AN16903A PANASONIC
Document overview
- Manufacturer or author: Provided By digicamel.com
- PDF pages: 8
Technical content
Datasheet sections
Part No. Package Code No. Publication date: May 2007 SDB00150AEB AN16903A SSOP024-P-0300E
IC for sound multiplex demodulation in NTSC (Japanese TV mode) Overview The AN16903A is TV sound multiplex demodulator IC corresponding to both I2C-bus control and parallel control for Japan. The functions of a SIF demodulation, a STEREO demodulation, and a Bilingual demodulation are built in. Features
- Controllable by either I2C bus or parallel.
- Built-in SIF demodulation circuit.
- Perfect adjustment free (in the case of use in SIF input). In use in base band input, one adjustment is required.
- Reduction of external parts.
- Low power consumption （TYP: VCC = 5 V, I tot = 22 mA） Applications
- TV, VCR, DVD recorder, PC, etc. for Japan. Package
- 24 pin Plastic Shrink Small Outline Package (SSOP type) Type
- Silicon Monolithic Bipolar IC
Application Circuit Example 1 μF0 . 1 μF 0.1 μF MAINREF SUBREF I2C/PARA COMP SUBDET CUEREF MOMODE MODE FOMO MUTE SIF/BB N.C. 10 kΩ 2.2 μF 10 kΩ 4.7 μF 1 000 pF VCC 5 V 4.7 μF 2.2 μF 2.2 μF Lout Rout GND SCL/STID SDA/SAPID SIF Input Base Band Input MODE CONTROL SW 1 μF 1 μF Rout N.C. SDA/BILID SCL/STID N.C. N.C. INPUT SIFREF GND PE VCC Lout
Block Diagram 2.2 μF Lout N.C. 0.1 μF 2.2 μF Rout 1 μF 4.7 μF 2.2 μF 1 000 pFSIF Input I2C/PARA MOMODE MODE FOMO MUTE SIF/BB Mode Control SW 4.7 μFBase Band Input CUE BPF AM Demod SUB Demod SUB Det. 952 Hz BPF Stereo Matri Offset Cancel Output Logic Cue det hys. I2C Decoder Offset Cancel SUB BPF 3.5 fH VCO Cue det Counter Output SW SIF Demod VCA MAIN De-Emph 4.5 fH TRAP SIF/BB SW SUB De-Emph GND 5 V VCC 1 μF 0.1 μF SDA/BILID SCL/STID 10 kΩ10 kΩ N.C.14 N.C.17 N.C.22 PE20 1 μF Offset Cancel COMP COMP VCA
Pin Descriptions L-ch outputOutputLOUT24 R-ch outputOutputROUT23 N.C.—NC22 SCL / STEREO IDInput/OutputSCL/STID21 PE—PE20 GNDGroundGND19 SDA / BILINGUAL IDInput/OutputSDA/BILID18 N.C.—NC17 SIF REFInput/OutputSIFREF16 SIF/Base band inputInputINPUT15 N.C.—NC14 VCCPower supplyVCC13 SUB DETInput/OutputSUBDET12 N.C.—NC11 SIF/Base band input selection (used only for parallel control)InputSIF/BB10 Mute selection (used only for parallel control)InputMUTE9 Forced monaural selection (used only for parallel control)InputFOMO8 Output mode selection (used only for parallel control)InputMODE7 Forced monaural mode selection (used only for parallel control)InputMOMODE6 I2C/Parallel control selectionInputI2C/PARA5 COMPInput/OutputCOMP4 CUE DC offset absorption Input/OutputCUEREF3 SUB system DC offset absorption Input/OutputSUBREF2 MAIN system DC offset absorption Input/OutputMAINREF1 DescriptionTypePin namePin No.
Absolute Maximum Ratings Operating Supply Voltage Range —mA32ICCSupply current2 NotesUnitRatingSymbolParameterA No. *3°C–55 to 125TstgStorage temperature5 *3°C–20 to 85ToprOperating ambient temperature4 *2mW156PDPower dissipation3 *1V6.0VCCSupply voltage1 Notes) *1: The values under the condition not exceeding the above absolute maximum ratings and the power dissipation. *2: The power dissipation shown is the value at T a = 85°C for the independent (unmounted) IC package. *3: Except for the operating ambient temperature and storage temperature, all ratings are for Ta = 25°C. NotesUnitRangeSymbolParameter *V4.5 to 5.5VCCSupply voltage range Note) *: The values under the condition not exceeding the above absolute maximum ratings and the power dissipation. Allowed Voltage Ranges *1V–0 . 3 t o( VCC + 0.3)MUTE9 *1V–0 . 3 t o( VCC + 0.3)MODE7 *1V–0 . 3 t o( VCC + 0.3)FOMO8 *1V–0 . 3 t o( VCC + 0.3)I2C/PARA5 *1V–0 . 3 t o( VCC + 0.3)MOMODE6 NotesUnitRatingPin namePin No. *1V–0 . 3 t o( VCC + 0.3)SCL/STID21 *1V–0 . 3 t o( VCC + 0.3)SDA/BILDT18 *1V–0 . 3 t o( VCC + 0.3)SIF/BB10 —V– 0.3 to 6.0VCC13 NotesUnitRatingPin namePin No. Notes) 1. Volotage values, unless otherw ise specified, are with respect to GND. 2. Do not apply external current or volotage to any pin not mentioned below. 3. *1: (V CC + 0.3) V should not be more than 6.0V.
Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod- ucts may directly jeopardize life or harm the human body. Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or im- provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.