A3212 ALLEGRO

Document overview

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Technical content

The A3212 integrated circuit is an ultra-sensitive, pole in de pen dent Hall-effect switch with a latched digital output. This sensor is es pe cial ly suited for opera- tion in battery-operated, hand-held equip ment such as cellular and cordless tele phones, pagers, and palmtop com put ers. A 2.5 volt to 3.5 volt operation and a unique clocking scheme reduce the average op er at ing power requirements to less than 15 µW with a 2.75 volt supply. Unlike other Hall-effect switches, either a north or south pole of suf fi cient strength will turn the output on; in the absence of a magnetic field, the output is off. The polarity independence and minimal power requirement allow these devices to easily replace reed switches for superior reliability and ease of manu- facturing, while eliminating the requirement for signal conditioning. Improved stability is made possible through chopper stabilization (dynamic off- set cancellation), which reduces the residual offset voltage normally caused by device overmolding, temperature de pen den cies, and thermal stress. This device includes on a single silicon chip a Hall-voltage generator, small-sig- nal amplifier, chopper sta bi li za tion, a latch, and a MOSFET output. Ad vanced BiCMOS processing is used to take advantage of low-voltage and low-power requirements, component matching, very low input-offset errors, and small com- ponent geometries. Four package styles provide magnetically op ti mized solutions for most ap pli - ca tions. Miniature low-profile surface-mount package types EH and EL (0.75 and 0.50 mm nominal height) are leadless, LH is a leaded low-profile SMD, and UA is a three-lead SIP for through-hole mount ing. Each package is available in a lead (Pb) free version (suffix, –T) with 100% matte tin plated lead- frame. EL package for limited release, engineering samples available.

FEATURES

■ Micropower Operation ■ Operation with North or South Pole ■ 2.5 V to 3.5 V Battery Operation ■ Chopper Stabilized Superior Temperature Stability Extremely Low Switch-Point Drift Insensitive to Physical Stress ■ ESD Protected to 5 kV ■ Sol id-State Reliability ■ Small Size ■ Easily Manufacturable with Magnet Pole Independence Data Sheet 27622.61G A3212 ABSOLUTE MAXIMUM RATINGS Operating Temperature, TA Storage Temperature Range, Caution: These CMOS devices have input static protection (Class 3) but are still sus- ceptible to damage if exposed to extremely high static electrical charges. MICROPOWER, ULTRA-SENSITIVE HALL-EF FECT SWITCH 2 x 2 mm MLPD Package A3212EELLT-T Approximate actual size

MICROPOWER, ULTRA-SENSITIVE HALL-EFFECT SWITCH

115 Northeast Cutoff, Box 15036

Worcester, Massachusetts 01615-0036 (508) 853-50002 Product Selection Guide Use complete part numbers when ordering Part Number Pb-free Packing* (Units/Pack) Package Ambient Temperature TA (°C) A3212EEHLT – Tape and Reel (3000) Leadless Surface Mount –40 to 85 A3212EEHLT–T Yes Tape and Reel (3000) A3212EELLT–T Yes Tape and Reel (2000) A3212ELHLT – Tape and Reel (3000) 3-Pin Surface Mount A3212ELHLT–T Yes Tape and Reel (3000) A3212EUA – Bulk Pack (500) SIP-3 Through Hole, Straight Lead A3212EUA–T Yes Bulk Pack (500) A3212LLHLT – Tape and Reel (3000) 3-Pin Surface Mount –40 to 150 A3212LLHLT–T Yes Tape and Reel (3000) A3212LUA – Bulk Pack (500) SIP-3 Through Hole, Straight Lead A3212LUA–T Yes Bulk Pack (500) *Contact Allegro for additional packaging and handling options. FUNCTIONAL BLOCK DIAGRAM TIMING LOGIC Dwg. FH-020-5 LATCH GROUND OUTPUT SUPPLY X DYNAMIC OFFSET CANCELLATION SWITCH SAMPLE & HOLD

MICROPOWER, ULTRA-SENSITIVE HALL-EFFECT SWITCH www.allegromicro.com 3 Copyright © 2002, 2003 Allegro MicroSystems, Inc. Package Suffix ‘UA’ Pinning (SIP) Pinning is shown viewed from branded side. Package Suffix ‘EH’ Pinning (Leadless Chip Carrier) X Dwg. PH-016-2 SUPPLY GROUND OUTPUT VDD GROUND NO CONNECTION NO CONNECTION 5 46 1 32 Dwg. PH-016 SUPPLY VDD GROUND OUTPUT X Package Suffix ‘LH’ Pinning (SOT23W) Dwg. PH-016-1 SUPPLY GROUND OUTPUT VDD Package Suffix ‘EL’ Pinning (Leadless Chip Carrier) Dwg. PH-016-1 SUPPLY GROUND OUTPUT VDD

MICROPOWER, ULTRA-SENSITIVE HALL-EFFECT SWITCH Worcester, Massachusetts 01615-0036 (508) 853-50004 ELECTRICAL CHARACTERISTICS over operating voltage and temperature range (unless otherwise specified). Limits Characteristic Symbol Test Conditions Min. Typ. Max. Units Operate Points B OPS South pole to branded side – 37 55 G BOPN North pole to branded side -55 -40 – G Release Points B RPS South pole to branded side 10 31 – G BRPN North pole to branded side – -34 -10 G Hysteresis B hys |BOPx - BRPx|– 5 . 9 – G NOTES: 1. Negative flux densities are defined as less than zero (algebraic convention), i.e., -50 G is less than +10 G. 2. BOPx = operate point (output turns on); B RPx = release point (output turns off). 3. Typical Data is at T A = +25°C and VDD = 2.75 V and is for design information only. 4. 1 gauss (G) is exactly equal to 0.1 millitesla (mT). MAGNETIC CHARACTERISTICS over operating voltage and temperature range (unless otherwise specified). Limits Characteristic Symbol Test Conditions Min. Typ. Max. Units Supply Voltage Range V DD Operating1 2.5 2.75 3.5 V Output Leakage Current I OFF VOUT = 3.5 V, BRPN < B < BRPS –< 1 . 0 1 . 0 µA Output On Voltage V OUT IOUT = 1 mA, VDD = 2.75 V – 100 300 mV Awake Time t awake –4 5 9 0 µs Period t period –4 5 9 0 m s Duty Cycle d.c. – 0.1 – % Chopping Frequency f C – 340 – kHz Supply Current I DD(EN) Chip awake (enabled) – – 2.0 mA IDD(DIS) Chip asleep (disabled) – – 8.0 µA IDD(AVG) VDD = 2.75 V – 5.1 10 µA VDD = 3.5 V – 6.7 10 µA NOTES: 1. Operate and release points will vary with supply voltage. 2. BOPx = operate point (output turns on); B RPx = release point (output turns off). 3. Typical Data is at T A = +25°C and VDD = 2.75 V and is for design information only.

MICROPOWER, ULTRA-SENSITIVE HALL-EFFECT SWITCH www.allegromicro.com 5 TYPICAL OPERATING CHARACTERISTICS SUPPLY CURRENT SWITCH POINTS 0 50 100 AMBIENT TEMPERATURE IN °°°°C -50 Dwg. GH-027-3 SWITCH POINTS IN GAUSS -20 -40 VDD = 2.75 V 150 -60 -25 25 75 125 BOPS BRPS BRPN BOPN SWITCH POINTS IN GAUSS -20 -40 SUPPLY VOLTAGE IN VOLTS 2.4 Dwg. GH-057-2 2.6 BOPS -60 BRPS BRPN BOPN TA = 25°C 02 5 5 0 7 5 100 AMBIENT TEMPERATURE IN °°°°C -50 Dwg. GH-028-11 125-25 AVERAGE SUPPLY CURRENT IN µµµµA 7.0 6.0 5.0 3.0 VDD =3.5 V 150 VDD =2.75 V VDD =2.5 V 4.0 7.0 AVERAGE SUPPLY CURRENT IN µµµµA 6.0 5.0 4.0 3.0 SUPPLY VOLTAGE IN VOLTS 2.4 Dwg. GH-058-7 2.6 TA = 25°C

MICROPOWER, ULTRA-SENSITIVE HALL-EFFECT SWITCH Worcester, Massachusetts 01615-0036 (508) 853-50006 FUNCTIONAL DESCRIPTION Low Average Power. Internal timing circuitry activates the sensor for 45 µs and deactivates it for the remainder of the pe- riod (45 ms). A short "awake" time allows for stabilization prior to the sensor sam pling and data latching on the falling edge of the timing pulse. The output during the "sleep" time is latched in the last sampled state. The supply current is not affected by the output state. Chopper-Stabilized Technique. The Hall element can be considered as a resistor array similar to a Wheatstone bridge. A large portion of the offset is a result of the mismatching of these resistors. These devices use a proprietary dynamic offset cancel- lation technique, with an internal high-frequency clock to reduce the residual offset voltage of the Hall element that is normally caused by device overmolding, temperature de pen den cies, and thermal stress. The chopper-stabilizing technique cancels the mismatching of the resistor circuit by changing the direction of the current flowing through the Hall plate using CMOS switches and Hall voltage measurement taps, while maintaing the Hall- voltage signal that is induced by the external magnetic flux. The signal is then captured by a sample-and-hold circuit and further processed using low-offset bipolar circuitry. This technique produces devices that have an extremely stable quiescent Hall output voltage, are immune to thermal stress, and have precise recoverability after temperature cycling. A relatively high sam- pling frequency is used for faster signal processing capability can be processed. More detailed descriptions of the circuit operation can be found in: Technical Paper STP 97-10, Monolithic Magnetic Hall Sensor Using Dynamic Quadrature Offset Cancellation and Technical Paper STP 99-1, Chopper-Stabilized Amplifiers With A Track- and-Hold Signal Demodulator. Dwg. WH-017-2 PERIOD "AWAKE" "SLEEP"IDD(EN) IDD(DIS) SAMPLE & OUTPUT LATCHED HALL VOLTAGE B Dwg. AH-011-2 Dwg. EH-012-1 SAMPLE & HOLD X

MICROPOWER, ULTRA-SENSITIVE HALL-EFFECT SWITCH www.allegromicro.com 7 Operation. The output of this device switches low (turns on) when a magnetic field perpendicular to the Hall sensor exceeds the operate point B OPS (or is less than BOPN). After turn-on, the output is capable of sinking up to 1 mA and the output voltage is V OUT(ON). When the magnetic field is reduced below the release point BRPS (or increased above BRPN), the device output switches high (turns off). The dif fer ence in the magnetic operate and release points is the hysteresis (Bhys) of the device. This built-in hysteresis allows clean switching of the output even in the presence of external mechanical vibration and electrical noise. As used here, negative flux densities are defined as less than zero (algebraic convention), i.e., -50 G is less than +10 G. Applications. Allegro's pole-independent sensing technique allows for operation with either a north pole or south pole mag- net orientation, enhancing the manufacturability of the device. The state-of-the-art technology provides the same output polarity for either pole face. It is strongly recommended that an external bypass ca pac i tor be con nect ed (in close proximity to the Hall sensor) between the supply and ground of the device to reduce both external noise and noise generated by the chopper-sta bi li za tion tech nique. This is especially true due to the relatively high im ped ance of battery supplies. The sim plest form of magnet that will op er ate these devices is a bar magnet with either pole near the branded surface of the device. Many oth er meth ods of operation are possible. Ex ten - sive applications information for Hall-effect sensors is available in:

  • Hall-Effect IC Applications Guide, Application Note 27701;
  • Hall-Effect Devices: Soldering, Gluing, Potting, En cap su - lat ing, and Lead Forming, Application Note 27703.1;
  • Soldering of Through-Hole Hall-Sensor Dervices, Application Note 27703; and
  • Soldering of Surface-Mount Hall-Sensor Devices, Application Note 27703.2. All are provided at www.allegromicro.com FUNCTIONAL DESCRIPTION (cont'd) 0 +B Dwg. GH-043-1 OUTPUT ON 5 V MAX B OPS BRPS B OPN BRPN OUTPUT VOLTAGE MAGNETIC FLUX OUTPUT OFF OUTPUT Dwg. EH-013-20.1µF SUPPLY (3 V BATTERY) 10 pF 50 kΩ X V DD 1 2

MICROPOWER, ULTRA-SENSITIVE HALL-EFFECT SWITCH Worcester, Massachusetts 01615-0036 (508) 853-50008 SENSOR LOCATIONS Package Designator 'EH' Dwg. MH-030 0.013" 0.34 mm NOM BRANDED SURFACE ACTIVE AREA DEPTH 0.035" 0.88 mm 0.062" 1.56 mm A 654 Package Designator 'LH' 0.033" 0.84 mm 1 2 Dwg. MH-025-2 0.011" 0.28 mm NOM ACTIVE AREA DEPTH 0.056" 1.42 mm A Package Designator 'UA' 1 32 Dwg. MH-011-13 0.0195" 0.50 mm NOM BRANDED SURFACE ACTIVE AREA DEPTH 0.078" 1.98 mm 0.052" 1.32 mm A Package Designator 'EL' 0.006" 0.16 mm NOM BRANDED SURFACE ACTIVE AREA DEPTH .0406 1.03 mm .0291 0.74 mm A

MICROPOWER, ULTRA-SENSITIVE HALL-EFFECT SWITCH www.allegromicro.com 9 PACKAGE DESIGNATOR ‘EH' (Reference MO-229C WCED-1) 3.70 BSC .146 1.25 BSC .049 0.30 0.20 .012 .008 3.15 2.85 .124 .112 2.15 1.85 .085 .073 0.65 0.45 .026 .018 1.324 1.074 .052 .042 1.142 0.892 .045 .035 1.00 BSC .039 0.50 BSC .020 0.50 BSC .020 0.95 BSC .037 0.40 BSC .016 0.25 BSC .010 0.25 BSC .010 0.30 BSC .012 0.80 0.70 .031 .028 0.05 0.00 .002 .000 0.20 REF .008 Dimensions in millimeters U.S. Customary dimensions (in.) in brackets, for reference only A Pin index area B Exposed thermal pad C ø0.3 Thermal via (optional) A B C

MICROPOWER, ULTRA-SENSITIVE HALL-EFFECT SWITCH www.allegromicro.com 10 PACKAGE DESIGNATOR ‘EL' MLPD 3 Contact 1.025 MAX .040 1.350 BSC .053 0.32 MIN .013 0.50 BSC .020 1.025 0.775 .040 .031 0.325 REF .013 0.325 REF .013 0.138 REF .005 0.138 REF .005 0.32 0.20 .013 .008 1.350 1.100 .053 .043 0.50 0.30 .020 .012 0.50 BSC .020 2.00 BSC .079 2.00 BSC .079 0.55 0.45 .022 .018 0.80 0.70 .031 .028 0.05 0.00 .002 .000 0.15 REF .006 R0.200 REF .008 0.40 NOM .016 0.15 MIN .006 2.40 REF .094 0.20 REF .008 A Dimensions in millimeters U.S. Customary dimensions (in.) in brackets, for reference only A Pin index area B Exposed thermal pad C D D C Optional thermal vias, ∅0.30 [.012], pitch 1.2 [.047] Typical pad layout; adjust as necessary to meet application process requirementsB

MICROPOWER, ULTRA-SENSITIVE HALL-EFFECT SWITCH www.allegromicro.com 11 PACKAGE DESIGNATOR ‘LH’ (SOT23W, fits SC-59A solder-pad layout) NOTES: 1. Tolerances on package height and width represent allowable mold offsets. Dimensions given are measured at the widest point (parting line). 2. Exact body and lead configuration at vendor’s option within limits shown. 3. Height does not include mold gate flash. 4. Where no tolerance is specified, dimension is nominal. Dimensions in Inches (for reference only) Dimensions in Millimeters (controlling dimensions) Dwg. MA-011-3 in 0.039 0.094 0.037 0.028 Dwg. MA-011-3 mm 1.00 2.40 0.95 0.70 Dwg. MA-010-3D in 0.006 0.000 0.0079 0.0050 0.083 0.073 0.118 0.106 0.037 BSC 0.022 REF 0.020 0.012 0.045 0.032 0° TO 8° 0.010 MIN GAUGE PLANE SEATING PLANE 0.010 BSC 0.122 0.114 Dwg. MA-010-3D mm 0.15 0.00 0.20 0.127 2.10 1.85 3.00 2.70 0.95 BSC 0.55 REF 0.50 0.30 1.13 0.87 0° TO 8° 0.25 MIN GAUGE PLANE SEATING PLANE 0.25 BSC 3.10 2.90

MICROPOWER, ULTRA-SENSITIVE HALL-EFFECT SWITCH Worcester, Massachusetts 01615-0036 (508) 853-500012 PACKAGE DESIGNATOR ‘UA’ Dimensions in Inches (controlling dimensions) Dimensions in Millimeters (for reference only) NOTES: 1. Tolerances on package height and width represent allowable mold offsets. Dimensions given are measured at the widest point (parting line). 2. Exact body and lead configuration at vendor’s option within limits shown. 3. Height does not include mold gate flash. 4. Recommended minimum PWB hole diameter to clear transition area is 0.035" (0.89 mm). 5. Where no tolerance is specified, dimension is nominal. Dwg. MH-014E in 0.164 0.159 0.062 0.058 0.0173 0.0138 0.050 BSC 45° 0.640 0.600 0.0189 0.0142 0.085 MAX 45° 0.031123 0.122 0.117 SEE NOTE Dwg. MH-014E mm 4.17 4.04 1.57 1.47 0.44 0.35 1.27 BSC 45° 16.26 15.24 0.48 0.36 2.16 MAX 45° 0.79123 3.10 2.97 SEE NOTE

MICROPOWER, ULTRA-SENSITIVE HALL-EFFECT SWITCH www.allegromicro.com 13 The products described herein are man u fac tured under one or more of the following U.S. pat ents: 5,045,920; 5,264,783; 5,442,283; 5,686,894; 5,694,038; 5,729,130; 5,917,320; and other patents pend- ing. Allegro MicroSystems, Inc. reserves the right to make, from time to time, such de par tures from the detail spec i fi ca tions as may be required to permit improvements in the per for mance, reliability, or manufactur- ability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. Allegro products are not authorized for use as critical components in life-support ap pli anc es, devices, or systems without express written approval. The information included herein is believed to be accurate and reli- able. However, Allegro MicroSystems, Inc. assumes no re spon si bil i ty for its use; nor for any infringements of pat ents or other rights of third parties that may result from its use.