AN26130A

AN26130A PANASONIC

Document overview

• Manufacturer or author: Provided By digicamel.com
• PDF pages: 16

Technical content

Datasheet sections

1Publication date: December 2010 Ver. AEB DATA SHEET Part No. Package Code No. AN26130A XLGA012-L-0303

3Ver. AEB AN26130A Loop through Amplifier IC for VHF & UHF Band (40 MHz to 900 MHz) Applications „ Overview y AN26130A is a Loop through amplifier IC for VHF and UHF band (40 MHz to 900 MHz) applications. y Realizing high performance by using 0.30 μm Bi-CMOS process (fT = 20 GHz, fmax = 20 GHz). y Off and Loop through mode is Changeable, Controlled by Integrated CMOS logic circuit. y Achieving miniaturization by using small size package. „ Features y 1-IN, 2-OUT Active Loop through. y Operation voltage +3.30 V typ. y Current consumption 120 mA typ. (Loop through mode) 0.1 μA typ. (Off through mode) yGain RF_OUT1 10.0 dB typ. fRX = 620 MHz, Z 0 = 50 Ω RF_OUT2 −4.0 dB typ. fRX = 620 MHz, Z 0 = 50 Ω y Low noise figure RF_OUT1 4.0 dB typ. fRX = 620 MHz, Z 0 = 50 Ω y Low distortion RF_OUT1 14.0 dBm typ. fRX = 620 MHz, Z 0 = 50 Ω y Small package (12 pin Plastic Package). „ Applications yVHF & UHF band (40 MHz to 900 MHz) applications „ Package y 12 pin Fine Pitch Land Grid Array Package (LGA Type) Size : 3.00 mm × 2.50 mm × 0.80 mm „ Type yBi–CMOS IC

4Ver. AEB „ Application Circuit Example (Block Diagram) Notes) y This application circuit is an example. The operation of mass production set is not guaranteed. Perform enough evaluation and verification on the design of mass production set. y This block diagram is for explaining functions. The part of the block diagram may be omitted, or it may be simplified. RF_IN Logic VCNT OTOUT Vdd NC RF_OUT1 10 9 8 7 13 4 5 6 FIN FIN LTOUT Trans1 RF_OUT2 ATT IN ATT OUT R2 ATT CNTOUT1 IN

5Ver. AEB „ Pin Descriptions Off through outputOutputOT OUT11 VSSGroundVSS310 RF inputInputIN9 VSSGroundVSS28 Non connectNCNC7 VSSGroundVSS11 ATT inputInputATT IN2 Loop through outputOutputLT OUT12 VDDPower supplyVDD4 RF output 1OutputOUT15 Off and Loop through mode control inputInputCNT6 ATT outputOutputATT OUT3 VSSGroundVSS4FIN DescriptionTypePin namePin No.

6Ver. AEB „ Absolute Maximum Ratings —mA170IDDSupply current2 NotesUnitRatingSymbolParameterA No. *3°C–40 to +150TstgStorage temperature5 *3°C–20 to +80ToprOperating ambient temperature4 *2mW65.5PDPower dissipation3 *1V3.6VDDSupply voltage1 Notes) *1 : The values under the condition not exceeding the above absolute maximum ratings and the power dissipation. *2 : The power dissipation shown is the value at T a = 80°C for the independent (unmounted) IC package without a heat sink. When using this IC, refer to • PD-Ta diagram in the „ Technical Data standard and design the heat radiation with sufficient margin so that the allowable value might not be exceeded based on the conditions of power supply voltage, load, and ambient temperature. *3 : Except for the power dissipation, operating ambient temp erature, and storage temperature, all ratings are for Ta = 25°C. „ Operating Supply Voltage Range Supply voltage range *1 NotesUnitRangeSymbolParameter V3.13 to 3.47VDD Note) *1 : The values under the condition not exceeding the above absolute maximum ratings and the power dissipation. Note) Absolute maximum ratings are limit values which do not result in damages to this IC, and IC operation is not guaranteed at these limit values.

7Ver. AEB „ Allowable Voltage Range Notes) y Allowable current and voltage ranges are limit ranges which do not result in damages to this IC, and IC operation is not guaranteed within these limit ranges. y Do not apply voltage to N.C. pins. y Voltage values are with respect to the GND. y Applying external voltage to any pin not mentioned below leads to the malfunction and the damage of the device. y Below ratings are specified for prevention of malfunction and stress, not for guaranteed operation. Notes) *1 : RF signal input pin (Maximum input power is +17dBm). Do not apply DC current. *2 : RF signal output pin. Do not apply DC current. *3 : RF signal output pin with DC current. Do not apply a voltage different from V DD voltage. *2V– 0.3 to (VDD + 0.3)OT OUT11 *3V(VDD – 0.05) to (VDD + 0.05)ATT OUT3 *3V(VDD – 0.05) to (VDD + 0.05)OUT15 —V– 0.3 to (VDD + 0.3)CNT6 *1V—ATT IN2 – 0.3 to (VDD + 0.3)LT OUT NotesUnitRatingPin namePin No. *1V—IN9 *2V12

8Ver. AEB —mA160120— VDD current at Loop through mode No input signal I DDLTSupply current LTDC-1 —μA100.1—VDD current at Off through mode No input signalIDDOTSupply current OTDC-2 —V—3.302.805VIH = VDD × 0.85VIHSW voltage (Loop through mode)DC-3 —V0.330.0—VIL = VDD × 0.10VILSW voltage (Off through mode)DC-4 —μA103.3—Current at CNT pin VIH = VDD IIHSW current (High)DC-5 Limits Typ Unit Max Notes Min ConditionsSymbolParameterB No. „ Electrical Characteristics at VDD = 3.30 V Note) T a = 25°C±2°C unless otherwise specified.

9Ver. AEB —dB−2.0−4.0−6.0Off through mode f = fRXGOTSOff through Gain OUT2A-3 —dB−1.0−4.0−7.0Loop through mode f = fRXGLTSLoop through Gain OUT2A-2 —dB12.5107.5Loop through mode f = fRXG1SPower Gain OUT1A-1 —dBm—14.08.0 Loop through mode OUT1 f1 = fRX f2 = fRX + 10 MHz Input 2 signals (f1, f2) IIP311S IIP3 + 10 MHz offset OUT1 Loop through A-4 Limits Typ Unit Max Notes Min ConditionsSymbolParameterB No. „ Electrical Characteristics (continued) at VDD = 3.30 V Note) T a = 25°C±2°C, fRX = 620 MHz, PRX = –15 dBm, Z0 = 50 Ω, CW unless otherwise specified.

10Ver. AEB „ Control Pin Mode Table Note) Control voltage range : See B No. DC-3 / B No. DC-4 at page 8 Pin voltage Loop through High —Off throughLoop through/Off through Switching (Mode Control)6 Remarks Low DescriptionPin No. „ Truth Table Note) Control voltage range : See B No. DC-3 / B No. DC-4 at page 8 Loop throughLoop throughHigh ModeIC CNT Off throughOff throughLow

11Ver. AEB OUT1 (RF output 1), ATT OUT (ATT output)—3,5 IN (RF input)1.4 V9 VSS (Ground)—0.0 V1,8,10,12 CNT (Loop through/Off through mode control input)—6 VDD (Power supply)3.30 V4 OTOUT (Loop through output), LTOUT (Off through output)—11,12 DescriptionsInternal CircuitVoltagePin No.1 „ Technical Data y I/O block circuit diagrams and pin function descriptions Note) The characteristics listed below a re reference values derived from the design of the IC and are not guaranteed. VDD VDD VSS VDD VSS VSS VSS VSS VDD

12Ver. AEB ATT IN (ATT input)—2 DescriptionsInternal CircuitVoltagePin No. „ Technical Data (continued) y I/O block circuit diagrams and pin function descriptions (Continued) Note) The characteristics listed below are reference values derived from the design of the IC and are not guaranteed. VDD VSS

13Ver. AEB „ Technical Data (continued) y PD ⎯ Ta diagram

14Ver. AEB y Special attention and precaution in using 1. This IC is intended to be used for general electronic equipment [TV]. Consult our sales staff in advance for information on the following applications: x Special applications in which exceptional quality and reliability are required, or if the failure or malfunction of this IC may directly jeopardize life or harm the human body. x Any applications other than the standard applications intended. (1) Space appliance (such as artificial satellite, and rocket) (2) Traffic control equipment (such as for automobile, airplane, train, and ship) (3) Medical equipment for life support (4) Submarine transponder (5) Control equipment for power plant (6) Disaster prevention and security device (7) Weapon (8) Others : Applications of which reliability equivalent to (1) to (7) is required It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the IC described in this book for any special application, unless our company agrees to your using the IC in this book for any special application. 2. Pay attention to the direction of LSI. When mounting it in the wrong direction onto the PCB (printed-circuit-board), it might smoke or ignite. 3. Pay attention in the PCB (printed-circuit-board) pattern layout in order to prevent damage due to short circuit between pins. In addition, refer to the Pin Description for the pin configuration. 4. Perform a visual inspection on the PCB be fore applying power, otherwise damage might happen due to problems such as a solder- bridge between the pins of the semiconductor device. Also, perform a full technical verification on the assembly quality, because the same damage possibly can happen due to conductive substances, such as solder ball, that adhere to the LSI during transportation. 5. Take notice in the use of this product that it might break or occasionally smoke when an abnormal state occurs such as output pin- V CC short (Power supply fault), output pin-GND short (Ground fault), or output-to-output-pin short (load short) . And, safety measures such as an installation of fuses are recommended because the extent of the above-mentioned damage and smoke emission will depend on the current capability of the power supply. 6. When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. 7. When using the LSI for new models, verify the safe ty including the long-term reliability for each product. 8. When the application system is designed by using this LSI, be sure to confirm notes in this book. Be sure to read the notes to descriptions and the usage notes in the book. „ Usage Notes

Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. (4) The products and product specifications described in this book are subject to change without notice for modification and/or im- provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20100202

Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. (4) The products and product specifications described in this book are subject to change without notice for modification and/or im- provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20100202