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Description
The Allegro® A1202 and A1203 Hall-effect bipolar switches are next-generation replacements and extension of the popular Allegro A3133 and A3132 bipolar switch product line. Overall, the A120x family, produced with BiCMOS technology, consists of continuous-time devices that feature fast power-on time and low-noise operation. Device programming is performed after packaging, to ensure increased switchpoint accuracy by eliminating offsets that can be induced by package stress. Unique Hall element geometries and low-offset amplifiers help to minimize noise and to reduce the residual offset voltage normally caused by device overmolding, temperature excursions, and thermal stress. The A120x Hall-effect bipolar switches include the following on a single silicon chip: voltage regulator, Hall-voltage generator, small-signal amplifier, Schmitt trigger, and NMOS output transistor. The integrated voltage regulator permits operation from 3.8 to 24 V . The extensive on-board protection circuitry makes possible a ±30 V absolute maximum voltage rating for superior protection in automotive and motor commutation A1202-DS, Rev. 17 Features and Benefits ▪ Continuous-time operation ▫ Fast power-on time ▫ Low noise ▪ Stable operation over full operating temperature range ▪ Reverse battery protection ▪ Solid-state reliability ▪ Factory-programmed at end-of-line for optimum performance ▪ Robust EMC performance ▪ High ESD rating ▪ Regulator stability without a bypass capacitor Continuous-Time Bipolar Switch Family Continued on the next page… 3 pin SIP (suffix UA) Functional Block Diagram Not to scale A1202 and A1203 Amp Regulator GND VCC VOUT OffsetGain Trim Control To all subcircuits
Continuous-Time Bipolar Switch FamilyA1202 and A1203 2Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com applications, without adding external components. All devices in the family are identical, except for magnetic switchpoints. The small geometries of the BiCMOS process allow these devices to be provided in ultrasmall packages. The package styles available provide magnetically optimized solutions for most applications. package, while package UA is a three-lead ultramini SIP for through- hole mounting. Each package is lead (Pb) free, with 100% matte tin plated leadframes. Selection Guide Part Number Packing * Mounting Ambient, T A BRP (Min) B OP (Max) A1202LUA-T Bulk, 500 pieces/bag 3-pin SIP through hole –40ºC to 150ºC –75 75 A1203EUA-T Bulk, 500 pieces/bag 3-pin SIP through hole –40ºC to 85ºC –95 95A1203LLHLT-T 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount –40ºC to 150ºC A1203LUA-T Bulk, 500 pieces/bag 3-pin SIP through hole *Contact Allegro for additional packing options. Description (continued) Absolute Maximum Ratings Characteristic Symbol Notes Rating Units Supply Voltage V CC 30 V Reverse Supply Voltage V RCC –30 V Output Off Voltage V OUT 30 V Reverse Output Voltage V ROUT –0.5 V Output Current Sink I OUTSINK 25 mA Magnetic Flux Density B Unlimited G Operating Ambient Temperature T A Range E –40 to 85 ºC Range L –40 to 150 ºC Maximum Junction Temperature T J(max) 165 ºC Storage Temperature T stg –65 to 170 ºC
Continuous-Time Bipolar Switch FamilyA1202 and A1203 3Allegro MicroSystems, Inc. Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com Pin-out Diagrams Terminal List Name Description Number Package LH Package UA VCC Connects power supply to chip 1 1 VOUT Output from circuit 2 3 GND Ground 3 2 1 32GND VOUT VCC Package UAPackage LH 1 2
3 GND
Continuous-Time Bipolar Switch FamilyA1202 and A1203 4Allegro MicroSystems, Inc. Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com OPERATING CHARACTERISTICS over full operating voltage and ambient temperature ranges, unless otherwise noted Characteristic Symbol Test Conditions Min. Typ. Max. Units
Electrical Characteristics
1 VCC Operating, TJ < 165°C 3.8 – 24 V Output Leakage Current I OUTOFF VOUT = 24 V, B < BRP –– 1 0 μA Output On Voltage V OUT(SAT) IOUT = 20 mA, B > BOP – 215 400 mV Power-On Time2 tPO Slew rate (dVCC/dt) < 2.5 V/μs, B > BOP(max) + 5 G or B < BRP(min) – 5 G ––4 μs Output Rise Time3 tr VCC = 12 V, RLOAD = 820 Ω, CS = 12 pF – – 2 μs Output Fall Time3 tf VCC = 12 V, RLOAD = 820 Ω, CS = 12 pF – – 2 μs Supply Current ICCON B > BOP – 3.8 7.5 mA ICCOFF B < BRP – 3.5 7.5 mA Reverse Battery Current I RCC VRCC = –30 V – – –10 mA Supply Zener Clamp Voltage V Z ICC = 30 mA; TA = 25°C 32 – – V Supply Zener Current4 IZ VZ = 32 V; TA = 25°C – – 30 mA Magnetic Characteristics5 Operate Point B OP A1202 – 26 75 G A1203 – 26 95 G Release Point B RP A1202 –75 –26 – G A1203 –95 –26 – G Hysteresis B HYS A1202 30 52 – G A1203 30 52 – G 1 Maximum voltage must be adjusted for power dissipation and junction temperature, see Power Derating section. 2 For VCC slew rates greater than 250 V/μs, and TA = 150°C, the Power-On Time can reach its maximum value. 3 CS =oscilloscope probe capacitance. 4 Maximum current limit is equal to the maximum ICC(max) + 22 mA. 5 Magnetic flux density, B, is indicated as a negative value for north-polarity magnetic fields, and as a positive value for sou th-polarity magnetic fields. This so-called algebraic convention supports arithmetic comparison of north and south polarity values, where the relative strength of the field is indicated by the absolute value of B, and the sign indicates the polarity of the field (for example, a –100 G field and a 100 G field ha ve equivalent strength, but opposite polarity). DEVICE QUALIFICATION PROGRAM Contact Allegro for information. EMC (Electromagnetic Compatibility) REQUIREMENTS Contact Allegro for information.
Continuous-Time Bipolar Switch FamilyA1202 and A1203 5Allegro MicroSystems, Inc. Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com THERMAL CHARACTERISTICS may require derating at maximum conditions, see application information Characteristic Symbol Test Conditions Value Units Package Thermal Resistance RθJA Package LH, 1-layer PCB with copper limited to solder pads 228 ºC/W Package LH, 2-layer PCB with 0.463 in.2 of copper area each side connected by thermal vias 110 ºC/W Package UA, 1-layer PCB with copper limited to solder pads 165 ºC/W 20 40 60 80 100 120 140 160 180 Maximum Allowable VCC (V) TJ(max) = 165ºC; ICC = ICC(max) Power Derating Curve (RQJA = 228 ºC/W) Package LH, 1-layer PCB (RQJA = 110 ºC/W) Package LH, 2-layer PCB (RQJA = 165 ºC/W) Package UA, 1-layer PCB VCC(min) VCC(max) 100 200 300 400 500 600 700 800 900 1000 1100 1200 1300 1400 1500 1600 1700 1800 1900 20 40 60 80 100 120 140 160 180 Temperature (°C) Power Dissipation, PD (mW) Power Dissipation versus Ambient Temperature QJA = 165 ºC/W) Package UA, 1-layer PCB QJA = 228 ºC/W) Package LH, 1-layer PCB QJA = 110 ºC/W) Package LH, 2-layer PCB
Continuous-Time Bipolar Switch FamilyA1202 and A1203 6Allegro MicroSystems, Inc. Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com Characteristic Data –50 0 50 100 150 0 5 10 15 20 25 –50 0 50 100 150 0 5 10 15 20 25 100 150 200 250 300 350 400 –50 0 50 100 150 100 150 200 250 300 350 400 0 5 10 15 20 25 (A1202/03) TA (°C) Supply Current (On) versus Ambient Temperature VCC (V) ICCON (mA) 24 3.8 (A1202/03) TA (°C) Supply Current (Off) versus Ambient Temperature VCC (V) ICCOFF (mA) 24 3.8 (A1202/03) TA (°C) Output Voltage (On) versus Ambient Temperature VCC (V) VOUT(SAT) (mV) 3.8 (A1202/03) Supply Current (On) versus Supply Voltage TA (°C) ICCON (mA) VCC (V) –40 150 (A1202/03) Supply Current (Off) versus Supply Voltage TA (°C) ICCOFF (mA) VCC (V) –40 150 (A1202/03) Output Voltage (On) versus Supply Voltage TA (°C) VOUT(SAT) (mV) VCC (V) –40 150 1.0 2.0 3.0 4.0 5.0 7.0 6.0 8.0 1.0 2.0 3.0 4.0 5.0 7.0 6.0 8.0 1.0 2.0 3.0 4.0 5.0 7.0 6.0 8.0 1.0 2.0 3.0 4.0 5.0 7.0 6.0 8.0
Continuous-Time Bipolar Switch FamilyA1202 and A1203 7Allegro MicroSystems, Inc. Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com -50 0 50 100 150 -50 0 50 100 150 -75 -65 -55 -45 -35 -25 -15 -50 0 50 100 150 (A1202, A1203) TA (°C) Operate Point versus Ambient Temperature BOP (G) (A1202, A1203) TA (°C) Release Point versus Ambient Temperature BRP (G) (A1202, A1203) TA (°C) Hysteresis versus Ambient Temperature BHYS (G) VCC (V) 3.8 VCC (V) 3.8 VCC (V) 3.8
shown in panel A of figure 1. Figure 1. Bipolar Device Output Switching Modes. These behaviors can be exhibited when using a circuit such as that shown in panel D. Panel A such as the 120x family, can operate in any of the three modes.
The typical output behavior of the A120x devices is latching. are specified in the Magnetic Characteristics table, on page 3. either north or south polarity ranges. of external mechanical vibration and electrical noise. within the hysteresis band of the device. Note 27705, Understanding Bipolar Hall Effect Sensor ICs. fastest available power-on settling time and frequency response. chopper-stabilization offset cancellation algorithm. Figure 2. Continuous-Time Application, B < BRP.. This figure illustrates the use of a quick cycle for chopping VCC in order to conserve battery power. Position 1, power is applied to the device. Position 2, the output assumes the correct state at a time prior to the maximum Power-On Time, tPO(max). valid, a control unit reads the output. Position 5, power is removed from the device.
Continuous-Time Bipolar Switch FamilyA1202 and A1203 10Allegro MicroSystems, Inc. Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com The choice between continuous-time and chopper-stabilized designs is solely determined by the application. Battery manage- ment is an example where continuous-time is often required. In these applications, V CC is chopped with a very small duty cycle in order to conserve power (refer to figure 4). The duty cycle is controlled by the power-on time, t PO, of the device. Because continuous-time devices have the shorter power-on time, they are the clear choice for such applications. For more information on the chopper stabilization technique, refer to Technical Paper STP 97-10, Monolithic Magnetic Hall Sensing Using Dynamic Quadrature Offset Cancellation and Technical Paper STP 99-1, Chopper-Stabilized Amplifiers with a Track-and-Hold Signal Demodulator. ADDITIONAL APPLICATIONS INFORMATION Extensive applications information for Hall-effect devices is available in:
- Hall-Effect IC Applications Guide, Application Note 27701
- Hall-Effect Devices: Gluing, Potting, Encapsulating, Lead Welding and Lead Forming, Application Note 27703.1
- Soldering Methods for Allegro’ s Products – SMT and Through- Hole, Application Note 26009 All are provided in Allegro Electronic Data Book, AMS-702, and the Allegro Web site, www.allegromicro.com.
Continuous-Time Bipolar Switch FamilyA1202 and A1203 11Allegro MicroSystems, Inc. Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com Power Derating Power Derating The device must be operated below the maximum junction temperature of the device, TJ(max). Under certain combinations of peak conditions, reliable operation may require derating sup- plied power or improving the heat dissipation properties of the application. This section presents a procedure for correlating factors affecting operating T J. (Thermal data is also available on the Allegro MicroSystems Web site.) The Package Thermal Resistance, RJA, is a figure of merit sum- marizing the ability of the application and the device to dissipate heat from the junction (die), through all paths to the ambient air. Its primary component is the Effective Thermal Conductivity, K, of the printed circuit board, including adjacent devices and traces. Radiation from the die through the device case, R JC, is relatively small component of RJA. Ambient air temperature, TA, and air motion are significant external factors, damped by overmolding. The effect of varying power levels (Power Dissipation, PD), can be estimated. The following formulas represent the fundamental relationships used to estimate T J, at PD. PD = VIN × IIN (1) T J = TA + ΔT (3) For example, given common conditions such as: TA= 25°C, VCC = 12 V, ICC = 4 mA, and RJA = 140 °C/W, then: P D = VCC × ICC = 12 V × 4 mA = 48 mW T = PD × RJA = 48 mW × 140 °C/W = 7°C A worst-case estimate, PD(max), represents the maximum allow- able power level (VCC(max), ICC(max)), without exceeding TJ(max), at a selected RJA and TA. Example: Reliability for VCC at TA = 150°C, package UA, using minimum-K PCB. Observe the worst-case ratings for the device, specifically: RJA = 165°C/W, TJ(max) = 165°C, VCC(max) = 24 V , and ICC(max) = 7.5 mA. Calculate the maximum allowable power level, PD(max). First, invert equation 3: Tmax = TJ(max) – TA = 165 °C – 150 °C = 15 °C This provides the allowable increase to TJ resulting from internal power dissipation. Then, invert equation 2: PD(max) = Tmax ÷ RJA = 15°C ÷ 165 °C/W = 91 mW Finally, invert equation 1 with respect to voltage: VCC(est) = PD(max) ÷ ICC(max) = 91 mW ÷ 7.5 mA = 12.1 V The result indicates that, at TA, the application and device can dissipate adequate amounts of heat at voltages ≤VCC(est). Compare VCC(est) to VCC(max). If VCC(est) ≤ VCC(max), then reli- able operation between VCC(est) and VCC(max) requires enhanced RJA. If VCC(est) ≥ VCC(max), then operation between VCC(est) and VCC(max) is reliable under these conditions.
Continuous-Time Bipolar Switch FamilyA1202 and A1203 12Allegro MicroSystems, Inc. Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com Package LH, 3-Pin (SOT-23W)
0.55 REF
0.25 BSC
0.95 BSC
0.95 1.00 0.70 2.40 A Active Area Depth, 0.28 mm REF B C B Reference land pattern layout All pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary to meet application process requirements and PCB layout tolerances Branding scale and appearance at supplier discretion A PCB Layout Reference View Branded Face C Standard Branding Reference View N = Last two digits of device part number T = Temperature code (letter) NNT N = Last three digits of device part number NNN 2.90 +0.10 –0.20 4°±4° 8X 10° REF 0.180+0.020 –0.053 0.05 +0.10 –0.05
0.25 MIN
1.91 +0.19 –0.06 2.98 +0.12 –0.08 1.00 ±0.13 0.40 ±0.10 For Reference Only; not for tooling use (reference dwg. 802840) Dimensions in millimeters Dimensions exclusive of mold flash, gate burrs, and dambar protrusions Exact case and lead configuration at supplier discretion within limits shown D Hall element, not to scale D D D1.49 0.96 A1203 only A1202 and A1203
Continuous-Time Bipolar Switch FamilyA1202 and A1203 13Allegro MicroSystems, Inc. Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com Package UA, 3-Pin SIP 231
1.27 NOM
2.16 MAX 0.51 REF 45° C 45°
0.79 REF
B E E E 2.04 1.44 Gate burr area A B C Dambar removal protrusion (6X) A D E D Branding scale and appearance at supplier discretion Hall element, not to scale Active Area Depth, 0.50 mm REF For Reference Only; not for tooling use (reference DWG-9049) Dimensions in millimeters Dimensions exclusive of mold flash, gate burrs, and dambar protrusions Exact case and lead configuration at supplier discretion within limits shown Standard Branding Reference View = Supplier emblem N = Last two digits of device part number T = Temperature code NNT Mold Ejector Pin Indent Branded Face 4.09 +0.08 –0.05 0.41 +0.03 –0.06 3.02 +0.08 –0.05 0.43 +0.05 –0.07 15.75 ±0.51 1.52 ±0.05
Continuous-Time Bipolar Switch FamilyA1202 and A1203 14Allegro MicroSystems, Inc. Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com Copyright ©2005-2012, Allegro MicroSystems, Inc. Allegro MicroSystems, Inc. reserves the right to make, from time to time, such de par tures from the detail spec i fi ca tions as may be required to per- mit improvements in the per for mance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current. Allegro’s products are not to be used in life support devices or systems, if a failure of an Allegro product can reasonably be expected to cause the failure of that life support device or system, or to affect the safety or effectiveness of that device or system. The in for ma tion in clud ed herein is believed to be ac cu rate and reliable. How ev er, Allegro MicroSystems, Inc. assumes no re spon si bil i ty for its use; nor for any in fringe ment of patents or other rights of third parties which may result from its use. For the latest version of this document, visit our website: www.allegromicro.com
Revision History
Revision Revision Date Description of Revision Rev. 17 May 24, 2012 Update LH package branding