AN26018A PANASONIC
Document overview
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Technical content
Datasheet sections
1Publication date: July 2010 Ver. AEB DATA SHEET Part No. Package Code No. SSMINI-5DC AN26018A
3Ver. AEB AN26018A LNA IC for UHF Band (400 MHz to 800 MHz) Applications Overview yAN26018A is LNA-IC for UHF Band (400 MHz to 800 MHz) Applications. yRealizing high performance by using SiGe Bi-CMOS process (fT = 90 GHz, fmax = 140 GHz). yHigh/Low Gain-mode is changeable, controlled by integrated CMOS logic circuit. yAchieving miniaturization by using small size package. Features yLow voltage operation +2.85 V typ. yLow current consumption 3.0 mA typ. (High-Gain mode) 0.1 μA typ. (Low-Gain mode) yHigh gain 14.5 dB typ. fRX = 620 MHz (High-Gain mode) yLow noise figure 1.50 dB typ. fRX = 620 MHz (High-Gain mode) yLow distortion –8.0 dBm typ. fRX = 620 MHz (High-Gain mode) (IIP3 +10 MHz offset) ySmall package Applications yUHF Band (400 MHz to 800 MHz) Applications Package y5 pin Plastic Small Surface Mount Package (SMINI Type) Type yBi-CMOS IC
4Ver. AEB Application Circuit Example (Block Diagram) IN OUT VCC 123 OUT IN GND CNT (Gain control) VCC Notes) y This application circuit is shown as an example but does not guarantee the design for mass production set. y This block diagram is for explaining functions. The part of the block diagram may be omitted, or it may be simplified. y External components : See page 15
5Ver. AEB Pin Descriptions RF OutputOutputOUT5 VCCPower SupplyVCC4 High-Gain / Low-Gain SWInputCNT3 GNDGroundGND2 RF InputInputIN1 DescriptionTypePin namePin No.
6Ver. AEB Absolute Maximum Ratings Operating Supply Voltage Range ⎯mA18ICCSupply current 2 NotesUnitRatingSymbolParameterA No. *3°C–40 to +125TstgStorage temperature5 *3°C–20 to +70ToprOperating ambient temperature4 *2mW66PDPower dissipation3 *1V3.6VCCSupply voltage1 NotesUnitRangeSymbolParameter *V2.70 to 3.00VCCSupply voltage range Notes) *1 : The values under the condition not exceeding the above absolute maximum ratings and the power dissipation. *2 : The power dissipation shown is the value at T a = 70°C for the independent (unmounted) IC package. When using this IC, refer to the • PD-Ta diagram in the Technical Data and design the heat radiation with sufficient margin so that the allowable value might not be exceeded based on the conditions of power supply voltage, load, and ambient temperature. *3 : Except for the power dissipation, operating ambient temp erature, and storage temperature, all ratings are for Ta = 25°C. Note) * : The values under the condition not exceeding the above absolute maximum ratings and the power dissipation Note) Absolute maximum ratings are limit values which are not dest ructed, and are not the values to which operation is guaranteed.
7Ver. AEB Allowable Voltage Range Notes) y Allowable current and voltage ranges are limit ranges which do not result in damages to this IC, and IC operation is not guaranteed within these limit ranges. y Do not apply voltage to N.C. pins. y Voltage values are with respect to the GND. y Applying external voltage to any pin not mentioned below leads to the malfunction and the damage of the device. y Below ratings are specified for prevention of malfunction and stress, not for guaranteed operation. *2V0GND2 —IN NotesUnitRatingPin namePin No. *3V–0.3 to (VCC)OUT5 —V–0.3 to (VCC)CNT3 *1V1 Notes) *1 : RF signal input pin. Do not apply DC current. *2 : Same as GND pin. *3 : RF signal output pin. Do not apply DC current.
8Ver. AEB Electrical Characteristics at VCC = 2.85 V Note) Ta = 25°C±2°C unless otherwise specified. —V0.550.0——VILInput voltage (Low-Gain mode)DC-4 Current at CNT pin VIH = VCC VCC current at Low-Gain mode No input signal —V—2.851.40—VIHInput voltage (High-Gain mode)DC-3 —μA4011—IIHSW current (High)DC-5 DC electrical characteristics —mA4.03.0—VCC current at High-Gain mode No input signalICCHSupply current HGDC-1 —μA9.50.1—ICCLSupply current LGDC-2 Limits Typ Unit Max Notes Min ConditionsSymbolParameterB No.
9Ver. AEB Electrical Characteristics (continued) at VCC = 2.85 V Note) Ta = 25°C±2°C, fRX = 620 MHz, PRX = –30 dBm, CW unless otherwise specified. —dB—–1.5–2.0Low-Gain mode f = fRX, PRX = –20 dBmGLSPower Gain LGA-2 f1 = fRX + 10 MHz f2 = fRX + 20 MHz Input 2 signals (f1, f2) —dBm—–8.0–14.5IIP31SIIP3 +10 MHz offsetA-3 LNA AC electrical characteristics —dB16.514.512.5High-Gain mode f = fRXGHSPower Gain HGA-1 Limits Typ Unit Max Notes Min ConditionsSymbolParameterB No.
10Ver. AEB Electrical Characteristics (Reference values for design) at VCC = 2.85 V Notes) T a = 25°C±2°C, fRX = 470 MHz, 620 MHz, 770 MHz, PRX = –30 dBm, CW unless otherwise specified. The characteristics listed below are reference values derived from the design of the IC and are not guaranteed by inspection. If a problem does occur related to these characteristics, we will respond in good faith to user concerns. ———1.51.0High-Gain mode f = 300 kHz to 6 GHzKHK-FactorC-14 —dB—1210Low-Gain mode f = fRXS22LOutput Return Loss LGC-13 —dB—237High-Gain mode f = fRXS22HOutput Return Loss HGC-12 —dB—2012Low-Gain mode f = fRXS11LInput Return Loss LGC-11 —dBm—–5–11High-Gain mode f = fRXIP1dBHInput P1dBC-7 —dB—9.55.0High-Gain mode f = fRXS11HInput Return Loss HGC-10 —μs10.03.2— High-Gain mode → Low-Gain mode Low-Gain mode → High-Gain mode TSWSwitching TimeC-15 Low-Gain mode f = fRX High-Gain mode f1 = fRX – 10 MHz f2 = fRX – 20 MHz Input 2 signals (f1, f2) Low-Gain mode f = fRX Low-Gain mode f = fRX, PRX = –20 dBm *1dB1.91.5—High-Gain mode f = fRXNFHNoise Figure HGC-3 —dB2.51.5—NFL Noise Figure LGC-4 —dBm—–8.0–16.5 High-Gain mode f1 = fRX + 10 MHz f2 = fRX + 20 MHz Input 2 signals (f1, f2) IIP3H1IIP3 +10 MHz offset HGC-5 —dBm—–8.5–17.0IIP3H2IIP3 –10 MHz offset HGC-6 —dB–18–24—High-Gain mode f = fRXISOHReverse Isolation HGC-8 LNA AC electrical characteristics —dB17.014.512.0High-Gain mode f = fRXGHPower Gain HGC-1 —dB—–1.5–2.5GLPower Gain LGC-2 —dB–1.0–1.6—ISOLReverse Isolation LGC-9 Reference values Typ Unit Max Notes Min ConditionsSymbolParameterB No. Note) *1 : Connector & pattern (evaluation PCB) loss (0.1 dB) included.
11Ver. AEB Control Pins Mode Table Note) Control voltage range : See B No. DC-3 / B No. DC-4 at page 8 Truth Table Note) Control voltage range : See B No. DC-3 / B No. DC-4 at page 8 Voltage High-Gain High —Low-GainHigh-Gain/Low-Gain Switching (Gain Control)3 Note Low DescriptionsPin No. High-GainHigh-GainHigh ModeLNA CNT Low-GainLow-GainLow
12Ver. AEB Technical Data y PD ⎯ Ta diagram
13Ver. AEB Usage Notes y Special attention and precaution in using 1. This IC is intended to be used for ge neral electronic equipment [cellular phones]. Consult our sales staff in advance for information on the following applications: x Special applications in which exceptional quality and reliability are required, or if the failure or malfunction of this IC may directly jeopardize life or harm the human body. x Any applications other than the standard applications intended. (1) Space appliance (such as artificial satellite, and rocket) (2) Traffic control equipment (such as for automobile, airplane, train, and ship) (3) Medical equipment for life support (4) Submarine transponder (5) Control equipment for power plant (6) Disaster prevention and security device (7) Weapon (8) Others : Applications of which reliability equivalent to (1) to (7) is required 2. Pay attention to the direction of LSI. When mounting it in the wrong direction onto the PCB (printed-circuit-board), it might smoke or ignite. 3. Pay attention in the PCB (printed-circuit-board) pattern layout in order to prevent damage due to short circuit between pins. In addition, refer to the Pin Description for the pin configuration. 4. Perform a visual inspection on the PCB be fore applying power, otherwise damage might happen due to problems such as a solder- bridge between the pins of the semiconductor device. Also, perform a full technical verification on the assembly quality, because the same damage possibly can happen due to conductive substances, such as solder ball, that adhere to the LSI during transportation. 5. Take notice in the use of this product that it might break or occasionally smoke when an abnormal state occurs such as output pin- V CC short (Power supply fault), output pin-GND short (Ground fault), or output-to-output-pin short (load short) . And, safety measures such as an installation of fuses are recommended because the extent of the above-mentioned damage and smoke emission will depend on the current capability of the power supply. 6. When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. 7. When using the LSI for new models, verify the safe ty including the long-term reliability for each product. 8. When the application system is designed by using this LSI, be sure to confirm notes in this book. Be sure to read the notes to descriptions and the usage notes in the book.
Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. Consult our sales staff in advance for information on the following applications: Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. (4) The products and product specifications described in this book are subject to change without notice for modification and/or im- provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. 20100202