AS1116-BQFT

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Technical content

The technical content of this austriamicrosystems datasheet is still valid. Contact information: Headquarters: ams AG Tobelbaderstrasse 30

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64 LED Driver wi th Detailed E rror Detection

1 General Description

nt. LED brightness can be controlled by analog or digital means. need for continuous device reprogramming. nal clock is also supported. The device is available in a QSOPx24 and TQFN(4x4)x24 package. Figure 1. AS1116 - Typical Application Diagram

2 Key Features

3 Applications

mobile phones, personal electronic and toys.

4 Pinout

Figure 2. Pin Assignments (Top View) 24 Digit Drive Lines . Eight digit drive lines that sink current from the display cathode. serial data are latched on the rising edge of this pin. decimal point drive that source current to the display. VDD 19 16 Positive Supply Voltage . Connect to +2.7 to +5.5V supply. pin is used to daisyxchain several devices and is never highximpedance. circuitxboard ground plane to maximize power dissipation.

www.austriamicrosystems.com/LEDxDriverxICs/AS1116 Revision 1.08 3 x 23 AS1116 Datasheet x Absolute Maximum Ratings

5 Absolute Maximum Ratings

Stresses beyond those listed in Ta ble 2 may cause permanent damage to the device. These are s tress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical Characteristics on page 4 is not implied. Exp osure to absolute maximum rating conditions for extended periods may affect device reliability. T able 2. Absolute Maximum Ratings Parameter Min Max Units Notes Electrical Parameters Input Voltage Range VDD to GND x0.3 7 V Al l other pins to GND x0.3 7 or VDD + 0.3 V Cu rrent DIG0:DIG7 Sink Current 500 mA SEGA:SEGG, SEGDP 100 mA Input Current (latchxup immunity) ±100 mA Norm: JEDEC 78 Electrostatic Discharge Electrostatic Discharge Digital outputs 1000 V Norm: MIL 833 E method 3015 All other pins 1000 V Thermal Information Thermal Resistance Θ JA 88 ºC/W on PCB, QSOPx24 package .5 ºC/W on PCB, TQFN(4x4)x24 package Temperature Ranges and Storage Conditions Junction Temperature +150 °C Storage Temperature x55 +150 ºC Package Body Temperature +260 ºC The reflow peak soldering temperature (body temperature) specified is in accordance with IPC/JEDEC J-STD-020 “Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices”. The lead finish for Pbxfree leaded packages is matte tin (100% Sn). Humidity nonxcondensing 5 85 % Moisture Sensitive Level QSOPx24 package 1 % Represents a max. floor life time of unlimited TQFN(4x4)x24 package 3 % Represents a max. floor life time 168h ams AG Technical content still valid

www.austriamicrosystems.com/LEDxDriverxICs/AS1116 Revision 1.08 4 x 23 AS1116 Datasheet x Electrical Characteristics

6 Electrical Characteristics

parameters with min and max values are guaranteed with production tests or SQC (Statistical Quality Control) methods. T able 3. Electrical Characteristics Symbol Parameter Conditions Min Typ Max Unit TAMB Operating Temperature Range x4 0 +85 °C TJ Op erating Junction Temperature x40 +125 °C VDD Operating Supply Voltage 2. 7 5.5 V IDDSD Shutdown Supply Current Al l digital inputs at VDD or GND, TAMB = +25ºC 0. 2 2 µA IDD Operating Supply Current RSET = open circuit. 0. 35 0.6 mAAll segments and decimal point on; ISEG = x40mA. 33 5 fOSC Display Scan Rate 8 digits scanned 0.6 0.8 1.2 kHz IDIGIT Digit Drive Sink Current VOUT = 0.65V 32 0 mA ISEG Segment Drive Source Current VDD = 5.0V, VOUT = (VDD x1V) 7 x42 x47 mA ΔISEG Segment Drive Current Matching 3 % IS EG Segment Drive Source Current Av erage Current 47 mA T able 4. Logic Inputs/Outputs Characteristics Symbol Parameter Conditions Min Typ Max Unit IIH, IIL Input Current SDI, SCL, LD VIN = 0V or VDD x1 1 µ A VIH Logic High Input Voltage 4. 5V < VDD < 5.5V 0. 6 x VDD V 7V < VDD < 4.5V 0. 7 x VDD V VIL Logic Low Input Voltage VDD = 5.0V 0. 8 V VDD = 3.0V 0. 6 VOH Output High Voltage SD O, ISOURCE = x1mA, VDD = 5.0V VDD x 1 V SD O, ISOURCE = x1mA, VDD = 3.0V VDD x 0.5 VOL Output Low Voltage SD O, ISINK = 1mA 0. 4 V ΔVI Hysteresis Voltage SD I, SCL, LD 1 V Open Detection Level Threshold 0.7x VDD 0.75x VDD 0.8x VDD V Sh ort Detection Level Threshold 0.05x VDD 0.1x VDD 0.15x VDD V ams AG Technical content still valid

www.austriamicrosystems.com/LEDxDriverxICs/AS1116 Revision 1.08 5 x 23 AS1116 Datasheet x Electrical Characteristics See Figure 19 on page 10 for more information. T ab le 5. SPI Timing Characteristics Symbol Parameter Conditions Min Typ Max Unit tCP SCL Clock Period 10 0 ns tCH SCL Pulse Width High 20 n s tCL SCL Pulse Width Low 20 n s tCSS LD to SCL Rise Setup Time 25 n s tCSH SCL Rise to LD Rise Hold Time 10 n s tDS SDI Setup Time 0 n s tDH SDI Hold Time 5 n s tDO Output Data Propagation Delay CLOAD = 50pF 25 ns tLDCK LD Rising Edge to SCL Rising Edge 20 n s tCSW Minimum LD Pulse High 20 n s tDSPD DataxtoxSegment Delay 2. 25 ms ams AG Technical content still valid

7 Typical Operating Characteristics

Figure 5. Segment Current vs. T emperature; Figure 6. Segment Current vs. R SET ;

8 Detailed Description

Figure 15. Block Diagram (QSOP-24 Package)

Figure 19. Interface Timing is time, all registers should be programmed for normal operation. is set to the minimum values. Note: During shutdown mode the DigitxRegisters maintain their data. ing shutdown mode). For minimum supply current in shutdown mode, logic input should be at GND or VDD (CMOS logic level). used with an external clock, Shutdown Register bit D7 should be set to 1 when writing to the Shutdown Register.

www.austriamicrosystems.com/LEDxDriverxICs/AS1116 Revision 1.08 11 x 23 AS1116 Datasheet x Detailed Description Digit- and Control-Registers The AS1116 devices contain 8 DigitxRegisters,11 controlxregisters and 8 diagnosticxregisters, which are listed in Ta ble 7. All registers are sel ected using a 8xbit address word, and communication is done via the serial interface. /square6 Digit Registers – These registers are realized with an onxchip 64xbit memory. Each digit can be controlled directly without rewriting the wh ole register contents. /square6 Control Registers – These registers consist of decode mode, display intensity, number of scanned digits, shutdown, display test and feax tu res selection registers. Note: Write operation: D14=0; Read operation: D14=1. T able 7. Register Address Map Type Register Address Page D15 D14 D13 D12 D11 D10 D9 D8 D7:D0 NoxOp X 0 0 0 0 0 0 0 16 Digit Register Digit 0 X 0 0 0 0 0 0 1 (see Table 10 on page 12, Table 11 on page 13 and Table 12 on page 13) N/A D igit 1 X 0 0 0 0 0 1 0 N/A Digit 2 X 0 0 0 0 0 1 1 N/A Digit 3 X 0 0 0 0 1 0 0 N/A Digit 4 X 0 0 0 0 1 0 1 N/A Digit 5 X 0 0 0 0 1 1 0 N/A Digit 6 X 0 0 0 0 1 1 1 N/A Digit 7 X 0 0 0 1 0 0 0 N/A Control Register DecodexMode X 0 0 0 1 0 0 1 ( see Table 9 on page 12) 12 Global Intensity X 0 0 0 1 0 1 0 ( see Table 16 on page 15) 15 Scan Limit X 0 0 0 1 0 1 1 ( see Table 18 on page 15) 15 Shutdown X 0 0 0 1 1 0 0 ( see Table 8 on page 12) 12 Not Used X 0 0 0 1 1 0 1 N/A Fea ture X 0/1 0 0 1 1 1 0 ( see Table 19 on page 16) 16 Display Test Mode X 0 0 0 1 1 1 1 ( see Table 13 on page 14) 12 DIG0:DIG1 Intensity X 0 0 1 0 0 0 0 ( see Table 17 on page 15) DIG 2:DIG3 Intensity X 0 0 1 0 0 0 1 ( see Table 17 on page 15) DIG 4:DIG5 Intensity X 0 0 1 0 0 1 0 ( see Table 17 on page 15) DIG 6:DIG7 Intensity X 0 0 1 0 0 1 1 ( see Table 17 on page 15) Diagnostic Register Diagnostic Digit 0 X 1 0 1 0 1 0 0 N/A Diagnostic Digit 1 X 1 0 1 0 1 0 1 N/A Diagnostic Digit 2 X 1 0 1 0 1 1 0 N/A Diagnostic Digit 3 X 1 0 1 0 1 1 1 N/A Diagnostic Digit 4 X 1 0 1 1 0 0 0 N/A Diagnostic Digit 5 X 1 0 1 1 0 0 1 N/A Diagnostic Digit 6 X 1 0 1 1 0 1 0 N/A Diagnostic Digit 7 X 1 0 1 1 0 1 1 N/A ams AG Technical content still valid

The Shutdown Register controls AS1116 shutdown mode. bit D1 corresponds to digit 1 and so on). Table 10 lists some examples of the possible settings for the Decode Enable Register bits. Note: A logic high enables decoding and a logic low bypasses the decoder altogether. When decode mode is used, the decoder looks only at the lowerxnibble (bits D3:D0) of the data in the DigitxRegisters, disregarding bits D6:D4. codexB font; Table 11 lists the HEX font. pairing of each data bit to the appropriate segment line. Table 9. Decode Enable Register Format Examples The decimal point can be enabled with every character by setting bit D7 = 1.

Figure 20. Standard 7-Segment LED The decimal point can be enabled with every character by setting bit D7 = 1.

www.austriamicrosystems.com/LEDxDriverxICs/AS1116 Revision 1.08 14 x 23 AS1116 Datasheet x Detailed Description Display-Test Mode The AS1116 can detect open or shorted LEDs. Readout of either open LEDs (D2=1) or short LEDs (D1=1) is possible, as well as a OR relation of op en and short (D1=D2=1). After a diagnostic run bit D4 can be read to clarify if an error occurred before reading out detailed diagnostic data. Note: All settings of the digitx and controlxregisters are maintained. LED Diagnostic Registers These eight registers contain the result of the LED open/short test for the individual LED of each digit. N o te: If more than 2 shorts occure in the LED array, detection of individual LED fault could become limited to blocs. T able 13. Testmode Register Summary D7 D6 D5 D4 D3 D2 D1 D0 X REXT_short REXT_open LED_global LED_test LED_open LED_short DISP_test T able 14. T estmode Register Bit Description (Address (HEX) = 0x0F)) Addr: 0x0F Address Bit Bit Name Default Access D7:D0 D0 DISP_test 0 W Optical display test. (Testmode for external visual test.) 0: Normal operation; 1: Run display test (All digits are tested independently from scan limit & shutdown register.) D1 LED_short 0 W Starts a test for shorted LEDs. (Can be set together with D2) 0: Normal operation; 1: Activate testmode D2 LED_open 0 W Starts a test for open LEDs. (Can be set together with D1) 0: Normal operation; 1: Activate testmode D3 LED_test 0 R Indicates an ongoing open/short LED test 0: No ongoing LED test; 1: LED test in progress D4 LED_global 0 R Indicates that the last open/short LED test has detected an error 0: No error detected; 1: Error detected D5 REXT_open 0 R Checks if external resistor REXT is open REXT correct; 1: REXT is open REXT_short 0 R Checks if external resistor REXT is shorted REXT correct; 1: REXT is shorted D7 0 x Not used T able 15. LED Diagnostic Register Address Register HEX Address Segment Register HEX Address Segment Digit D7 D6 D5 D4 D3 D2 D1 D0 Digit D7 D6 D5 D4 D3 D2 D1 D0 0x14 DIG0 DP A B C D E F G 0x18 DIG4 DP A B C D E F G0x15 DIG1 0x19 DIG5 0x16 DIG2 0x1A DIG6 0x17 DIG3 0x1B DIG7 ams AG Technical content still valid

intesity command will only write to the associated individual intensity register. Display brightness is controlled by an integrated pulsexwidth modulator which is controlled by the lowerxnibble of the Intensity Control Register. The modulator scales the average segmentxcurrent in 16 steps from a maximum of 15/16 down to 1/16 of the peak current set by RSET . N is the number of digits. Since the number of displayed digits influences the brightness, RSET should be adjusted accordingly. te: To avoid differences in brightness this register should not be used to blank parts of the display (leading zeros). Table 17. Intensity Register Address

www.austriamicrosystems.com/LEDxDriverxICs/AS1116 Revision 1.08 16 x 23 AS1116 Datasheet x Detailed Description Feature Register (0x0E) The Feature Register is used for enabling various features including switching the device into external clock mode, applying an external reset, se lecting codexB or HEX decoding, enabling or disabling blinking, enabling or disabling the SPIxcompatible interface, setting the blinking rate, and resetting the blink timing. Note: At powerxup the Feature Register is initialized to 0. No-Op Register (0xX0) The NoxOp Register is used when multiple AS1116 devices are cascaded in order to support displays with more than 8 digits. The cascading mu st be done in such a way that all SDO pins are connected to SDI of the next AS1116 (see Figure 21 on page 18). The LD and SCL sigx nal s are connected to all devices. For example, if five devices are cascaded, in order to perform a write operation to the fifth device, the writexcommand must be followed by four noxoperation commands. When the LD signal goes high, all shift registers are latched. The first four devices will receive noxoperation commands and only the fifth device will receive the intended operation command, and subsequently update its register. T able 19. Feature Register Summary D7 D6 D5 D4 D3 D2 D1 D0 blink_start sync blink_freq_sel blink_en NU decode_sel reg_res clk_en T able 20. Feature Register Bit Descriptions (Address (HEX) = 0xXE) Addr: 0xXE Feature Register Enables and disables various device features. Bit Bit Name Default Access Bit Description D0 clk_en 0 R/W External clock active. 0 = Internal oscillator is used for system clock. 1 = Pin CLK of the serial interface operates as system clock input. D1 reg_res 0 R/W Resets all control registers except the Feature Register. 0 = Reset Disabled. Normal operation. 1 = All control registers are reset to default state (except the Feature Register) identically after powerxup. Note: The Digit Registers maintain their data. D2 decode_sel 0 R/W Selects display decoding for the selected digits (Table 9 on page 12). 0 = Enable CodexB decoding (see Table 10 on page 12). 1 = Enable HEX decoding (see Table 11 on page 13). D3 N U Not used D4 blink_en 0 R/W Enables blinking. 0 = Disable blinking. 1 = Enable blinking. D5 blink_freq_sel 0 R/W Sets blink with low frequency (with the internal oscillator enabled): 0 = Blink period typically is 1 second (0.5s on, 0.5s off). 1 = Blink period is 2 seconds (1s on, 1s off). D6 sync 0 R/W Synchronizes blinking on the rising edge of pin LD. The multiplex and blink timing counter is cleared on the rising edge of pin LD. By setting this bit in multiple devices, the blink timing can be synchronized across all the devices. D7 blink_start 0 R/W Start Blinking with display enabled phase. When bit D4 (blink_en) is set, bit D7 determines how blinking starts. 0 = Blinking starts with the display turned off. 1 = Blinking starts with the display turned on. ams AG Technical content still valid

www.austriamicrosystems.com/LEDxDriverxICs/AS1116 Revision 1.08 17 x 23 AS1116 Datasheet x Typical Application

9 Typical Application

lecting R SET Resistor Value and Using External Drivers Brightness of the display segments is controlled via RSET . The current that flows between VDD and ISET defines the current that flows through th e LEDs. Segment current is about 200 times the current in ISET . Typical values for RSET for different segment currents, operating voltages, and LED voltx ag e drop (VLED ) are given in Ta ble 21 & Table 22. The maximum current the AS1116 can drive is 47mA. If higher currents are needed, exterx nal drivers must be used, in which case it is no longer necessary that the devices drive high currents. Note: The display brightness can also be logically controlled (see Intensity Control Register (0x0A) on page 15). Calculating Power Dissipation The upper limit for power dissipation (PD) for the AS1116 is determined from the following equation: PD = (VDD x 5mA) + (VDD - VLED)(DUTY x ISEG x N) (E Q 1) Where: V DD is the supply voltage. DU TY is the duty cycle set by intensity register (page 15). N is the number of segments driven (worst case is 8) V LED is the LED forward voltage ISEG = segment current set by RSET Di ssipation Example: ISEG = 40mA, N = 8, DUTY = 15/16, VLED = 2.2V at 40mA, VDD = 5V (E Q 2) PD = 5V(5mA) + (5V - 2.2V)(15/16 x 40mA x 8) = 0.865W (EQ 3) Thus, for a QSOPx24 package Θ JA = +88°C/W, the maximum allowed TAMB is given by: TJ,MAX = TAMB + PD x Θ JA = 150° C = TAMB + 0.865W x 88° C/W (E Q 4) In this example the maximum ambient temperature must stay below 73.88°C. ISEG (mA) V LED V LED V LED VDD = 2.7V 5kΩ 4.4kΩ VDD = 3.3V 6.7kΩ 6.4kΩ 5.7kΩ VDD = 3.6V 7.5kΩ 7.2kΩ 6.6kΩ 5.5kΩ T able 22. RSET vs. Segment Current and LED Forward Voltage, V DD = 4.0V & 5.0V ISEG (mA) V LED V LED VDD = 4.0V VDD = 5.0V ams AG Technical content still valid

The application example in Fi gure 21 shows the AS1116 in the 8x8 LED dot matrix mode. the 64 LEDs can be addressed separately. The columns are selected via the digits as listed in Table 7 on page 11. addressed as described in Table 12 on page 13, where bit D0 corresponds to segment G and bit D7 cor responds to segment DP. Note: For a multiplexdigit dot matrix, multiple AS1116 devices can be cascaded easily. Figure 21. Application Example as LED Dot Matrix Driver rence and wiring inductance. y ripple (see Figure 21 on page 18).

Figure 22. QSOP-24 Marking

Figure 24. QSOP-24 Package

Figure 25. TQFN(4x4)-24 Package

www.austriamicrosystems.com/LEDxDriverxICs/AS1116 Revision 1.08 22 x 23 AS1116 Datasheet x Ordering Information The devices are available as the standard products shown in T able 24. No te: All products are RoHS compliant and austriamicrosystems green. Buy our products or get free samples online at ICdirect: http://www.austriamicrosystems.com/ICdirect Technical Support is found at http://www.austriamicrosystems.com/TechnicalxSupport For further information and requests, please contact us mailto:sales@austriamicrosystems.com or find your local distributor at http://www.austriamicrosystems.com/distributor T able 24. Ordering Information Ordering Code Marking Description Delivery Form Package AS1116xBSST AS1116 64 LED Driver with Detailed Error Detection Tape and Reel QSOPx24 AS1116xBQFT ASR9 64 LED Driver with Detailed Error Detection Tape and Reel TQFN(4x4)x24 ams AG Technical content still valid

www.austriamicrosystems.com/LEDxDriverxICs/AS1116 Revision 1.08 23 x 23 AS1116 Datasheet Copyrights Copyright © 1997x2012, austriamicrosystems AG, Tobelbaderstrasse 30, 8141 Unterpremstaetten, AustriaxEurope. Trademarks Registered ®. A ll rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. All products and companies mentioned are trademarks or registered trademarks of their respective companies. Disclaimer Devices sold by austriamicrosystems AG are covered by the warranty and patent indemnification provisions appearing in its Term of Sale. a ustriamicrosystems AG makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. austriamicrosystems AG reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with austriamicrosystems AG for current information. This product is intended for use in normal commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical lifexsupport or lifexsustaining equipment are specifically not recommended without additional processing by austriamicrosystems AG for each application. For shipments of less than 100 parts the manufacturing flow might show deviations from the standard production flow, such as test flow or test location. The information furnished here by austriamicrosystems AG is believed to be correct and accurate. However, austriamicrosystems AG shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any third party shall arise or flow out of austriamicrosystems AG rendering of technical or other services. Contact Information Headquarters a ustriamicrosystems AG Tobelbaderstrasse 30 Ax8141 Unterpremstaetten, Austria Tel: +43 (0) 3136 500 0 Fax: +43 (0) 3136 525 01 For Sales Offices, Distributors and Representatives, please visit: http://www.austriamicrosystems.com/contact ams AG Technical content still valid