AZ1117C_12 BCDSEMI

Document overview

  • Manufacturer or author: Provided By digicamel.com
  • PDF pages: 23

Technical content

Features

  • Current Limit: 1.35A (Typ.)
  • Output Noise from 10Hz to 10KHz: 0.003% of V OUT
  • PSRR at IOUT=300mA and f=120Hz: 70dB
  • Output V oltage Accuracy: ±1% (Except 1.2V version)
  • On-chip Thermal Shutdown
  • Maximum Quiescent Current: IQMAX=6mA
  • Compatible with Low ESR Ceramic Capacitor
  • Operation Junction Temperature: -20 to 125oC

Applications

  • USB Device
  • Add-on Card
  • DVD Player
  • PC Motherboard TO-252-2 (3) SOT-89 TO-252-2 (4)

Figure 2. Pin Configuration of AZ1117C (Top View)

3 INPUT

3 OUTPUT

Figure 3. Functional Block Diagram of AZ1117C

600mA LOW DROPOUT LINEAR REGULATOR AP2317 600mA LOW DROPOUT LINEAR REGULATOR AP1117M Data Sheet LOW DROPOUT LINEAR REGULATOR AZ1117C Nov. 2012 Rev. 1. 8 BCD Semiconductor Manufacturing Limited Circuit Type Package H: SOT-223 ADJ: Adjustable Output 1.8: Fixed Output 1.8V AZ1117C - TR: Tape and Reel

Ordering Information

3.3: Fixed Output 3.3V Package Temperature Range Part Number Marking ID Packing Type SOT-223 -20 to 125oC AZ1117CH-ADJTRG1 GH15B Tape & Reel AZ1117CH-1.2TRG1 GH16B Tape & Reel AZ1117CH-1.5TRG1 GH15C Tape & Reel AZ1117CH-1.8TRG1 GH16C Tape & Reel AZ1117CH-2.5TRG1 GH15D Tape & Reel AZ1117CH-3.3TRG1 GH16D Tape & Reel AZ1117CH-5.0TRG1 GH15E Tape & Reel TO-252-2 (3) /TO-252-2 (4) AZ1117CD-ADJG1 AZ1117CD-ADJG1 Tube AZ1117CD-ADJTRG1 AZ1117CD-ADJG1 Tape & Reel AZ1117CD-1.2G1 AZ1117CD-1.2G1 Tube AZ1117CD-1.2TRG1 AZ1117CD-1.2G1 Tape & Reel AZ1117CD-1.5G1 AZ1117CD-1.5G1 Tube AZ1117CD-1.5TRG1 AZ1117CD-1.5G1 Tape & Reel AZ1117CD-1.8G1 AZ1117CD-1.8G1 Tube AZ1117CD-1.8TRG1 AZ1117CD-1.8G1 Tape & Reel AZ1117CD-2.5G1 AZ1117CD-2.5G1 Tube AZ1117CD-2.5TRG1 AZ1117CD-2.5G1 Tape & Reel AZ1117CD-3.3G1 AZ1117CD-3.3G1 Tube AZ1117CD-3.3TRG1 AZ1117CD-3.3G1 Tape & Reel AZ1117CD-5.0G1 AZ1117CD-5.0G1 Tube AZ1117CD-5.0TRG1 AZ1117CD-5.0G1 Tape & Reel 2.5: Fixed Output 2.5V G1: Green 5.0: Fixed Output 5.0V 1.2: Fixed Output 1.2V 1.5: Fixed Output 1.5V Blank: Tube TO-252-2 (3) R/R2: SOT-89 /TO-252-2 (4)

600mA LOW DROPOUT LINEAR REGULATOR AP2317 600mA LOW DROPOUT LINEAR REGULATOR AP1117M LOW DROPOUT LINEAR REGULATOR AZ1117C Nov. 2012 Rev. 1. 8 BCD Semiconductor Manufacturing Limited Data Sheet Ordering Information (Continued) Package Temperature Range Part Number Marking ID Packing Type SOT-89 -20 to 125oC AZ1117CR-ADJTRG1 G27N Tape & Reel AZ1117CR-1.2TRG1 G28J Tape & Reel AZ1117CR-1.5TRG1 G28K Tape & Reel AZ1117CR-1.8TRG1 G28L Tape & Reel AZ1117CR-2.5TRG1 G28M Tape & Reel AZ1117CR-3.3TRG1 G28N Tape & Reel AZ1117CR-5.0TRG1 G27M Tape & Reel SOT-89 AZ1117CR2-ADJTRG1 G42O Tape & Reel AZ1117CR2-1.2TRG1 G43M Tape & Reel AZ1117CR2-1.5TRG1 G43N Tape & Reel AZ1117CR2-1.8TRG1 G43O Tape & Reel AZ1117CR2-2.5TRG1 G70M Tape & Reel AZ1117CR2-3.3TRG1 G70N Tape & Reel AZ1117CR2-5.0TRG1 G33N Tape & Reel BCD Semiconductor's products, as designated with "G1" suffix in the part number, are RoHS compliant and Green.

600mA LOW DROPOUT LINEAR REGULATOR AP2317 600mA LOW DROPOUT LINEAR REGULATOR AP1117M Data Sheet LOW DROPOUT LINEAR REGULATOR AZ1117C Nov. 2012 Rev. 1. 8 BCD Semiconductor Manufacturing Limited Absolute Maximum Ratings (Note 1) Note 1: Stresses greater than thos e listed under "Absolute Maximum Ratings " may cause permanent damage to the device. These are stress ratings only, and functi onal operation of the device at these or any other conditions beyond those indicated under "Recommended Operating Conditions" is not implied. Exposure to "Absolute Maximum Ratings" for extended periods may affect device reliability. Note 2: Chip is soldered to 100mm2(10mm*10mm) copper (top side solder mask) on 2oz.2 layers FR-4 PCB with 8*0.5mm vias. Parameter Symbol Value Unit Input V oltage VIN 18 V Operating Junction Temperature Range TJ 150 oC Storage Temperature Range TSTG -65 to 150 oC Thermal Resistance (Without Heatsink) θJA SOT-89 170 oC/WSOT-223 125 Thermal Resistance (With Heatsink) (Note2) θJA SOT-89 150 oC/WSOT-223 100 Lead Temperature (Soldering, 10sec) TLEAD 260 oC Recommended Operating Conditions Parameter Symbol Min Max Unit Input V oltage VIN 15 V Operating Junction Temperature Range T J -20 125 oC

600mA LOW DROPOUT LINEAR REGULATOR AP2317 600mA LOW DROPOUT LINEAR REGULATOR AP1117M LOW DROPOUT LINEAR REGULATOR AZ1117C Nov. 2012 Rev. 1. 8 BCD Semiconductor Manufacturing Limited Data Sheet Parameter Symbol Conditions Min Typ Max Unit Reference V oltage VREF 1.5V≤VIN-VOUT≤10V 1.238 1.250 1.262 V1.225 1.250 1.270 Line Regulation VRLINE 1.5V≤VIN-VOUT ≤10V 0.001 0.1 0.2 Load Regulation VRLOAD 0.4 1.0 % Dropout V oltage VDROP ΔVREF=1%, IOUT=0.8A SOT-223 1.2 1.3 V Current Limit I LIMIT 11 . 3 5 A Adjust Pin Current 60 120 μA Adjust Pin Current Change 1.5V≤(VIN-VOUT)≤10V 0.2 5 μA Minimum Load Current 1.5V≤(VIN-VOUT)≤10V 1.7 5 mA Ripple Rejection PSRR f=120Hz, COUT=22μF (VIN-VOUT)=3V , IOUT=300mA 70 dB Temperature Stability 0.5 % RMS Output Noise (% of VOUT) TA=25oC, 10Hz≤f≤10KHz 0.003 % Thermal Shutdown Junction Temperature 160 oC Thermal Shutdown Hysteresis 16 oC Thermal Resistance (Junction to Case) θJC SOT-89 30 oC/WSOT-223 15

Electrical Characteristics

Operating Conditions: V IN=VOUT+2V , IOUT=10mA, TJ=25oC, unless otherwise specified. (P ≤maximum power dissipation). Limits appearing in Boldface type apply over the entire junction temperature range for operation, -20oC to 125oC.

600mA LOW DROPOUT LINEAR REGULATOR AP2317 600mA LOW DROPOUT LINEAR REGULATOR AP1117M Data Sheet LOW DROPOUT LINEAR REGULATOR AZ1117C Nov. 2012 Rev. 1. 8 BCD Semiconductor Manufacturing Limited Parameter Symbol Conditions Min Typ Max Unit Output V oltage VOUT 1.5V≤VIN-VOUT≤10V 1.176 1.2 1.224 V1.152 1.2 1.228 Line Regulation VRLINE 1.5V≤VIN-VOUT≤10V 0.5 6 mV Load Regulation VRLOAD 2 15 mV Dropout V oltage VDROP ΔVOUT=1%, IOUT=0.8A SOT-223 1.2 1.3 V Current Limit I LIMIT 11 . 3 5 A Quiescent Current IQ IOUT=0 4 6 mA Ripple Rejection PSRR f=120Hz, C OUT=22μF (VIN-VOUT)=3V , IOUT=300mA 70 dB Temperature Stability 0.5 % RMS Output Noise (% of VOUT) TA=25oC, 10Hz≤f≤10KHz 0.003 % Thermal Shutdown Junction Temperature 160 oC Thermal Shutdown Hysteresis 16 oC Thermal Resistance (Junction to Case) θ JC SOT-89 30 oC/WSOT-223 15 Electrical Characteristics (Continued) AZ1117C-1.2 Electrical Characteristics Operating Conditions: VIN≤10V , IOUT=10mA, TJ=25oC, unless otherwise specified. (P≤maximum power dissipation). Limits appearing in Boldface type apply over the entire junction temperature range for operation, -20oC to 125oC.

600mA LOW DROPOUT LINEAR REGULATOR AP2317 600mA LOW DROPOUT LINEAR REGULATOR AP1117M LOW DROPOUT LINEAR REGULATOR AZ1117C Nov. 2012 Rev. 1. 8 BCD Semiconductor Manufacturing Limited Data Sheet Parameter Symbol Conditions Min Typ Max Unit Output V oltage VOUT 1.5V≤VIN-VOUT≤10V 1.485 1.5 1.515 V1.470 1.5 1.530 Line Regulation VRLINE 1.5V≤VIN-VOUT≤10V 0.5 6 mV Load Regulation VRLOAD 2 15 mV Dropout V oltage VDROP ΔVOUT=1%, IOUT=0.8A SOT-223 1.2 1.3 V Current Limit I LIMIT 11 . 3 5 A Quiescent Current IQ IOUT=0 4 6 mA Ripple Rejection PSRR f=120Hz, C OUT=22μF (VIN-VOUT)=3V , IOUT=300mA 70 dB Temperature Stability 0.5 % RMS Output Noise (% of VOUT) TA=25oC, 10Hz≤f≤10KHz 0.003 % Thermal Shutdown Junction Temperature 160 oC Thermal Shutdown Hysteresis 16 oC Thermal Resistance (Junction to Case) θ JC SOT-89 30 oC/WSOT-223 15 Electrical Characteristics (Continued) AZ1117C-1.5 Electrical Characteristics Operating Conditions: VIN≤10V , IOUT=10mA, TJ=25oC, unless otherwise specified. (P≤maximum power dissipation). Limits appearing in Boldface type apply over the entire junction temperature range for operation, -20oC to 125oC.

600mA LOW DROPOUT LINEAR REGULATOR AP2317 600mA LOW DROPOUT LINEAR REGULATOR AP1117M Data Sheet LOW DROPOUT LINEAR REGULATOR AZ1117C Nov. 2012 Rev. 1. 8 BCD Semiconductor Manufacturing Limited Parameter Symbol Conditions Min Typ Max Unit Output V oltage VOUT 1.5V≤VIN-VOUT≤10V 1.782 1.8 1.818 V1.764 1.8 1.836 Line Regulation VRLINE 1.5V≤VIN-VOUT≤10V 0.5 6 mV Load Regulation VRLOAD 2 15 mV Dropout V oltage VDROP ΔVOUT=1%, IOUT=0.8A SOT-223 1.2 1.3 V Current Limit I LIMIT 11 . 3 5 A Quiescent Current IQ IOUT=0 4 6 mA Ripple Rejection PSRR f=120Hz, C OUT=22μF (VIN-VOUT)=3V , IOUT=300mA 70 dB Temperature Stability 0.5 % RMS Output Noise (% of VOUT) TA=25oC, 10Hz≤f≤10KHz 0.003 % Thermal Shutdown Junction Temperature 160 oC Thermal Shutdown Hysteresis 16 oC Thermal Resistance (Junction to Case) θ JC SOT-89 30 oC/WSOT-223 15 Electrical Characteristics (Continued) AZ1117C-1.8 Electrical Characteristics Operating Conditions: VIN≤10V , IOUT=10mA, TJ=25oC, unless otherwise specified. (P≤maximum power dissipation). Limits appearing in Boldface type apply over the entire junction temperature range for operation, -20oC to 125oC.

600mA LOW DROPOUT LINEAR REGULATOR AP2317 600mA LOW DROPOUT LINEAR REGULATOR AP1117M LOW DROPOUT LINEAR REGULATOR AZ1117C Nov. 2012 Rev. 1. 8 BCD Semiconductor Manufacturing Limited Data Sheet Parameter Symbol Conditions Min Typ Max Unit Output V oltage VOUT 1.5V≤VIN-VOUT≤10V 2.475 2.5 2.525 V 2.455 2.5 2.545 Line Regulation VRLINE 1.5V≤VIN-VOUT≤10V 0.5 6 mV Load Regulation VRLOAD 2 15 mV Dropout V oltage VDROP ΔVOUT=1%, IOUT=0.8A SOT-223 1.2 1.3 V Current Limit I LIMIT 11 . 3 5 A Quiescent Current IQ IOUT=0 4 6 mA Ripple Rejection PSRR f=120Hz, C OUT=22μF (VIN-VOUT)=3V , IOUT=300mA 70 dB Temperature Stability 0.5 % RMS Output Noise (% of VOUT) TA=25oC, 10Hz≤f≤10KHz 0.003 % Thermal Shutdown Junction Temperature 160 oC Thermal Shutdown Hysteresis 16 oC Thermal Resistance (Junction to Case) θ JC SOT-89 30 oC/WSOT-223 15 Electrical Characteristics (Continued) AZ1117C-2.5 Electrical Characteristics Operating Conditions: VIN≤10V , IOUT=10mA, TJ=25oC, unless otherwise specified. (P≤maximum power dissipation). Limits appearing in Boldface type apply over the entire junction temperature range for operation, -20oC to 125oC.

600mA LOW DROPOUT LINEAR REGULATOR AP2317 600mA LOW DROPOUT LINEAR REGULATOR AP1117M Data Sheet LOW DROPOUT LINEAR REGULATOR AZ1117C Nov. 2012 Rev. 1. 8 BCD Semiconductor Manufacturing Limited Parameter Symbol Conditions Min Typ Max Unit Output V oltage VOUT 1.5V≤VIN-VOUT≤10V 3.267 3.3 3.333 V3.235 3.3 3.365 Line Regulation VRLINE 1.5V≤VIN-VOUT≤10V 0.5 6 mV Load Regulation VRLOAD 2 15 mV Dropout V oltage VDROP ΔVOUT=1%, IOUT=0.8A SOT-223 1.2 1.3 V Current Limit I LIMIT 11 . 3 5 A Quiescent Current IQ IOUT=0 4 6 mA Ripple Rejection PSRR f=120Hz, C OUT=22μF (VIN-VOUT)=3V , IOUT=300mA 70 dB Temperature Stability 0.5 % RMS Output Noise (% of VOUT) TA=25oC, 10Hz≤f≤10KHz 0.003 % Thermal Shutdown Junction Temperature 160 oC Thermal Shutdown Hysteresis 16 oC Thermal Resistance (Junction to Case) θJC SOT-89 30 oC/WSOT-223 15 Electrical Characteristics (Continued) AZ1117C-3.3 Electrical Characteristics Operating Conditions: VIN≤10V , IOUT=10mA, TJ=25oC, unless otherwise specified. (P≤maximum power dissipation). Limits appearing in Boldface type apply over the entire junction temperature range for operation, -20oC to 125oC.

600mA LOW DROPOUT LINEAR REGULATOR AP2317 600mA LOW DROPOUT LINEAR REGULATOR AP1117M LOW DROPOUT LINEAR REGULATOR AZ1117C Nov. 2012 Rev. 1. 8 BCD Semiconductor Manufacturing Limited Data Sheet Parameter Symbol Conditions Min Typ Max Unit Output V oltage VOUT 1.5V≤VIN-VOUT≤10V 4.950 5.0 5.050 V4.900 5.0 5.100 Line Regulation VRLINE 1.5V≤VIN-VOUT≤10V 0.5 6 mV Load Regulation VRLOAD 2 15 mV Dropout V oltage VDROP ΔVOUT=1%, IOUT=0.8A SOT-223 1.2 1.3 V Current Limit I LIMIT 11 . 3 5 A Quiescent Current IQ IOUT=0 4 6 mA Ripple Rejection PSRR f=120Hz, C OUT=22μF (VIN-VOUT)=3V , IOUT=300mA 70 dB Temperature Stability 0.5 % RMS Output Noise (% of VOUT) TA=25oC, 10Hz≤f≤10KHz 0.003 % Thermal Shutdown Junction Temperature 160 oC Thermal Shutdown Hysteresis 16 oC Thermal Resistance (Junction to Case) θJC SOT-89 30 oC/WSOT-223 15 Electrical Characteristics (Continued) AZ1117C-5.0 Electrical Characteristics Operating Conditions: VIN≤10V , IOUT=10mA, TJ=25oC, unless otherwise specified. (P≤maximum power dissipation). Limits appearing in Boldface type apply over the entire junction temperature range for operation, -20oC to 125oC.

Figure 16. Dropout Voltage vs. Junction Temperature

Figure 17. Typical Applications of AZ1117C

600mA LOW DROPOUT LINEAR REGULATOR AP2317 600mA LOW DROPOUT LINEAR REGULATOR AP1117M LOW DROPOUT LINEAR REGULATOR AZ1117C Nov. 2012 Rev. 1. 8 BCD Semiconductor Manufacturing Limited Data Sheet Mechanical Dimensions SOT-223 Unit: mm(inch) 3.300(0.130) 3.700(0.146) 6.700(0.264) 7.300(0.287) 2.900(0.114) 3.100(0.122) 0.610(0.024) 0.810(0.032) 2.300(0.091) TYP 6.300(0.248) 6.700(0.264) 1.750(0.069) TYP 4.500(0.177) 4.700(0.185) 0.020(0.001) 0.100(0.004) 1.520(0.060) 1.800(0.071) 1.500(0.059) 1.700(0.067) 0.250(0.010) 0.350(0.014) 0.250(0.010) 10° 0.900(0.035) MIN

600mA LOW DROPOUT LINEAR REGULATOR AP2317 600mA LOW DROPOUT LINEAR REGULATOR AP1117M Data Sheet LOW DROPOUT LINEAR REGULATOR AZ1117C Nov. 2012 Rev. 1. 8 BCD Semiconductor Manufacturing Limited Mechanical Dimensions (Continued) SOT-89 Unit: mm(inch) 1.030(0.041)REF 1.550(0.061)REF 4.400(0.173) 4.600(0.181) 0.900(0.035) 1.100(0.043) 3.950(0.156) 4.250(0.167) 3.000(0.118) TYP 0.480(0.019) 2.300(0.091) 2.600(0.102) 0.320(0.013) 0.520(0.020) 3 10 2.060(0.081)REF 1.400(0.055) 1.600(0.063) 0.350(0.014) 0.450(0.018) R0.150(0.006) 1.500(0.059) 0.320(0.013)REF 1.620(0.064)REF 2.210(0.087)REF 0.320(0.013) 0.520(0.020) 1.800(0.071)

600mA LOW DROPOUT LINEAR REGULATOR AP2317 600mA LOW DROPOUT LINEAR REGULATOR AP1117M LOW DROPOUT LINEAR REGULATOR AZ1117C Nov. 2012 Rev. 1. 8 BCD Semiconductor Manufacturing Limited Data Sheet Mechanical Dimensions (Continued) TO-252-2 (3) Unit: mm(inch) 1.29±0.1 2.900REF 1.400(0.055) 1.700(0.067) 0.470(0.019) 0.600(0.024) 9.800(0.386) 10.400(0.409) 2.200(0.087) 2.380(0.094) 0.900(0.035) 1.100(0.043) 4.700REF 6.500(0.256) 6.700(0.264) 5.130(0.202) 5.460(0.215) 0.150(0.006) 0.750(0.030) 6.000(0.236) 6.200(0.244) 0.720(0.028) 0.850(0.033) 2.286(0.090) BSC 0.720(0.028) 0.900(0.035) 0.900(0.035) 1.250(0.049) 1.800REF 0.600(0.024) 1.000(0.039) 5.250REF Option 1 Option 2

600mA LOW DROPOUT LINEAR REGULATOR AP2317 600mA LOW DROPOUT LINEAR REGULATOR AP1117M Data Sheet LOW DROPOUT LINEAR REGULATOR AZ1117C Nov. 2012 Rev. 1. 8 BCD Semiconductor Manufacturing Limited Mechanical Dimensions (Continued) Unit: mm(inch)TO-252-2 (4) 5.460(0.215) 4.960(0.195) 6.350(0.250) 6.730(0.265) 1.20±0.05 1.900(0.075) 1.700(0.067) 6.220(0.245) 5.970(0.235) 1.270(0.050) 0.890(0.035) 1.492(0.059) 1.145(0.045) 1.010(0.040) 1.124(0.044) 0.765(0.030) 2.290(0.090) 0.640(0.025) 0.884(0.035) MAX BSC 10.340(0.407) 9.940(0.391) 0.600(0.024) 0.460(0.018) 2.380(0.094) 2.180(0.086) 4.320(0.170) MIN MIN 5.210(0.205) 3 3 0.780(0.031) 0.650(0.026) 0.884(0.035) 0.640(0.025) 0.460(0.018) 0.610(0.024) 0.410(0.016) 0.560(0.022) DETAIL “A” 2.160(0.085) MIN BASE METAL PLATING SECTION B-B 0.020(0.001) 0.120(0.005) 2.740(0.108) 1.500(0.059) REF 1.780(0.070) SEATING PLANE GAUGE PLANE B B

BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Limited 800, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 BCD Semiconductor Manufacturing Limited MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. Shenzhen Office Advanced Analog Circuits (Shanghai) Corporation Shenzhen Office Room E, 5F, Noble Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corporation 30920 Huntwood Ave. Hayward, CA 94544, U.S.A Tel : +1-510-324-2988 Fax: +1-510-324-2788 - IC Design Group Advanced Analog Circuits (Shanghai) Corporation 8F, Zone B, 900, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6495 9539, Fax: +86-21-6485 9673 BCD Semiconductor Manufacturing Limited http://www.bcdsemi.com BCD Semiconductor Manufacturing Limited IMPORTANT NOTICE BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.

800 Yi Shan Road, Shanghai 200233, China

Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office Unit A Room 1203, Skyworth Bldg., Gaoxin Ave.1.S., Nanshan District, Shenzhen, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corp. 30920 Huntwood Ave. Hayward, CA 94544, USA Tel : +1-510-324-2988 Fax: +1-510-324-2788 - Headquarters BCD Semiconductor Manufacturing Limited No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, China Tel: +86-21-24162266, Fax: +86-21-24162277