AN12948A PANASONIC

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Technical content

Datasheet sections

1Publication date: April 2007 SDF00042AEB DATA SHEET AN12948APart No.

Audio Power IC for Note PC „ Overview AN12948A is the stereo BTL amplifier which contained the AGC circuit for clip prevention of a speaker output and headphone amplifier within charge pump. This IC performs a mode change by pararel cont rol system. (Standby function ON/OFF change etc.) „ Features y In order to realize high efficiency of output power, it adopts CMOS power amplifier circuit . y Max. Power: 1.4 W (VCCSP = 5 V, RL = 8 Ω, THD = 10%)

2.2 W (VCCSP = 5 V, RL = 4 Ω, THD = 10%)

y The resistance and the capacitor of a detector circuit which were being used for the conventional AGC. y The filter circuit for the frequency response deci sion can be composed of the input circuit. y Built-in direct drive headphone amplifier within charge pump. y STBY function (countermeasure pop noise) The standby terminal of the speaker amplifier and the hea dphone amplifier is prepared by each of two terminals. When either of two terminals becomes "High", it is standby OFF. y AGC ON/OFF function y AGC ON Level select function y AGC attack time select function y AGC recovery time select function y Cellular phone measures RF noise prevention y Built-in over current protection „ Applications y For the notebook personal computer „ Package y 48-pin plastic quad flat package with heat slug (QFP type) „ Type y Silicon monolithic BI-CMOS IC

„ Block Diagram (Application Circuit Example) Note) This circuit and these circuit constants show an example and do not guarantee the design as a mass-production set. 123 45 6789 1 0 1 1 1 2 36 35 34 33 32 31 30 29 28 27 26 25 Protector VCC_SPL 1 μF AGC DET AGCL GND_SPL VCC_SPR 1 μF VREFSP Protector AGCR RL = 4 Ω to 8 Ω GND_SPR 1 μF VSS 1 μF VCC_CP Charge Pump REG+_ 1 μF VCC_HP HP_INR HP_OUTR HP_OUTL HP_INL SP_OUTR RL = 4 Ω to 8 Ω SP_OUTL SP_INL SP_INR VCC 1 μF AGC Control ON/OFF ON Level Attack time Recovery time AGC_Lv1 AGC_Attack AGC_Recovery1 AGC_Recovery2 AGC_Lv2 Test2 Test3 Test4 1 μF 10 kΩ 10 kΩ 1 μF 820 pF 10 kΩ10 kΩ 820 pF 10 kΩ 20 kΩ 1 μF 20 kΩ 10 kΩ 1 μF +6 dB +6 dB VCC 3.3 V 1 μF VCC_SP 5.0 V GND_CP 0 dB 0 dB +14 dB +14 dB +14 dB +14 dB 0 dB 0 dB Test1 AGC_ON/OFF 1 μF N.C. HP_STBY2 HP_STBY1 SP_STBY2 SP_STBY1 HP STBY ON/OFF SP STBY ON/OFF N.C. 68 Ω 68 Ω

„ Pin Descriptions Power Supply for SP L-channel amp system Power supplyVCC_SPL19 Power Supply for SP R-channel amp system Power supplyVCC_SPR18 SP amp. R-channel output (−) OutputSP_OUTR–17 SP amp. R-channel output (−)OutputSP_OUTR–16 SP amp. R-channel output (+)OutputSP_OUTR+15 SP amp. R-channel output (+) OutputSP_OUTR+14 Ground for SP R-channel amp system GroundGND_SPR13 N.C.⎯N.C.12 AGC-recovery-time selectionInputAGC_Recovery211 AGC-recovery-time selectionInputAGC_Recovery110 The output terminal of SP input amp. R-channelOutputPREOUT_R9 The feedback terminal of SP input amp. R-channelInputSP_INR8 Power Supply VCC Terminal for testing (please connect to Ground) Ground The feedback terminal of SP input amp. L-channel The output terminal of SP input amp. L-channel Terminal of reference voltage for SP amp. Terminal for testing (please connect to Ground) N.C. Ground for SP L-channel amp system SP amp. L-channel output (+) SP amp. L-channel output (+) SP amp. L-channel output (−) SP amp. L-channel output (−) Ground AGC ON/OFF selection Terminal for testing (please connect to Ground) AGC-attack-time selection AGC-on-level selection Power Supply Ground Input Output Input Ground Output Output Output Output Ground Input Input Input AGC-on-level selection Power Supply for HP amp.

Description

AGC_ON/OFF6 Test15 AGC_Attack4 SP_OUTL+23 SP_OUTL+22 SP_OUTL–21 SP_OUTL–20 SP_INL29 PREOUT_L28 N.C.25 GND_SPL24 VCC32 Test331 GND30 AGC_Lv23 AGC_Lv12 VCC_HP1 Pin namePin No.

„ Pin Descriptions (continued) The feedback terminal of HP amp. R-channelInputHP_INR48 HP amp. R-channel outputOutputHP_OUTR47 GroundGroundGND46 HP amp. L-channel outputOutputHP_OUTL45 The feedback terminal of HP amp. L-channelInputHP_INL44 Negative Power Supply supplied from Charge pumpPower supplyVSS43 Charge pump outputOutputVSS_CP42 Capacitor Connect Terminal2 for Charge pumpOutputC241 Ground for Charge pumpGroundGND_CP40 Capacitor Connect Terminal1 for Charge pump Power Supply for Charge pump Terminal for testing (please connect to Ground) HP Standby On/Off control HP Standby On/Off control Output Power Supply Input Input SP Standby On/Off control SP Standby On/Off control VCC_CP38 Test437 HP_STBY236 HP_STBY135 SP_STBY234 SP_STBY133 Pin namePin No.

5.75VCC_SPL VCC_SPR A⎯ICCSupply current2 NoteUnitRatingSymbolParameterA No. °C−55 to +150TstgStorage temperature5 °C−30 to +75ToprOperating ambient temperature4 *2mW355PDPower dissipation3 *1V 5.75 VCC VCC_HP VCC_CPSupply voltage1 Note) *1: The values under the condition not exceeding the above absolute maximum ratings and the power dissipation. *2 : The power dissipation shown is the value at Ta = 75°C for the independent (unmounted) IC package with a heat sink. *3 : Except for the power dissipation, operating ambient temperature, and storage temperature, all ratings are for Ta = 25°C. NoteUnitRangeSymbolParameter V 4.5 to 5.5VCC_SPL VCC_SPR 3.0 to 5.5 VCC VCC_HP VCC_CPSupply voltage range Note) *: The values under the condition not exceeding the above absolute maximum ratings and the power dissipation. „ Absolute Maximum Ratings „ Operating Supply Voltage Range

Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod- ucts may directly jeopardize life or harm the human body. – Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or im- provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.