ASM3-Sxx2-NxxxH ABRACON

Document overview

  • Manufacturer or author: Provided By digicamel.com
  • PDF pages: 12

Technical content

Features

 High reliability package with enhanced silicone resin encapsulation  Available in Red, Red-Orange, and Amber  Available in 90° and 120° viewing angle  Compatible with reflow soldering process  JEDEC MSL 3

Applications

 Horticulture lighting  Commercial lighting  Architecture lighting  Specialty lighting CAUTION! This LED is ESD sensitive. Observe appropriate precautions during handling and processing. Refer to the Premium InGaN LEDs: Safety Handling Fundamentals ESD, Application Note AN-1142, for additional details. ASM3-Sxx2-NxxxH 3W 3535 Surface-Mount LED

Broadcom ASM3-Sxx2-NxxxH-DS100 ASM3-Sxx2-NxxxH Data Sheet 3W 3535 Surface-Mount LED Figure 1: Package Drawing NOTE: 1. All dimensions are in millimeters (mm). 2. Tolerance is ±0.20 mm unless otherwise specified. 3. Encapsulation = silicone. 4. Terminal finish = silver plating. 5. Dimensions in parentheses are for reference only. Part Number Dimension A (mm) Dimension B (mm) ASM3-SxC2-AxxxH 2.60 2.00 ASM3-Sx92-AxxxH 2.20 2.23 3.45 3.45 DIMENSION B 0.68 DIMENSION A 3.30 1.30 0.50 THERMAL PAD (ELECTRICALLY ISOLATED) CATHODE MARK

Broadcom ASM3-Sxx2-NxxxH-DS100 ASM3-Sxx2-NxxxH Data Sheet 3W 3535 Surface-Mount LED Device Selection Guide (TJ = 25°C, IF = 350 mA) Absolute Maximum Ratings Optical and Electrical Characteristics (TJ = 25°C, IF = 350 mA) Part Number Color Viewing Angle, 2θ½ a a. θ½ is the off-axis angle where the luminous intensity is half of the peak intensity. Luminous Flux, ɸV (lm)b, c b. Luminous flux, ɸV, is the total output measured with an integrating sphere at a single current pulse condition. c. Luminous flux, ɸV, tolerance is ±10%. PPF, ɸP (μmol/s)d, e d. Photosynthetic photon flux (PPF), ɸV, is the measurement of Photosynthetically Active Radiation (PAR) ranging from 400 nm to 700 nm. e. Values are calculated and for reference only. PPF/W (μmol/J) Dice ASM3-SR92-ALN0H Red 90 78 90 115 1.95 2.65 AlInGaP ASM3-SH92-ALN0H Red-Orange 90 78 92 115 1.80 2.45 AlInGaP ASM3-SA92-AJL0H Amber 90 58 68 90.5 0.67 0.80 AlInGaP ASM3-SRC2-ALN0H Red 120 78 90 115 1.95 2.65 AlInGaP ASM3-SHC2-ALN0H Red-Orange 120 78 92 115 1.80 2.45 AlInGaP ASM3-SAC2-AJL0H Amber 120 58 68 90.5 0.67 0.80 AlInGaP Parameters Red Red-Orange Amber Unit DC Forward Currenta a. Derate linearly as shown in Figure 12, Figure 13, Figure 14, and Figure 15. 1000 1000 700 mA Peak Forward Currentb b. Duty factor = 10%, frequency = 1 kHz. 2000 2000 2000 mA Power Dissipation 2800 2800 1960 mW Reverse Voltage Not designed for reverse bias operation. LED Junction Temperature 125 °C Operating Temperature Range –40 to +120 °C Storage Temperature Range –40 to +120 °C Color Dominant Wavelength, λd (nm) Forward Voltage, VF (V)a a. Forward voltage, V F tolerance is ±0.1V. Thermal Resistance, RθJ-S (°C/W)b b. Thermal resistance from LED junction to solder point. Red 617 622 635 1.8 2.1 2.8 4.5 Red-Orange 611 615 620 1.8 2.1 2.8 4.5 Amber 583 590 595 1.8 2.4 2.8 10.0

Broadcom ASM3-Sxx2-NxxxH-DS100 ASM3-Sxx2-NxxxH Data Sheet 3W 3535 Surface-Mount LED Performance Characteristics (TJ = 25°C, IF = 700 mA) Part Numbering System Part Number Example ASM3-SR92-ALN0H Part Number Color Viewing Angle, 2θ½ (°) Luminous Flux, ɸV (lm) PPF, ɸP (μmol/s) Forward Voltage, VF (V) ASM3-SR92-ALN0H Red 90 166.5 3.61 2.31 ASM3-SH92-ALN0H Red-Orange 90 170.2 3.33 2.31 ASM3-SA92-AJL0H Amber 90 125.8 1.24 2.78 ASM3-SRC2-ALN0H Red 120 166.5 3.61 2.31 ASM3-SHC2-ALN0H Red-Orange 120 170.2 3.33 2.31 ASM3-SAC2-AJL0H Amber 120 125.8 1.24 2.78 ASM3 - S x 1 x2 2-N x 3 x4 x5 x6 Code Description Option x1 Viewing Angle R Red H Red-Orange AA m b e r x

2 Viewing Angle 9 90°

C 120° x3 Minimum Flux Bin See Luminous Flux Bin Limits (CAT) table. x4 Maximum Flux Bin x5 Color Bin Option 0 Full distribution x6 Test Option H Test current = 350 mA x1 : R ˗̶ Red color x3 : 9 ˗̶ 90° viewing angle x4 : L ˗̶ Minimum radiant flux bin L x5 : N ˗̶ Maximum radiant flux bin N x6 : H ˗̶ Test current = 350 mA

ASM3-Sxx2-NxxxH Data Sheet 3W 3535 Surface-Mount LED Broadcom ASM3-Sxx2-NxxxH-DS100 Bin Information Luminous Flux Bin Limits (CAT) Tolerance = ±10% Color Bin Limits (BIN) Tolerance = ±1.0 nm Forward Voltage Limits (VF) Tolerance = ±0.1V Example of bin information on reel and packaging label: Bin ID Luminous Flux, ɸV (lm) Min. Max. J 58.0 67.3 K 67.3 78.0 L 78.0 90.5 M 90.5 105.0 N 105.0 115.0 Bin ID Dominant Wavelength, λd (nm) Min. Max. Amber 2 583 586 3 586 589 4 589 592 5 592 595 Red-Orange 16 1 1 6 1 6 2 616 620 3 620 625 Red — 617 635 Bin ID Forward Voltage, VF (V) Min. Max. 11 . 8 2 . 0 22 . 0 2 . 2 32 . 2 2 . 4 42 . 4 2 . 6 52 . 6 2 . 8 CAT : J ˗̶ Luminous Flux bin J BIN : 2 ˗̶ Color bin 2 VF : 2 ˗̶ Forward Voltage bin 2

ASM3-Sxx2-NxxxH Data Sheet 3W 3535 Surface-Mount LED Broadcom ASM3-Sxx2-NxxxH-DS100 Precautionary Notes Soldering  Do not perform reflow soldering more than twice. Observe necessary precautions of handling moisture- sensitive device as stated in the following section.  Do not apply any pressure or force on the LED during reflow and after reflow when the LED is still hot. Figure 19: Recommended Lead-Free Reflow Soldering Profile Handling Precautions The encapsulation material of the LED is made of silicone for better product reliability. Compared to epoxy encapsulant, which is hard and brittle, silicone is softer and flexible. Observe special handling precautions during assembly of silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. Refer to Broadcom Application Note AN5288, Silicone Encapsulation for LED: Advantages and Handling Precautions, for additional information.  Do not poke sharp objects into the silicone encapsulant. Sharp objects, such as tweezers or syringes, might apply excessive force or even pierce through the silicone and induce failures to the LED die or wire bond.  Do not touch the silicone encapsulant. Uncontrolled force acting on the silicone encapsulant might result in excessive stress on the wire bond. Hold the LED only by the body.  Do not stack assembled PCBs together. Use an appropriate rack to hold the PCBs.  The surface of silicone material attracts dust and dirt easier than epoxy due to its surface tackiness. To remove foreign particles on the surface of silicone, use a cotton bud with isopropyl alcohol (IPA). During cleaning, rub the surface gently without putting too much pressure on the silicone. Ultrasonic cleaning is not recommended.  For automated pick and place, Broadcom has tested a nozzle size with OD 3.7 mm and ID 3.0 mm to work with this LED. However, due to the possibility of variations in other parameters such as pick and place machine maker/model, and other settings of the machine, verify that the selected nozzle will not cause damage to the LED. Application Precautions  The drive current of the LED must not exceed the maximum allowable limit across temperature as stated in the data sheet. Constant current driving is recommended to ensure consistent performance.  Circuit design must cater to the whole range of forward voltage (V F) of the LEDs to ensure the intended drive current can always be achieved.  The LED exhibits slightly different characteristics at different drive currents, which can result in a larger variation of performance (meaning: intensity, wavelength, and forward voltage). Set the application current as close as possible to the test current to minimize these variations.  Do not use the LED in the vicinity of material with sulfur content or in environments of high gaseous sulfur compounds and corrosive elements. Examples of material that might contain sulfur are rubber gaskets, room-temperature vulcanizing (RTV) silicone rubber, rubber gloves, and so on. Prolonged exposure to such environments can affect the optical characteristics and product life.  White LEDs must not be exposed to acidic environments and must not be used in the vicinity of any compound that can have acidic outgas, such as, but not limited to, acrylate adhesive. These environments have an adverse effect on LED performance.  Avoid rapid change in ambient temperature, especially in high-humidity environments, because they cause condensation on the LED.  If the LED is intended to be used in harsh or outdoor environment, protect the LED against damages caused by rain water, water, dust, oil, corrosive gases, external mechanical stresses, and so on. 10 to 30 SEC. 6°C/SEC. MAX. 255 – 260°C 3°C/SEC. MAX. 217°C 200°C 150°C 3°C/SEC. MAX. 60 – 120 SEC. 100 SEC. MAX. TIME TEMPERATURE

ASM3-Sxx2-NxxxH Data Sheet 3W 3535 Surface-Mount LED Broadcom ASM3-Sxx2-NxxxH-DS100 Thermal Management The optical, electrical, and reliability characteristics of the LED are affected by temperature. Keep the junction temperature (T J) of the LED below the allowable limit at all times. TJ can be calculated as follows: TJ = TA + RθJ-A x IF x VFmax where: TA = Ambient temperature (°C) RθJ-A = Thermal resistance from LED junction to ambient (°C/W) IF = Forward current (A) VFmax = Maximum forward voltage (V) The complication of using this formula lies in TA and RθJ-A. Actual TA is sometimes subjective and hard to determine. RθJ-A varies from system to system depending on design and is usually not known. Another way of calculating TJ is by using the solder point temperature, TS as follows: TJ = TS + RθJ-S x IF x VFmax where: TS = LED solder point temperature as shown in the following figure (°C) RθJ-S = Thermal resistance from junction to solder point (°C/W) IF = Forward current (A) VFmax = Maximum forward voltage (V) Figure 20: Solder Point Temperature on the PCB TS can be easily measured by mounting a thermocouple on the soldering joint as shown in preceding figure, while RθJ-S is provided in the data sheet. Verify the TS of the LED in the final product to ensure that the LEDs are operating within all maximum ratings stated in the data sheet. Eye Safety Precautions LEDs can pose optical hazards when in operation. Do not look directly at operating LEDs because it might be harmful to the eyes. For safety reasons, use appropriate shielding or personal protective equipment. T S POINT PACKAGE MARKING PCB

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