8085A INTEL
Document overview
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Technical content
3 DISTINCTIVE CHARACTERISTICS
© | @ SMD/DESC qualified © Serial-in/serial-out port © 3. and 5-MHz selections available © Decimal, binary, and double-precision arithmetic © On-chip system controller; advanced cycle status infor. © Direct addressing capability to 64K bytes ‘of memory mation available for large system control © 1.3 ys instruction cycle (8085A) © Four vectored interrupts (one is non-maskable) © 0.8 us instruction cycle (8085A-2) © On-chip clock generator (with external crystal, LC or © 100% software-compatible with 8080A R/C network) © Single +5 V power supply GENERAL DESCRIPTION The 8085A is a new generation, complete 8-bit parallel The 8085A uses a multiplexed data bus. The address is central processing unit (CPU). Its instruction set is 100% split between the 8-bit address bus and the 8-bit data bus. Software compatible with the 8080A microprocessor. Spe- The on-chip address latches of 8155H/56H memory prod- cifically, the 8085A incorporates all of the features that the ucts allow a direct interface with 8085A. The 80854 8224 (clock generator) and 8228 (system controller) provid) components, including various timing-compatible support ‘ad for the 8080A, The 8085A-2 is a faster version of the chips, allow system speed optimization. 085A. The 8085A is a 3-MHz CPU with 10% supply tolerances and lower power consumption. BLOCK DIAGRAM wren GS ROTOR ROTTS TRAP ~ = 800 oe LL | ) a SS —- eels | ——e tom |= oo ‘ssonese Ton 1 aan — a ee ee TTITT III! II i cutout mor HWA NE 0 moon AERTS: ret soda onthe 80003790
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a4 Issue Date: November 1967
| Top View ES DIPs acre fave sq: “Bro ees? 2Be so? 3 Bitton =e i Bears E=H Breer wre? xB babel} 2B mgs 2Bn pore 2Be 233 2B wee 7Bs Pea *Be eae Be rah Bs eas ipa cooosses Note: Pin 1 is marked for orientation. MILITARY ORDERING INFORMATION Standard Military Drawing (SMD)/DESC Products AMD products for Aerospace and Defense applications are available in several Packages and operating ranges. Standard Military Drawing (SMD)/DESC products are fully compliant with MIL-STD-883C requirements. The order number (Valid Combination) for ‘SMD/DESC products is formed by a combination of: a. Military Drawing Part Number bd. Device Type ¢. Case Outline d. Lead Finish 79010 or Q x LL d. LEAD FINISH X= Any Lead Finish Acceptable . CASE OUTLINE Q=40-Pin Ceramic DIP (CD 040) b. MILITARY DEVICE TYPE 01=3 MHz (8085A) a. MILITARY DRAWING PART NUMBER 79010 8-Bit Microprocessor Valid Combinations Valid Combinations list configurations planned to be Valid Combinations ‘supported in volume for this device. Consult the local AMD 700007 sales office to confirm availability of specific valid combinations or to check on newly released valid combinations. Group A Tests Group A tests consist of Subgroups 345.
Fe MILITARY ORDERING INFORMATION (Cont'd.) ° APL Products AMD products for Aerospace and Defense applications are available in several packages and operating ranges. APL (Aoproved Products List) products are fully compliant with MIL-STD-88C requirements. The order number (Valid Combination) for APL products is formed by a combination of: a. Device Number b. Speed Option (it applicable) ©. Device Class d. Package Type e. Lead Finish 8085A_ 2 Ba Q A |. LEAD FINISH A= Hot Solder Dip d. PACKAGE TYPE Q = 40-Pin Ceramic DIP (CD 040) ©. DEVICE CLASS /B=Class B b. SPEED OPTION Blank = 3 MHz -2=5 MHz a. DEVICE NUMBER/DESCRIPTION 085A 8-Bit Microprocessor Valid binations [Valid Combinations | Valid Combinations list configurations planned to be Vakd Combinations, supported in volume for this device. Consult the local AMD 7BOA gales office to confirm availability of specific valid [ sosa2 combinations or to check for newly released valid combinations. Group A Tests Group A tests consist of Subgroups 3.16
ABSOLUTE MAXIMUM RATINGS OPERATING RANGES. e Voltage on Any Pin Temperature (To)... eeeeceeeeceeeeeeee 55 10 $125°C With Respect to Ground... secs 05 10 +7: V Supply Voltage (VCC) <.ecssssssssssee 5 V 10% Stresses above those listed under ABSOLUTE MAXIMUM Operating ranges define those limits between which the RATINGS may cause permanent device failure. Functionality functionality of the device is guaranteed. at or above these limits is not implied. Exposure to absolute ‘maximum ratings for extended periods may affect device reliability. DC CHARACTERISTICS over operating range (for SMD/DESC and APL Products, Group A, Subgroups 1, 2, 3 are tested unless otherwise noted) Parameter Parameter Symbol Description Test Conditions [vu [ope tO atage | Vec=svston osm roe [Vou [Output HIGH Votege | ton = 400 al a= 5 1 A [tua opi Leakane Pg 1 | Bei 58 v.Fv= voc wo ov | 0a] [Yun Tne SOW Bows Mis S| voo=sVetm TP ess | soe vd [Yay | Hse reser | veo sv to as “Guaranteed by design; not tested. Notes: 1. icc is measured while running a functional pattern with no loads applied. See Secton 6 ofthe WOS Maoprocessors and Ponpherals ata Book (Order #090674) for thwrmal CharactangicsInfovmaton at
$3 | SWITCHING CHARACTERISTICS over operating range (for SMD/DESC and APL Products, Group A, Subgroups 9, 10, 11 are tested unless otherwise noted) 8085A 8085A-2 (Note 2) (Note 2) Parameter Parameter Symbol Description ee a SS [eT ek tw Tine Geanaare COR tease wee [RK HGH Tw Gincard COR tosengy | ve es enc ise and Farting ec eee er ising tw CK Falng CY co fe fs i — res Watt Leacing ope ai Coma Bowe [eps Pe [eT er Vata to teasing Eoge of Convat ff fs Ps [is are vad to vera oven oe ‘Address Float After Leading Edge of READ (INTA) a Vala tae Tang Fame TALE We fw [see [ter vata Gore Fang Fame ot EP Tso Ps [eT READY Vat rom access Vargo [Tica | Asess the.) Vaid Aer Contato | 5 ee re [therm orerenm Te eee t= Edge of ALE a ec, [ow | ata Valid to Trang age of WATE a co, “SR [tase | HUDA to Sus enabio ee 2 ee [ane] is Hoar tor AOR wf [wack | HEDA Valid to Traitng Edge of CLK df OC i — ow rote ees [tos | HOLD Setup Timo to Traling Edge of GLX Rs f= eee EN Ce Tey Falling Edge of CLK ‘ a ress vol Tne Ag Ag | ese pee re |e Lc of Controt 7. [tex | ALE LOW Dunn Cs [won | ALE to vale Oat a [uae ME te Vat aia OBing wine | mo ef ewan ee a OA a tee omeeemmenes Te [fe Tt of Address ap Er te Vas bow me ee Conwol Traling Edge to Leading Edge bid ‘of Next Control [Taon [ata Ho Timo Aer READ NTA Wow 6) fo | es Se —|senoy norte Pe READY Setup Timo 10 Leading Edge tays of CLK ao [ba Vand ir ang Bape WaT eee [to —— exon cage of Re to Dow ves Pe Notes 1 Ag-Avs address Specs apply 10 107K, Sp, and S, except Ae Ars are undetmed during Ta-Te oF OF eyee; whereas, O/H. So and Sy are stable. 2. Test conclons: tovc = 820 ns (@085A)/200 ns (S08SA-2}, CL = 100 pF, Voom S V #10%, Vi = 45 Vs Vin= 24 V: VoL = 8 Vo Vou = 20 V. 3. For at ‘output timing where C, = 150 pF use the following correction factors: 25 PFS C, < 150 pF. -0.10 1s/pF {80 pF < C, <300 pF: +090 ns/pF 4. Output timings are measured with purely capacitne toad. 5. To calculate timing specifications at other values of tcvc use Table 3 on page 3-191 of the MOS Microprocessors and Peripherals: Data Book (Order #09067A) 6. Data hold time is guaranteed under all loading conditions, 348
PACKAGE OUTLINES* Ceramic DIPs (CD) cD 024 1.235 1.290 po ooo | ds ‘Ses _Semororoooo + +f [+ .005 Min. ‘L 0 # ccd ase a8 — 7150 aa + fie oe ois ta rosoris cp 028 : 143s 1.490 nooo oon ye co Sooo ooo 500 560 150 MIN, ; te roses * For reference only. NOTE: Package dimensions are given in inches. To convert to millimeters, multiply by 25.4. ea eee nets Te conver fo milimeters, mulpy by 254 6-1 1780 a-11
ADVANCED MICRO DEVICES 46D D M@®@ 0257525 gge?7001 2 ms CHAPTER 6 General Information T-90-20 PACKAGE OUTLINES (Continued) Ceramic DIPs (CD) (Continued) cD 040 3035 ~ (098 MAX. AEerae iii ert 88 we e pt 8 it hy <I @ rosa cDVvo40 2.035 2.096, oo > 098 MAX, a ponnannnannaanadi (4\\ + E) Sooo eo oy = Dl 7 Dl >| > 005 MIN. C z e a B i ¢ E ¥ Pe i ty a E] rowes NOTE: Package dimensions are given in inches, To convert to millimeters, multiply by 25.4, 1781 a-i2 62
ADVANCED MICRO DEVICES TbD D - Qes?ses ooe7o0e 4 _ CHAPTER 6 General Information PACKAGE OUTLINES (Continued) 7-90-20 Ceramic Sidebrazed DIPs (SD) SD 040 | : ee Se a apie F ee i ae sll a SD 048 2B |.-soonnx wo aim # : 8 uu! pial pa % 98 : ber rownue NOTE: Package dimensions are given in inches. To convert to millimeters, multiply by 25.4. 6-3
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ADVANCED MICRO DEVICES JbD D ml Oes?ses o0e7003 bm ee CHAPTER 6 T-90-20 General Information ee PACKAGE OUTLINES (Continued) Ceramic Leadless Chip Carriers (CL/CLV) CL 044 084 100 500, 25095" $e BSC A BN ares = ors . 095 | | 250
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022 5 — : NY ss i | 625 MAX: £40 660 ‘PIO sose2se CLV044 an a ii 20 ie | 250 0° 054 aso . 088 it HW It Cr = "~~ - Pairiin LJ ' 1 Se | ous_,| | 1" TE fase ’ i f rae aso BSC Fi oe og Y 4 ‘015 MIN re er Tenby 285 22-4 ; = 7 CI 015 625 MAX.- 860 PD KOM. NOTE: Package dimensions are given in inches. To convert to millimeters, multiply by 25.4, -S ml by 28
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7-90-20 General information PACKAGE OUTLINES (Continued) 68-Pin Square Leadless Chip Carrier (CA2) CA2068 —— =| J i He N A NS Ar , #! LS 8 Eee wwe HUUUKSS
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ADVANCED MICRO DEVICES 9bD D m@ 0257525 0027005 T CHAPTER 6 T-90-20 General Information Rabiner oem PACKAGE OUTLINES (Continued) Ceramic Pin-Grid-Array Package (CG/CGX) CGX068 BOTTOM VIEW 1.149, 228, 075 x ‘ones 1.180 (055 (REFERENCE COf ) [10 Bsc————>| ABCDEFGHIJI KL ifteecocboooe ro 2] 00000600000 s| ©o@ ! (Xo) ay 4] Oo dH Coo} , : 1.440 5] ©®@ eo Bsc 7] © i eo 080 2] OO 1 (Xo) 140 s} Ge ! ee ous 1] CODOOHOHOOOG ocd io 90090009 hs (090 x 45° REF. “foo.8se “(@PLACES) | oso cd i OEE 108 1198 PID #075478 NOTE: Package dimensions are given in inches. To convert to millimeters, multiply by 25.4. Sa ic lS ISI