AN17808B PANASONIC
Document overview
- Manufacturer or author: Provided By digicamel.com
- PDF pages: 15
Technical content
Panasonic Semiconductor Singapore A Division of Panasonic Semiconductor Asia Pte Ltd Company Registration No. 197803125E 22, Ang Mo Kio Industrial Park 2, Singapore 569506. Tel: (65)64818811 Fax: (65)64816486 Note: This cover page establishes the Doc No., Title and current status of the attached document.
Revision History
Removed physical product marking indications.4 RemarksChange DetailsPageS/NEff DateRevIssue Eff DateRevIssue Level SDSC-PSE-AN17808BDoc No. Doc Title Product Specifications for AN17808B Total no. of pages (excluding this page) 28-MAR-054 4-NOV-0421 Added this cover page.-1 Added this page for leadfree specification.7A2 Amended Outer Lead Surface Process &7A2 Chip Mounting Method. 28-MAR-05 61 Removed this page.3 15-DEC-04 71 Free Datasheet http://www.datasheet4u.com/
Semiconductor Company, Matsushita Electric Industrial Co., Ltd.FMSC-PSDA-002-01 REV 1 Prepared Checked Approved Eff. Date Eff. Date Eff. Date Eff. Date AN17808B Ref No. Total Page Page No. E Package Name Unit : mm FP-12S 29.96 ± 0.3 28.0 ± 0.3 20.0±0.10.6 0.6 ± 0.12.54 3.5 ± 0.3 0.25 +0.1 -0.05 1.2 ± 0.1 R1.8 1 12 29.6 ± 0.3 Lim Fuey Sheen Kenneth Law Yasuo Higuchi 12-SIL(FP)
Inner lead surface process Outer lead surface process Chip mounting method Wire bonding method Wire material Mold material Molding method Fin material SiN, Fe group, Ag plating, Solder plating (98Sn-2Bi), Ag paste, Thermalsonic bonding, Au, Epoxy, Transfer mold, Cu group, Others ( ) Others ( ) Others ( ) Others ( ) Others ( ) Others ( ) Others ( ) Others ( ) Others ( ) 2 , 6 PSG, Cu group, Au plating, Solder dip, Multiplunger mold, Product Specifications Semiconductor Company, Matsushita Electric Industrial Co., Ltd.FMSC-PSDA-002-01 REV 1 Prepared Checked Approved Eff. Date Eff. Date Eff. Date Eff. Date Ref No. Total Page Page No. F (Structure Description) Package FP-12S AN17808B Lim Fuey Sheen Kenneth Law Yasuo Higuchi 4-NOV-04 (Leadfree) Solder (95.5Pb-2.5Ag-2Sn)Au-Si alloy, 15-DEC-04 Under RoHS exemption clause, Lead (Pb) in high melting temperature type solder (i.e. tin-lead solder alloys containing more than 85% of lead), is exempted until 2010.