75730 MOLEX
Document overview
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Technical content
FEATURES AND SPECIFICATIONS EXTreme MicroPower™ 4.00mm (0.157”) Pitch Board-to-Board Connector
75730 Right Angle
78094 Vertical
ORDERING INFORMATION
n Compact, direct solder high current power blades for VRM, and other point of load applications n 16.0A per blade at 30°C temperature rise (22 circuits loaded) n 4.00mm pitch standard (optional voided circuits available) Reference Information Packaging: Tray UL File No.: E29179 Designed In: Millimeters n 4 to 24 circuits, single inline row configuration n Very low 4.17mm x 4.00mm right angle profile n 7.00 and 10.00mm stack heights on vertical version n Slotted via for maximum current transfer Electrical Voltage: 250V max (Right Angle) 350V max (Vertical) Current (@ 30°C Temperature rise): 22 Circuit – 16.0A max. (per blade) Dielectric Withstanding Voltage: 1500V DC (Right Angle) 1750V AC (Vertical) Insulation Resistance: 5000 Megaohms min. (Right Angle) 1000 Megaohms min. (Vertical) Physical Housing: LCP Contact: Copper Alloy Plating: Overall: 100µ” Select Matte Tin min. Underplating — 50µ” Nickel min. Flammability Rating: UL 94V-0 Documents Sales Drawings: SD-75730-118 SD-87094-100 Product Specs: PS-75730-999 PS-87094-010 Series* Description Circuits Stack Heights Solder tail lengths 75730 Right Angle 4 to 24 N/A Riser card side 2.60mm / Motherboard side 3.06 or 3.81mm 78094 Vertical 2 to 22 7.00 and 10.00mm Mezzanine card side 2.60mm / Motherboard side 3.70mm *Complete part numbers can be found at www.molex.com/link/ext-power.html EXTreme MicroPower™ Temperature Rise 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Temperature Rise - (°C) Current (Amps) The EXTreme MicroPower™ High-Current Header can be used in VRM / DC-DC converters or any board-to- board application where power transfer is needed through a non-separable interface in a compact design. EXTreme MicroPower™ offers extremely high current density, rated at 16.0A per blade at 30◦C T-rise on a 4.00mm pitch, its low profile design of 4.17mm (.164”) off the PCB enhances system airflow. EXTreme MicroPower™ is available in both right angle and vertical (mezzanine) mounting configurations, and is an excellent choice to replace old fashioned, low capacity stick headers.
www.molex.com/link/ext-power.html Order No. 987650-3007 USA/KC/2009.03 © 2009, Molex FEATURES AND SPECIFICATIONS EXTreme Power® Products EXTreme Power® Products The need for high-current power interconnect solutions in increasingly smaller space continues to rise rapidly. Solving this power equation on new architectures and system platforms has been a major focus for Molex product development teams. The new Molex EXTreme Power® family of products is the direct result of listening intently to our customers’ electrical and mechanical design challenges. Since no two applications are the same, the Molex EXTreme Power® offering is comprised of several product families that cover a wide range of current densities, mechanical envelopes, mating terminations and configuration choices that give system designers the ability to maximize their power interconnect needs.
50.0 A / Contact
215.0 A / Sq. in. 33.0 A / Sq. cm 10.00mm
16.0 A / Blade
618.0 A / Sq. in. 96.0 A / Sq. cm 4.00mm
40.0 A / Blade
445.0 A / Sq. in. 68.0 A / Sq. cm 15.00mm
30.0 A / Blade
203.0 A / Sq. in. 31.0 A / Sq. cm 14.58mm 431.0 A / Sq. in. 67.0 A / Sq. cm 7.50mm
60.0 A / Blade
705.0 A / Sq. in. 109.0 A / Sq. cm 10.00mm
150.0 A / Blade
372.0 A / Sq. in. 58.0 A / Sq. cm 25.00mm EXTreme MicroPower™ EXTreme MicroPower™ EXTreme PowerEdge™ EXTreme PowerPlus™ (SSI) EXTreme LPHPower™ EXTreme Ten60Power™ EXTreme PowerMass™