ATL431AQDBZR

ATL431 TI1

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C KA (/c50F) IKA (/c50A) 0.0001 0.001 0.01 0.1 1 10 100 1000 2000 STABLE D001 Vref Input VKA IKA Product Folder Sample & Buy T echnical Documents Tools & Software Support & Community Reference Design ATL431,ATL432 SLVSCV5C –MARCH 2015–REVISED SEPTEMBER 2015 ATL43x2.5-VLowIqAdjustablePrecisionShuntRegulator

1 Features 3 Description

The ATL431 and ATL432 are three-terminal 1• Adjustable Regulated Output of 2.5 V to 36 V adjustable shunt regulators, with specified thermal• Very-Low Operating Current stability over applicable automotive, commercial, and – IKA(min) = 35 µA (Max) industrial temperature ranges. The output voltage can be set to any value between Vref (approximately– IREF = 150 nA (Max) 2.5 V) and 36 V, with two external resistors. These• Internally Compensated for Stability devices have a typical output impedance of 0.05 Ω. – Stable With No Capacitive Load Active output circuitry provides a very sharp turn-on characteristic, making these devices excellent• Reference Voltage Tolerances at 25°C replacements for Zener diodes in many applications,– 0.5% for ATL43xB such as onboard regulation, adjustable power– 1% for ATL43xA supplies, and switching power supplies.

• Typical Temperature Drift The ATL43x has > 20x improvement cathode current – 5 mV (–40°C to 85°C); I Version range over it's TL43x predecessor. It also is stable with a wider range of load capacitance types and– 6 mV (–40°C to 125°C); Q Version values.• Extended Cathode Current Range 35 µA to 100 mA ATL431 and ATL432 are the exact same parts but with different pinouts and order numbers. The• Low Output Impedance of 0.3 Ω (Max) ATL43x is offered in two grades, with initial tolerances (at 25°C) of 0.5%, 1%, for the B and A2 Applications grade, respectively. In addition, low output drift vs
• Secondary Side Regulation in Flyback SMPSs temperature ensures good stability over the entire temperature range.• Industrial, Computing, Consumer, and Portables
• Adjustable Voltage and Current Referencing The ATL43xxI devices are characterized for operation from –40°C to 85°C, and the ATL43xxQ devices are• Power Management characterized for operation from –40°C to 125°C.• Power Isolation
• Zener Replacement Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) ATL431 SOT (3) 2.90 mm × 1.60 mmATL432 (1) For all available packages, see the orderable addendum at the end of the data sheet. Simplified Schematic Stability Region for VKA = 15.0 V An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.

ATL431,ATL432 SLVSCV5C –MARCH 2015–REVISED SEPTEMBER 2015 www.ti.com Table of Contents

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision B (May 2015) to Revision C Page Changes from Revision A (April 2015) to Revision B Page Changes from Original (March 2013) to Revision A Page

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Product Folder Links: ATL431 ATL432

3 ANODE

ATL431,ATL432 www.ti.com SLVSCV5C –MARCH 2015–REVISED SEPTEMBER 2015

5 Pin Configuration and Functions

NO. I/O DESCRIPTION NAME ATL431x ATL432x CATHODE 1 2 I/O Shunt Current/Voltage input REF 2 1 I Threshold relative to common anode ANODE 3 3 O Common pin, normally connected to ground

6 Specifications

6.1 Absolute Maximum Ratings(1)

over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VKA Cathode voltage(2) 40 V IKA Continuous cathode current –100 150 mA II(ref) Reference input current –0.05 10 mA TJ Operating virtual junction temperature -40 150 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to ANODE, unless otherwise noted.

6.2 ESD Ratings

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

VKA Cathode voltage Vref 36 V IKA Cathode current .035 100 mA "I" Grade –40 85 TA Operating free-air temperature °C "Q" Grade –40 125 Copyright © 2015, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: ATL431 ATL432

ATL431,ATL432 SLVSCV5C –MARCH 2015–REVISED SEPTEMBER 2015 www.ti.com

6.4 Thermal Information

THERMAL METRIC(1) DBZ (SOT-23) UNIT

3 PINS

RθJA Junction-to-ambient thermal resistance 331.8 °C/W RθJC(top) Junction-to-case (top) thermal resistance 106.5 °C/W RθJB Junction-to-board thermal resistance 64.6 °C/W ψJT Junction-to-top characterization parameter 4.9 °C/W ψJB Junction-to-board characterization parameter 62.9 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics, ATL431Ax, ATL432Ax

over recommended operating conditions, TA = 25°C (unless otherwise noted) PARAMETER TEST CIRCUIT TEST CONDITIONS MIN TYP MAX UNIT Vref Reference voltage Figure 22 VKA = Vref, IKA = 1 mA 2475 2500 2525 mV ATL43xAI; TA = 5 15Deviation of reference input -40°C to 85°CVKA = Vref,VI(dev) voltage over full temperature Figure 22 mVIKA = 1 mA, ATL43xAQ; TA =range, see section 6 34-40°C to 125°C Ratio of change in reference ΔVKA = 10 V − Vref –0.4 –2.7 ΔVref / ΔVKA voltage to the change in Figure 23 IKA = 1 mA mV/V ΔVKA = 36 V − 10 V –0.1 –2cathode voltage Iref Reference input current Figure 23 IKA = 1 mA, R1 = 10 kΩ, R2 = ∞ 30 150 nA Deviation of reference input II(dev) current over full temperature Figure 23 IKA = 1 mA, R1 = 10 kΩ, R2 = ∞ 20 50 nA range, see section Minimum cathode current for Figure 22Imin VKA = Vref 20 35 µAregulation Figure 5 Ioff Off-state cathode current Figure 24 VKA = 36 V, Vref = 0 0.05 0.2 µA Dynamic impedance, see VKA = Vref, f ≤ 1 kHz,|zKA| Figure 22 0.05 0.3 Ωsection IKA = 1 mA to 100 mA

6.6 Electrical Characteristics, ATL431Bx, ATL432Bx

over recommended operating conditions, TA = 25°C (unless otherwise noted) PARAMETER TEST CIRCUIT TEST CONDITIONS MIN TYP MAX UNIT Vref Reference voltage Figure 22 VKA = Vref, IKA = 1 mA 2487 2500 2512 mV ATL43xBI; TA = 5 15Deviation of reference input –40°C to 85°CVKA = Vref, IKA = 1VI(dev) voltage over full temperature Figure 22 mVmA ATL43xBQ; TA =range, see section 6 34–40°C to 125°C Ratio of change in reference ΔVKA = 10 V − Vref –0.4 –2.7ΔVref / voltage to the change in Figure 23 IKA = 1 mA mV/VΔVKA ΔVKA = 36 V − 10 V –0.1 –2cathode voltage Iref Reference input current Figure 23 IKA = 1 mA, R1 = 10 kΩ, R2 = ∞ 30 150 nA Deviation of reference input II(dev) current over full temperature Figure 23 IKA = 1 mA, R1 = 10 kΩ, R2 = ∞ 20 50 nA range, see section Minimum cathode current for Figure 22Imin VKA = Vref 20 35 µAregulation Figure 5 Ioff Off-state cathode current Figure 24 VKA = 36 V, Vref = 0 0.05 0.2 µA Dynamic impedance, see|zKA| Figure 22 VKA = Vref, f ≤ 1 kHz, IKA = 1 mA to 100 mA 0.05 0.3 Ωsection

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Product Folder Links: ATL431 ATL432

6.7 Typical Characteristics

Figure 2. Reference Current vs Free-Air TemperatureFigure 1. Reference Voltage vs Free-Air Temperature Figure 4. Cathode Current vs Cathode VoltageFigure 3. Cathode Current vs Cathode Voltage Figure 6. Off-State Cathode Current vs Free-Air TemperatureFigure 5. Cathode Current vs Cathode Voltage

Figure 7. Delta Reference Voltage vs Cathode Voltage Figure 8. Delta Reference Voltage vs Cathode Voltage Figure 10. Small-Signal Voltage Amplification vs FrequencyFigure 9. Noise Voltage Figure 26 used for this measurement. Figure 26 used for this measurement. Figure 11. Output Impedance vs Frequency Figure 12. DC Output Impedance vs Temperature

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ESR < 20 mΩ Figure 27 used to verify stability. ESR < 20 mΩ Figure 27 used to verify stability. Figure 19. High IKA (VKA = 5.0 V) Stability Boundary Figure 20. High IKA (VKA = 10.0 V) Stability Boundary ESR < 20 mΩ Figure 27 used to verify stability. Figure 21. High IKA (VKA = 15.0 V) Stability Boundary Conditions all ATL43xx Devices

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7 Parameter Measurement Information

Figure 23. Test Circuit for VKA > VrefFigure 22. Test Circuit for VKA = Vref Figure 25. Test Circuit for Phase and Gain MeasurementFigure 24. Test Circuit for Ioff

Figure 27. Test Circuit for Stability Boundary ConditionsFigure 26. Test Circuit for Reference Impedance (ZKA) Figure 28. Test Circuit for Pulse Response

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ATL431,ATL432 www.ti.com SLVSCV5C –MARCH 2015–REVISED SEPTEMBER 2015

8 Detailed Description

8.1 Overview

ATL43x is a low power counterpart to TL431 and TLV431, having lower minimum cathode current (Ik(min) = 35 µA vs 0.1/1.0 mA). Like TL431, ATL43x is used in conjunction with it's key components to behave as a single voltage reference, error amplifier, voltage clamp or comparator with integrated reference. ATL43x can be operated and adjusted to cathode voltages from 2.5 V to 36 V, making this part optimum for a wide range of end equipments in industrial, auto, telecom and computing. In order for this device to behave as a shunt regulator or error amplifier, > 35 µA (Imin(max)) must be supplied in to the cathode pin. Under this condition, feedback can be applied from the Cathode and Ref pins to create a replica of the internal reference voltage. Various reference voltage options can be purchased with initial tolerances (at 25°C) of 0.5% and 1.0%. These reference options are denoted by B (0.5%) and A (1.0%) after the ATL43x. The ATL43xxI devices are characterized for operation from –40°C to 85°C, and the ATL43xxQ devices are characterized for operation from –40°C to 125°C.

8.2 Functional Block Diagram

8.3 Feature Description

ATL43x consists of an internal reference and amplifier that outputs a sink current based on the difference between the reference pin and the virtual internal pin. The sink current is produced by an internal Darlington pair. When operated with enough voltage headroom (≥ 2.5 V) and cathode current (IKA), ATL43x forces the reference pin to 2.5 V. However, the reference pin can not be left floating, as it needs Iref ≥ 0.1 µA (please see the Functional Block Diagram). This is because the reference pin is driven into an NPN, which needs base current in order operate properly. When feedback is applied from the Cathode and Reference pins, ATL43x behaves as a Zener diode, regulating to a constant voltage dependent on current being supplied into the cathode. This is due to the internal amplifier and reference entering the proper operating regions. The same amount of current needed in the above feedback situation must be applied to this device in open loop, servo or error amplifying implementations in order for it to be in the proper linear region giving ATL43x enough gain. Unlike many linear regulators, ATL43x is internally compensated to be stable without an output capacitor between the cathode and anode; however, if it is desired to use an output capacitor Figure 14 through Figure 21 can be used as a guide to assist in choosing the correct capacitor to maintain stability. Copyright © 2015, Texas Instruments Incorporated Submit Documentation Feedback 11 Product Folder Links: ATL431 ATL432

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8.4 Device Functional Modes

8.4.1 Open Loop (Comparator)

When the cathode/output voltage or current of ATL43x is not being fed back to the reference/input pin in any form, this device is operating in open loop. With such high gain in this configuration, ATL43x is typically used as a comparator. Due to the integrated reference, the ATL43x allows users to monitor a certain level of a single signal.

8.4.2 Closed Loop

When the cathode/output voltage or current of ATL43x is being fed back to the reference/input pin in any form, this device is operating in closed loop. The majority of applications involving ATL43x use it in this manner to regulate a fixed voltage or current. The feedback enables this device to behave as an error amplifier, computing a portion of the output voltage and adjusting it to maintain the desired regulation. This is done by relating the output voltage back to the reference pin in a manner to make it equal to the internal reference voltage, which can be accomplished via resistive or direct feedback.

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Product Folder Links: ATL431 ATL432

9 Application and Implementation

validate and test their design implementation to confirm system functionality.

9.1 Application Information

ATL43x that this application will see, open loop (Comparator + Vref) and closed loop (Shunt Regulator). compensation can be found in the application note Compensation Design With TL431 for UCC28600, SLUA671. Figure 29. Flyback With Isolation Using ATL43x

9.2 Typical Applications

9.2.1 Comparator With Integrated Reference (Open Loop)

Figure 30. Comparator Application Schematic

9.2.1.1 Design Requirements

For this design example, use the parameters listed in Table 1 as the input parameters. Table 1. Design Parameters

9.2.1.2 Detailed Design Procedure

• Input voltage range
• Reference voltage accuracy
• Output logic input high and low level thresholds
• Current source resistance

9.2.1.2.1 Basic Operation

to 40 µA over temperature, operation below that could result in low gain, leading to a slow response.

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9.2.1.2.2 Overdrive

Slow or inaccurate responses can also occur when the reference pin is not provided enough overdrive voltage. voltage will be within the range of 2.5 V ±(0.5% or 1.0%) depending on which version is being used. The more overdrive voltage provided, the faster the ATL43x will respond. used as a guide for selecting the overdrive voltage.

9.2.1.2.3 Output Voltage and Logic Input Level

to the receiving low voltage logic device. outgoing logic's reliability.

9.2.1.3 Application Curve

Figure 31. Open Loop (Comparator Mode) VOUT vs VIN

9.2.2 Shunt Regulator/Reference

Figure 32. Shunt Regulator Schematic

9.2.2.1 Design Requirements

For this design example, use the parameters listed in Table 2 as the input parameters. Table 2. Design Parameters

9.2.2.2 Detailed Design Procedure

• Input voltage range
• Temperature range
• Total accuracy
• Cathode current
• Reference initial accuracy
• Output capacitance

9.2.2.2.1 Programming Output/Cathode Voltage

9.2.2.2.2 Total Accuracy

• R1 and R2 accuracies
• VI(dev) - Change in reference voltage over temperature

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• ΔVref / ΔVKA - Change in reference voltage to the change in cathode voltage
• |zKA| - Dynamic impedance, causing a change in cathode voltage with cathode current Worst case cathode voltage can be determined taking all of the variables in to account. Application note SLVA445 assists designers in setting the shunt voltage to achieve optimum accuracy for this device.

9.2.2.2.3 Stability

Figure 21. Also, designers may use capacitive loads to improve the transient response or for power supply the "Advanced" TL431, ATL431 SLVA685. more suitable for low cathode current applications.

9.2.2.3 Application Curves

Figure 33. ATL43x Start-up Response IKA = 50 µA Figure 34. ATL43x Start-up Response IKA = 1 mA

10 Power Supply Recommendations

Designing with the "Advanced" TL431, ATL431 SLVA685. sure to limit the current being driven into the Ref pin, as not to exceed it's absolute maximum rating. of the traces to have the proper current density.

11 Layout

11.1 Layout Guidelines

high currents to avoid excessive voltage drops.

11.2 Layout Example

Figure 35. DBZ Layout Example

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12 Device and Documentation Support

12.1 Related Links

resources, tools and software, and quick access to sample or buy. Table 3. Related Links

12.2 Community Resources

solve problems with fellow engineers. contact information for technical support.

12.3 Trademarks

E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.

12.4 Electrostatic Discharge Caution

during storage or handling to prevent electrostatic damage to the MOS gates.

12.5 Glossary

This glossary lists and explains terms, acronyms, and definitions.

13 Mechanical, Packaging, and Orderable Information

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

www.ti.com 12-Oct-2015 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples ATL431AIDBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 (ZCKS ~ ZCR3) ATL431AQDBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (ZCLS ~ ZCS3) ATL431BIDBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 (ZCMS ~ ZCT3) ATL431BQDBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (ZCJS ~ ZCU3) ATL432AIDBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 (ZCNS ~ ZCV3) ATL432AQDBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (ZCOS ~ ZCW3) ATL432BIDBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 (ZCPS ~ ZCX3) ATL432BQDBZR ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (ZCQS ~ ZCY3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

www.ti.com 12-Oct-2015 Addendum-Page 2 (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 23-Oct-2015 Pack Materials-Page 1

*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) ATL432AIDBZR SOT-23 DBZ 3 3000 202.0 201.0 28.0 ATL432AQDBZR SOT-23 DBZ 3 3000 202.0 201.0 28.0 ATL432BIDBZR SOT-23 DBZ 3 3000 202.0 201.0 28.0 ATL432BQDBZR SOT-23 DBZ 3 3000 202.0 201.0 28.0 PACKAGE MATERIALS INFORMATION www.ti.com 23-Oct-2015 Pack Materials-Page 2

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