A30 Datasheet | DigiCamel IC Datasheet

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Secure Authenticator

Document overview

Manufacturer or author: NXP B.V.
PDF pages: 26

Technical content

Datasheet sections

1 General description
2 Features and use cases
2.1 Use cases
2.2 Key features
2.3 Configuration
2.4 Configuration as authenticator
2.5 Configuration to secure IoT applications
3 Ordering information
4 Block diagram
5 Pin description
6 Limiting values
7 Recommended operating conditions
8 Characteristics
8.1 DC characteristics
8.1.1 General-purpose I/O interface
8.1.2 I2C interface
8.1.3 Power Consumption
8.2 AC characteristics
8.3 I2C Bus Timings
8.4 EMC/EMI
9 Package information
9.1 WLCSP
9.2 HVQFN
10 Abbreviations
11 References
12 Note about the source code in the
13 Revision history

Rev. 3.1 — 1 July 2026 Product data sheet

1 General description

A30 is a secure authentication IC for IoT platforms, electronic accessories, and consumable devices such as home electronic devices, mobile accessories, and medical supplies. A30 contains ECC key pairs, which can be generated by the IC itself to make sure that private keys are never exposed outside the IC. Also it performs cryptographic operations for security critical communication and control functions. A30 offers Common Criteria EAL 6+ security certification with AVA_VAN.5 on product level ref.[1] and supports a generic Crypto API providing AES, ECDSA, ECDH, SHA, HMAC, and HKDF cryptographic functionality for users. Asymmetric cryptography features support 256-bit ECC over the NIST P-256 and brainpoolP256r1 curves. Symmetric cryptography features support both AES-128 and AES-256. It also supports PKI-based mutual authentication including certificate handling. The CC security certification ensures that the IC security measures and protection mechanisms have been evaluated against sophisticated noninvasive and invasive attack scenarios. A30 supports an I2C contact interface with two GPIOs. A30 supports a low-power design, and consumes only 5 μA at Halt mode when an external VDD is supplied. Note: For the functional description and command set, refer to UM12553.

2 Features and use cases

2.1 Use cases

A30 can be used for:

Secure key(s) and certificate(s) storage
PKI (Public Key Infrastructure) based authentication and communication
Device only, device-to-device, and device-to-cloud authentication
Secure connection for consumer devices, industrial machines, and medical devices
Battery passport and/or Digital product passport
Device to meet increasing cybersecurity requirements

2.2 Key features

A30 is designed to support many IoT applications and solves the problems in IoT applications' full life cycle.

ECC key generation on the IC, and provisioning item level certificate(s) in NXP, or in the field.
The following cryptographic primitives are supported: AES-128/256 (ECB, CBC, CMAC, CCM, GCM), ECDSA, and ECDH over NIST P-256 and brainpoolP256r1, SHA-256/384, HMAC, and HKDF. This allows to support advanced cryptographic protocols such as SIGMA-I, TLS1.3 and Matter.
Nonreversible monotonic counter as the usage counter
Delivery of the list of UID and certificates at shipping from NXP
I2C target operates at 100 kHz (standard mode), 400 kHz (fast mode), or 1 MHz (Fast-mode Plus)
Two configurable GPIOs; 1 GPIO can be used for power downstream - up to 10 mW for batteryless

applications

1 V operation with 1.5 V battery
Small footprint on PCB with WLCSP16 A30 All information provided in this document is subject to legal disclaimers. © 2026 NXP B.V. All rights reserved. Product data sheet Rev. 3.1 — 1 July 2026 Document feedback

2.3 Configuration

A30 can be used as an I2C target with Host MCU. Figure 1. A30 solution block diagram There are many configuration options for different types of applications.

2.4 Configuration as authenticator

ISOGeneralAuthenticate" in UM12553). Figure 2. A30 for the consumable authentication device has been powered up or used with a nonreversible monotonic counter.

2.5 Configuration to secure IoT applications

A30 can be used for many other IoT applications. and certificates securely, provide one-way and/or mutual authentication, and transferred sign data. Figure 3. A30 solution block diagram communications, for example, with Matter. A30 All information provided in this document is subject to legal disclaimers. © 2026 NXP B.V. All rights reserved.

3 Ordering information

4 Block diagram

5 Pin description

Table 2. A30 pin configuration Please refer the available pin outs in the section Section 9. A30 All information provided in this document is subject to legal disclaimers. © 2026 NXP B.V. All rights reserved.

6 Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to VSS (ground = 0 V). Table 3. Limiting values [3] Depending on the appropriate thermal resistance of the package. electrostatic sensitive devices. A30 All information provided in this document is subject to legal disclaimers. © 2026 NXP B.V. All rights reserved.

7 Recommended operating conditions

A30 is characterized by its specified operating supply voltage range of 1 V to 2 V. Table 4. Recommended operating conditions [1] The supply voltage operating range of 1 V to 2 V requires internal supply elevation for the supply voltage range of 1 V to 1.62 V. The supply voltage mode is automatically selected during boot-up based on internal supply voltage measurement. the application to reopen the session. the device boots in voltage elevation mode. For VCC supply voltages >1.62 V the supply voltage ramp shall therefore >600 μs. [2] All product properties and values specified within this data sheet are only valid within the operating ambient temperature range. A30 All information provided in this document is subject to legal disclaimers. © 2026 NXP B.V. All rights reserved.

8 Characteristics

8.1 DC characteristics

respect to the ground contact pad VSS. All currents flowing into the device are considered positive.

8.1.1 General-purpose I/O interface

External pullup resistor 20 kΩ to VCC assumed. The worst case test condition for parameter VOH is present at minimum VCC.

0.7 VCC ≤ VI ≤ VCC

0 V ≤ VI ≤ VCC;

0 V VILmax

Figure 5. Input characteristics of GPIO1/2

8.1.2 I2C interface

8.1.3 Power Consumption

Table 7. Electrical characteristics of IC supply voltage VCC

8.2 AC characteristics

Table 8. Authentication application timing Table 9. Nonvolatile memory timing characteristics [1] The given value specifies physical access times of FLASH memory only. Table 10. Nonvolatile memory data retention and endurance [1] Typical values are only referenced for information. They are subject to change without notice. A30 All information provided in this document is subject to legal disclaimers. © 2026 NXP B.V. All rights reserved.

SCL, SDA pads in open-drain mode. Table 11. Electrical AC characteristics of SDA, SCL [1] All appropriately marked values are typical values and only referenced for information. They are subject to change without notice. [3] tr is defined as rise time between 30 % and 70 % of the signal amplitude. [4] tf is defined as fall time between 70 % and 30 % of the signal amplitude.

8.3 I2C Bus Timings

The A30 I2C bus timing parameters are in accordance to the NXP I2C bus specification, see Section 11.

8.4 EMC/EMI

9 Package information

A30 is either offered as Wafer Level Chip-Scale Package (WLCSP), or HVQFN.

9.1 WLCSP 16

Figure 6. Package outline WLCSP (Top view) Figure 7. Package outline WLCSP (Bottom view) A30 All information provided in this document is subject to legal disclaimers. © 2026 NXP B.V. All rights reserved.

9.2 HVQFN 20

10 Abbreviations

11 References

[1] User Manual - UM12053 - NRV11 Information on Guidance and Operation, Doc. No. UM97631 [2] Data sheet addendum - A30 - Delivery specification, Document number AD9772 [3] User manual - UM12553 - A30 user manual (link) 1 ** … document version number A30 All information provided in this document is subject to legal disclaimers. © 2026 NXP B.V. All rights reserved. Product data sheet Rev. 3.1 — 1 July 2026 Document feedback

12 Note about the source code in the document

Example code shown in this document has the following copyright and BSD-3-Clause license: Copyright 2024-2026 NXP Redistribution and use in source and binary forms, with or without modification, are permitted provided that the following conditions are met: 1. Redistributions of source code must retain the above copyright notice, this list of conditions and the following disclaimer. 2. Redistributions in binary form must reproduce the above copyright notice, this list of conditions and the following disclaimer in the documentation and/or other materials must be provided with the distribution. 3. Neither the name of the copyright holder nor the names of its contributors may be used to endorse or promote products derived from this software without specific prior written permission. THIS SOFTWARE IS PROVIDED BY THE COPYRIGHT HOLDERS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS OR IMPLIED WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE ARE DISCLAIMED. IN NO EVENT SHALL THE COPYRIGHT HOLDER OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THIS SOFTWARE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE. A30 All information provided in this document is subject to legal disclaimers. © 2026 NXP B.V. All rights reserved. Product data sheet Rev. 3.1 — 1 July 2026 Document feedback

Section 8.2 "AC characteristics": updated
Section 9.2 "HVQFN 20": Figure 9 "Pin description HVQFN " added
Section 11 "References": updated
Sections "Functional description" and "Command set" moved to UM12553 A30 v.3.0 [1] 27 January 2025 Initial version for the public release

Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL https://www.nxp.com. Definitions Draft — A draft status on a document indicates that the content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included in a draft version of a document and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at https://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. A30 All information provided in this document is subject to legal disclaimers. © 2026 NXP B.V. All rights reserved. Product data sheet Rev. 3.1 — 1 July 2026 Document feedback

Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Suitability for use in non-automotive qualified products — Unless this document expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. HTML publications — An HTML version, if available, of this document is provided as a courtesy. Definitive information is contained in the applicable document in PDF format. If there is a discrepancy between the HTML document and the PDF document, the PDF document has priority. Translations — A non-English (translated) version of a document, including the legal information in that document, is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. Security — Customer understands that all NXP products may be subject to unidentified vulnerabilities or may support established security standards or specifications with known limitations. Customer is responsible for the design and operation of its applications and products throughout their lifecycles to reduce the effect of these vulnerabilities on customer’s applications and products. Customer’s responsibility also extends to other open and/or proprietary technologies supported by NXP products for use in customer’s applications. NXP accepts no liability for any vulnerability. Customer should regularly check security updates from NXP and follow up appropriately. Customer shall select products with security features that best meet rules, regulations, and standards of the intended application and make the ultimate design decisions regarding its products and is solely responsible for compliance with all legal, regulatory, and security related requirements concerning its products, regardless of any information or support that may be provided by NXP. NXP has a Product Security Incident Response Team (PSIRT) (reachable at PSIRT@nxp.com) that manages the investigation, reporting, and solution release to security vulnerabilities of NXP products. NXP B.V. — NXP B.V. is not an operating company and it does not distribute or sell products. Trademarks Notice: All referenced brands, product names, service names, and trademarks are the property of their respective owners. NXP — wordmark and logo are trademarks of NXP B.V. Bluetooth — the Bluetooth wordmark and logos are registered trademarks owned by Bluetooth SIG, Inc. and any use of such marks by NXP Semiconductors is under license. I2C-bus — logo is a trademark of NXP B.V. Matter, Zigbee — are developed by the Connectivity Standards Alliance. The Alliance's Brands and all goodwill associated therewith, are the exclusive property of the Alliance. MIFARE — is a trademark of NXP B.V. NTAG — is a trademark of NXP B.V. SmartMX — is a trademark of NXP B.V. A30 All information provided in this document is subject to legal disclaimers. © 2026 NXP B.V. All rights reserved. Product data sheet Rev. 3.1 — 1 July 2026 Document feedback

Tab. 7. Electrical characteristics of IC supply Tab. 10. Nonvolatile memory data retention and A30 All information provided in this document is subject to legal disclaimers. © 2026 NXP B.V. All rights reserved. Product data sheet Rev. 3.1 — 1 July 2026 Document feedback

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NXP Semiconductors A30 overview.

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Summary

Secure Authenticator Rev. 3.0 27 January 2025

Description

Secure Authenticator Rev. 3.0 27 January 2025

Source title A30 Datasheet(PDF) - NXP Semiconductors

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