AT73C202_14 ATMEL

Document overview

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Technical content

Features

 300mA/1.8V/2.5V Switching Regulator for Baseband Supply  2.8V/80mA LDO for Baseband Pad Supply  Two 130mA/2.8V Low-noise, High PSRR RF LDO Voltage Regulators  130mA/2.7V/2.8V Baseband Low-noise, High PSRR Analog LDO Regulator  Ultra Low-power RTC LDO Voltage Regulator  Backup Battery Charger  Li-Ion or Li-polymer Battery Charger Controller  Buzzer and Vibrator Drivers  Charging LED Driver  Power Management Start-up Controller and Reset Generation  SIM Level Shifters and SIM 10mA/1.8V/2.8V LDO Voltage Regulator  Ultra-low Sleep Mode Current Consumption (17 µA typ)  Over and Under Voltage Protections  Over Temperature Protection  Low-power Mode and Sleep Mode  Straight and Easy Interfacing to any Baseband Controller  Small 5x5mm, Forty-nine Ball FBGA Package

Description

The AT73C202 is a low-cost, ultra low-power, power and battery management IC designed to interface directly with state-of-the-art cellular phones, for example with 2.5G GSM phones. It includes all required power supplies tailored to be fully compati- ble with the sub-systems of recent mobile phone chipsets, including the RF , analog and digital (DSP , microcontroller, memories) sections. The A T73C202 integrates a step-down DC-DC converter that supplies 300 mA with internal switches and two levels of voltage programming for the baseband core (1.8V and 2.5V). A low-power mode is available in order to minimize standby current con- sumption during the “quiet” transmission periods. In addition, the AT73C202 includes a lowcost battery charger, using a simple external PNP transistor for Li-Ion or Li-Polymer batteries. Battery operating conditions are maintained within safe limits under hardware control during the start-up procedure (when the phone is turned on or a charger is plugged in). The battery pre-charge is also integrated and self-operated by the A T73C202. On completion the fast charge and end-of-charge procedure is transferred to the baseband software. The AT73C202 integrates 7 low-dropout linear regulators specifically designed to sup- ply RF (x2), analog, memories, etc. It also includes a back-up battery charger and an ultra low-power regulator dedicated to the baseband real-time clock (RTC) supply dur- ing sleep mode. The hardwired start-up mechanism (power management controller state machine) ensures safe telephone operation during the wake-up and shut-down procedures, and during the multiple real-life operating conditions of a mobile phone (such charger plug- in, plug-out, battery plug-in, plug-out, low or dead battery, etc.). The A T73C202 is packaged into a 49 ball (7x7 matrix), 0.65mm pitch, 5mm x 5mm outline FBGA package. Power Management for Mobiles (PM) AT73C202 Power and Battery Management Unit for Cellular Phone Preliminary

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Figure 1. AT73C202 Functional Diagram

Table 1. AT73C202 Pin Description

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Table 1. AT73C202 Pin Description (Continued)

Figure 2. AT73202 Application Schematic

32 Ohm

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Table 2. External Component Specifications

2740B–PMGMT–05/03 Power ON Control Block This block generates the Power ON and Power OFF for the AT73C202. Power ON is activated when one of these conditions is true:  The AC/DC Charger is plugged (CHG-IN input): the DC-ON pin is then set to high level  ON/OFF Key is set to high level, which sets the ON-OFF pin to high level  UP-ON/OFF is set to high level To achieve all Power ON, the conditions below must be true:  Battery must be higher than normal operating voltage (VBATTERY > 3.2V)  Thermal protection is right (TJ < 120°C) When the ON/OFF Key is pressed (tied to VBAT ), the POWER-EN goes to high level and activates the Base Band Chip Core Supply. As the Base Band Chip detects the ON/OFF, it must drive UP-ON/OFF to high level in order to maintain the POWER-EN at high level and the ON/OFF key can be released. When the ON/OFF key is pressed again to power off, the base band chip releases the UP-ON/OFF pin to low level. Note that UP-ON/OFF can also be generated as a wake-up alarm when the phone is in OFF mode (the UP-ON/OFF pin is supplied by the back-up battery on V-RTC (1.0V to 1.8V). Charger Controller BlockThere are three specific phases of battery charging:  Pre-charge when VBA T < 3.2V with 50 mA pulsed current stopped by either software or hardware if VBAT > 3.6V or the software crashes.  Fast charge with CO current by software  Pulse charging with CO current for end of charge by software. Note: CO equals 600 mA when the battery capacity equals 600mAH. Fast charging and pulse charging use only one switch. The pre-charging will be done using a pulse charging CO during 100 ms each second. Pre-charging Phase When the Base Band Chip is powered OFF and battery voltage is under 3.2V, the charge must be performed by the AT73C202. To ensure no damage occurs, the current is limited to 50 mA or nominal capacity divided by 10 (C O / 10). When the base band chip is powered ON and sets CHG at high level the pre-charge phase is finished. In case of a software crash after power on, a watchdog timer of 10s will set the RES-B to "0" and turn off the device. Pulse & Fast charging In this phase, the base band chip controls the charge through the CHG pin and monitors the battery voltage and temperature through BAT-VOLT on the AT73C202 and temper- ature through any available temperature sensor in the battery pack. When Battery voltage is under 4.1V, the charger is always active (CHG is high level). As soon as battery voltage exceeds 4.1V, the software enters into a pulse charging phase. The pulse charging stops when battery voltage reaches 4.2V. FLASH-LED Description During the pre-charging phase, the phone is OFF. To indicate the pre-charging is cur- rently running, a LED driver (LED-OUT, open drain) is turned on every second for 100ms. During the fast charge and pulse charging, the Baseband can control the LED driver through the FLASH-LED pin.

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Ratings” may cause permanent damage to the device. Table 3. Recommended Operating Conditions Table 4. Power Supply Current Consumption on VBAT (Fully Charged Backup Battery)

V-CORE DC to DC TAMB = -20°C to 85°C, VBAT = 3V to 4.2V unless otherwise specified. C OUT = 22 µF Tantalum, LOUT = 10 µH. Table 5. Charger Interface Electrical Characteristics Table 6. V-CORE (1) DC to DC Electrical Characteristics

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Note: 1. V OUT and IOUT refer to V-CORE. Table 7. V-CORE DC to DC External Components Table 6. V-CORE (1) DC to DC Electrical Characteristics (Continued)

A-VCC – Analog TAMB = -20°C to 85°C, VBAT = 3V to 4.2V unless otherwise specified. Note: 1. V OUT and IOUT refer to A-VCC. Table 8. A-VCC (1)– Analog Electrical Characteristics Table 9. A-VCC – Analog External Components

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V-PAD – PAD Supply TAMB = -20°C to 85°C, VBAT = 3V to 4.2V unless otherwise specified. Note: 1. V OUT and IOUT refer to V-PAD. Table 10. V-PAD (1)– PAD Supply Electrical Characteristics Table 11. V-PAD – PAD Supply External Components

TAMB = -20°C to 85°C, VBAT = 3V to 4.2V unless otherwise specified. Note: 1. V OUT and IOUT refer to V-BCK. TAMB = -20°C to 85°C, VBAT = 3V to 4.2V unless otherwise specified. Table 12. Backup Battery LDO (V-BCK)(1) Electrical Characteristics Table 13. Backup Battery LDO (V-BCK) External Components Table 14. RTC LDO (V-RTC )(1) Electrical Characteristics Table 15. RTC LDO (V-RTC ) External Components

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Note: 1. V OUT and IOUT refer to V-RF1/V-RF2. Table 16. RF LDOs (V-RF1 and V-RF2)(1) Electrical Characteristics Table 17. RF LDOs (V-RF1 and V-RF2) External Components

Note: 1. V OL , IOL , IOH , TON and TOFF refer to Buz-Out. Note: 1. V OUT and IOUT refer to V-VIB. Table 18. Buzzer Open Drain Electrical Characteristics(1) Table 19. Vibrator Electrical Characteristics(1)

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Table 20. Digital Pins.

Table 20. Digital Pins. (Continued)

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Table 21. SIM Interface Electrical Characteristics.

Table 21. SIM Interface Electrical Characteristics. (Continued)

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Figure 3. Forty-nine Ball FBGA Package (Top VIew)

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