AS300 ETC
Document overview
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Technical content
Features
¥ Calibrated directly in Kelvin ¥ Linear 10 mV/¡C scale factor ¥ 1¡C typical accuracy at 27¡C (300 K) ¥ Fully rated for Ð40 to 125¡C (233 to 398 K) ¥ Suitable for remote applications ¥ Low-impedance output, 0.3 ½ for a 1 mA load ¥ Now available in the SOT-223 for improved substrate temperature sensing
Description
The AS300 is a two-terminal integrated circuit temperature sensor. It is a precision-trimmed shunt type regulator that emulates a zener diode in function. Its output voltage is linearly proportional to temperature in Kelvin. The output voltage is calibrated for 3.000 V at 27¡C (300 K) and increases by 10 mV/¡C. The AS300 is available in four packages.The SOT-223 offers a large heat-sink for transferring heat to the die for fast and accurate thermal sensing. The SOT-223 is especially effective at sensing the tem- perature of hybrid and MCM substrates. The SOT-23 is best-suited for applications requiring a small footprint or precision force/sense metering. SEMICONDUCTOR Pin Configuration Ñ Top view
Ordering Information
TO-92 (LP) SOT-223 (G) GND (F) GND (S) VTEMP GND (F) GND (S) SOIC (D) N/C N/C V TEMP (F) VTEMP (F) GND (S) GND (F) N/C N/C SOT-23/3L (VS) VTEMP GND GND Circuit Type: Shunt Temperature Sensor AS300 LP A Packaging Option: A B T Package Style: D G LP VS = Ammo Pack = Bulk = Tube = Tape and Reel (7" Reel Dia) = Tape and Reel (13" Reel Dia) = SOIC = SOT-223 = TO-92 = SOT-23/3L
AS300 Shunt Temperature Sensor Functional Block Diagram Pin Function Description Pin Number TO, SOT SOIC Function Description 1 1 GND (S) Optional sense pin ground, otherwise tie to substrate pin GND (F). 2 2 GND (F) Signal ground and circuit substrate. 3 6 VTEMP (F) Output voltage proportional to temperature. VTEMP is nominally 3.00 V at 27¡C (300 K) and increases at 10 mV/ ¡C. Ð 5 VTEMP (S) Optional sense pin for VTEMP. Available on the 8L SOIC package only. Tie pin to VTEMP (F) if not using force/sense metering. 10 mV/°C GND VTEMP Absolute Maximum Ratings Parameter Symbol Rating Unit Supply Current IREF 20 mA Continuous Power Dissipation at 25¡C PD TO-92 775 mW SOT-223 1250 mW 8L SOIC 750 mW SOT-23/3L 200 mW Junction Temperature TJ 150 ¡C Operating Temperature Ð40 to 125 ¡C Storage Temperature TSTG Ð65 to 150 ¡C Lead Temp, Soldering 10 Seconds TL 300 ¡C Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sec- tions of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may af fect reliability.
AS300Shunt Temperature Sensor Typical Thermal Resistances Package qJA qJC Typical Derating TO-92 160¡C/W 80¡C/W 6.3 mW/¡C SOT-223 115¡C/W 8¡C/W 8.7 mW/¡C 8L SOIC 175¡C/W 45¡C/W 5.7 mW/¡C SOT-23/3L 575¡C/W 150¡C/W 1.7 mW/¡C
Electrical Characteristics
Electrical Characteristics are guaranteed over the full junction temperature range (Ð40 to 125 ¡C). Ambient temperature must be derated based upon power dissipation and package thermal characteristics. Parameter Symbol Test Condition Min. Typ. Max. Unit Output Voltage VTEMP IK = 2 mA, TJ = 27¡C (300 K) 2.970 3.000 3.030 V VTEMP IK = 2 mA, TJ = 100¡C (373 K) 3.690 3.730 3.770 V Temperature Coefficient Error IK = 2 mA, deviation from 10 mV/ ¡C 40 µV/¡C Minimum Operating Current IK(min) 0.6 mA Output Impedance ZKA IK = 0.6 to 5.5 mA 0.3 2 ½ VTEMP IK VIN Test Circuit Figure 1