATIONAL. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to

perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.

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Product Specifications

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Label Specifications

■Harvatek P/N:

B 170 1

NB--

05D- 0017 14

■ Lot No.:

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Specifications Range ■Luminous Intensity (Iv) Bin:

Note: It maintains a tolerance of ±10% on Luminous Intensity

■Wavelength Bin:

Note: It maintains a tolerance of ±0.5nm on Wavelength Bin

■Forward Voltage (Vf) Bin:

Note: It maintains a tolerance of ±0.05V on forward voltage measurements

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Product Features

Electro-Optical Characteristics

( TSoldering , 25 ℃)

Package Outline Dimension and Recommended Soldering Pattern for Reflow Soldering

(Unit:mm Tolerance: +/-0.1)

Absolute Maximum Ratings

(TSoldering 25 ℃)

\*Condition for IFP is pulse of 1/10 duty and 0.1msec width

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Precaution for Use 1. The chips should not be used directly in any type of fluid such as water, oil, organic solvent, etc. 2. When the LEDs are illuminating, the maximum ambient temperature should be first considered before operation. 3. LEDs must be stored in a clean environment. A sealed container with a nitrogen atmosphere is necessary if the storage period is over 3 months after shipping. 4. The LEDs must be used within 4 weeks after unpacked. Unused products must be repacked in an anti-electrostatic package, folded to close any opening and then stored in a dry and cool space. 5. The appearance and specifications of the products may be modified for improvement

without further notice. 6. The LEDs are sensitive to the static electricity and surge. It is strongly recommended to use a grounded wrist band and anti-electrostatic glove when handling the LEDs.If a voltage over the absolute maximum rating is applied to LEDs, it will damage LEDs.Damaged LEDs will show some abnormal characteristics such as remarkable increase of leak current, lower turn-on voltage and getting unlit at low current.

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Packaging Tape Dimension

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Reel Dimension

Packing

5 or 10 boxes per carton is available depending on shipment quantity.

Page 12

Dry Pack All SMD optical devices are MOISTURE SENSITIVE. Avoid exposure to moisture at all times during transportation or storage. Every reel is packaged in a moisture protected anti-static bag. Each bag is properly sealed prior to shipment.

A humidity indicator will be included in the moisture protected anti-static bag prior to shipment.

The packaging sequence is as follows:

Baking Baking before soldering is recommended when the package has been unsealed for 4 weeks. The conditions are as followings: 1. 60±3℃×(12~24hrs)and<5%RH, taped reel type. 2. 100±3℃×(45min~1hr), bulk type. 3. 130±3℃×(15min~30min), bulk type. Precautions 1. Avoid exposure to moisture at all times during transportation or storage. 2. Anti-Static precaution must be taken when handling GaN, InGaN, and AlInGaP products. 3. It is suggested to connect the unit with a current limiting resistor of the proper size. Avoid applying a reverse voltage beyond the specified limit. 4. Avoid operation beyond the limits as specified by the absolute maximum ratings. 5. Avoid direct contact with the surface through which the LED emits light.

1. If possible, assemble the unit in a clean room or dust-free environment.

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Reflow Soldering Recommend soldering paste specifications: 1. Operating temp.: Above 220 ℃ ,60 sec. 2. Peak temp.:260 ℃Max.,10sec Max. 3. Reflow soldering should not be done more than two times. 4. Never attempt next process until the component is cooled down to room temperature after reflow. 5. The recommended reflow soldering profile (measured on the surface of the LED terminal) is as following: Lead-free Solder Profile

Reworking  Rework should be completed within 5 seconds under 260℃.  The iron tip must not come in contact with the copper foil.  Twin-head type is preferred.

Cleaning Following are cleaning procedures after soldering:  An alcohol-based solvent such as isopropyl alcohol (IPA) is recommended.  Temperature x Time should be 50℃ x 30sec. or <30℃ x 3min  Ultrasonic cleaning: < 15W/ bath; bath volume ≤ 1liter  Curing: 100℃ max, <3min

Page 14

Cautions of Pick and Place  Avoid stress on the resin at elevated temperature.  Avoid rubbing or scraping the resin by any object.  Electric-static may cause damage to the component. Please ensure that the equipment is properly grounded. Use of an ionizer fan is recommended.

Revise History