AFE78101

AFEx8101 16-Bit and 14-Bit, Low-Power DACs With Voltage Reference and Diagnostic ADC for 4-mA to 20-mA Loop-Powered Applications datasheet

Document overview

• Manufacturer or author: Texas Instruments, Incorporated [SLASF21,*]
• PDF pages: 89

Technical content

AFEx8101 16-Bit and 14-Bit, Low-Power DACs With Voltage Reference and Diagnostic ADC for 4-mA to 20-mA Loop-Powered Applications

1 Features

• Functional Safety-Capable – Documentation available to aid functional safety system design: AFE88101, AFE78101
• Low quiescent current: 170 µA (typ)
• 16-bit or 14-bit monotonic high-performance DAC – 5-V supply: 0.3 V to 2.5 V, 0.4 V to 2.0 V – 4-LSB INL at 16 bits – 0.07% FSR (max) TUE from –40°C to +125°C
• 12-bit 3.84-kSPS ADC for advanced diagnostics
• Integrated 1.25-V reference at 10 ppm/°C
• Internal 1.2288-MHz oscillator with clock output
• Digital interfaces: – Serial peripheral interface (SPI) – Universal asynchronous receiver-transmitter (UART)
• Fault detection: CRC bit error checking, windowed watchdog timer, diagnostic ADC
• Wide operating temperature: –55°C to +125°C

2 Applications

• 2-wire transmitters
• 4-mA to 20-mA loop-powered applications
• Process control and industrial automation
• Smart transmitters
• PLC or DCS I/O modules

3 Description

The 16-bit AFE88101 and 14-bit AFE78101 (AFEx8101) are highly-integrated, high-accuracy, extremely low-power digital-to-analog converters (DACs) with voltage outputs designed for sensor- transmitter applications. The AFEx8101 devices include most of the components required to design a 4 ‑mA to 20 ‑mA, 2‑wire (loop-powered) sensor transmitter. In addition to the highly accurate DAC, these devices include a 10‑ppm/°C voltage reference and a diagnostic analog- to-digital converter (ADC). To accommodate intrinsic and functional-safety concerns, external voltage-to- current conversion and power regulation are required. The internal diagnostic ADC is multiplexed to several internal nodes that enable an automatic self- health check. This check is capable of detecting errors or malfunctions of the internal bias sources, power regulator, voltage reference, DAC output, die temperature, and optional external voltage source. If any fault is detected from the diagnostic ADC, CRC frame-error checking, or windowed watchdog timer, the devices can optionally issue an interrupt, enter a fail-safe state corresponding to a standard NAMUR output value or user-specified custom value, or both. These devices operate from supplies as low as 1.71 V with a maximum quiescent current of 210 µA. The devices are specified over the temperature range of –40°C to +125°C, but are functional from –55°C to +125°C. Device Information PART NUMBER RESOLUTION PACKAGE(1) AFE78101 14-bit RRU (UQFN, 24) 4.00 mm × 4.00 mmAFE88101 16-bit (1) For all available packages, see the package option addendum at the end of the data sheet. MUX12-Bit ADC MUX Internal Diagnostics Temperature Sensor AIN0 POL_SEL/AIN1 16-/14-Bit DAC VOUT Alarm Diagnostics Alarm Responses User Calibration Slew-Rate Control DAC Data Register Watchdog Timer CRC Frame Error Check ALARM SPI Interface UART Interface Control Logic CS SDI SDO SCLK SCLR UARTIN UARTOUT PVDD VDD GND Internal Reference VREFIO REF_EN REF_GND IOVDD RESET Internal OscillatorCLK_OUT IRQ (UARTOUT or SDO) Output Buffer Range Setting Functional Block Diagram AFE78101, AFE88101 SLASF21 – DECEMBER 2022 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.

10 Mechanical, Packaging, and Orderable

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version. DATE REVISION NOTES December 2022 * Initial release. AFE78101, AFE88101 SLASF21 – DECEMBER 2022 www.ti.com

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5 Pin Configuration and Functions

24 ALARM24 ALARM7SCLK 7SCLK

1UARTIN 1UARTIN 18 VOUT18 VOUT

23 NC23 NC8SDI 8SDI

2UARTOUT 2UARTOUT 17 PVDD17 PVDD

22 GND22 GND9SDO 9SDO

3NC 3NC 16 POL_SEL/AIN116 POL_SEL/AIN1

21 GND21 GND10CS 10CS

4SCLR 4SCLR 15 AIN015 AIN0

20 REF_GND20 REF_GND11CLK_OUT 11CLK_OUT

5REF_EN 5REF_EN 14 GND14 GND

19 VREFIO19 VREFIO12IOVDD 12IOVDD

6RESET 6RESET 13 VDD13 VDD Not to scaleNot to scale

24 ALARM7SCLK

23 NC8SDI

22 GND9SDO

3NC 16 POL_SEL/AIN1

21 GND10CS

20 REF_GND11CLK_OUT

5REF_EN 14 GND

19 VREFIO12IOVDD

Figure 5-1. RRU (24-pin UQFN) Package, Top View Table 5-1. Pin Functions PIN TYPE(1) DESCRIPTION NAME NO. AIN0 15 AI ADC input voltage. The input range is 0 V to VREF if PVDD = VDD, or 0 V to 2 × VREF if PVDD > 2.7 V. ALARM 24 DO Alarm notification. Open drain. When alarm condition is asserted, this pin is held to logic low; otherwise, this pin is in a high-impedance state (Hi-Z). CLK_OUT 11 DO Clock output. This pin can be configured as a clock output for the 1.2288‑MHz internal clock. CS 10 DI SPI chip-select. Data bits are clocked into the serial shift register when CS is logic low. When CS is logic high, SDO is in a high-impedance state and data on SDI are ignored. Do not leave any digital input pins floating. GND 14 P Digital and analog ground. Ground reference point for all circuitry on the device. GND 21, P Digital and analog ground. IOVDD 12 P Interface supply. Supply voltage for digital input and output circuitry. This voltage sets the logical thresholds for the digital interfaces. NC 3, 23 – No connection. Leave floating. POL_SEL/AIN1 16 DI/AI ADC input voltage if SPECIAL_CFG.AIN1_ENB bit is set to 1. The input range is 0 V to VREF if PVDD = VDD, or 0 V to 2 × VREF if PVDD > 2.7 V. Otherwise, this pin acts as ALMV_POL, which sets the polarity of the VOUT alarm voltage. PVDD 17 P Power supply for the internal low-dropout regulator (LDO), ADC input, and VOUT DAC output. When provided, the internal LDO is disabled. REF_EN 5 DI Internal VREF enable input. A logic high on this pin enables the internal VREF and the VREFIO pin outputs 1.25 V. A logic low on this pin disables the internal VREF and the external 1.25-V reference is required at the VREFIO pin. REF_GND 20 P GND reference for VREFIO pin. RESET 6 DI Reset. Logic low on this pin places the device into power-down mode and resets the device. Logic high returns the device to normal operation. Do not leave any digital input pins floating. www.ti.com AFE78101, AFE88101 SLASF21 – DECEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: AFE78101 AFE88101

Table 5-1. Pin Functions (continued) PIN TYPE(1) DESCRIPTION NAME NO. SCLK 7 DI SPI serial clock. Data can be transferred at rates up to 12.5 MHz. SCLK is a Schmitt-trigger logic input. Connect to GND or logic low if not used. Do not leave any digital input pins floating. SCLR 4 DI DAC clear input pin in SPI mode. A logic high on this pin forces the DAC output into a CLEAR state. Connect to GND in UBM. Do not leave any digital input pins floating. SDI 8 DI SPI data input. Data are clocked into the 24‑bit input shift register on the falling edge of the serial clock input. SDI is a Schmitt-Trigger logic input. Do not leave any digital input pins floating. SDO 9 DO SPI data output. Data are output on the rising edge of SCLK when CS is logic low. Interrupt request (IRQ) pin in the UART break mode (UBM). The output is in a Hi-Z state at power up and must be enabled in the CONFIG register. UARTIN 1 DI UART data input. Connect to IOVDD or logic high if not used. Do not leave any digital input pins floating. UARTOUT 2 DO UART data output. This pin can be configured to function as the IRQ pin in SPI only mode. VDD 13 P/AO Power supply. When 2.7 V to 5.5 V is provided on PVDD pin, the internal LDO drives VDD internally. Connect a 1‑μF to 10‑μF capacitor to this pin. When 1.71 V to 1.89 V is provided on the PVDD pin, an external power supply must be provided on this pin. VOUT 18 AO DAC output voltage. VREFIO 19 AI/AO When the internal VREF is enabled by REF_EN pin, this pin outputs the internal VREF voltage. In this case, a load capacitance of 70-nF to 130-nF is required for stability. When disabled, this pin is the external 1.25‑V reference input. (1) AI = analog input, AO = analog output, DI = digital input, DO = digital output, P = power. AFE78101, AFE88101 SLASF21 – DECEMBER 2022 www.ti.com

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT Voltage PVDD, IOVDD to GND –0.3 5.5 V VDD to GND –0.3 1.98 V AIN0, POL_SEL/AIN1, VOUT to GND –0.3 PVDD + 0.3 V Digital Input/Output to GND –0.3 IOVDD + 0.3 V VREFIO to GND –0.3 VDD + 0.3 V REF_GND to GND –0.3 0.3 V Input current Current into any pin –10 10 mA TJ Junction temperature –55 150 Tstg Storage temperature –65 150 (1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

6.2 ESD Ratings

V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002, all pins(2) ±500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT PVDD to GND PVDD > 2.7 V, VDD internally generated 2.7 5.5 V PVDD = VDD 1.71 1.89 V VDD to GND 1.71 1.89 V IOVDD to GND 1.71 5.5 V VREFIO to GND External VREF 1.2 1.25 1.3 V TA Ambient temperature Specified –40 125 Operating –55 125

6.4 Thermal Information

THERMAL METRIC(1) AFEx8101 UNITRRU (UQFN)

24 PINS

RθJA Junction-to-ambient thermal resistance 103.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 84.4 °C/W RθJC(bottom) Junction-to-case (bottom) thermal resistance N/A °C/W RθJB Junction-to-board thermal resistance 69.5 °C/W ΨJT Junction-to-top characterization parameter 0.4 °C/W ΨJB Junction-to-board characterization parameter 68.4 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. www.ti.com AFE78101, AFE88101 SLASF21 – DECEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 5 Product Folder Links: AFE78101 AFE88101

6.5 Electrical Characteristics

all minimum and maximum values at TA = –40°C to +125°C and all typical values at TA = 25°C, PVDD = VDD = IOVDD = 1.8 V, external or internal VREFIO = 1.25 V, RLOAD = 50 kΩ to GND, CLOAD = 100 pF to GND, and digital inputs at IOVDD or GND (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VOUT DAC STATIC PERFORMANCE Resolution AFE88101 16 Bits AFE78101 14 INL Integral nonlinearity(1) AFE88101 –4 4 LSB AFE78101 –2 2 DNL Differential nonlinearity(1) –1 1 LSB TUE Total unadjusted error(1) %FSRTA = –40°C to +85°C –0.05 0.05 TA = 25°C –0.04 0.04 ZCE Zero code error %FSRTA = –40°C to +85°C –0.05 0.05 TA = 25°C –0.03 0.03 ZCE-TC Zero code error temperature coefficient ±3 ppm/°C OE Offset error(1) %FSRTA = –40°C to +85°C –0.05 0.05 TA = 25°C –0.03 0.03 OE-TC Offset error temperature coefficient (1) ±3 ppm/°C GE Gain error(1) %FSRTA = –40°C to +85°C –0.04 0.04 TA = 25°C –0.03 0.03 GE-TC Gain error temperature coefficient(1) ±3 ppm FSR/°C FSE Full-scale error %FSRTA = –40°C to +85°C –0.06 0.06 TA = 25°C –0.04 0.04 FSE-TC Full-scale error temperature coefficient ±3 ppm FSR/°C VOUT DAC DYNAMIC PERFORMANCE ts Output voltage settling time(4) ¼ to ¾ scale and ¾ to ¼ scale settling to ±2 LSB, PVDD = VDD = 1.8 V, VREFIO = 1.25 V 65 µs 10-mV step settling to ±2 LSB, PVDD = VDD = 1.8 V, VREFIO = 1.25 V 30 SR Slew rate(4) Fullscale transition measured from 10% to 90% 2 V/µs Vn Output noise(4)

0.1 Hz to 10 Hz, DAC at midscale,

PVDD = VDD = 1.8 V, VREFIO = 1.25 V 0.25 LSBPP 100-kHz bandwidth, DAC at midscale, PVDD = VDD = 1.8 V, VREFIO = 1.25 V 32 µVrms Vn Output noise density Measured at 1 kHz, DAC at midscale, PVDD = VDD = 1.8 V, VREFIO = 1.25 V 180 nV/√Hz Measured at 1 kHz, DAC at midscale, PVDD = 5 V, VREFIO = 1.25 V 260 Power supply rejection ratio (AC) 200-mV 50-Hz to 60-Hz sine wave superimposed on power supply voltage, DAC at midscale. 85 dB Code change glitch impulse Midcode ±1 LSB (including feedthrough) PVDD = VDD = 1.8 V, VREFIO = 1.25 V 4.5 nV-s Code change glitch magnitude Midcode ±1 LSB (including feedthrough) PVDD = 5 V, VREFIO = 1.25 V 1.5 mV Digital feedthrough At SCLK = 1 MHz, DAC output at midscale 1 nV-s AFE78101, AFE88101 SLASF21 – DECEMBER 2022 www.ti.com

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6.5 Electrical Characteristics (continued)

all minimum and maximum values at TA = –40°C to +125°C and all typical values at TA = 25°C, PVDD = VDD = IOVDD = 1.8 V, external or internal VREFIO = 1.25 V, RLOAD = 50 kΩ to GND, CLOAD = 100 pF to GND, and digital inputs at IOVDD or GND (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VOUT DAC OUTPUT CHARACTERISTICS Output voltage range RANGE = 0, PVDD = VDD 0.15 1.25 V RANGE = 1, PVDD = VDD 0.2 1.0 RANGE = 0, PVDD > 2.7 V, VDD generated 0.3 2.5 RANGE = 1, PVDD > 2.7 V, VDD generated 0.4 2.0 VOUT alarm output high PVDD > 2.7 V, VDD internally generated –6% 2.5 +6% V PVDD = VDD –6% 1.25 +6% VOUT alarm output low PVDD > 2.7 V, VDD internally generated –5% 0.3 +5% V PVDD = VDD –5% 0.15 +5% RLOAD Resistive load(2) 10 kΩ CLOAD Capacitive load(2) 100 pF Load regulation DAC at midscale, –1 mA ≤ IOUT ≤ +1 mA 10 µV/mA Short-circuit current Full scale output shorted to GND 5 mA Zero output shorted to VDD 5 Output voltage headroom to PVDD DAC at full code, IOUT = 1 mA (sourcing) 200 mV Output voltage footroom to GND DAC at zero code, IOUT = 1 mA (sinking) 200 mV ZO DC small signal output impedance DAC at midscale 10 mΩ Output Hi-Z 500 kΩ Power supply rejection ratio (dc) DAC at midscale; PVDD = 1.8 V ± 10% 0.1 mV/V Output voltage drift vs time, 1000 hours TA = 35°C, VOUT = midscale, ideal VREF ±5 ppm FSR DIAGNOSTIC ADC Input voltage range PVDD = VDD 0 1.25 V PVDD > 2.7 V 0 2.5 Resolution 12 Bits DNL Differential nonlinearity Specified 12-bit monotonic –1 ±0.2 1 LSB INL Integral nonlinearity –4 ±1 4 LSB OE Offset error After calibration –10 ±1.6 10 LSB GE Gain error –0.8 ±0.13 0.8 %FSR Noise ±4 LSB Input capacitance 6 pF Input bias current ADC not converting –50 50 nA Acquisition time 52 µs Conversion time 210 µs Conversion rate 3.84 kSPS Temperature sensor accuracy 5 °C INTERNAL OSCILLATOR Frequency TA = –40°C to +125°C 1.2165 1.2288 1.2411 MHz www.ti.com AFE78101, AFE88101 SLASF21 – DECEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 7 Product Folder Links: AFE78101 AFE88101

all minimum and maximum values at TA = –40°C to +125°C and all typical values at TA = 25°C, PVDD = VDD = IOVDD = 1.8 V, external or internal VREFIO = 1.25 V, RLOAD = 50 kΩ to GND, CLOAD = 100 pF to GND, and digital inputs at IOVDD or GND (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VOLTAGE REFERENCE INPUT ZVREFIO Reference input impedance (VREFIO) RANGE = 0 125 kΩ RANGE = 1 180 CVREFIO Reference input capacitance (VREFIO) 100 pF VOLTAGE REFERENCE OUTPUT Output (initial accuracy)(3) TA = 25°C 1.248 1.25 1.252 V Output drift(3) TA = –40°C to +125°C 10 ppm/℃ Output impedance(3) 0.1 Ω Output noise(3) 0.1 Hz to 10 Hz 7.5 µVPP Output noise density(3) Measured at 10 kHz, reference load = 100 nF 200 nV/√Hz Load current(3) Sourcing, 0.1% VREF change from nominal 2.5 mA Sinking, 0.1% VREF change from nominal 0.3 Load regulation(3) Sourcing, 0 mA to 2.5 mA 4 µV/mA COUT Stable output capacitance TA = –40°C to +125°C, ESR from 10 mΩ to 400 mΩ 70 100 130 nF Line regulation(3) 80 µV/V Output voltage drift vs time(3) TA = 35°C, 1000 hours ±100 ppm Thermal hysteresis(3) 1st cycle 500 µV Additional cycles 25 µV VDD VOLTAGE REGULATOR OUTPUT Output voltage 1.71 1.8 1.89 V Output impedance(3) PVDD = 3.3 V, sourcing, 0.5 mA to 2.5 mA 3 Ω Load current(3) PVDD = 3.3 V, sourcing, 1% VDD change from nominal 4 mA THERMAL ALARM Alarm trip point 130 °C Warning trip point 85 °C Hysteresis 12 °C Trip point absolute accuracy 5 °C Trip point relative accuracy 2 °C DIGITAL INPUT CHARACTERISTICS VIH High-level input voltage 0.7 V/IOVDD VIL Low-level input voltage 0.3 V/IOVDD Hysteresis voltage 0.05 V/IOVDD Input current –400 400 nA Pin capacitance Per pin 10 pF DIGITAL OUTPUT CHARACTERISTICS VOH High-level output voltage ISOURCE = 1 mA 0.8 V/IOVDD VOL Low-level output voltage ISINK = 1 mA 0.2 V/IOVDD VOL Open-drain low-level output voltage ISINK = 2 mA 0.3 V Output pin capacitance 10 pF AFE78101, AFE88101 SLASF21 – DECEMBER 2022 www.ti.com

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all minimum and maximum values at TA = –40°C to +125°C and all typical values at TA = 25°C, PVDD = VDD = IOVDD = 1.8 V, external or internal VREFIO = 1.25 V, RLOAD = 50 kΩ to GND, CLOAD = 100 pF to GND, and digital inputs at IOVDD or GND (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT POWER REQUIREMENTS IPVDD Current flowing into PVDD PVDD only, VDD internally generated, DAC at zero- scale, ADC and SPI static, internal reference 170 210 µA Shared PVDD and VDD connection, DAC at zero- scale, ADC and SPI static 32 45 ILDO VDD LDO quiescent current From PVDD 8 µA IVDD Current flowing into VDD Shared PVDD and VDD connection, DAC at zero- scale, ADC and SPI static, internal reference 130 160 µA IREFIO Internal reference current consumption From external or internally generated VDD 52 70 µA IADC ADC current consumption From PVDD, ADC converting at 3.84 kSPS 10 µA CVDD Recommended VDD decoupling capacitance 1 10 µF IIOVDD Current flowing into IOVDD SPI static 5 20 µA IVREFIO Current flowing into VREFIO 0.15-V to 1.25-V range, midscale code 10 µA (1) End point fit between code 0 to code 65,535 for 16-bit, code 0 to code 16,383 for 14-bit, DAC output unloaded, performance under resistive and capacitive load conditions are specified by design and characterization. (2) Not production tested. (3) Derived from the characterization data. (4) Output buffer gain (G) = 2, PVDD > 2.7 V. www.ti.com AFE78101, AFE88101 SLASF21 – DECEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 9 Product Folder Links: AFE78101 AFE88101

6.6 Timing Requirements

all input signals are specified with tR = tF = 1 ns/V and timed from a voltage level of (VIL + VIH) / 2, 2.7 V ≤ PVDD ≤ 5.5 V, VIH = 1.62 V, VIL = 0.15 V, VREFIO = 1.25 V, and TA = –40°C to +125°C (unless otherwise noted) PARAMETER MIN NOM MAX UNIT SERIAL INTERFACE - WRITE AND READ OPERATION fSCLK Serial clock frequency 12.5 MHz tSCLKHIGH SCLK high time 36 ns tSCLKLOW SCLK low time 36 ns tCSHIGH CS high time 80 ns tCSS CS to SCLK falling edge setup time 30 ns tCSH SCLK falling edge to CS rising edge 30 ns tCSRI CS rising edge to SCLK falling edge ignore 30 ns tCSFI SCLK falling edge ignore to CS falling edge 5 ns tSDIS SDI setup time 5 ns tSDIH SDI hold time 5 ns tSDOZD CS falling edge to SDO tri-state condition to driven 40 ns tSDODZ CS rising edge to SDO driven to tri-state condition 40 ns tSDODLY SCLK to SDO output delay 40 ns UART tBAUD Baud rate = 9600 ± 1% 104 µs DIGITAL LOGIC tDACWAIT Sequential DAC update wait time 2.1 µs tPOR POR reset delay 100 µs tRESET RESET pulse duration 100 ns tRESETWAIT Wait time after RESET pulse 10 µs AFE78101, AFE88101 SLASF21 – DECEMBER 2022 www.ti.com

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6.7 Timing Diagrams

Don’t Care Valid DataHi-Z SDO FSDO = 0 SDI SCLK SPI Mode 1 SDO FSDO = 1 CS Discontinuous Clock Mode Continuous Clock Mode Bit N Bit 0 Bit N Bit 0 tSDODZ Bit 0Bit N tSDODLY tSDODLY tSDOZD Bit 1 Bit 1 Bit 1 tSDIS tSDIH tCSS tCSH tCSRI tCSHIGH tCSFI N = 31 for 32-bit frame with CRC N = 23 for 24-bit frame without CRC SCLK SPI Mode 2 Figure 6-1. SPI Timing S = Start bit, Par = Parity bit, P = Stop bit UART Communication S UART Break Character tBAUD D1D0 D3 D2 D5 D4 D7 D6S Par PD1D0 D3 D2 D5 D4 D7 D6S Par P 11 • tBAUD Figure 6-2. UBM Timing www.ti.com AFE78101, AFE88101 SLASF21 – DECEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 11 Product Folder Links: AFE78101 AFE88101

6.8 Typical Characteristics: VOUT DAC

at TA = 25°C, PVDD = VDD = IOVDD = 1.8 V, external or internal VREFIO = 1.25 V, RLOAD = 50 kΩ to GND, CLOAD = 100 pF to GND, and digital inputs at IOVDD or GND (unless otherwise noted) Figure 6-3. DAC DNL vs Digital Input Code Figure 6-4. DAC DNL vs Digital Input Code Figure 6-5. DAC INL vs Digital Input Code Figure 6-6. DAC INL vs Digital Input Code Figure 6-7. MIN and MAX DAC DNL Range vs Temperature Figure 6-8. MIN and MAX DAC INL Range vs Temperature AFE78101, AFE88101 SLASF21 – DECEMBER 2022 www.ti.com

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6.8 Typical Characteristics: VOUT DAC (continued)

at TA = 25°C, PVDD = VDD = IOVDD = 1.8 V, external or internal VREFIO = 1.25 V, RLOAD = 50 kΩ to GND, CLOAD = 100 pF to GND, and digital inputs at IOVDD or GND (unless otherwise noted) Figure 6-9. DAC TUE vs Digital Input Code Figure 6-10. DAC TUE vs Digital Input Code Figure 6-11. MIN and MAX DAC TUE vs Temperature Figure 6-12. DAC RESET Response RANGE = 0 Figure 6-13. DAC Source and Sink Current Capability RANGE = 1 Figure 6-14. DAC Source and Sink Current Capability www.ti.com AFE78101, AFE88101 SLASF21 – DECEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 13 Product Folder Links: AFE78101 AFE88101

at TA = 25°C, PVDD = VDD = IOVDD = 1.8 V, external or internal VREFIO = 1.25 V, RLOAD = 50 kΩ to GND, CLOAD = 100 pF to GND, and digital inputs at IOVDD or GND (unless otherwise noted) Figure 6-15. DAC Gain Error vs Temperature Figure 6-16. DAC Offset Error vs Temperature Figure 6-17. DAC Full Scale Error vs Temperature Figure 6-18. DAC Zero Scale Error vs Temperature DAC at midcode Figure 6-19. DAC Output Noise, 0.1 Hz to 10 Hz DAC at midcode Figure 6-20. DAC Output Noise Density vs Frequency AFE78101, AFE88101 SLASF21 – DECEMBER 2022 www.ti.com

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at TA = 25°C, PVDD = VDD = IOVDD = 1.8 V, external or internal VREFIO = 1.25 V, RLOAD = 50 kΩ to GND, CLOAD = 100 pF to GND, and digital inputs at IOVDD or GND (unless otherwise noted) Figure 6-21. DAC Settling Time vs Load (Rising Voltage Step) Figure 6-22. DAC Settling Time vs Load (Falling Voltage Step) Figure 6-23. DAC Settling Time With Linear Slew Rate Control Figure 6-24. DAC Settling Time With Sinusoidal Slew Rate Control Figure 6-25. DAC Glitch Impulse Rising Edge Figure 6-26. DAC Glitch Impulse Falling Edge www.ti.com AFE78101, AFE88101 SLASF21 – DECEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 15 Product Folder Links: AFE78101 AFE88101

at TA = 25°C, PVDD = VDD = IOVDD = 1.8 V, external or internal VREFIO = 1.25 V, RLOAD = 50 kΩ to GND, CLOAD = 100 pF to GND, and digital inputs at IOVDD or GND (unless otherwise noted) Figure 6-27. DAC Supply Power On, PVDD = 1.8 V Figure 6-28. DAC Supply Power On, PVDD = 3.3 V 1: 0.4-V to 2-V range, midcode 3: 0.3-V to 2.2-V range, 2: 0.2-V to 1-V range, midcode zero code Figure 6-29. DAC PVDD Supply Collapse Response, RANGE = 1 0.15-V to 1.25-V range, midcode Figure 6-30. DAC PVDD Supply Collapse Response, RANGE = 0 0.15-V to 1.25-V range, midcode Figure 6-31. DAC VDD Supply Collapse Response, RANGE = 0 0.4-V to 2-V range, midcode Figure 6-32. DAC IOVDD Supply Collapse Response, RANGE = 1 AFE78101, AFE88101 SLASF21 – DECEMBER 2022 www.ti.com

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at TA = 25°C, PVDD = VDD = IOVDD = 1.8 V, external or internal VREFIO = 1.25 V, RLOAD = 50 kΩ to GND, CLOAD = 100 pF to GND, and digital inputs at IOVDD or GND (unless otherwise noted) Ideal reference Figure 6-33. DAC Output Voltage Long-Term Stability Internal Reference Figure 6-34. DAC AC PSRR vs Frequency www.ti.com AFE78101, AFE88101 SLASF21 – DECEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 17 Product Folder Links: AFE78101 AFE88101

6.9 Typical Characteristics: ADC

at TA = 25°C, PVDD = VDD = IOVDD = 1.8 V, external or internal VREFIO = 1.25 V, RLOAD = 50 kΩ to GND, CLOAD = 100 pF to GND, and digital inputs at IOVDD or GND (unless otherwise noted) Figure 6-35. ADC DNL vs Digital Input Code Figure 6-36. ADC INL vs Digital Input Code Figure 6-37. ADC DNL Range vs Temperature Figure 6-38. ADC INL Range vs Temperature Figure 6-39. ADC Offset Error vs Temperature Figure 6-40. ADC Gain Error vs Temperature AFE78101, AFE88101 SLASF21 – DECEMBER 2022 www.ti.com

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6.10 Typical Characteristics: Reference

at TA = 25°C, PVDD = IOVDD = 3.3 V, external or internal VREFIO = 1.25 V, RLOAD = 50 kΩ to GND, CLOAD = 100 pF to GND, and digital inputs at IOVDD or GND (unless otherwise noted) Pre-soldered Figure 6-41. Reference Voltage Temperature Drift Post-soldered Figure 6-42. Reference Voltage Temperature Drift –40°C to +85°C cycles, 60 minutes per cycle Figure 6-43. Multiple Temperature Cycle Hysteresis –40°C to +85°C cycles, 60 minutes per cycle Figure 6-44. Multiple Temperature Cycle Hysteresis Two minutes after 25°C to 85°C temperature step Figure 6-45. Ambient Temperature Change Settling Figure 6-46. Reference Voltage Long-Term Stability www.ti.com AFE78101, AFE88101 SLASF21 – DECEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 19 Product Folder Links: AFE78101 AFE88101

6.10 Typical Characteristics: Reference (continued)

at TA = 25°C, PVDD = IOVDD = 3.3 V, external or internal VREFIO = 1.25 V, RLOAD = 50 kΩ to GND, CLOAD = 100 pF to GND, and digital inputs at IOVDD or GND (unless otherwise noted) Figure 6-47. Reference Output Noise, 0.1 Hz to 10 Hz Figure 6-48. Reference AC PSRR vs frequency Figure 6-49. Reference Source and Sink Current Capability Figure 6-50. Initial Accuracy Distribution AFE78101, AFE88101 SLASF21 – DECEMBER 2022 www.ti.com

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6.11 Typical Characteristics: Power Supply

at TA = 25°C, PVDD = IOVDD = 3.3 V, internal VREFIO, RLOAD = 50 kΩ to GND, CLOAD = 100 pF to GND, and digital inputs at IOVDD or GND (unless otherwise noted) Figure 6-51. PVDD Supply Current vs Temperature Figure 6-52. IOVDD Supply Current vs Temperature Figure 6-53. VDD Voltage vs Load Current www.ti.com AFE78101, AFE88101 SLASF21 – DECEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 21 Product Folder Links: AFE78101 AFE88101

7 Detailed Description

7.1 Overview

The AFEx8101 feature a 16-bit ( AFE88101) or 14 ‑bit (AFE78101) string DAC with voltage output buffer. Both devices are capable of operating from supplies as low as 1.71 V at very low power, and are designed for 4-mA to 20-mA, loop-powered applications. The AFEx8101 have two different DAC output voltage ranges depending on supply voltage, and two other ranges depending on configuration. The DAC has calibration registers for setting gain and offset values for adjusting the DAC outputs. The DAC also has different output slewing modes that allow for a programmable linear slew and a sinusoidal shaped output slew. The AFEx8101 also feature a 12 ‑bit SAR ADC that can be multiplexed to measure different inputs, including external nodes and internal nodes for diagnostic measurements on the device. The ADC is capable of making direct-mode measurements with on-demand conversions or auto-mode measurements through continuous conversions using a channel sequencer with a multiplexer. The devices have optional alarm configurations with fault detection and alarm actions. Device communication and programming are done through an SPI or through the UART break mode (UBM). With the SPI, a cyclic redundancy check (CRC) is implemented by default, which can be disabled. Additionally, communications can be monitored with a watchdog timer (WDT) that alerts the user if the device becomes unresponsive to periodic communication. The AFEx8101 feature a 1.25-V, onboard precision voltage reference, and an integrated precision oscillator. Throughout this data sheet, register and bit names are combined with a period to use the following format: <register_name>.<bit_name>. For example, the CLR bit in the DAC_CFG register is labeled DAC_CFG.CLR.

7.2 Functional Block Diagram

POL_SEL/AIN1 16-/14-Bit DAC VOUT Alarm Diagnostics Alarm Responses User Calibration Slew-Rate Control DAC Data Register Watchdog Timer CRC Frame Error Check ALARM SPI Interface UART Interface Control Logic CS SDI SDO SCLK SCLR UARTIN UARTOUT PVDD VDD GND Internal Reference VREFIO REF_EN REF_GND IOVDD RESET Internal OscillatorCLK_OUT IRQ (UARTOUT or SDO) Output Buffer Range Setting AFE78101, AFE88101 SLASF21 – DECEMBER 2022 www.ti.com

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7.3 Feature Description

7.3.1 Digital-to-Analog Converter (DAC) Overview

The AFEx8101 feature a 16 ‑bit ( AFE88101) or 14-bit ( AFE78101) string DAC followed by an output voltage buffer. The DAC can be configured to support two low PVDD (0.15 V to 1.25 V and 0.2 V to 1 V), or high PVDD (0.3 V to 2.5 V and 0.4 V to 2 V) output ranges of operation depending on the PVDD supply voltage and the DAC_CFG.RANGE bit in the device configuration register. Using a voltage-to-current converter stage, these output voltages can be used to control a 4 mA to 20 mA loop. The narrow range corresponds to a 4-mA to 20-mA range. The full range allows for currents under and over the 4-mA to 20-mA range. The devices continuously monitor the PVDD supply to provide proper operation based on the DAC range setting. Table 7-1 shows the valid supply ranges and corresponding VOUT DAC voltage ranges for the AFEx8101. Table 7-1. VOUT DAC Voltage Ranges DAC CONFIGURATION SUPPLY DAC_CFG.RANGE NAME VOUT DAC VOLTAGE RANGEPVDD VDD Invalid configuration 0 V ≤ PVDD < 1.71 V 0 V ≤ VDD < 1.71 V NA Alarm condition(1) 0.15 V or 1.25 V(2) Low PVDD DAC range 1.71 V ≤ PVDD ≤ 1.89 V 1.71 V ≤ VDD ≤ 1.89 V 0 Full range 0.15 V to 1.25 V 1 Narrow range 0.2 V to 1 V High PVDD DAC range 2.7 V ≤ PVDD ≤ 5.5 V VDD is internally generated 0 Full range 0.3 V to 2.5 V 1 Narrow range 0.4 V to 2 V Invalid configuration PVDD > 5.5 V VDD > 1.89 V NA Alarm condition(1) 0.3 V or 2.5 V(2) (1) See Table 7-7 for details. (2) See Figure 7-12 for details. If PVDD or VDD fall outside the specified threshold values associated with the supply configuration during operation, an alarm is generated and the DAC output is set according to the ALARM_ACTION setting. www.ti.com AFE78101, AFE88101 SLASF21 – DECEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 23 Product Folder Links: AFE78101 AFE88101

7.3.1.1 DAC Resistor String

Figure 7-1 shows that the resistor string structure consists of a series of resistors, each of value R. The code loaded to the DAC determines the node on the string at which the voltage is tapped off to be fed into the output amplifier. The voltage is tapped off by closing one of the switches connecting the string to the amplifier. The resistor string architecture has inherent monotonicity, voltage output, and low glitch. To Output Amplifier R R R R R Figure 7-1. DAC Resistor String

7.3.1.2 DAC Buffer Amplifier

The VOUT output pin is driven by the DAC output buffer amplifier. The output amplifier default settings are designed to drive capacitive loads as high as 100 pF without oscillation. The output buffer is able to source and sink 1 mA. The device implements short-circuit protection for momentary output shorts to ground and VDD supply. The source and sink short-circuit current thresholds are set to 5 mA. AFE78101, AFE88101 SLASF21 – DECEMBER 2022 www.ti.com

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7.3.1.3 DAC Transfer Function

The following equation describes the DAC transfer function, which is the relationship between internal signal DAC_CODE and output voltage VOUT: VOUT = DAC_CODE 2N × FSR + V MIN (1) where

• DAC_CODE is an internal signal and the decimal equivalent of the gain and offset calibrated binary code loaded into the DAC_DATA register. DAC_CODE range = 0 to 2N – 1.
• N = DAC_CODE resolution in bits (16 for the AFE88101 and 14 for the AFE78101).
• FSR = VOUT full-scale range for the selected output range in Table 7-2.
• VMIN = the lowest voltage for the selected DAC output range. Table 7-2. FSR and VMIN for all VOUT Ranges PVDD DAC_CFG.RANGE VOUT RANGE FSR VMIN The VOUT range for the DAC is determined by DAC_CFG.RANGE bit when not in the CLEAR state. In the CLEAR state, the range is determined by DAC_CFG.CLR_RANGE bit.

7.3.1.4 DAC Gain and Offset Calibration

The AFEx8101 provide DAC gain and offset calibration capability to correct for end-point errors present in the system. Implement the gain and offset calibration using two registers, DAC_GAIN.GAIN and DAC_OFFSET.OFFSET. Update DAC_DATA register after gain or offset codes are changed for the new values to take effect. The DAC_GAIN can be programmed from 0.5 to 1.499985 using Equation 2. DAC_GAIN = 1 2 + GAIN 2N (2) where

• N = DAC_GAIN resolution in bits: 16 for the AFE88101 and 14 for the AFE78101.
• GAIN is the decimal value of the DAC_GAIN register setting.
• GAIN data are left justified; the last two LSBs in the DAC_GAIN register are ignored for the AFE78101. The example DAC_GAIN settings for the AFE88101 are shown in Table 7-3. Table 7-3. DAC_GAIN Setting vs GAIN Code DAC_GAIN GAIN (HEX) 0.5 0x0000 1.0 0x8000 1.499985 0xFFFF www.ti.com AFE78101, AFE88101 SLASF21 – DECEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 25 Product Folder Links: AFE78101 AFE88101

The DAC_OFFSET is stored in the DAC_OFFSET register using 2's-complement encoding. The DAC_OFFSET value can be programmed from –2(N–1) to 2(N–1) – 1 using Equation 3. DAC_OFFSET = − OFFSETMSB × 2 N − 1 + ∑ i = 0 N − 2 OFFSETi × 2 i (3) where

• N = DAC_OFFSET resolution in bits: 16 for the AFE88101 and 14 for the AFE78101.
• OFFSETMSB = MSB bit of the DAC_OFFSET register.
• OFFSETi = The rest of the bits of the DAC_OFFSET register.
• i = Position of the bit in the DAC_OFFSET register.
• OFFSET data are left justified; the last two LSBs in the DAC_OFFSET register are ignored for the device. The most significant bit determines the sign of the number and is called the sign bit. The sign bit has the weight of –2(N–1) as shown in Equation 3. The example DAC_OFFSET settings for the AFE88101 are shown in Table 7-4. Table 7-4. DAC_OFFSET Setting vs OFFSET Code DAC_OFFSET OFFSET (HEX) 32767 0x7FFF 1 0x0001 0 0x0000 –1 0xFFFF –2 0xFFFE –32768 0x8000 The following transfer function is applied to the DAC_DATA.DATA based on the DAC_GAIN and DAC_OFFSET values: DAC_CODE = DATA × DAC_GAIN + DAC_OFFSET (4) where
• DAC_CODE is the internal signal applied to the DAC.
• DATA is the decimal value of the DAC_DATA register.
• DAC_GAIN and DAC_OFFSET are the user calibration settings.
• DATA data are left justified; the last two LSBs in the DAC_DATA register are ignored for the AFE78101. Substituting DAC_GAIN and DAC_OFFSET in Equation 4 with Equation 2 and Equation 3 results in: DAC_CODE = DATA × 1 2 + GAIN 2N − OFFSETMSB × 2 N − 1 + ∑ i = 0 N − 2 OFFSETi × 2 i (5) The multiplier is implemented using truncation instead of rounding. This truncation can cause a difference of one LSB if rounding is expected. Figure 7-2 shows the DAC calibration path. DAC_DATA Register 01h DAC_GAIN Register 04h DAC_OFFSET Register 05h DAC_CODE Gain = ½ + DAC_GAIN / 216 < 8000h: Gain < 1 = 8000h: Gain = 1 > 8000h: Gain > 1 Offset in 2’s-complement < 0000h: Negative offset 0000h: No offset > 0000h: Positive offset Figure 7-2. DAC Calibration Path AFE78101, AFE88101 SLASF21 – DECEMBER 2022 www.ti.com

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7.3.1.5 Programmable Slew Rate

The slew rate feature controls the rate at which the output voltage or current changes. This feature is disabled by default and is enabled by writing a logic 1 to the DAC_CFG.SR_EN bit. With the slew rate control feature disabled, the output changes smoothly at a rate limited by the output drive circuitry and the attached load. With this feature enabled, the output does not slew directly between the two values. Instead, the output steps digitally at a rate defined by DAC_CFG.SR_STEP[2:0] and DAC_CFG.SR_CLK[2:0]. SR_CLK defines the rate at which the digital slew updates. SR_STEP defines the amount by which the output value changes at each update. Section 7.6.1 shows different settings for SR_STEP and SR_CLK. The time required for the output to slew is expressed as Equation 6: Slew Time = Delta Code Change Slew Step × Slew Clock Rate (6) where

• Slew Time is expressed in seconds
• Slew Step is controlled by DAC_CFG.SR_STEP
• Slew Clock Rate is controlled by DAC_CFG.SR_CLK When the slew-rate control feature is enabled, the output changes at the programmed slew rate. This configuration results in a staircase formation at the output. If the clear code is asserted (see Section 7.3.1.6), the output slews to the DAC_CLR_CODE value at the programmed slew rate. When new DAC data are written, the output starts slewing to the new value at the slew rate determined by the current DAC code and the new DAC data. The update clock frequency for any given value is the same for all output ranges. The step size, however, varies across output ranges for a given value of step size because the LSB size is different for each output range. Two slew-rate control modes are available: linear (default) and sinusoidal. Figure 7-3 and Figure 7-4 show the typical rising and falling DAC output waveforms, respectively. 4 mA (0x0BA3) to 24 mA (0xF45D) measured on a 40-Ω shunt Figure 7-3. Linear Slew Rate: Rising 24 mA (0xF45D) to 4 mA (0x0BA3) measured on 40-Ω shunt Figure 7-4. Linear Slew Rate: Falling www.ti.com AFE78101, AFE88101 SLASF21 – DECEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 27 Product Folder Links: AFE78101 AFE88101

Sinusoidal mode enables fast DAC settling while improving analog rate of change characteristics. Sinusoidal mode is selected by the DAC_CFG.SR_MODE bit. Figure 7-5 and Figure 7-6 show the typical rising and falling DAC output waveforms with sinusoidal slew-rate control, respectively. 4 mA (0x0BA3) to 24 mA (0xF45D) measured on a 40-Ω shunt Figure 7-5. Sinusoidal Slew Rate: Rising 24 mA (0xF45D) to 4 mA (0x0BA3) measured on a 40-Ω shunt Figure 7-6. Sinusoidal Slew Rate: Falling If the slew-rate feature is disabled while the DAC is executing the slew-rate command, the slew-rate operation is aborted, and the DAC output goes to the target code. AFE78101, AFE88101 SLASF21 – DECEMBER 2022 www.ti.com

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7.3.1.6 DAC Register Structure and CLEAR State

The AFE88101 DAC has a 16-bit voltage output, and the AFE78101 DAC has a 14-bit voltage output. Table 7-1 shows four possible VOUT DAC output ranges. With a voltage-to-current converter stage, the narrow range corresponds to a 4-mA to 20-mA range. The full range allows for undercurrents and overcurrents from 3 mA to 25 mA, and is controlled by DAC_CFG.RANGE. The AFEx8101 provide the option to quickly set the DAC output to the value set in the DAC_CLR_CODE register without writing to the DAC_DATA register, referred to as the CLEAR state. Setting the DAC to CLEAR state also sets the DAC output range according to DAC_CFG.CLR_RANGE. For register details, see Table 7-15. Transitioning from the DAC_DATA to the DAC_CLR_CODE is synchronous to the clock. If slew mode is enabled, the output slews during the transition. Figure 7-7 shows the full AFEx8101 DAC_DATA signal path. The devices synchronize the DAC_DATA code to the internal clock, causing up to 2.5 internal clock cycles of latency (2 μs) with respect to the rising edge of CS or the end of a UBM command. Update DAC_GAIN and DAC_OFFSET values when DAC_CFG.SR_EN = 0 to avoid an IRQ pulse generated by SR_BUSY. Set the DAC to CLEAR state either by: 1. Setting DAC_CFG.CLR. 2. Configuring the DAC to transition to the CLEAR state in response to an alarm condition. 3. Using the SDI pin in UBM or the SCLR pin in SPI mode as the CLEAR state input pin. Method 1 is a direct command to the AFEx8101 to set the DAC to CLEAR state. Set the DAC_CFG.CLR bit to 1h to set the DAC to CLEAR state. Method 2 is controlled by settings of ALARM_ACT register. For details of conditions and other masks required to use this method, see Table 7-24 and Section 7.3.3.1. Method 3 supports setting the DAC to CLEAR state without writing to the AFEx8101. This pin-based DAC CLEAR state function is available in SPI mode on the SCLR pin, or in UBM on the SDI pin. The SCLR pin must be tied to GND in UBM. For details of connection options based on communication modes and pins used in each mode, see Section 7.5.1. Set the appropriate pin high to drive the DAC to CLEAR state. DAC_DATA Register 01h DAC_CLR_CODE Register 06h DAC_CFG.CLR Register 03h (Method 1) ALARM_ACT Register 10h (Method 2) Clear Input Pin (Method 3) DAC_GAIN Register 04h DAC_OFFSET Register 05h DAC_CODE DAC_CFG.SR_MODE DAC_CFG.SR_STEP DAC_CFG.SR_CLK Register 03h DAC_OUT Slew Rate: Mode, Step Size, and Clock Timing DAC_CFG.SR_EN Register 03h Slew Enable Figure 7-7. DAC Data Path www.ti.com AFE78101, AFE88101 SLASF21 – DECEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 29 Product Folder Links: AFE78101 AFE88101

7.3.2 Analog-to-Digital Converter (ADC) Overview

The AFEx8101 feature a monitoring system centered on a 12-bit successive approximation register (SAR) ADC and a highly flexible analog multiplexer. The monitoring system is capable of sensing up to two external inputs, as well as several internal device signals. The ADC uses the VREFIO pin voltage as a reference. The ADC timing signals are derived from an on-chip oscillator. The conversion results are accessed through the device serial interface.

7.3.2.1 ADC Operation

The device ADC supports direct-mode and auto-mode conversions. Both conversion modes use a custom channel sequencer to determine which of the input channels are converted by the ADC. The sequence order is fixed. The user selects the start channel and stop channel of the conversion sequence. The conversion method and channel sequence are specified in the ADC Configuration registers. The default conversion method is auto-mode. Figure 7-8 shows the ADC conversion sequence. START Set ADC_CFG.BUF_PD = 0, ADC_CFG.DIRECT_MODE = 0 or 1 TRIGGER.ADC =1? Yes No Set ADC mux to ADC_INDEX_CFG. START Convert ADC ADC idle state Increment ADC custom channel sequencer ADC_CFG. DIRECT_MODE =1? TRIGGER_ADC = 0? Yes No No No Yes ADC_INDEX.STOP (last conversion Completed)? Yes Figure 7-8. ADC Conversion Sequence AFE78101, AFE88101 SLASF21 – DECEMBER 2022 www.ti.com

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To use the ADC, first enable the ADC buffer by setting ADC_CFG.BUF_PD = 0. Then wait at least 210 μs before setting the trigger using the TRIGGER.ADC bit. An internal delay is forced if the trigger signal is sent before the timer has expired. Make sure the ADC is not converting before setting the ADC_CFG.BUF_PD = 1. If ADC_CFG.BUF_PD is set to 1 while the ADC is still converting, the internal timer delays this command. When the timer expires, the enable signal for the ADC is cleared, and the current conversion finishes before powering down the ADC and the ADC Buffer. A trigger signal must occur for the ADC to exit the idle state. The ADC trigger is generated through the TRIGGER.ADC bit. The ADC data registers have the latest available data. Accessing the data registers does not interfere with the conversion process, and thus provides continuous ADC operation. In direct-mode conversion, the selected ADC input channels are converted on demand by issuing an ADC trigger signal. After the last enabled channel is converted, the ADC enters the idle state and waits for a new trigger. Read the results of the ADC conversion through the register map. Direct-mode conversion is typically used to gather the ADC data of any of the data channels. In direct-mode, use the ADC_BUSY bit to determine when a direct-mode conversion is complete and the ADC has returned to the idle state. Direct mode is set by writing ADC_CFG.DIRECT_MODE = 1. In auto-mode conversion, the selected ADC input channels are converted continuously. The conversion cycle is initiated by issuing an ADC trigger. Upon completion of the first conversion sequence, another sequence is automatically started. Conversion of the selected channels occurs repeatedly until the auto-mode conversion is stopped by clearing the ADC trigger signal. Auto-mode conversion is not typically used to gather the ADC data. Instead, auto-mode conversions are used in combination with upper and lower ADC data thresholds to detect when the data has exceeded the programmable out-of-range alarm thresholds. Auto mode is set by writing ADC_CFG.DIRECT_MODE = 0. Regardless of the selected conversion method, update the ADC configuration register only while the ADC is in the idle state. Do not change the ADC configuration bits while the ADC is converting channels. Before changing configuration bits, disable the ADC and verify that GEN_STATUS.ADC_BUSY = 0. www.ti.com AFE78101, AFE88101 SLASF21 – DECEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 31 Product Folder Links: AFE78101 AFE88101

7.3.2.2 ADC Custom Channel Sequencer

The device uses a custom channel sequencer to control the multiplexer of the ADC. The ADC sequencer allows the user to specify which channels are converted. The sequencer consists of 16 indexed slots with programmable start and stop index fields to configure the start and stop conversion points. In direct-mode conversion, the ADC converts from the start index to the stop index once and then stops. In auto-mode conversion, the ADC converts from the start to stop index repeatedly until the ADC is stopped. Figure 7-9 shows the indexed custom channel sequence slots available in the device. ADC OFFSET AIN0 AIN1 TEMP SD MUX GND GND VREF PVDD VDD ZTAT VOUT 4 - 8 ADC_INDEX_CFG.START ADC_INDEX_CFG.STOP Register 09h Custom Channel Sequencer (CCS) Pointer Self Diagnostic Multiplexer (SD MUX) Figure 7-9. ADC MUX Control Table 7-5 lists the ADC input channel assignments for the sequencer. Table 7-5. Indexed Custom Channel Sequence CCS POINTER CHANNEL CONV_RATE RANGE

0 OFFSET 2560 Hz VREF

1 AIN0 Programmable Programmable

2 AIN1 Programmable Programmable

3 TEMP 2560 Hz VREF

4 SD0 (VREF) 2560 Hz VREF

5 SD1 (PVDD) 2560 Hz VREF

6 SD2 (VDD) 2560 Hz VREF

7 SD3 (ZTAT) 2560 Hz VREF

8 SD4 (VOUT) 2560 Hz VREF when PVDD = 1.8 V 2 × VREF when PVDD ≥ 2.7 V 9-15 GND 2560 Hz VREF Use the ADC_INDEX_CFG register to select the channels. The order of the channels is fixed and shown in Table 7-5. Then, use ADC_INDEX_CFG.START and ADC_INDEX_CFG.STOP to select the range of indices to convert. If these two values are the same, then the ADC only converts a single channel. If the START and STOP values are different, then the ADC cycles through the corresponding indices. By default, all channels are configured to be converted; START = 0 and STOP = 8. If the AIN1 channel is not configured as an ADC input, then the result for this channel is 0x000. The minimum time for a conversion is still allotted to AIN1 if the channel is within the START and STOP range. If START is configured to be greater than STOP, then the device interprets the conversion sequence as if START = STOP. In direct mode, each selected channel in the ADC_INDEX_CFG register is converted once per TRIGGER.ADC command. In auto mode, each channel selected in the ADC_INDEX_CFG register is converted once; after the last channel, the loop is repeated as long as the ADC is enabled. In auto mode, writing to TRIGGER.ADC = 1 starts the conversions. Writing TRIGGER.ADC = 0 disables the ADC after the current channel being converted finishes. In direct mode, writing TRIGGER.ADC = 1 starts the sequence. When the sequence ends, then TRIGGER.ADC is self-cleared. AFE78101, AFE88101 SLASF21 – DECEMBER 2022 www.ti.com

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A minimum of 20 clock cycles is required to perform one conversion. The ADC clock is derived from the internal oscillator and divided by 16, which gives an ADC clock frequency of 1.2288 MHz / 16 = 76.8 kHz, for a clock period = 13.02 μs. Each of the internal nodes has a fixed conversion rate. Pins AIN0 and AIN1 have programmable conversion rates (see also the ADC_CFG register). Pins AIN0 and AIN1 also have a configurable range. If PVDD ≥ 2.7 V, then the input range can be either 0 V to 1.25 V or 0 V to 2.5 V, depending on the ADC_CFG.RANGE bit. If PVDD = 1.8 V, then only the 0 V to 1.25 V range is allowed. In this case, the ADC_CFG.RANGE bit is prevented from being set. If any ADC configuration bits are changed, the following sequence is recommended: 1. Disable the ADC 2. Wait for ADC_BUSY to go low 3. Change the configuration 4. Restart the conversions ADC_BUSY can be monitored in the GEN_STATUS register. If the ADC is configured for direct mode (ADC_CFG.DIRECT_MODE = 1), then after setting the desired channels to convert, write a 1 to TRIGGER.ADC. This bit is self-cleared when the sequence is finished converting. This command converts all the selected channels once. To initiate another conversion of the channels, send another TRIGGER.ADC command.

7.3.2.3 ADC Synchronization

The trigger signal must be generated for the ADC to exit the idle state and start conversions. The ADC trigger is generated through the TRIGGER.ADC bit. The ADC data registers have the latest available data. Accessing the data registers does not interfere with the conversion process, and thus provides continuous ADC operation. In direct-mode, use the GEN_STATUS.ADC_BUSY bit to determine when a direct-mode conversion is complete, and the ADC has returned to the idle state. Similarly, monitor the TRIGGER.ADC bit to see if the ADC has returned to the idle state.

7.3.2.4 ADC Offset Calibration

Channel 0 of the CCS pointer is named OFFSET. The OFFSET channel is used to calibrate and improve the ADC offset performance. Convert the OFFSET channel, and use the result as a calibration for the ADC offset in subsequent measurements. This ADC channel samples VREF / 2 and compares this result against 7FFh as a measure of the ADC offset. The data rate for the ADC measuring this channel is 2560 Hz. The ADC conversion for the OFFSET channel is subtracted from 7FFh and the resulting value is stored in ADC_OFFSET (28h). The offset can be positive or negative; therefore, the value is stored in 2’s complement notation. With the subtraction from 7FFh, ADC_OFFSET is the negative of the offset. This value is subtracted from conversions of the ADC by default. For direct measurements of the ADC, set ADC_BYP.OFST_BYP_EN to 1 to enable the offset bypass. www.ti.com AFE78101, AFE88101 SLASF21 – DECEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 33 Product Folder Links: AFE78101 AFE88101

7.3.2.5 External Monitoring Inputs

The AFEx8101 have two analog inputs for external voltage sensing. Channels 1 and 2 for the CCS pointer are for external monitoring inputs that can be measured by pins AIN0 and AIN1, respectively. The input range for the analog inputs is configurable to either 0 V to 1.25 V or 0 V to 2.5 V. The analog inputs conversion values are stored in straight binary format in the ADC registers. The ADC resolution can be computed by Equation 7:

1 L SB =

212 (7) where Figure 7-10 and Table 7-6 detail the transfer characteristics. NFSC+1 PFSC MC + 1 MC ADC Code (Hex) VINNFSC

1 LSB (VRANGE ±1 LSB)(VRANGE/2 + 1 LSB)VRANGE/2

Figure 7-10. ADC Transfer Characteristics Table 7-6. Transfer Characteristics INPUT VOLTAGE CODE DESCRIPTION IDEAL OUTPUT CODE ≤1 LSB NFSC Negative full-scale code 000

1 LSB to 2 LSB NFSC + 1 Negative full-scale code plus 1 001

(VRANGE / 2) to (VRANGE / 2) + 1 LSB MC Midcode 800 (VRANGE / 2) + 1 LSB to (VRANGE / 2) + 2 LSB MC + 1 Midcode plus 1 801 ≥ VRANGE – 1 LSB PFSC Positive full-scale code FFF For these external monitoring inputs, the ADC is configurable for both data rate and voltage range. The data rate is set to either 640 Hz, 1280 Hz, 2560 Hz, or 3840 Hz with the ADC_CFG.CONV_RATE bits. The range of the ADC measurement is set with the ADC_CFG.AIN_RANGE bit. The ADC range is 2 × VREF when the bit = 0; the ADC range is VREF when the bit = 1. ADC_CFG.AIN_RANGE only controls the range if PVDD > 2.7 V. When PVDD = 1.8 V, the range is VREF regardless of the setting. When the ADC conversion is completed for AIN0 and AIN1, the resulting ADC data are stored in the ADC_AIN0.DATA and ADC_AIN1.DATA bits at 24h and 25h of the register map. If the external monitoring inputs are not used, connect the AIN0 and AIN1 pins to GND through a 1-kΩ resistor. AFE78101, AFE88101 SLASF21 – DECEMBER 2022 www.ti.com

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7.3.2.6 Temperature Sensor

Channel 3 of the CCS is used to measure the die temperature of the device. The ADC measures an internal temperature sensor that measures a voltage complementary to the absolute temperature (CTAT). This CTAT voltage has a negative temperature coefficient. The ADC converts this voltage at a data rate of 2560 Hz. When the ADC conversion is completed, the data are found in the ADC_TEMP.DATA bits (address 26h). The relationship between the ambient temperature and the ADC code is shown in Equation 8: ADC Code = 2681 − 11 × T A °C (8)

7.3.2.7 Self-Diagnostic Multiplexer

In addition to the ADC offset, the two external monitoring inputs, and the temperature sensor, the ADC of the AFEx8101 has five other internal inputs to monitor the reference voltage, the power supplies, a static voltage, and the DAC output. These five voltages measurements are part of the self-diagnostic multiplexer (SD0 to SD4) measurements of the ADC, and are reported in the ADC_SD_MUX register at 27h; see also Section 7.6. Channel 4 (SD0) measures the reference voltage of the device. The ADC measures the reference voltage through a resistor divider (divide by two). Be aware that all ADC measurements are a function of the reference; using SD0 to measure the reference is not revealing as a diagnostic measurement. The data rate for this conversion is 2560 Hz and the range of the ADC is set to VREF. Channel 5 (SD1) measures the PVDD power supply of the device. The ADC measures the PVDD voltage through a resistor divider (divide by six). The data rate for this conversion is 2560 Hz and the range of the ADC is set to VREF. Channel 6 (SD2) measures the VDD power supply of the device. When channel 6 is selected, the ADC measures the VDD voltage through a resistor divider (divide by 2). The data rate for this conversion is 2560 Hz and the range of the ADC is set to VREF. Channel 7 (SD3) is a ZTAT (zero temperature coefficient) voltage. This internal voltage is nominally 0.6 V with a low temperature drift and does not depend on the reference voltage. An ADC measurement of ZTAT voltage can be useful to determine the state of the reference voltage. The data rate for this conversion is 2560 Hz and the range of the ADC is set to VREF. Channel 8 (SD4) measures the VOUT of the DAC. The ADC measures the VOUT voltage through a resistor divider (divide by two). The data rate for this conversion is 2560 Hz. The input range for the DAC voltage monitoring input is scaled from either 0-V to 2.5-V or 0-V to 1.25-V, depending on PVDD voltage. As soon as the PVDD voltage exceeds 2.7 V, the input range for the DAC voltage monitoring automatically switches to the 0-V to 2.5-V range. The DAC voltage conversion values are stored in straight-binary format in the ADC registers. The ADC resolution for these channels is computed by Equation 7. www.ti.com AFE78101, AFE88101 SLASF21 – DECEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 35 Product Folder Links: AFE78101 AFE88101

7.3.2.8 ADC Bypass

To test the offset, modify the ADC data path by programming the bypass data register, ADC_BYP.DATA (2Eh). This read/write register is used in two different ways. First, this bypass data register is used as a substitute for the ADC_OFFSET by setting the ADC_BYP.OFST_BYP_EN to 1. Second, the ADC_BYP.DATA is used as the readback register for the data for the different settings of the custom channel sequencer. The data are replaced by setting the ADC_BYP.DATA_BYP_EN bit. When this bit is set to 1, the ADC conversion is bypassed, and the value of ADC_BYP.DATA is used in the readback channel. This setting is used to test the alarm settings of the ADC. When the ADC bypass is unused, set the ADC_BYP.DATA to 000h. Figure 7-11 shows the ADC bypass data flow. ADC_BYP.DATA Register 2Eh ADC_OFFSET Register 28h ADC_AIN0 Register 24h ADC_AIN1 Register 25h ADC_TEMP Register 26h ADC_SD_MUX Register 27h ADC_BYP. OFST_BYP_EN Register 2Eh ADC_BYP. DATA_BYP_EN Register 2Eh ADC Data From ADC MUX ADC. ADC_OUT Register 2Dh ADC MUX 07FFh – OFFSET Stored as 2’s Complement CCS Pointer Read and Writeable for Testing Figure 7-11. ADC Bypass Data Flow

7.3.3 Programmable Out-of-Range Alarms

The AFEx8101 are capable of continuously analyzing the supplies, external ADC inputs, DAC output voltage, reference, internal temperature, and other internal signals for normal operation. Normal operation for the conversion results is established through the lower- and upper-threshold registers. When any of the monitored inputs are out of the specified range, the corresponding alarm bit in the alarm status registers is set. The alarm bits in the alarm status registers are latched. The alarm bits are referred to as being latched because the alarm bits remain set until read by software. This design makes sure that out-of-limit events cannot be missed if the software is polling the device periodically. All bits are cleared when reading the alarm status registers, and all bits are reasserted if the out-of limit condition still exists on the next monitoring cycle. All of the alarms can be set to activate the ALARM pin. The ALARM pin works as an interrupt to the host so that the host can query the alarm status registers to determine the alarm source. Any alarm event activates the pin as long as the alarm is not masked in the ALARM_STATUS_MASK register. When an alarm event is masked, the occurrence of the event sets the corresponding status bit in the alarm status registers, but does not activate the ALARM pin. In addition, Section 7.3.3.1 describes how the alarm action can be individually configured for each alarm. When the alarm event is cleared, the DAC is reloaded with the contents of the DAC active registers, which allows the DAC outputs to return to the previous operating point without any additional commands. AFE78101, AFE88101 SLASF21 – DECEMBER 2022 www.ti.com

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7.3.3.1 Alarm Action Configuration Register

The AFEx8101 implements an alarm action configuration register (ALARM_ACT, Table 7-24). Writing to this register selects the action that the device automatically takes in case of a specific alarm condition. The ALARM_ACT register determines how the main DAC responds to an alarm event from conversion on self- diagnostics channels, AIN0, AIN1, and TEMP, as well as a CRC and WDT fault, a VREF fault, a TEMP_HI fault, and a TEMP_LO fault. Only these faults can cause a response by the DAC. Other alarm status events can trigger the ALARM pin. There are four options for alarm action. In case different settings are chosen for different alarm conditions, the following (low-to-high) priority is considered when taking action:

• 0. → No action
• 1. → DAC CLEAR state
• 2. → VOUT alarm voltage
• 3. → VOUT Hi-Z If the alarm event occurs and option 1 is selected, then the DAC is forced to the clear code and clear range. This operation is done by controlling the input code to the DAC and the range of the DAC. If the alarm event occurs and option 2 is selected, then VOUT is forced to the alarm voltage. The alarm voltage is controlled by either pin or register bit. If SPECIAL_CFG.AIN1_ENB = 0, then the AIN1 pin controls alarm polarity. Also, register bit SPECIAL_CFG.ALMV_POL can be used. If either of these signals = 1, then the alarm voltage is high; otherwise, the alarm voltage is low. The SPECIAL_CFG register is only reset with POR, so the user setting remains intact through hardware or software resets. If the alarm event occurs and option 3 is selected, then the VOUT buffer is put into Hi-Z. If multiple events occur, then the highest setting takes precedence. Option 3 has the highest priority. www.ti.com AFE78101, AFE88101 SLASF21 – DECEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 37 Product Folder Links: AFE78101 AFE88101

7.3.3.2 Alarm Voltage Generator

Figure 7-12 shows that the alarm voltage is generated independently from the DAC output voltage. The alarm polarity control logic selects the output level of the alarm voltage generator. The alarm action control logic selects between the DAC output and alarm voltage generator output voltages. The alarm action control logic also controls the output buffer Hi-Z switch. POL_SEL/ AIN1 VDD GND Alarm Voltage Generator OUT = 0.15 V OUT = 1.25 V DAC_DATA DAC ALARM_ACT Register 10h VOUT G PVDD =1.8 V: G = 1 PVDD > 2.7 V: G = 2 Hi-Z ALMV_POL 1DAC_CLR_CODE DAC_CODE Figure 7-12. Alarm Voltage Generator Architecture During normal operation, the expected VOUT voltage depends on the DAC_CODE. The ADC thresholds for the SD4 (VOUT) diagnostic channel are set around the programmed DAC_CODE. During the alarm condition, if the alarm action changes the VOUT voltage to the alarm voltage, or switches the VOUT buffer into Hi-Z mode, the VOUT voltage no longer depends on the DAC_CODE. In this case, the SD4 (VOUT) diagnostic channel also reports the alarm. To clear this alarm, as long as all other alarm conditions are cleared, set the alarm action to either no action or to the DAC clear code. Applying either alarm action sets the VOUT voltage within the expected ADC thresholds and clears the alarm after the next ADC measurement of the SD4 (VOUT) channel. Give special consideration to the alarm logic during the transient events. When the new DAC_CODE goes beyond the SD4 (VOUT) alarm thresholds with the ADC monitoring the SD4 (VOUT) input in auto mode, the ADC conversion can occur while VOUT settles to a new value. This conversion can trigger a false alarm. There are two ways to prevent this false alarm: 1. Use direct mode and allow VOUT to settle before triggering the next ADC conversion. 2. Set ADC_CFG.FLT_CNT > 0. With this configuration, a single error in SD4 or any other measurement does not cause an alarm condition to be asserted.

7.3.3.3 Temperature Sensor Alarm Function

The AFEx8101 continuously monitor the internal die temperature. In addition to the ADC measurement, the temperature sensor triggers a comparator to show a thermal warning and a thermal error. A thermal warning alarm is set when the temperature exceeds 85°C. Additionally, a thermal error alarm is set when the die temperature exceeds 130°C. The thermal warning and thermal error alarms can be configured to set the ALARM pin and are indicated in the ALARM_STATUS register. These alarms can be masked with the ALARM_MASK register and also be configured to control the DAC output with the ALARM_ACT register.

7.3.3.4 Internal Reference Alarm Function

The devices provide out-of-range detection for the reference voltage. When the reference voltage exceeds ±5% of the nominal value, the reference alarm flag (VREF_FLT bit) is set. Make sure that a reference alarm condition has not been issued by the device before powering up the DAC output. AFE78101, AFE88101 SLASF21 – DECEMBER 2022 www.ti.com

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7.3.3.5 ADC Alarm Function

The AFEx8101 provide independent out-of-range detection for each of the ADC inputs. Figure 7-13 shows the out-of-range detection block. When the measurement is out of range, the corresponding alarm bit is set to flag the out-of-range condition. AIN0_THRESHOLD [15:8] AIN1_THRESHOLD [15:8] TEMP_THRESHOLD [15:8] Register 12h, 13h, 14h Upper threshold AIN0_THRESHOLD [7:0] AIN1_THRESHOLD [7:0] TEMP_THRESHOLD [7:0] Register 12h, 13h, 14h Lower threshold ADC conversion value ALARM_STATUS ADC_AIN0_FLT, ADC_AIN1_FLT, ADC_TMP_FLT Register 20h [3],[4],[2] Figure 7-13. ADC Out-of-Range Alarm An alarm event is only registered when the monitored signal is out of range for N number of consecutive conversions, where N is configured in the ADC_CFG.FLT_CNT false alarm register settings. If the monitored signal returns to the normal range before N consecutive conversions, an alarm event is not issued. If an ADC input signal is out of range and the alarm is enabled, then the corresponding alarm bit is set to 1. However, the alarm condition is cleared only when the conversion result returns to a value less than the high-limit register setting and greater than the low-limit register setting by the number of codes specified by the hysteresis setting (see Figure 7-14). The hysteresis is a programmable value between 0 LSB to 127 LSB in the ADC_CFG.HYST register. High Threshold Low Threshold Over High Alarm Below Low Alarm Hysteresis Hysteresis Figure 7-14. ADC Alarm Hysteresis www.ti.com AFE78101, AFE88101 SLASF21 – DECEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 39 Product Folder Links: AFE78101 AFE88101

7.3.3.6 Fault Detection

There are two fields within the ADC_CFG register: FLT_CNT and HYST. These fields are applied to the assertion and deassertion of alarm conditions for all the ADC channels. ADC_CFG.FLT_CNT determines the number of consecutive failures needed to trip an alarm condition. For example, if ADC_CFG.FLT_CNT is set for three counts, then three consecutive conversions must be outside of the thresholds. Each failure counts towards the FLT_CNT limit even if the failures alternate between high threshold and low threshold. ADC_CFG.HYST sets the hysteresis used by the alarm-detection circuit. After an alarm is triggered, the hysteresis is applied before the alarm condition is released. In the case of the high threshold, the hysteresis is subtracted from the threshold value. In the case of the low threshold limit, the hysteresis is added to the threshold value. Channels AIN0, AIN1, and TEMP have high and low thresholds associated with them. If a conversion value falls outside of these limits (that is, if TEMP < low threshold or TEMP > high threshold), an alarm condition for that channel is set. The alarms are disabled by setting 0x000 for the low threshold and 0xFFF for the high threshold, respectively. These alarms are disabled by default. Because the configuration fields for the thresholds are only eight bits wide, the four LSBs are hardcoded for each threshold. The high thresholds four LSBs are hardcoded to 0xF, and the low thresholds four LSBs are hardcoded to 0x0. All the self diagnostic (SD) channels have fixed thresholds, except SD4, which measures the VOUT of the main DAC. The threshold for SD4 tracks the VOUT with respect to the DAC code. Table 7-7 shows the calculations used to determine the high and low ADC thresholds for each SD channel. The limits in the two right-most columns are determined by the threshold columns to the left and given some margin. The four LSBs are assigned as described previously. Table 7-7. Self Diagnostic (SD) Alarm ADC Thresholds SD ADC INPUT ACCEPTED LOW VALUE ACCEPTED HIGH VALUE LOW THRESHOLD HIGH THRESHOLD ADC LOW (HEX) ADC HIGH (HEX) SD0 VREF/2 VREF/2 – 9% – 25 mV VREF/2 + 9% + 25 mV 0.54375 V 0.70625 V 0x6D0 0x92F SD1 PVDD/6 1.65/6 – 25 mV 6/6 + 25 mV 0.25 V 1.025 V 0x310 0xD3F SD2 VDD/2 1.6/2 – 25 mV 2/2 + 25 mV 0.775 V 1.025 V 0x9C0 0xD3F SD4 VOUT/2 VOUT/2 – 6 mV VOUT/2 + 6 mV VOUT – 12 mV VOUT + 12 mV Expected – 0x040 Expected + 0x040 The alarm threshold for the SD4 input depends on the expected ADC measurement based on the DAC code. The threshold is different for each DAC range and is adjusted accordingly. Equation 9 shows the expected ADC code for RANGE = 0, and Equation 10 shows the expected ADC code for RANGE = 1. ADC Expected Code: RANGE 0 = DAC_CODE MSB: MSB – 11 × 113 ÷ 128 + 492 2 (9) ADC Expected Code: RANGE 1 = DAC_CODE MSB: MSB – 11 × 82 ÷ 128 + 655 2 (10) AFE78101, AFE88101 SLASF21 – DECEMBER 2022 www.ti.com

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7.3.4 IRQ

The devices include an interrupt request (IRQ) to communicate the occurrence of a variety of events to the host controller. The IRQ block initiates interrupts that are reported internally in a status register, externally on the IRQ pin if the function is enabled, or on the ALARM pin if the condition is from the ALARM_STATUS register. Figure 7-15 shows the IRQ block diagram. GEN_STATUS Register 21h ALARM_STATUS Register 20h GEN_STATUS_MASK Register 1Eh ALARM_STATUS_MASK Register 1Dh Interrupt Generation Maskable Status Bits D CLK Q Internal Oscillator D CLK Q CONFIG.IRQ_POL Register 02h CONFIG.IRQ_LVL Register 02h XOR IRQ Pulse Generation (813-ns Wide) IRQ Figure 7-15. IRQ Block Diagram There are two registers that can generate interrupts: GEN_STATUS and ALARM_STATUS. Each of these registers has a corresponding STATUS_MASK register. The mask register controls which of the events trigger an interrupt. Writing a 1 in the mask register masks, or disables, the event from triggering an interrupt. Writing a 0 in the mask register allows the event to trigger an IRQ. All bits are masked by default. Some status bits are sticky. Reading the corresponding register clears a sticky bit, unless the condition still exists. The IRQ is configured through CONFIG.IRQ_LVL to be edge- or level-sensitive. Set this bit to logic 1 to enable level-sensitive functionality (default). In edge-sensitive mode, the IRQ signal is a synchronous pulse, one internal clock period wide (813 ns). In level-sensitive mode, the IRQ is set and remains set as long as the condition exists. After the IRQ condition is removed, the condition is cleared by reading the corresponding status register. Trying to clear the bit while the condition still exists does not allow the bit to be cleared if the bit is sticky. CONFIG.IRQ_POL determines the active level of the IRQ. A logic 1 configures IRQ to be active high. When using edge-sensitive IRQ signals, there is a clock cycle delay for synchronization and edge detection. With a 307.2-kHz clock, this delay is up to 3.26 μs. For level-sensitive mode, the delay is approximately 10 ns to 20 ns. Most status bits have two versions within the design. The first version is an edge event that is created when the status is asserted. This signal is used to generate edge-sensitive IRQs. This edge detection prevents multiple status events from blocking one another. The second version is the sticky version of the status bit. This signal is set upon assertion of the status bit and cleared when the corresponding status register is read, as long as the status condition does not still persist. Signals GEN_IRQ and ALARM_IRQ are driven by the logical OR of the of the status bits within the corresponding register. If a status bit is unmasked and the sticky version of that bit has been asserted, and the IRQ is level-sensitive, then an interrupt is triggered as soon as the bit is unmasked. If the IRQ is edge-sensitive then a status event must occur after the bit has been unmasked to assert an interrupt. www.ti.com AFE78101, AFE88101 SLASF21 – DECEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 41 Product Folder Links: AFE78101 AFE88101

7.3.5 Internal Reference

The AFEx8101 family of devices includes a 1.25-V precision band-gap reference. The internal reference is externally available at the VREFIO pin and sources up to 2.5 mA. For noise filtering, use a 100-nF capacitor between the reference output and GND. The internal reference circuit is enabled or disabled by using the REF_EN pin. A logic high on this pin enables the internal reference, and the VREFIO pin outputs 1.25 V. A logic low on this pin disables the internal reference, and the device expects to have 1.25 V from external VREF at the VREFIO pin. An invalid reference voltage asserts an alarm condition. The DAC response depends on the VREF_FLT setting in the ALARM_ACT register (10h).

7.3.6 Integrated Precision Oscillator

The internal time base of the device is provided by an internal oscillator that is trimmed to less than 0.5% tolerance at room temperature. The precision oscillator is the timing source for ADC conversions. At power up, the internal oscillator and ADC take roughly 300 µs to reach < 1% error stability. After the clock stabilizes, the ADC data output is accurate to the electrical specifications provided in Section 6.

7.3.7 One-Time Programmable (OTP) Memory

One-time programmable (OTP) memory in the device is used to store the device trim settings and is not accessible to users. The OTP memory data are loaded to the memory at power up. The OTP memory CRC is performed to verify the correct data are loaded. The TRIGGER.SHADOWLOAD bit is available to initiate a reload of the OTP memory data if a CRC error is detected. The SPECIAL_CFG.OTP_LOAD_SW_RST bit controls whether the OTP memory data are reloaded with a software reset. AFE78101, AFE88101 SLASF21 – DECEMBER 2022 www.ti.com

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7.4 Device Functional Modes

7.4.1 DAC Power-Down Mode

Power-down mode facilitates rapid turn-off of the voltage at the DAC output. The DAC can be set to enter and exit power-down mode through hardware, software, or automatically in response to an alarm event. The DAC output is specified for glitch-free performance when going into and out of power-down mode. Power-down mode is also be enabled by setting DAC_CFG.PD to 1. In power-down mode, the DAC output amplifier powers down and the DAC output pin is put into the Hi-Z configuration. The DAC output remains in power-down mode until the DAC output is re-enabled. Alarm control of the power-down mode is enabled by setting the alarm events as DAC power-down sources. The alarm events that trigger the DAC output power-down state must be specified in the ALARM_ACT register. After the alarm bit is cleared, the DAC returns to normal operation, as long as no other power-down controlling alarm event has been triggered. The DAC register does not change when the DAC enters power-down mode, which enables the device to return to the original operating point after return from the power-down mode. Additionally, the DAC register can be updated while the DAC is in power-down mode, thus allowing the DAC to output a new value upon return to normal operation.

7.4.2 Reset

There are three reset mechanisms in the device: a power-on reset (POR), a RESET pin, and the SW_RST command that can be sent through the either the SPI or by UBM. When power is first applied to the device, a POR circuit holds the device in reset until all supplies reach the specified operating voltages. The power-on reset returns the device to a known operating state in case a brownout event occurs (when the supplies have dipped below the minimum operating voltages). The POR starts all digital circuits in reset as the supply settles, and releases them to make sure that the device starts in the default condition and loads the OTP memory. After the OTP memory has been loaded, the ALARM pin is released. At this time, communication with the device is safe. This tPOR time is less than 100 µs. The devices also have a RESET pin that is used as a hardware reset to the device. Send the RESET pin low for a minimum of 100 ns (t RESET) to reset the device. A delay time of 10 μs (tRESETWAIT) is required before sending the first serial interface command as the device latches and releases the reset. The release of the internal reset state is synchronized to the internal clock. The RESET pin resets the SPI and the UART interfaces, the watchdog timer, the internal oscillator, and the device registers. RESET does not reload the OTP memory. The command to RESET.SW_RST = 0xAD resets the device as a software reset. The command is decoded at the rising edge of CS with an SPI command or during the stop bit of the last character of a UBM frame. Set UBM.REG_MODE again to put the device back into UBM when resetting the device in UBM. After sending the RESET command, no delay time is required before sending the first serial interface command as the device latches and releases the reset. The reset is synchronized to the falling edge of the internal clock and is released well before the next rising edge. The ALARM pin pulses low for the width of the internal reset. This pulse duration is less than 20 ns. This command resets the SPI and the UART interface, and the watchdog timer, but does not reset the internal oscillator. The software reset also reloads internal factory trim registers if properly configured in the SPECIAL_CFG register. The SPECIAL_CFG register is only reset with a POR. The POR and hardware reset place the internal oscillator into a reset condition, which holds the clock low. When these two signals are released, there is a delay of a few microseconds before the first rising edge of the clock. The hardware reset, RESET, pulse width must be at least 100 ns to allow the oscillator to properly reset. The SW_RST command is a short pulse. This pulse is not long enough to adequately reset the oscillator. The SW_RST is asserted with a falling edge of the clock. As a result of the long oscillator period, the design architecture provides that all devices are out of reset by the next rising edge. Figure 7-16 shows the reset tree. www.ti.com AFE78101, AFE88101 SLASF21 – DECEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 43 Product Folder Links: AFE78101 AFE88101

ALARM_STATUS GEN_STATUS SPECIAL_CFG Pin Reset Reset Command Power-On Reset Reset Command Power-On Reset CS Pin Reset Power-On Reset Software Reset Hardware Reset Reset WDT.WDT_EN CONFIG.UART_DIS Device Module Register Reset ALARM_STATUS Read Reset GEN_STATUS Read Power-On Reset Device Resets Other Registers Figure 7-16. Reset Conditions AFE78101, AFE88101 SLASF21 – DECEMBER 2022 www.ti.com

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7.5 Programming

The AFEx8101 communicate with the system controller through a serial interface that supports either a UART- compatible two-wire bus or an SPI-compatible bus. Based on the hardware configuration, either interface can be enabled. Figure 7-17 and Figure 7-18 show the configurations to enable SPI mode and UART break mode (UBM), respectively. The SPI supports an 8-bit frame-by-frame CRC that is enabled by default, but can be disabled by the user. UBM does not support CRC, but does support the UART protocol parity bit.

7.5.1 Communication Setup

After any reset or power up, the AFEx8101 wake up able to use the SPI or UART break mode (UBM). The devices include a robust mechanism that configures the interface between either an SPI-compatible or UART- compatible protocol based system, thus preventing protocol change during normal operation. The selection is based on initial conditions from the respective hardware configurations (see Figure 7-17 and Figure 7-18) and any subsequent user configuration.

7.5.1.1 SPI Mode

By default, the AFEx8101 can be fully accessed with the SPI (except UBM.REG_MODE). To set up the device in SPI mode: 1. Set CONFIG.UART_DIS = 1 (disables the UART communication). details, see Table 7-14. IOVDD SPI UART (UBM) Control Logic SDI SDO SCLK UARTOUT UARTIN Serial Peripheral Interface Clock Data In Data Out Chip Select System Controller AFE Isolation Minimum Functionality IOVDD RESET CS SCLR SPI UART (UBM) Control Logic SDI SDO SCLK UARTOUT UARTIN Serial Peripheral Interface Clock Data In Data Out Chip Select Reset Interrupt System Controller AFE Isolation Maximum Functionality RESET CS SCLRClear GND IOVDD CLK_OUT CLK_OUTMonitor Figure 7-17. SPI Mode Connections Figure 7-17 shows the SPI mode logical connections (through the isolation barrier, if used) for both minimum functionality (all optional pins disconnected) and maximum functionality (all pins connected). If CONFIG.IRQ_PIN_EN = 1 is set, then the UARTOUT pin functions as the IRQ output. In SPI mode, set CONFIG.SDO_DSDO = 0 to enable the readback function. This function is disabled by default to save power. If the readback function not enabled, SDO remains in Hi-Z mode even during the subsequent frame after a read request.

7.5.1.2 UART Mode

At power up, the UART interface is set to 9600 baud with UBM enabled. Any reset clears the UBM register, and the register must be set again to use UBM. To set up the device in UBM: 1. Using UBM, set UBM.REG_MODE = 1 at 9600 baud. This setting blocks the SPI from accessing the device and enables the UART interface access to the entire register map. 2. Optionally, set CONFIG.CLR_PIN_EN and CONFIG.IRQ_PIN_EN (See Table 7-14 for details). Figure 7-18 shows the UBM logical connections (through the isolation barrier, if used) for both minimum functionality (all optional pins disconnected) and maximum functionality (all pins connected). If www.ti.com AFE78101, AFE88101 SLASF21 – DECEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 45 Product Folder Links: AFE78101 AFE88101

CONFIG.IRQ_PIN_EN = 1 is set, then the SDO pin functions as the IRQ output. If CONFIG.CLR_PIN_EN = 1 is set, then the SDI pin controls the clear pin function. IOVDD SPI UART (UBM) Control Logic SDI SDO SCLK UARTOUT UARTIN UART Interface Tx Rx System Controller AFE Isolation Minimum Functionality RESET CS SCLR GND IOVDD SPI UART (UBM) Control Logic SDI SDO SCLK UARTOUT UARTIN UART Interface Tx Interrupt Clear Reset Rx System Controller AFE Isolation Maximum Functionality RESET CS SCLR GND IOVDD CLK_OUT CLK_OUTMonitor Figure 7-18. UBM (UART Interface) Connections

7.5.2 Serial Peripheral Interface (SPI)

The AFEx8101 are controlled over a versatile four-wire serial interface (SDIN, SDO, SCLK, and CS). The interface operates at clock rates of up to 12.5 MHz and is compatible with SPI, QSPI, Microwire, and digital signal processing (DSP) standards. The SPI communication command consists of a read or write address, a data word, and an optional CRC byte. The SPI can access all register addresses except for the UBM register. Read-only and read-write capability is defined by register (see Table 7-10). The SPI supports both SPI Mode 1 (CPOL = 0, CPHA = 1) and SPI Mode 2 (CPOL = 1, CPHA = 0). The default SCLK value is low for SPI Mode 1 and high for SPI Mode 2. See Section 6.7 for timing diagrams in each mode. The serial clock, SCLK, can be continuous or gated.

7.5.2.1 SPI Frame Definition

Subject to the timing requirements listed in the Timing Requirements, the first SCLK falling edge immediately following the falling edge of CS captures the first frame bit. Subject to the same requirements, the last SCLK falling edge before the rising edge of CS captures the last bit of the frame. Figure 7-19 shows that the SPI shift register frame is 32-bits wide, and consists of an R/W bit, followed by a 7-bit address, and a 16-bit data word. The 8-bit CRC is optional (enabled by default) and is disabled by setting CONFIG.CRC_EN = 0 (see also SDO SDI Don’t Care Valid DataHi-Z Output Frame (n-1) Status Details CRC_ERR Next Frame (n+1), Command or NOP CS 1'b0 1'b0 RESET 1'b0 GEN_IRQ ALARM_IRQ Address (7b) Data Word (16b) CRC (8b)R/W (1b) R/W (1b) Status (7b) Data Word (16b) CRC (8b) Output Frame (n) Input Frame (n) SCLK 31 30~24 23~8 7~0 Figure 7-19. SPI Frame Details (Default, CRC Enabled) AFE78101, AFE88101 SLASF21 – DECEMBER 2022 www.ti.com

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R/W (1b) Don’t Care Valid DataHi-Z Output Frame (n-1) Status (7b) Data Word (16b) Address (7b) Data Word (16b)R/W (1b) Next Frame (n+1), Command or NOP CS Output Frame (n) Input Frame (n) SCLK 23 22~16 15~0 Figure 7-20. SPI Frame Details (CRC Disabled) For a valid frame, a full frame length of data (24 bits if CRC is disabled or 32 bits if CRC is enabled) must be transmitted before CS is brought high. If CS is brought high before the last falling SCLK edge of a full frame, then the data word is not transferred into the internal registers. If more than a full frame length of falling SCLK edges are applied before CS is brought high, then the last full frame length number of bits are used. In other words, if the number of falling SCLK edges while CS = 0 is 34, then the last 32 SCLK cycles (or 24 if CRC is disabled) are treated as the valid frame. The device internal registers are updated from the SPI shift register on the rising edge of CS. To start another serial transfer, bring CS low again. When CS is high, the SCLK and SDI signals are blocked and the SDO pin is high impedance.

7.5.2.2 SPI Read and Write

The SDI input bit is latched on the SCLK falling edge. The SDI pin receives right-justified data. At the rising edge of CS, the right-most (last) bits are evaluated as a frame. Extra clock cycles (exceeding frame length) during the frame begin to output on SDO the SDI data delayed by one frame length. A read operation is started when R/W bit is 1. The data word input for SDI is ignored in the read command frame. Send the subsequent read or write command frame into SDI to clock out the data of the addressed register on SDO. If no other read or write commands are needed, then issue a NOP command to retrieve the requested data. The read register value is output most significant bit first on SDO on successive edges (rising or falling based on CONFIG.FSDO setting) of SCLK. A write operation starts when R/W bit is 0. The SDO output to a write command, delivered in the next frame, contains status bits, data described in Table 7-8, and if the CRC is enabled, an 8-bit CRC for the output frame. Table 7-8. Command Functions COMMAND BIT SDI INPUT DATA WORD SDO RESPONSE DATA WORD(1) Write (R/W = 0) Data to be written (16b) 0x0000 Read (R/W = 1) Ignored(2) Register output data (16b) (1) Response data portion in next frame output. (2) The input bits are included in the calculation for CRC, if enabled (see Section 7.5.2.3). Valid SDO output is driven only when CS = 0 and CONFIG.DSDO = 0; otherwise, the SDO pin remains Hi-Z to save power. The SDO data bits are left-justified within the frame, meaning the most significant bit is produced on the line (subject to timing details) when CS is asserted low (bit is driven by falling edge of CS). The subsequent bits in the frame are driven by the rising SCLK edge when CONFIG.FSDO = 0 (default). To drive the SDO data on the falling edge of SCLK, set CONFIG.FSDO = 1. This setting effectively gives the SDO data an additional ½ clock period for setup time, but at the expense of hold time. The frame output on SDO contains the command bit of the input that generated the frame (previous input frame), followed by seven status bits (see Figure 7-19 ). When an input frame CRC error is detected, the status bit CRC_ERR = 1. If there is no input frame CRC error, then CRC_ERR = 0. See Table 7-9 for details.

7.5.2.3 Frame Error Checking

If the AFEx8101 are used in a noisy environment, use the CRC to check the integrity of the SPI data communication between the device and the system controller. This feature is enabled by default and is controlled www.ti.com AFE78101, AFE88101 SLASF21 – DECEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 47 Product Folder Links: AFE78101 AFE88101

by the CONFIG.CRC_EN bit. If the CRC is not required in the system, disable frame error checking through the CRC_EN bit, and switch from the default 32-bit frame to the 24-bit frame. Frame error checking is based on the CRC-8-ATM (HEC) polynomial: x8 + x2 + x + 1 (9'b100000111). For the output register readback, the AFEx8101 supply the calculated 8-bit CRC for the 24 bits of data provided, as part of the 32-bit frame. The AFEx8101 decodes 24-bits of the input frame data and the 8-bit CRC to compute the CRC remainder. If no error exists in the frame, the CRC remainder is zero. When the remainder is nonzero (that is, the input frame has single-bit or multiple-bit errors) the ALARM_STATUS.CRC_ERR_CNT bits are incremented. A bad CRC value prevents execution of commands to the device. When the CRC error counter reaches the limit programmed in CONFIG.CRC_ERR_CNT, the CRC_FLT status bit is set in the ALARM_STATUS register. The fault is reported (as long as the corresponding mask is not set) as an ALARM_IRQ on SDO during the next frame. The ALARM pin asserts low if enabled by the alarm action configuration (see Section 7.3.3.1). The CRC_ERR status bit (see Figure 7-19 ) in the SDO frame is not sticky and is only reported for the previous frame. The ALARM_STATUS.CRC_FLT bit is sticky and is only cleared after a successful read of the ALARM_STATUS register. Read the GEN_STATUS or ALARM_STATUS registers to clear any sticky bits that are set. The sticky status bits are cleared at the start of the readback frame and are latched again at the end of the readback frame. Therefore, if the fault condition previously reported in the status register is no longer present at the end of the readback frame, and the data are received by the microcontroller with the CRC error, the fault information is lost. If a robust monitoring of the status bits is required in a noisy environment, use the IRQ pin in combination with the status mask bits to find out the status of each fault before clearing the status bits. Set the CONFIG.IRQ_LVL bit to monitor the signal level on the IRQ pin, and unmask each status bit one at a time to retrieve the information from the status registers.

7.5.2.4 Synchronization

The AFEx8101 register map runs on the internal clock domain. Both the SPI and UBM packets are synchronized to this domain. This synchronization adds a latency of 0.4 µs to 1.22 µs (1.5 internal clocks), with respect to the rising edge of CS or the STOP bit of the last byte of the UBM packet. The effect of clock synchronization on UBM communication is not evident because of the lower speed and asynchronous nature of UBM communication. In SPI mode, if changing register bits CONFIG.DSDO, CONFIG.FSDO, or CONFIG.CRC_EN, keep CS high for at least two clock cycles before issuing the next frame. Frame data corruption can occur if the two extra cycles are not used. The following are examples of frame corruption:

• Setting CONFIG.DSDO = 0: SDO begins to drive in the middle of the next frame.
• Changing CONFIG.FSDO: The launching edge of SDO changes in the middle of the next frame.
• Setting CONFIG.CRC_EN = 1: The next frame has a CRC error because the CRC is enabled in the middle of the frame. Send a NOP command (SDI = 0x00_0000) after setting the DSDO, FSDO, and CRC_EN bits to prevent the corrupted frames from impacting communication. Sending a NOP after CONFIG.CRC_EN is set still generates a CRC error, and is reported in the STATUS portion of SDO. To avoid false errors, wait approximately 2 µs after setting CONFIG.CRC_EN before sending the next frame. AFE78101, AFE88101 SLASF21 – DECEMBER 2022 www.ti.com

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7.5.3 UART

In UART mode, the device expects 1 start bit, 8 data bits, 1 odd parity bit, and 1 stop bit, or an 8O1 UART character format.

7.5.3.1 UART Break Mode (UBM)

In UART break mode (UBM), the microcontroller issues a UART break to start communication. The device interprets the UART break as the start to receive commands from the UART. A communication UART character consists of one start bit, eight data bits, one odd parity bit, and at least one stop bit. A UART break character is all 11 bits (including start, data, parity and stop bit) held low by the microcontroller on the UARTIN pin and by the AFEx8101 on the UARTOUT pin. When a valid break character is detected on UARTIN by the AFEx8101, no parity (even though parity is odd) or stop bit errors are flagged for this character. The parity and stop bit differences between valid UBM break and communication characters must be managed by the system microcontroller when receiving these characters from the UARTOUT pin of the AFEx8101. See Figure 6-2 for UBM break character, communication timing details, and bit order. AFEx8101 UART break mode communication is supported at 9600 baud. Set UBM.REG_MODE = 1 to enable register map access through the UART. By default, this bit is set to 0. The entire register map can only be accessed with SPI, except for the UBM register. The UBM register can only be accessed with UBM. After UBM.REG_MODE is set to 1, the SPI does not have access to the register map, and the full register map is accessible by UBM. A UBM data output packet is initiated by AFEx8101 on UARTOUT in two cases. See Figure 7-23 for packet structure details. If the R/IRQn status bit is 0 an IRQ event initiated the break command. If the R/IRQn status bit is 1, the break command is a response to the prior read request. To enable IRQ events, set CONFIG.UBM_IRQ_EN = 1. When IRQ is enabled, the AFEx8101 triggers a break command followed by data on UARTOUT (see Figure 7-23). The contents of the data are listed in order of priority below. 1. If ALARM_IRQ bit is set, then the contents of the ALARM_STATUS register are output. 2. If GEN_IRQ is set, then the contents of the GEN_STATUS register are output. 3. If none of the previous bits are set, then an IRQ is not generated. A break byte is followed by three bytes. These three bytes have information identical to the SPI frame without the CRC (see Figure 7-20). The CRC cannot be enabled for UBM. All communication characters on the UART bus are transmitted least significant data bit (D0) first. Figure 7-21 shows the data structure of the UBM write command, and Figure 7-22 shows the data structure of the UBM read command. S = Start bit, Par = Parity bit, P = Stop bit UART Break UART Write Data MSB Address [0:6] S P UART Break Write Par 1'b0 (Write) Data [8:15] S P Par UART Write Data LSB Data [0:7] P Par UARTIN S Figure 7-21. UARTIN Break Write Data Format www.ti.com AFE78101, AFE88101 SLASF21 – DECEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 49 Product Folder Links: AFE78101 AFE88101

[0:6] S P UART Read Command Par 1'b1 (Read) UARTIN S = Start bit, Par = Parity bit, P = Stop bit Figure 7-22. UARTIN Break Read Data Format Figure 7-23 shows the UARTOUT data frame with details of the status bits produced by the AFEx8101. See Table 7-9 for details. S = Start bit, Par = Parity bit, P = Stop bit Status [0:7] S P UART Read Data Par Data [8:15] S P Par Data [0:7] P Par UARTOUT Continued from UART Break Read... SUART Break UART Read DataStatus Byte ALARM_IRQ GEN_IRQ 1'b0 RESET 1'b0 1'b0 1'b0 R/IRQn 1 = Read req. 0 = IRQ event Figure 7-23. UARTOUT Break Data Format AFE78101, AFE88101 SLASF21 – DECEMBER 2022 www.ti.com

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7.5.4 Status Bits

Every response, in SPI mode and UBM, from the AFEx8101 includes a set of status bits. For SPI mode bit order, Table 7-9. Status Bits STATUS BIT DESCRIPTION NOTES / REFERENCE ALARM_IRQ 1h = ALARM_IRQ asserted 0h = Normal operation From the GEN_STATUS(1) register (Table 7-33). Also see Section 7.3.4. CRC_ERR (CRC enabled SPI only) 1h = CRC error detect in input frame 0h = No CRC error detected Generated by the SPI on a frame by frame basis. See Section 7.5.2.3. GEN_IRQ 1h = GEN_IRQ asserted 0h = Normal Operation From the ALARM_STATUS(1) register (Table 7-32). Also see Section 7.3.4. R/IRQn (UBM only) 1h = Read request 0h = IRQ event Generated by the UART interface on a frame by frame basis. See Section 7.5.3.1 for details. RESET 1h = First readback after RESET 0h = All other readbacks From the GEN_STATUS register (Table 7-33). Also see Section 7.4.2. (1) ALARM_STATUS, and GEN_STATUS registers contain cross-readable IRQ flags for the other register. The ALARM_STATUS register has the GEN_IRQ bit. GEN_STATUS has the ALARM_IRQ bit. This functionality enables the system microcontroller to always get full status information by reading only one register, and thus save power.

7.5.5 Watchdog Timer

The AFEx8101 include a watchdog timer (WDT) that is used to make sure that communication between the system controller and the device is not lost. The WDT checks that the device received a communication from the system controller within a programmable period of time. To enable this feature, set WDT.WDT_EN to 1. The WDT monitors both SPI and UBM communications. The WDT has two limit fields: WDT.WDT_UP and WDT.WDT_LO. The WDT_UP field sets the upper time limit for the WDT. The WDT_LO field sets the lower time limit. If the WDT_LO is set to a value other than 2’b00, then the WDT acts as a window comparator. If the write occurs too quickly (less than the WDT_LO time), or too slowly (greater than the WDT_UP time), then a WDT error is asserted. When acting as a window comparator, in the event of a WDT error, the WDT resets only when a write to the WDT register occurs. If the WDT_LO is set to 2'b00, then a write to any register resets the WDT time counter. In this mode, the WDT error is asserted when the timer expires. If enabled, the chip must have any SPI or UBM write to the device within the programmed timeout window. Otherwise, the ALARM pin asserts low, and the ALARM_STATUS.WD_FLT bit is set to 1. The WD_FLT bit is sticky. After a WD_FLT has been asserted, WDT.WDT_EN must be set to 0 to clear the WDT condition. Then the WDT can be re-enabled. The WDT condition is also cleared by issuing a software or hardware reset. After the WDT condition is clear, WD_FLT is cleared by reading the ALARM_STATUS register. The watchdog timeout period is based on a 1200-Hz clock (1.2288 MHz / 1024). www.ti.com AFE78101, AFE88101 SLASF21 – DECEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 51 Product Folder Links: AFE78101 AFE88101

7.6 Register Maps

Table 7-10 lists the memory-mapped registers for the AFEx8101 registers. Consider all register offset addresses not listed in Table 7-10 as reserved locations; do not modify these register contents. Table 7-10. Register Map ADDR (HEX) REGISTER BIT DESCRIPTION 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 00h NOP NOP [15:0] 01h DAC_DATA DATA [15:0] 02h CONFIG RESERVED CRC_ERR_CNT [1:0] CLKO_DIV CLKO_EN RESERVED UBM_ IRQ_EN IRQ_ PIN_EN CLR_ PIN_EN UART_DIS RESERVED CRC_EN IRQ_POL IRQ_LVL DSDO FSDO 03h DAC_CFG RESERVED PD SR_CLK [2:0] SR_STEP [2:0] SR_EN SR_MODE RESERVED CLR CLR_ RANGE RANGE 04h DAC_GAIN GAIN [15:0] 05h DAC_OFFSET OFFSET [15:0] 06h DAC_CLR_ CODE CODE [15:0] 07h RESET RESERVED SW_RST [7:0] 08h ADC_CFG BUF_PD HYST [6:0] FLT_CNT [2:0] AIN_ RANGE EOC_ PER_CH CONV_RATE [1:0] DIRECT_ MODE 09h ADC_INDEX_ CFG RESERVED STOP [3:0] START [3:0] 0Ah TRIGGER RESERVED SHADOW LOAD ADC 0Bh SPECIAL_ CFG (1) RESERVED OTP_ LOAD_ SW_RST ALMV_ POL AIN1_ENB 10h ALARM_ACT SD_FLT [1:0] TEMP_FLT [1:0] AIN1_FLT [1:0] AIN0_FLT [1:0] CRC_WDT_FLT [1:0] VREF_FLT [1:0] THERM_ERR_FLT [1:0] THERM_WARN_FLT [1:0] 11h WDT RESERVED WDT_UP [2:0] WDT_LO [1:0] WDT_EN 12h AIN0_ THRESHOLD Hi [7:0] Lo [7:0] 13h AIN1_ THRESHOLD Hi [7:0] Lo [7:0] 14h TEMP_ THRESHOLD Hi [7:0] Lo [7:0] 16h UBM (2) RESERVED REG_ MODE 1Dh ALARM_ STATUS_MASK RESERVED SD_FLT OSC_FAIL RESERVED OTP_ CRC_ERR CRC_FLT WD_FLT VREF_FLT ADC_ AIN1_FLT ADC_ AIN0_FLT ADC_ TEMP_ FLT THERM_ ERR_FLT THERM_ WARN_ FLT 1Eh GEN_ STATUS_MASK RESERVED SR_ BUSYn ADC_ EOC RESERVED BREAK_ FRAME_ ERR BREAK_ PARITY_ ERR UART_ FRAME_ ERR UART_ PARITY_ ERR 20h ALARM_ STATUS GEN_ IRQ RESERVED SD_FLT OSC_FAIL CRC_CNT [1:0] OTP_ LOADEDn OTP_ CRC_ERR CRC_FLT WD_FLT VREF_FLT ADC_ AIN1_FLT ADC_ AIN0_FLT ADC_ TEMP_ FLT THERM_ ERR_FLT THERM_ WARN_ FLT 21h GEN_ STATUS ALARM_ IRQ RESERVED OTP_ BUSY RESERVED RESET SR_ BUSYn ADC_ EOC ADC_ BUSY PVDD_HI BREAK_ FRAME_ ERR BREAK_ PARITY_ ERR UART _FRAME _ERR UART_ PARITY_ ERR AFE78101, AFE88101 SLASF21 – DECEMBER 2022 www.ti.com

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Table 7-10. Register Map (continued) ADDR (HEX) REGISTER BIT DESCRIPTION 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 23h ADC_FLAGS RESERVED SD4_FAIL SD3_FAIL SD2_FAIL SD1_FAIL SD0_FAIL TEMP_ FAIL AIN1_ FAIL AIN0_ FAIL RESERVED 24h ADC_AIN0 RESERVED DATA [11:0] 25h ADC_AIN1 RESERVED DATA [11:0] 26h ADC_TEMP RESERVED DATA [11:0] 27h ADC_SD_MUX RESERVED DATA [11:0] 28h ADC_OFFSET RESERVED DATA [11:0] 2Ch DAC_OUT DATA [15:0] 2Dh ADC_OUT RESERVED DATA [11:0] 2Eh ADC_BYP DATA_ BYP_EN OFST_ BYP_EN DIS_GND_ SAMP RESERVED DATA [11:0] 2Fh FORCE_FAIL CRC_FLT VREF_FLT THERM_ ERR_FLT THERM_ WARN_ FLT RESERVED SD4_HI_ FLT SD4_LO_ FLT SD3_HI_ FLT SD3_LO_ FLT SD2_HI_ FLT SD2_LO_ FLT SD1_HI_ FLT SD1_LO_ FLT SD0_HI_ FLT SD0_LO_ FLT (1) The SPECIAL_CFG register can only be reset with POR, and does not respond to the RESET pin or SW_RST command. (2) The UBM register can only be accessed with a UBM command. www.ti.com AFE78101, AFE88101 SLASF21 – DECEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 53 Product Folder Links: AFE78101 AFE88101

7.6.1 AFEx8101 Registers

Complex bit access types are encoded to fit into small table cells. Table 7-11 shows the codes that are used for access types in this section. Table 7-11. AFEx8101 Access-Type Codes Access Type Code Description Read Type R R Read Write Type W W Write W WO Write only W WSC Write self clear Reset or Default Value -n Value after reset or the default value Register Array Variables i,j,k,l,m,n When used in a register name, an offset, or an address, these variables refer to the value of a register array where the register is part of a group of repeating registers. The register groups form a hierarchical structure and the array is represented with a formula. y When used in a register name, an offset, or an address, this variable refers to the value of a register array.

7.6.1.1 NOP Register (Offset = 0h) [Reset = 0000h]

Return to the Register Map. Table 7-12. NOP Register Field Descriptions Bit Field Type Reset Description 15-0 NOP WO 0h No operation. Data written to this field have no effect. Always reads zeros.

7.6.1.2 DAC_DATA Register (Offset = 1h) [Reset = 0000h]

Return to the Register Map. DAC code for VOUT. Table 7-13. DAC_DATA Register Field Descriptions Bit Field Type Reset Description 15-0 DATA R/W 0h Data. DAC code for VOUT. AFE78101, AFE88101 SLASF21 – DECEMBER 2022 www.ti.com

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7.6.1.3 CONFIG Register (Offset = 2h) [Reset = 0036h]

Return to the Register Map. Table 7-14. CONFIG Register Field Descriptions Bit Field Type Reset Description

15 RESERVED R 0h

14-13 CRC_ERR_CNT R/W 0h CRC Errors Count Limit Sets the numbers of consecutive SPI CRC frames that must have errors before the status bits is set. 0h = 1 (default); 1h = 2; 2h = 4; 3h = 8

12 CLKO_DIV R/W 0h CLKO Divider

Divide the clock by 128 to output to CLKO. 0h = Divider disabled, output 1.2288 MHz (default) 1h = Divider enabled, output 9600 Hz

11 CLKO_EN R/W 0h CLKO Enable

Enable the internal oscillator to be driven on CLKO pin. 0h = Disabled (default); 1h = Enabled

10 RESERVED R 0h

9 UBM_IRQ_EN R/W 0h UBM IRQ Enable

Enable IRQ to be sent on UARTOUT through UBM. 0h = Disabled (default); 1h = Enabled

8 IRQ_PIN_EN R/W 0h IRQ Pin Enable

Enable IRQ pin functionality. 0h = Disabled (default); 1h = Enabled

7 CLR_PIN_EN R/W 0h Clear Input Pin Enable

Enable pin-based transition to the CLEAR state in UBM and SPI. 0h = Disabled (default); 1h = SCLR pin enabled in SPI mode or SDI pin configured as clear input pin in UBM

6 UART_DIS R/W 0h UART Disable

Disable UART functionality. 0h = Disabled (default); 1h = Enabled 5 RESERVED R 1h Reserved. Always set this bit to 1h for proper functionality.

4 CRC_EN R/W 1h CRC Enable

Enable CRC for SPI. 0h = Disabled; 1h = Enabled (default)

3 IRQ_POL R/W 0h IRQ Polarity

0h = Active low (default); 1h = Active high

2 IRQ_LVL R/W 1h IRQ Level

0h = Edge sensitive 1h = Level sensitive (default)

1 DSDO R/W 1h SDO Hi-Z

0h = Drive SDO during CS = 0 1h = SDO always Hi-Z (default)

0 FSDO R/W 0h Fast SDO

SDO is driven on negative edge of SCLK. 0h = drive SDO on rising edge of SCLK (launching edge) (default) 1h = drive SDO on falling edge of SCLK (capture edge 1/2 clock early) www.ti.com AFE78101, AFE88101 SLASF21 – DECEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 55 Product Folder Links: AFE78101 AFE88101

7.6.1.4 DAC_CFG Register (Offset = 3h) [Reset = 0B00h]

Return to the Register Map. Table 7-15. DAC_CFG Register Field Descriptions Bit Field Type Reset Description 15-13 RESERVED R/W 0h

12 PD R/W 0h DAC Output Buffer Power-down

DAC output set to Hi-Z in power-down. 0h = DAC output buffer enabled (default) 1h = DAC output buffer disabled 11-9 SR_CLK R/W 5h Slew Clock Rate 0h = 307.2 kHz 1h = 153.6 kHz 2h = 76.8 kHz 3h = 38.4 kHz 4h = 19.2 kHz 5h = 9600 Hz (default) 6h = 4800 Hz 7h = 2400 Hz 8-6 SR_STEP R/W 4h Slew Step Size 0h = 1 code 1h = 2 codes 2h = 4 codes 3h = 8 codes 4h = 16 codes (default) 5h = 32 codes 6h = 64 codes 7h = 128 codes

5 SR_EN R/W 0h Slew Enable

Enables slew on the output voltage. 0h = Disabled (default) 1h = Enabled

4 SR_MODE R/W 0h Slew Mode

Output slew rate mode select. 0h = Linear Slew (default) 1h = Sinusoidal Slew

3 RESERVED R 0h

2 CLR R/W 0h CLEAR State

0h = Normal operation (default) 1h = Force the DAC to the CLEAR state

1 CLR_RANGE R/W 0h Clear Range

Sets DAC CLEAR state output range. 0h = 0.15 V to 1.25 V (default) 1h = 0.2 V to 1.0 V

0 RANGE R/W 0h Range

Sets DAC output range during normal operation. 0h = 0.15 V to 1.25 V (default) 1h = 0.2 V to 1.0 V AFE78101, AFE88101 SLASF21 – DECEMBER 2022 www.ti.com

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7.6.1.5 DAC_GAIN Register (Offset = 4h) [Reset = 8000h]

Return to the Register Map. Table 7-16. DAC_GAIN Register Field Descriptions Bit Field Type Reset Description 15-0 GAIN R/W 8000h Gain Set the gain of the DAC output from 0.5 – 1.499985. For example: 0000h = 0.5 8000h = 1.0 (default) FFFFh = 1.499985

7.6.1.6 DAC_OFFSET Register (Offset = 5h) [Reset = 0000h]

Return to the Register Map. Table 7-17. DAC_OFFSET Register Field Descriptions Bit Field Type Reset Description 15-0 OFFSET R/W 0h Offset Adjust the offset of the DAC output, 2's complement number. For example: 0000h = 0 (default) FFFFh = –1

7.6.1.7 DAC_CLR_CODE Register (Offset = 6h) [Reset = 0000h]

Return to the Register Map. Table 7-18. DAC_CLR_CODE Register Field Descriptions Bit Field Type Reset Description 15-0 CODE R/W 0h CLEAR State DAC Code

7.6.1.8 RESET Register (Offset = 7h) [Reset = 0000h]

Return to the Register Map. Table 7-19. RESET Register Field Descriptions Bit Field Type Reset Description 15-8 RESERVED R 0h 7-0 SW_RST WSC 0h Software Reset Write ADh to initiate software reset. www.ti.com AFE78101, AFE88101 SLASF21 – DECEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 57 Product Folder Links: AFE78101 AFE88101

7.6.1.9 ADC_CFG Register (Offset = 8h) [Reset = 8810h]

Return to the Register Map. Table 7-20. ADC_CFG Register Field Descriptions Bit Field Type Reset Description

15 BUF_PD R/W 1h ADC Buffer Power-down

0h = ADC buffer enabled; 1h = ADC buffer powered down (default) 14-8 HYST R/W 8h Hysteresis The number of codes of hysteresis used when a threshold is exceeded for an ADC measurement of AIN0/AIN1/TEMP. 7-5 FLT_CNT R/W 0h Fault Count Number of successive faults to trip an alarm. Number of successive faults is programmed value + 1 (1-8 faults).

4 AIN_RANGE R/W 1h ADC Analog Input Range

Can only be set if PVDD ≥ 2.7 V to use 2.5-V range for AIN0 and AIN1 inputs. 0h = 2 × VREF; 1h = 1 × VREF (default)

3 EOC_PER_CH R/W 0h ADC End-of-Conversion for Every Channel

Sends an EOC pulse at the end of each channel instead of at the end of all the channels. 0h = EOC after last channel (default); 1h = EOC for every channel 2-1 CONV_RATE R/W 0h ADC Conversion Rate This setting only affects the conversion rate for channels AIN0 and AIN1. Rates are based on a 76.8-kHz ADC clock. All other channels use 2560 Hz. 0h = 3840 Hz (default) 1h = 2560 Hz 2h = 1280 Hz 3h = 640 Hz

0 DIRECT_MODE R/W 0h Direct Mode Enable

0h = Auto mode (default); 1h = Direct mode

7.6.1.10 ADC_INDEX_CFG Register (Offset = 9h) [Reset = 0080h]

The ADC custom channel sequencing configuration is shown in Table 7-21. Return to the Register Map. Table 7-21. ADC_INDEX_CFG Register Field Descriptions Bit Field Type Reset Description 15-8 RESERVED R 0h 7-4 STOP R/W 8h Custom Channel Sequencer Stop Index CCS index to stop ADC sequence. Must be ≥ START. If not, STOP is forced to = START. 0h = OFFSET 1h = AIN0 2h = AIN1 3h = TEMP 4h = SD0 (VREF) 5h = SD1 (PVDD) 6h = SD2 (VDD) 7h = SD3 (ZTAT) 8h = SD4 (VOUT) (default) 9h through Fh = GND 3-0 START R/W 0h Custom Channel Sequencer Start Index CCS index to start ADC sequence. 0h through Fh = Same as STOP field (0h is default) AFE78101, AFE88101 SLASF21 – DECEMBER 2022 www.ti.com

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7.6.1.11 TRIGGER Register (Offset = Ah) [Reset = 0000h]

Return to the Register Map. Table 7-22. TRIGGER Register Field Descriptions Bit Field Type Reset Description 15-2 RESERVED R 0h

1 SHADOWLOAD WSC 0h Shadowload Trigger

This trigger initiates the loading of the OTP array into the parallel latches. If an OTP CRC error is detected, assert this trigger to try and reload the OTP into the memory locations.

0 ADC WSC 0h ADC Trigger

In auto mode, this bit enables or disables the conversions. Manually set 1 (enable) and 0 (disable). In direct mode, setting this bit starts a conversion sequence. The bit is cleared at the end of the sequence. To stop a sequence prematurely, manually clear this bit.

7.6.1.12 SPECIAL_CFG Register (Offset = Bh) [Reset = 0000h]

Return to the Register Map. Table 7-23. SPECIAL_CFG Register Field Descriptions Bit Field Type Reset Description 15-3 RESERVED R 0h

2 OTP_LOAD_SW_RST R/W 0h OTP (One Time Programmable Factory Trimmed Registers) LOAD

OTP reloads with the assertion of a software reset (SW_RST). 0h = No reload with SW_RST 1h = Reload with SW_RST

1 ALMV_POL R/W 0h Alarm Voltage Polarity

This register bit is ORed with the POL_SEL/AIN1 pin (if AIN1_ENB bit is low) to control the VOUT during a hardware reset condition or if alarm is active and alarm action is set appropriately. The following Boolean function is implemented for the internal signal ALMV_POL_o that sets the VOUT voltage: ALMV_POL_o = ALMV_POL OR (POL_SEL/AIN1 AND NOT AIN1_ENB) 0h = Low (0 V) 1h = High (2.5 V)

0 AIN1_ENB R/W 0h AIN1 Pin Enable

This bit determines whether the POL_SEL/AIN1 pin acts as alarm voltage polarity control bit or an input channel to the ADC. 0h = AIN1 pin acts as alarm voltage polarity bit and ADC converts GND 1h = AIN1 pin is an active channel to the ADC www.ti.com AFE78101, AFE88101 SLASF21 – DECEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 59 Product Folder Links: AFE78101 AFE88101

7.6.1.13 ALARM_ACT Register (Offset = 10h) [Reset = 8020h]

Return to the Register Map. Table 7-24. ALARM_ACT Register Field Descriptions Bit Field Type Reset Description 15-14 SD_FLT R/W 2h Self-Diagnostic Fault Action These bits set the device action after a self-diagnostic fault. 0h = No Action 1h = Set DAC to CLEAR state 2h = Switch to alarm voltage determined by ALMV_POL (default) 3h = Place DAC into Hi-Z (power-down) 13-12 TEMP_FLT R/W 0h TEMP Fault Action These bits set the device action if the ADC temperature is outside the TEMP_THRESHOLD Hi or Lo thresholds. 0h through 3h = Same as SD_FLT field (default 0h) 11-10 AIN1_FLT R/W 0h AIN1 Fault Action These bits set the device action if the ADC AIN1 channel is outside the AIN1_THRESHOLD Hi or Lo thresholds. 0h through 3h = Same as SD_FLT field (default 0h) 9-8 AIN0_FLT R/W 0h AIN0 Fault Action These bits set the device action if the ADC AIN0 channel is outside the AIN0_THRESHOLD Hi or Lo thresholds. 0h through 3h = Same as SD_FLT field (default 0h) 7-6 CRC_WDT_FLT R/W 0h CRC and WDT Fault Action These bits set the device action when a SPI CRC or SPI Watchdog Timeout error occurs. 0h through 3h = Same as SD_FLT field (default 0h) 5-4 VREF_FLT R/W 2h VREF Fault Action These bits set the device action when a fault is detected on VREF. 0h through 3h = Same as SD_FLT field a 3-2 THERM_ERR_FLT R/W 0h Thermal Error Fault Action These bits set the device action when a high temperature error occurs (> 130°C). 0h through 3h = Same as SD_FLT field (default 0h) 1-0 THERM_WARN_FLT R/W 0h Thermal Warning Fault Action These bits set the device action when a high temperature warning occurs (> 85°C). 0h through 3h = Same as SD_FLT field (default 0h) AFE78101, AFE88101 SLASF21 – DECEMBER 2022 www.ti.com

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7.6.1.14 WDT Register (Offset = 11h) [Reset = 0018h]

Return to the Register Map. Table 7-25. WDT Register Field Descriptions Bit Field Type Reset Description 15-6 RESERVED R 0h 5-3 WDT_UP R/W 3h Watchdog Timer (WDT) Upper Limit If the WDT is enabled and the timer exceeds the programmed value, a WDT error is asserted. All times are based on 1200-Hz clock (1.2288 MHz / 1024). 0h = 53 ms (64 clocks) 1h = 106 ms (128 clocks) 2h = 427 ms (512 clocks) 3h = 853 ms (1024 clocks, default) 4h = 1.7 s (2048 clocks) 5h = 2.56 s (3072 clocks) 6h = 3.41 s (4096 clocks) 7h = 5.12 s (6144 clocks) 2-1 WDT_LO R/W 0h WDT Lower Limit If the WDT is enabled and the WDT Lower Limit is enabled, then only a write to this register resets the WDT timer. If the write occurs before the WDT Lower Limit time, or after the WDT Upper Limit time, then a WDT error is asserted. If WDT Lower Limit is disabled, then a write to any register resets the timer. This is true for both SPI and UART Break modes. All times are based on 1200-Hz clock (1.2288 MHz / 1024). 0h = Disabled (default) 1h = 53 ms (64 clocks) 2h = 106 ms (128 clocks) 3h = 427 ms (512 clocks)

0 WDT_EN R/W 0h WDT Enable

0h = Disabled (default); 1h = Enabled

7.6.1.15 AIN0_THRESHOLD Register (Offset = 12h) [Reset = FF00h]

Return to the Register Map. Table 7-26. AIN0_THRESHOLD Register Field Descriptions Bit Field Type Reset Description 15-8 Hi R/W FFh High Threshold for Channel AIN0 {[11:4],4b1111} This value is compared (>) against AIN0 data bits[11:0]. 7-0 Lo R/W 0h Low Threshold for Channel AIN0 {[11:4],4b0000} This value is compared (<) against AIN0 data bits[11:0]. www.ti.com AFE78101, AFE88101 SLASF21 – DECEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 61 Product Folder Links: AFE78101 AFE88101

7.6.1.16 AIN1_THRESHOLD Register (Offset = 13h) [Reset = FF00h]

Return to the Register Map. Table 7-27. AIN1_THRESHOLD Register Field Descriptions Bit Field Type Reset Description 15-8 Hi R/W FFh High Threshold for Channel AIN1 {[11:4],4b1111} This value is compared (>) against AIN1 data bits[11:0]. 7-0 Lo R/W 0h Low Threshold for Channel AIN1 {[11:4],4b0000} This value is compared (<) against AIN1 data bits[11:0].

7.6.1.17 TEMP_THRESHOLD Register (Offset = 14h) [Reset = FF00h]

Return to the Register Map. Table 7-28. TEMP_THRESHOLD Register Field Descriptions Bit Field Type Reset Description 15-8 Hi R/W FFh High Threshold for Channel TEMP {[11:4],4b1111} This value is compared (>) against TEMP data bits[11:0]. 7-0 Lo R/W 0h Low Threshold for Channel TEMP {[11:4],4b0000} This value is compared (<) against TEMP data bits[11:0].

7.6.1.18 UBM Register (Offset = 16h) [Reset = 0000h]

Return to the Register Map. Table 7-29. UBM Register Field Descriptions Bit Field Type Reset Description 15-1 RESERVED R 0h

0 REG_MODE R/W 0h Register Mode

Configure the rest of the Register Map to be accessed by UART break mode (UBM) or SPI. This register can only be written by the UART Break communication. 0h = SPI Mode (default) 1h = UART Break Mode AFE78101, AFE88101 SLASF21 – DECEMBER 2022 www.ti.com

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7.6.1.19 ALARM_STATUS_MASK Register (Offset = 1Dh) [Reset = EFDFh]

Return to the Register Map. Table 7-30. ALARM_STATUS_MASK Register Field Descriptions Bit Field Type Reset Description 15-14 RESERVED R 3h

13 SD_FLT R/W 1h SD Fault Mask

0h = Fault asserts IRQ 1h = The mask prevents IRQ or Alarm being triggered (default). The status is always set if the condition exists.

12 OSC_FAIL R/W 0h OSC_FAIL Fault Mask

Same as SD Fault Mask (default 0h). 11-9 RESERVED R 7h

8 OTP_CRC_ERR R/W 1h OTP CRC Error Mask

Same as SD Fault Mask (default 1h).

7 CRC_FLT R/W 1h SPI CRC Fault Mask

Same as SD Fault Mask (default 1h).

6 WD_FLT R/W 1h Watchdog Fault Mask

Same as SD Fault Mask (default 1h).

5 VREF_FLT R/W 0h VREF Fault Mask

Same as SD Fault Mask (default 0h).

4 ADC_AIN1_FLT R/W 1h ADC AIN1 Fault Mask

Same as SD Fault Mask (default 1h).

3 ADC_AIN0_FLT R/W 1h ADC AIN0 Fault Mask

Same as SD Fault Mask (default 1h).

2 ADC_TEMP_FLT R/W 1h ADC TEMP Fault Mask

Same as SD Fault Mask (default 1h).

1 THERM_ERR_FLT R/W 1h Temperature > 130°C Error Mask

Same as SD Fault Mask (default 1h).

0 THERM_WARN_FLT R/W 1h Temperature > 85°C Warning Mask

Same as SD Fault Mask (default 1h). www.ti.com AFE78101, AFE88101 SLASF21 – DECEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 63 Product Folder Links: AFE78101 AFE88101

7.6.1.20 GEN_STATUS_MASK Register (Offset = 1Eh) [Reset = FFFFh]

Return to the Register Map. Table 7-31. GEN_STATUS_MASK Register Field Descriptions Bit Field Type Reset Description 15-8 RESERVED R FFh

7 SR_BUSYn R/W 1h Slew Rate Not Busy Mask

0h = Fault asserts IRQ 1h = The mask prevents IRQ or Alarm being triggered (default). The status is always set if the condition exists.

6 ADC_EOC R/W 1h ADC End Of Conversion Mask

Same as Slew Rate Not Busy Mask (default 1h). 5-4 RESERVED R 3h

3 BREAK_FRAME_ERR R/W 1h Break Frame Error Fault Mask

Same as Slew Rate Not Busy Mask (default 1h).

2 BREAK_PARITY_ERR R/W 1h Break Parity Error Fault Mask

Same as Slew Rate Not Busy Mask (default 1h).

1 UART_FRAME_ERR R/W 1h UART Frame Error Fault Mask

Same as Slew Rate Not Busy Mask (default 1h).

0 UART_PARITY_ERR R/W 1h UART Parity Error Fault Mask

Same as Slew Rate Not Busy Mask (default 1h). AFE78101, AFE88101 SLASF21 – DECEMBER 2022 www.ti.com

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7.6.1.21 ALARM_STATUS Register (Offset = 20h) [Reset = 0200h]

Return to the Register Map. Table 7-32. ALARM_STATUS Register Field Descriptions Bit Field Type Reset Description 15 GEN_IRQ R 0h General IRQ OR of all the unmasked bits in the GEN_STATUS register. 0h = All of the unmasked bits of the GEN_STATUS register are low 1h = At least one of the unmasked bits in the GEN_STATUS register is high

14 RESERVED R 0h

13 SD_FLT R 0h Self Diagnostic (SD) Fault

0h = All self diagnostic channels are within threshold limits 1h = At least one of the self diagnostic channels has failed 12 OSC_FAIL R 0h Oscillator Fault Oscillator failed to start. This bit holds ALARM low and does not feed IRQ. 0h = Oscillator started; 1h = Oscillator has failed to start 11-10 CRC_CNT R 0h CRC Fault Counter If counter limit ≤ 4 then bits[1:0] of the counter are shown here. If the counter limit = 8 then bits[2:1] of the counter are shown. 9 OTP_LOADEDn R 1h OTP NOT Loaded Clears when OTP has loaded at least once. Keeps ALARM asserted until OTP finishes loading. Does not feed IRQ. 0h = OTP has loaded at least once; 1h = OTP has not finished loading 8 OTP_CRC_ERR R 0h OTP CRC Error Maskable fault. An error occurred with the OTP CRC calculation. Sticky, cleared by reading register, unless condition still persist. 0h = No OTP CRC fault; 1h = OTP CRC fault 7 CRC_FLT R 0h CRC Fault Maskable fault. Invalid CRC value transmitted during SPI frame. Sticky, cleared by reading register, unless condition still persist. 0h = No CRC fault; 1h = CRC fault

6 WD_FLT R 0h Watchdog Timer Fault

Maskable fault. Sticky, cleared by reading register, unless condition still persist. 0h = No watchdog fault; 1h = Watchdog fault 5 VREF_FLT R 0h Invalid Reference Voltage Maskable fault. OR with FORCE_FAIL.VREF_FLT bit. Active signal, set as long as condition is true. Direct input from analog circuit. 0h = Valid VREF voltage; 1h = Invalid VREF voltage 4 ADC_AIN1_FLT R 0h ADC AIN1 Fault. Maskable fault. 0h = AIN1 ADC measurement within threshold limits 1h = AIN1 ADC measurement outside threshold limits 3 ADC_AIN0_FLT R 0h ADC AIN0 Fault. Maskable fault. 0h = AIN0 ADC measurement within threshold limits 1h = AIN0 ADC measurement outside threshold limits 2 ADC_TEMP_FLT R 0h ADC Temp Fault. Maskable fault. 0h = TEMP ADC measurement within threshold limits 1h = TEMP ADC measurement outside threshold limits 1 THERM_ERR_FLT R 0h Temperature > 130°C error. Maskable fault. OR with FORCE_FAIL.THERM_ERR_FLT bit. Active signal, set as long as condition is true. Direct input from analog circuit. 0h = Temperature ≤ 130°C; 1h = Temperature > 130°C 0 THERM_WARN_FLT R 0h Temperature > 85°C warning. Maskable fault. OR with FORCE_FAIL.THERM_WARN_FLT bit. Active signal, set as long as condition is true. Direct input from analog circuit. 0h = Temperature ≤ 85°C; 1h = Temperature > 85°C www.ti.com AFE78101, AFE88101 SLASF21 – DECEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 65 Product Folder Links: AFE78101 AFE88101

7.6.1.22 GEN_STATUS Register (Offset = 21h) [Reset = 1180h]

Return to the Register Map. Table 7-33. GEN_STATUS Register Field Descriptions Bit Field Type Reset Description 15 ALARM_IRQ R 0h Alarm IRQ OR of all the unmasked bits in the ALARM_STATUS register. 0h = All of the unmasked bits of the ALARM_STATUS register are low 1h = At least one of the unmasked bits in the ALARM_STATUS register is high 14-13 RESERVED R 0h 12 OTP_BUSY R 1h OTP Busy Status = 1h at power up while the OTP is being loaded into the trim latches. 0h = OTP has completed loading into the device 1h = OTP is being loaded into the device

11 RESERVED R 0h

8 RESET R 1h Device Reset Occurred. Status only. Does not feed IRQ. Sticky, cleared by reading register, unless condition still persist. 0h = Device has not reset since last read of register 1h = Device has reset since last read of register 7 SR_BUSYn R 1h Slew Rate Not Busy. Maskable fault. 0h = DAC is slewing to the target code 1h = DAC_OUT has reached the DAC_DATA. If slew rate is disabled, then this signal produces a rising edge within 3 internal clock cycles. If slew rate is enabled, this signal creates an IRQ event when the DAC_OUT has reached the DAC_DATA. At this time, slew rate can be safely disabled. If slew rate is disabled prior to DAC_OUT = DAC_DATA then a jump of DAC_OUT occurs. This can cause an unwanted fast transition on VOUT. 6 ADC_EOC R 0h ADC End of Conversion (EOC). Maskable fault. Sticky, cleared by reading register, unless condition still persist. 0h = No EOC since last read of register; 1h = ADC end of conversion 5 ADC_BUSY R 0h ADC Busy. Status only. Does not feed IRQ. Active signal, set as long as condition is true. 0h = No ADC activity; 1h = ADC is actively converting 4 PVDD_HI R 0h PVDD High. Status only. Does not feed IRQ. Set as long as condition is true. 0h = PVDD < 2.7 V; 1h = PVDD ≥ 2.7V

3 BREAK_

FRAME_ERR R 0h Incorrect Stop Bit During Break Character. Maskable fault. Applies to UARTIN. Sticky, cleared by reading register, unless condition still persist. 0h = No break frame error; 1h = Break frame error

2 BREAK_

PARITY_ERR R 0h Incorrect parity (ODD) bit during break character. Maskable fault. Applies to UARTIN. Sticky, cleared by reading register, unless condition still persist. 0h = No break parity error; 1h = Break parity error

1 UART_

FRAME_ERR R 0h Incorrect stop bit during UART character. Maskable fault. Applies to UARTIN. Sticky, cleared by reading register, unless condition still persist. 0h = No UART frame error; 1h = UART frame error

0 UART_

PARITY_ERR R 0h Incorrect parity (ODD) bit during UART character. Maskable fault. Applies to UARTIN. Sticky, cleared by reading register, unless condition still persist. 0h = No UART parity error; 1h = UART parity error AFE78101, AFE88101 SLASF21 – DECEMBER 2022 www.ti.com

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7.6.1.23 ADC_FLAGS Register (Offset = 23h) [Reset = 0000h]

Return to the Register Map. The limits for Self Diagnostic (SD) Alarm ADC Thresholds are shown in Table 7-7. Table 7-34. ADC_FLAGS Register Field Descriptions Bit Field Type Reset Description 15-9 RESERVED R 0h

8 SD4_FAIL R 0h SD4 (VOUT) Limit Fail

7 SD3_FAIL R 0h SD3 (ZTAT) Limit Fail

6 SD2_FAIL R 0h SD2 (VDD) Limit Fail

5 SD1_FAIL R 0h SD1 (PVDD) Limit Fail

4 SD0_FAIL R 0h SD0 (VREF) Limit Fail

3 TEMP_FAIL R 0h TEMP Limit Fail

2 AIN1_FAIL R 0h AIN1 Limit Fail

1 AIN0_FAIL R 0h AIN0 Limit Fail

0 RESERVED R 0h

7.6.1.24 ADC_AIN0 Register (Offset = 24h) [Reset = 0000h]

Return to the Register Map. Table 7-35. ADC_AIN0 Register Field Descriptions Bit Field Type Reset Description 15-12 RESERVED R 0h 11-0 DATA R 0h Converted Value of Voltage on Pin AIN0

7.6.1.25 ADC_AIN1 Register (Offset = 25h) [Reset = 0000h]

Return to the Register Map. Table 7-36. ADC_AIN1 Register Field Descriptions Bit Field Type Reset Description 15-12 RESERVED R 0h 11-0 DATA R 0h Converted Value of Voltage on Pin AIN1

7.6.1.26 ADC_TEMP Register (Offset = 26h) [Reset = 0000h]

Return to the Register Map. Table 7-37. ADC_TEMP Register Field Descriptions Bit Field Type Reset Description 15-12 RESERVED R 0h 11-0 DATA R 0h Converted Value of Temperature www.ti.com AFE78101, AFE88101 SLASF21 – DECEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 67 Product Folder Links: AFE78101 AFE88101

7.6.1.27 ADC_SD_MUX Register (Offset = 27h) [Reset = 0000h]

Return to the Register Map. Table 7-38. ADC_SD_MUX Register Field Descriptions Bit Field Type Reset Description 15-12 RESERVED R 0h 11-0 DATA R 0h Converted Value of Voltage on Self-Diagnostic (SD) MUX Input

7.6.1.28 ADC_OFFSET Register (Offset = 28h) [Reset = 0000h]

Return to the Register Map. Table 7-39. ADC_OFFSET Register Field Descriptions Bit Field Type Reset Description 15-12 RESERVED R 0h 11-0 DATA R 0h ADC Comparator Offset This value reports the offset measured in the device, and can be used to adjust each conversion value. If ADC_BYP.OFST_BYP_EN is set, then the value in ADC_BYP.DATA is used as the offset. This value is not affected by ADC_BYP.

7.6.1.29 DAC_OUT Register (Offset = 2Ch) [Reset = 0000h]

Return to the Register Map. Table 7-40. DAC_OUT Register Field Descriptions Bit Field Type Reset Description 15-0 DATA R 0h DAC Code Applied to the Analog Circuit AFE78101, AFE88101 SLASF21 – DECEMBER 2022 www.ti.com

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7.6.1.30 ADC_OUT Register (Offset = 2Dh) [Reset = 0000h]

Return to the Register Map. Table 7-41. ADC_OUT Register Field Descriptions Bit Field Type Reset Description 15-12 RESERVED R 0h 11-0 DATA R 0h ADC Data for Each Conversion Does not include ADC_OFFSET.DATA adjustment. Is not affected by ADC_BYP.DATA.

7.6.1.31 ADC_BYP Register (Offset = 2Eh) [Reset = 0000h]

ADC_BYP is shown in ADC_BYP Register Field Descriptions. Return to the Register Map. Table 7-42. ADC_BYP Register Field Descriptions Bit Field Type Reset Description

15 DATA_BYP_EN R/W 0h Data Bypass Enable

Applies ADC_BYP.DATA to the ADC channel being converted. ADC_OFFSET is ignored. Do not set OFST_BYP_EN and DATA_BYP_EN at the same time. If OFST_BYP_EN is also set, OFST_BYP_EN takes priority over DATA_BYP_EN. In this case, ADC_BYP.DATA is used for the ADC_OFFSET register, and DATA_BYP_EN is forced to 0. After a channel is converted, the ADC_BYP.DATA value appears in the readback register and is used to calculate faults. 0h = Data bypass disabled (default) 1h = Data bypass enabled

14 OFST_BYP_EN R/W 0h Offset Bypass Enable

Overrides the offset register with the ADC_BYP.DATA value. When using this bit, the ADC_BYP.DATA field is processed as 2's complement. Do not set OFST_BYP_EN and DATA_BYP_EN at the same time. 0h = Offset bypass disabled (default) 1h = Offset bypass enabled

13 DIS_GND_SAMP R/W 0h Disable GND Sampling

This bit disables the sampling of GND during SAR activity. The sampling of GND is used to fully discharge the sampling CAP to reduce channel crosstalk. 0h = GND sampling enabled (default) 1h = GND sampling disabled

12 RESERVED R 0h

11-0 DATA R/W 0h Bypass Data www.ti.com AFE78101, AFE88101 SLASF21 – DECEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 69 Product Folder Links: AFE78101 AFE88101

7.6.1.32 FORCE_FAIL Register (Offset = 2Fh) [Reset = 0000h]

Return to the Register Map. Force failures for fault detection. Table 7-43. FORCE_FAIL Register Field Descriptions Bit Field Type Reset Description

15 CRC_FLT R/W 0h Force CRC Failure on SDO by Inverting the CRC Byte

0h = No force failure of CRC (default) 1h = Force failure of CRC 14 VREF_FLT R/W 0h Force Reference Voltage Failure. Analog signal. 0h = No force failure of VREF (default) 1h = Force failure of VREF 13 THERM_ERR_FLT R/W 0h Force Temperature > 130°C Thermal Error. Analog signal. 0h = No force temperature > 130°C error (default) 1h = Force temperature > 130°C error 12 THERM_WARN_FLT R/W 0h Force Temperature > 85°C thermal Warning. Analog signal. 0h = No force temperature > 85°C warning (default) 1h = Force temperature > 85°C warning 11-10 RESERVED R/W 0h 9 SD4_HI_FLT R/W 0h SD4 (VOUT) High Limit Failure. ADC measurement. 0h = No force failure of SD4 (VOUT) (default) 1h = Force failure of SD4 (VOUT) 8 SD4_LO_FLT R/W 0h SD4 (VOUT) Low limit failure. ADC measurement. 0h = No force failure of SD4 (VOUT) (default) 1h = Force failure of SD4 (VOUT) 7 SD3_HI_FLT R/W 0h SD3 (ZTAT) High Limit Failure. ADC measurement. 0h = No force failure of SD3 (ZTAT) (default) 1h = Force failure of SD3 (ZTAT) 6 SD3_LO_FLT R/W 0h SD3 (ZTAT) Low Limit Failure. ADC measurement. 0h = No force failure of SD3 (ZTAT) (default) 1h = Force failure of SD3 (ZTAT) 5 SD2_HI_FLT R/W 0h SD2 (VDD) High Limit Failure. ADC measurement. 0h = No force failure of SD2 (VDD) (default) 1h = Force failure of SD2 (VDD) 4 SD2_LO_FLT R/W 0h SD2 (VDD) Low Limit Failure. ADC measurement. 0h = No force failure of SD2 (VDD) (default) 1h = Force failure of SD2 (VDD) 3 SD1_HI_FLT R/W 0h SD1 (PVDD) High Limit Failure. ADC measurement. 0h = No force failure of SD1 (PVDD) (default) 1h = Force failure of SD1 (PVDD) 2 SD1_LO_FLT R/W 0h SD1 (PVDD) Low Limit Failure. ADC measurement. 0h = No force failure of SD1 (PVDD) (default) 1h = Force failure of SD1 (PVDD) 1 SD0_HI_FLT R/W 0h SD0 (VREF) High Limit Failure. ADC measurement. 0h = No force failure of SD0 (VREF) (default) 1h = Force failure of SD0 (VREF) 0 SD0_LO_FLT R/W 0h SD0 (VREF) Low Limit Failure. ADC measurement. 0h = No force failure of SD0 (VREF) (default) 1h = Force failure of SD0 (VREF) AFE78101, AFE88101 SLASF21 – DECEMBER 2022 www.ti.com

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8 Application and Implementation

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.

8.1 Application Information

The AFEx8101 are extremely low-power 16-bit and 14-bit voltage output DACs. The DACs support a low output and an optional precision internal reference. Use these output values with a voltage-to-current (V-to-I) converter stage for 4-mA to 20-mA, loop-powered applications. These devices also feature a SAR ADC that is used to measure internal and external nodes for making diagnostic measurements with fault detection and alarm actions. Use these diagnostic measurements together with the CRC and watchdog timer monitoring for device and system monitoring for functional safety. The AFEx8101 can operate using extremely low power with 1.8-V supplies. For low-voltage operation, use PVDD with a 1.8-V nominal supply and an operating range of 1.71 V to 1.89 V. Run the digital interface supply, IOVDD, from 1.71 V to 5.5 V. During low-voltage operation, the VDD LDO is automatically disabled and VDD is tied to PVDD. Low-voltage operation allows for both lower power for field transmitter applications and better voltage compliance when there are high resistances in the loop. With higher-supply operation, the PVDD has an operating range of 2.7 V to 5.5 V. With this range of operation, the VDD is powered from an onboard LDO.

8.1.1 Multichannel Configuration

Because CS low is required for communication and SDO can be set to a tri-state condition, only individual CS signals are required from the microcontroller for all the AFEx8101 devices in the system. The SDI, SDO, and SCLK signals can be combined. All the individual ALARM pins can be wired-OR together. This minimizes the number of microcontroller GPIO signals required for communication, as well as the number of isolation channels for isolated systems. The multichannel configuration block diagram is shown in Figure 8-1. Microcontroller AFE #1 GPIO1 SCLK DOUT DIN AFE #2 AFE #3 GPIO2 GPIO3 ALARM CS SCLK SDI SDO ALARM CS SCLK SDI SDO ALARM CS SCLK SDI SDO ALARM Figure 8-1. Multichannel Configuration www.ti.com AFE78101, AFE88101 SLASF21 – DECEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 71 Product Folder Links: AFE78101 AFE88101

8.2 Typical Application

This design example shows a loop-powered, 4-mA to 20-mA field transmitter featuring the AFE88101. The AFE78101 can also be used in this design for lower-resolution applications. This design example combines several circuit elements to create a subsystem that can support most field sensors in two-wire, current-loop applications. The design accepts bus voltages from 12 V to 36 V, while regulating the loop-current representation of a sensor to a post-calibration accuracy of less than 0.1% full-scale range (FSR) of total error at room temperature. The high integration in the system allows for a compact circuit, making this device an excellent choice for field transmitters where space is a concern. In field-transmitter applications, the current-loop transmitter, microcontroller, sensors, and analog front end are all required to consume less than the minimum bus current of 3 mA. Use an integrated DC/DC converter in the system to extend the current budget and allow more current for sensors and the AFE. Figure 8-2 shows the schematic diagram for the loop-powered, 4-mA to 20-mA field transmitter. AFE78101, AFE88101 SLASF21 – DECEMBER 2022 www.ti.com

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8.2.1 4-mA to 20-mA Current Transmitter IOVDD PVDD REF_EN 100 nF100 nF 2.2 μF VDD GND GND GND 3V3 100 k 3V3 SDI ALARM RESET CS SDO SCLK UARTOUT UARTIN NC 100 nF GND 3V3 GND GND 100 nF ISO GND ISO GND ISO GND SCLK CS SDI SDO 3V ISO INA INB VCC1 GND1 EN1 GND1 INC OUTD OUTA OUTB VCC2 GND2 EN2 GND2 OUTC IND 100 nF GND 3V3 GND 100 nF ISO GND ISO GND 3V ISO OUTA INB VCC1 GND1 OUTB VCC2 GND2 INA 100 nF GND 3V3 GND 100 nF ISO GND ISO GND UARTIN 3V ISO OUTA INB VCC1 GND1 OUTB VCC2 GND2 INA 2UARTOUT 4.7 μF 4.7 μF 6.8 μF 4.7 μF ISO7021 ISO7021 ISO7041 PWR ISO ISO GNDISO GND 1 μF ISO GND 3V ISO GND Thermal Pad OUT IN EN TPS7A0230P OUT GND CFLY+ CFLY- IN TPS60402 GND 1 μF GND 1 μF22 μF 1 k 560 pF GND 10 μF GND 10 μF 499 k 499 k GND 4.7 μF GND 3V3 AIN0 POL_SEL/AIN1 NC VOUT VREFIO CLK_OUT GND REF_GND 8.2 510 249 k 1 k 330 k 200 k GND GND 3V3 10 μF GND 3.6-V Zener TLVH431BCDBZR 3V3 GNDGND GND 680 pF GND 15.8 AIN0 GND 100 nF GND 1 k 40.2 GND 40.2 k 100 k GND LOOP- LOOP+ 300 pF 300 pF ISOLATION AFE88101 CDSOD323-T36SC 100 nF GND 3V3 GND GND 100 nF GND 40.2 k 40.2 k AIN0 OPA333 OPA333 CD-MBL206SL Q1 Q2 Q3 FB1 FB2 PZT2907A GNDALARM RESET SCLR 40 M ISO GND GND Figure 8-2. AFEx8101 in a 4-mA to 20-mA Current Transmitter www.ti.com AFE78101, AFE88101 SLASF21 – DECEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 73 Product Folder Links: AFE78101 AFE88101

8.2.1.1 Design Requirements

The design requirements are:

• Transmitter with a current output range of 4 mA to 20 mA for a process variable signal
• Out-of-range current output capability from 3 mA to 25 mA for error or fault signal levels
• Operation with standard industrial automation supply voltages from 12 V to 30 V
• Current and voltage outputs with TUE less than 0.5% at 25°C
• Total on-board current must be less than or equal to 3 mA

8.2.1.2 Detailed Design Procedure

Figure 8-3 shows a block diagram of a loop-powered, 4-mA to 20-mA current transmitter. Power and Digital Isolation Loop Protection AFE88101MCU MSP430FR5969 Start-Up and V-to-I Converter +VTERMINAL –VTERMINAL LDOLDO Sensor and AFE 4-mA to 20-mA Loop Terminals Boost Constructed Section of the Circuit Figure 8-3. Block Diagram of a Loop-Powered, 4-mA to 20-mA Current Transmitter The terminals connected to the loop are shown on the right side of the block diagram. This connection to the loop powers the entire transmitter. A bridge rectifier at the input protects against reverse connection to the loop. The rectified loop voltage powers a start-up circuit that provides power to an LDO, that in turn powers the AFE88101. The LDO powers a flyback converter acting as a boost and supplies power across an isolation barrier. On the other side of the isolation barrier, another LDO powers the MCU and any sensor connected to the transmitter. The LDOs also power the digital signal isolation on each side of the barrier. The AFE88101 controls the loop current through the voltage-to-current (V-to-I) converter block. The DAC voltage sets the output from 0.3 V to 2.5 V. The output is sent through a V-to-I converter block using an OPA333 and an NPN bipolar junction transistor (BJT). AFE78101, AFE88101 SLASF21 – DECEMBER 2022 www.ti.com

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8.2.1.2.1 Start-Up Circuit

When the loop is applied to the terminals, the loop power starts up the board. Transistor Q4 from Figure 8-2 pulls current from the start-up and current-shunt regulator sections of the transmitter. The start-up circuit is shown in Figure 8-4. 8.2 510 249 k 1 k 330 k 200 k 3V3 10 μF 3.6-V Zener TLVH431BCDBZR LOOP+ Q1 Q2 Current sourced to loop control Figure 8-4. Start-Up Circuit In the start-up circuit, the 3.6-V Zener diode sets the voltage at the base of Q1. If the TLVH431B shunt regulator has not started, apply voltage to LOOP+ and LOOP– to turn on Q1 and source current to the shunt regulator. As the shunt regulator turns on and approaches the set voltage of 3.3 V, the base-emitter voltage (V BE) of Q1 becomes smaller. The collector current of Q2 drives the current of the shunt regulator to set the LOOP current going through the 40.2- Ω resistor in the current loop control circuit shown in the following section. After the start-up circuit has started, Q1 stops supplying current because the V BE is restricted. Q1 shuts off, leaving several microamps of current flowing through the 3.6-V Zener diode. Take care when selecting the Zener diode. The voltage across the Zener diode varies with the loop voltage and the temperature of the circuit. This variance can change the V BE across Q1 and change the total current going through the start-up circuit. If the voltage is too high, the Zener diode sets Q1 to continue to source current after the circuit starts up. If the voltage is too low, the Zener diode prevents the TLVH431B from turning on. Verify proper start up by checking that the 3.3-V supply starts up, and that Q1 turns off when in operation. When the circuit starts up and the 3V3 line comes up to the desired 3.3-V supply level, the current through the TLVH431B is primarily sourced through Q2. The Q2 transistor must be able to dissipate enough power to handle the high current (> 20 mA) and the high voltage (> 30 V) in the loop. Because the biased transistor, Q2, is responsible for sourcing most of the output current, choose the components in the path of this current flow with appropriate power ratings. In this case, the 8.2-Ω resistor is rated to 0.25 W. The current mirror is set up so that the current gain from Q3 to Q2 is approximately a factor of 60 ×. The exact current gain is not important as long as the current through Q3 is low. www.ti.com AFE78101, AFE88101 SLASF21 – DECEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 75 Product Folder Links: AFE78101 AFE88101

8.2.1.2.2 Current Loop Control

The AFE88101 sets an output voltage from 0.3 V to 2.5 V if configured in Range 0 with PVDD > 2.7 V. Figure 8-5 shows the feedback circuit that sets the loop current from the DAC output voltage. 3V3 1 k 40.2 40.2 k 100 k LOOP– 100 nF OPA3330.3 V to 2.5 V from AFE88101 VOUT ILOOP 20 M 3V3 8.2 510 330 k 200 k 10 μF TLVH431BCDBZR LOOP+ Q2 Q33V3 Figure 8-5. Current Loop Control for the AFE88101 Transmitter In this circuit, the VOUT voltage is set across the 100-k Ω resistor by the AFE88101. The opposite end of the 100-kΩ resistor is set to ground by the feedback of the OPA333. The current across the 100-kΩ resistor is VOUT divided by 100 kΩ. This current continues through the 40.2-kΩ resistor so that the voltage at LOOP– is less than ground. Equation 11 calculates the voltage at LOOP–. V LOOP– = – VOUT / 100 kΩ × 40.2 kΩ = – VOUT × 0.402 (11) When the DAC output voltage is set to 0.3 V, the voltage at LOOP– is 0.1206 V less than ground. When the DAC output voltage is set to 2.5 V, the voltage at LOOP– is 1.005 V less than ground. The LOOP– voltage sets the loop current that flows from ground to LOOP– through the 40.2- Ω resistor. This current is sourced from ground but controlled by the current sunk from Q4 coming from the start-up circuit. Equation 12 calculates the loop current. I LOOP = – V LOOP / 40.2 kΩ (12) Substituting Equation 12 into Equation 11, Equation 13 is obtained. I LOOP = VOUT × 0.402 / 40.2 Ω = VOUT / 100 Ω (13) When the DAC output voltage is set to 0.3 V, the loop current is 3 mA. When the DAC output voltage is set to 2.5 V, the loop current is 25 mA. The OPA333 drives the base of transistor Q4 to pull the correct amount of current to set the feedback loop. The current pulled from LOOP+ powers the board. Excess current greater than what is required to power the board is shunted through the TLVH431B regulator. AFE78101, AFE88101 SLASF21 – DECEMBER 2022 www.ti.com

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The AFE88101 sets the DAC output voltage through an output code. This conversion to output voltage is set through Equation 1; VMIN = 0.3 V and FSR = 2.2 V, resulting in Equation 14. VO U T = D AC _CO DE 216 × 2.2 V + 0.3 V (14) In 4-mA to 20-mA systems, the nominal output operates from 4 mA as the low output and 20 mA as the high output. However, systems sometimes use current outputs that are outside this range to indicate different error conditions. Loop currents of 3.375 mA and 21.75 mA can be used to indicate different loop errors. Table 8-1 shows different loop output currents, along with the DAC code and voltages used. Table 8-1. DAC Voltage Output and Loop Current Based on DAC Output Codes OUTPUT CONDITION DAC CODE DAC OUTPUT (V) LOOP CURRENT (mA) DAC minimum 0x0000 0.3 3 Error low 0x045D 0.3375 3.375 In-range minimum 0x0BA2 0.4 4 In-range midscale 0x68BA 1.2 12 In-range maximum 0xC5D1 2.0 20 Error high 0xDA2E 2.175 21.75 DAC maximum 0xFFFF 2.5 25 Among the passive devices included in the design, choose gain setting resistors that exhibit tight tolerances to achieve high accuracy. These resistors are primarily responsible for setting the gain of the current loop, along with primary path of the output current flow.

8.2.1.2.3 Input Protection and Rectification

Figure 8-6 shows the simple protection scheme implemented in the design to mitigate issues that arise from voltage and current transients on the bus. These transients have two main components: high-frequency and high-energy. These two components can be leveraged with a strategy of attenuation and diversion by the protection circuitry to deliver robust immunity. +VTERMINAL -VTERMINAL 36-V Bidirectional TVS Diode LOOP+ LOOP- Ferrite Bead Figure 8-6. Loop Input Protection Attenuation uses passive components, primarily resistors and capacitors, to attenuate high-frequency transients and to limit series current. Use ferrite beads to maintain dc accuracy while still delivering the ability to limit current from high-frequency transients. This circuit uses a capacitor placed across the input terminals, as well as ferrite beads in series with the terminals. Diversion capitalizes on the high-voltage properties of the transient signals by using a diode to clamp the transient within supply voltages, or to divert the energy away from the system. Transient voltage suppressor (TVS) diodes help protect against transients because TVS diodes break down very quickly and often feature high power ratings that are critical to survive multiple transient strikes. A rectifier is also implemented for reverse polarity protection so that the design can be connected to the bus regardless of the pin orientation or polarity without damage to the design. www.ti.com AFE78101, AFE88101 SLASF21 – DECEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 77 Product Folder Links: AFE78101 AFE88101

8.2.1.2.4 System Current Budget

Power consumption is an important consideration when designing two-wire transmitters. Power supplied from the loop must power all the circuitry related to the transmitter and sensor. The minimum loop current in two-wire applications is typically 4 mA. However, for error indications, this current is as low as 3.375 mA. Therefore, the power budget of all transducer circuitry must be less than the maximum allowable system power budget of 3 mA. Table 8-2 lists the specified maximum quiescent current of all included active components (provided from the respective data sheets). Table 8-2. Typical Component Currents DEVICE DESCRIPTION TYPICAL CURRENT (µA) TPS7A0230 LDO 0.025 AFE88101 16-bit DAC 170 OPA333 (2) Operational amplifier 17 TLVH431B Shunt regulator 60 MSP430 Microcontroller Dependent on firmware ISO7021D (2), ISO7041F Digital isolation Dependent on communications

8.2.1.3 Application Curves

Figure 8-7. Circuit Start-Up

8.3 Initialization Set Up

This section describes several recommendations to set up the AFEx8101. The AFEx8101 power up with the CRC enabled. If the device is intended to be run without the CRC, the CRC must be disabled by setting the CRC_EN bit to 0h in the CONFIG register. Be aware that the command to write to this register is first done with the CRC enabled. The CRC byte must be appended to the command for the device to interpret the command correctly. To disable the CRC after start up, write 0x02 0x00 0x26 0x24 to the device. The first three bytes write the command, while the last byte is the CRC byte. For more information on the CRC, see the communication description in Section 7.5.2.3. The AFEx8101 also power up with the SDO pin disabled. The SDO is required for reading from any of the device registers, as well as reading any data from the ADC in SPI mode. The SDO is enabled by writing 0h into the To enable the ADC, first enable the ADC buffer by writing 0h into the BUF_PD bit in the ADC_CFG register. Information about using the ADC in different modes of operation is in Section 7.3.2. AFE78101, AFE88101 SLASF21 – DECEMBER 2022 www.ti.com

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8.4 Power Supply Recommendations

The AFEx8101 can operate within a single-supply range of 2.7 V to 5.5 V applied to the PVDD pin. When 2.7 V to 5.5 V is provided to PVDD, an internal LDO is enabled that drives VDD internally. VDD pin must have 1 μF to 10 μF of capacitance for operation. The AFEx8101 can also be operated with a lower supply voltage of 1.71 V to 1.89 V applied to the PVDD pin. When the voltage is within this lower range, the internal LDO is not operational, and the lower external supply on the PVDD pin must be tied to the VDD pin. The digital interface supply, IOVDD, can operate with a supply range of 1.71 V to 5.5 V. Switching power supplies and DC/DC converters often have high-frequency glitches or spikes riding on the output voltage. In addition, digital components can create similar high-frequency spikes. This noise can easily couple into the DAC output voltage or current through various paths between the power connections and analog output. To further reduce noise, include bulk and local decoupling capacitors. The current consumption on the PVDD and IOVDD pins, the short-circuit current limit for the voltage output, and the current ranges for the current output are listed in the Electrical Characteristics. The power supply must meet the requirements listed in the Recommended Operating Conditions.

8.5 Layout

8.5.1 Layout Guidelines

To maximize the performance of the AFEx8101 in any application, follow good layout practices and proper circuit design. The following recommendations are specific to the device:

• For best performance, dedicate an entire PCB layer to a ground plane and do not route any other signal traces on this layer. However, depending on restrictions imposed by specific end equipment, a dedicated ground plane is not always practical. If ground-plane separation is necessary, make a direct connection of the planes at the DAC. Do not connect individual ground planes at multiple locations because this configuration creates ground loops.
• IOVDD and PVDD must have 100-nF decoupling capacitors local to the respective pins. VDD must have at least a 1-μF decoupling capacitor used for the internal LDO, or for an external 1.8-V supply. Use a high-quality ceramic-type NP0 or X7R capacitor for best performance across temperature and a very low dissipation factor.
• Place a 100-nF reference capacitor close to the VREFIO pin.
• Avoid routing switching signals near the reference input.
• Maintain proper placement for the digital and analog sections with respect to the digital and analog components. Separate the analog and digital circuitry for less coupling into neighboring blocks and to minimize the interaction between analog and digital return currents.
• For designs that include protection circuits: – Place diversion elements, such as TVS diodes or capacitors, close to off-board connectors to make sure that return current from high-energy transients does not cause damage to sensitive devices – Use large, wide traces to provide a low-impedance path to divert high-energy transients away from the I/O pins. www.ti.com AFE78101, AFE88101 SLASF21 – DECEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 79 Product Folder Links: AFE78101 AFE88101

8.5.2 Layout Example

UART_IN UART_OUT NC SCLR REF_EN RESET SCLK SDI SDO CS CLK_OUT IOVDD Digital Signals IOVDD IOVDD Bypass Capacitor VDD Bypass Capacitor PVDD PVDD Bypass Capacitor ALARM Pull-Up Resistor IOVDD ALARM NC GND GND REF_GND VREFIO VOUT VREFIO Bypass Capacitor PVDD POL_SEL/AIN1 AIN0 GND VDD AFE88101 Figure 8-8. Layout Example AFE78101, AFE88101 SLASF21 – DECEMBER 2022 www.ti.com

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9 Device and Documentation Support

9.1 Documentation Support

9.1.1 Related Documentation

For related documentation see the following:

• Texas Instruments, AFE881H1 Evaluation Module User's Guide
• Texas Instruments, REF35 Ultra Low-Power, High-Precision Voltage Reference data sheet
• Texas Instruments, OPA391 Precision, Ultra-Low IQ, Low Offset Voltage, e-trim™ Op Amp data sheet
• Texas Instruments, ADS1220 4-Channel, 2-kSPS, Low-Power, 24-Bit ADC with Integrated PGA and Reference data sheet
• Texas Instruments, TPS7A16 60-V, 5-µA IQ, 100-mA, Low-Dropout Voltage Regulator With Enable and Power-Good data sheet
• Texas Instruments, TPS7A02 Nanopower IQ, 25-nA, 200-mA, Low-Dropout Voltage Regulator With Fast Transient Response data sheet
• Texas Instruments, ISO7021 Ultra-Low Power Two-Channel Digital Isolator data sheet
• Texas Instruments, Isolated, Ultra-Low Power Design for 4- to 20-mA Loop Powered Transmitters design guide
• Texas Instruments, Isolated Loop Powered Thermocouple Transmitter design guide
• Texas Instruments, Small Form Factor, 2-Wire, 4- to 20-mA Current-Loop, RTD Temperature Transmitter design guide
• Texas Instruments, Isolated Power and Data Interface for Low-power Applications reference design
• Texas Instruments, Uniquely Efficient Isolated DC/DC Converter for Ultra-Low Power and Low-Power Applications design guide

9.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

9.3 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

9.4 Trademarks

TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners.

9.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

9.6 Glossary

TI Glossary This glossary lists and explains terms, acronyms, and definitions.

10 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. www.ti.com AFE78101, AFE88101 SLASF21 – DECEMBER 2022 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 81 Product Folder Links: AFE78101 AFE88101

www.ti.com 9-Nov-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) AFE78101RRUR Active Production UQFN (RRU) | 24 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -55 to 125 AFE 78101 AFE78101RRUR.A Active Production UQFN (RRU) | 24 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -55 to 125 AFE 78101 AFE78101RRUT Active Production UQFN (RRU) | 24 250 | SMALL T&R Yes NIPDAU Level-2-260C-1 YEAR -55 to 125 AFE 78101 AFE78101RRUT.A Active Production UQFN (RRU) | 24 250 | SMALL T&R Yes NIPDAU Level-2-260C-1 YEAR -55 to 125 AFE 78101 AFE88101RRUR Active Production UQFN (RRU) | 24 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -55 to 125 AFE 88101 AFE88101RRUR.A Active Production UQFN (RRU) | 24 3000 | LARGE T&R Yes NIPDAU Level-2-260C-1 YEAR -55 to 125 AFE 88101 AFE88101RRUT Active Production UQFN (RRU) | 24 250 | SMALL T&R Yes NIPDAU Level-2-260C-1 YEAR -55 to 125 AFE 88101 AFE88101RRUT.A Active Production UQFN (RRU) | 24 250 | SMALL T&R Yes NIPDAU Level-2-260C-1 YEAR -55 to 125 AFE 88101 (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Addendum-Page 1

www.ti.com 9-Nov-2025 Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 12-Apr-2024 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 12-Apr-2024 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) AFE78101RRUR UQFN RRU 24 3000 367.0 367.0 35.0 AFE78101RRUT UQFN RRU 24 250 210.0 185.0 35.0 AFE88101RRUR UQFN RRU 24 3000 367.0 367.0 35.0 AFE88101RRUT UQFN RRU 24 250 210.0 185.0 35.0 Pack Materials-Page 2

www.ti.com PACKAGE OUTLINE 4.1 3.9 4.1 3.9 0.7 0.6 0.01 0.00 2X 2.5 20X 0.5 2X 2.5 24X 0.6 0.4 24X 0.3 0.2 (0.2) TYP 24X (0.18) (0.1) TYP (0.663) (0.25) UQFN - 0.7 mm max heightRRU0024A PLASTIC QUAD FLATPACK - NO LEAD 4225850/A 04/2020 0.08 C

0.1 C A B

0.05 C NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. PIN 1 INDEX AREA 0.05 C SEATING PLANE 0.01 C PIN 1 ID SYMM SYMM 7 12 1924 7X (45 X 0.087) SCALE 3.000 AB C

www.ti.com EXAMPLE BOARD LAYOUT 20X (0.5) (R0.05) TYP

0.05 MAX

0.05 MIN

24X (0.7) 24X (0.25) (3.7) (3.7) UQFN - 0.7 mm max heightRRU0024A PLASTIC QUAD FLATPACK - NO LEAD 4225850/A 04/2020 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. SYMM SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 20X SEE SOLDER MASK DETAIL 7 12 1924 METAL EDGE SOLDER MASK OPENING EXPOSED METAL METAL UNDER SOLDER MASK SOLDER MASK OPENING EXPOSED METAL NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS

www.ti.com EXAMPLE STENCIL DESIGN 24X (0.7) 24X (0.25) 20X (0.5) (3.7) (3.7) (R0.05) TYP UQFN - 0.7 mm max heightRRU0024A PLASTIC QUAD FLATPACK - NO LEAD 4225850/A 04/2020 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. SOLDER PASTE EXAMPLE BASED ON 0.125 MM THICK STENCIL SCALE: 20X SYMM SYMM 7 12 1924

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