75310-0001 MOLEX

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FEATURES AND SPECIFICATIONS SPECIFICATIONS 0.80mm (.031”) Pitch SFP Stacked Multi-Port Connectors 75310, 75786, 75460, 75787, 75462, 75640, 75759, 75714, 75454, 75450, 75733, 75734, 75477, 75451 Molex is rapidly expanding its Small Form-factor Pluggable (SFP) product offering to meet the demands of networking and storage industries, which require denser and faster packaging for high-speed serial interfaces. The new SFP Stacked Multi-Port Connectors are the latest additions to Molex’s extensive SFP product line. These new connectors offer high port density with complete integration of stacked 20-circuit SFP connector ports within a cage. Integrated lightpipes are available to provide port-status indication to the user. The product line encompasses connectors offered in two heights and is available in five por t configurations: 2-by-1, 2-by-2, 2-by-4, 2-by-5 and 2-by-6. Molex’s SFP Stacked Multi-Port Connectors accept SFP MSA-compliant modules, allowing installers to configure and upgrade high-speed Ethernet and Fibre Channel (FC) ports. Tin/Lead press-fit connector tails are provided as the standard option. Tin-plated tails will also be available to meet lead-fr ee requirements. Contact Molex for additional information. Reference Information Packaging: Tray UL File No.: E29179 CSA File No.: LR19980 Mates With: SFP MSA-compliant modules Designed In: Millimeters Electrical Voltage: 120V Current: 0.5A max. Dielectric Withstanding Voltage: 300V Insulation Resistance: 1 Megohm Mechanical Insertion Force to PCB: 35.59N (8 lb) per compliant pin, max. Mating Force: 40N (8.99 lb) max. Unmating Force: 11.5N (2.59 lb) max. Durability: 100 cycles Physical Housing: High-temperature plastic, Glass-filled Contact: Tin/Brass (Sn/CuZn) Plating: Contact Area — Gold (Au) Solder Tail Area — Tin/Lead (Sn/Pb) or Tin (Sn) Underplating — Nickel (Ni) PCB Thickness: 2.36mm (0.093”) Operating Temperature: -40 to +85°C Features and Benefits I High-speed contact design meets 4.25Gbps SFP requirements and is capable of speeds up to 10Gbps I Connectors are available in multiple port configurations (2, 4, 8, 10 and 12) pr oviding greater port density and reduced PCB assembly labor I Integrated lightpipe option, for use with mono or bi- color SMT LED’s provides port status and activity feedback I Modules are oriented “belly-to-belly” when inserted assuring ease of module removal from the port I Connectors are available in 2 heights: medium 25.50mm (1.000”) and tall 29.30mm (1.150”); Medium-height connectors meet industry standard and are consistent with the stacked multi-port modular jack design; Tall-height connector (2-by-1 only) is designed for 1U applications Upgrade to high-speed Ethernet and Fibre Channel ports with Molex’s Stacked Multi-Port SFP Connectors Multi-port connectors with lightpipes

APPLICATIONS 0.80mm (.031”) Pitch SFP Stacked Multi-Port Connectors 75310, 75786, 75460, 75787, 75462, 75640, 75759, 75714, 75454, 75450, 75733, 75734, 75477, 75451 I Networking, Storage and Telecommunication - Hubs - Routers - Servers - Switches Americas Headquarters Lisle, Illinois 60532 U.S.A. 1-800-78MOLEX amerinfo@molex.com Far East North Headquarters Yamato, Kanagawa, Japan 81-462-65-2324 feninfo@molex.com Far East South Headquarters Jurong, Singapore 65-6-268-6868 fesinfo@molex.com European Headquarters Munich, Germany 49-89-413092-0 eurinfo@molex.com Corporate Headquarters 2222 Wellington Ct. Lisle, IL 60532 U.S.A. 630-969-4550 Fax:630-969-1352 Visit our Web site at http://www.molex.com/product/SFP_Stacked_Connectors Order No. USA-321 Printed in USA/JI/2005.08 ©2005 Molex

ORDERING INFORMATION

Order No. Port Configuration Height Mounting Lightpipes EMI Protection 75310-0001 2-by-1 29.30mm (1.150”) Through-hole Yes Gasket with flange 75786-0001 Press-fit 75460-0001 Through-hole Gasket with extended flange 75787-0001 Press-fit 75462-0001 25.50mm (1.000”) No Spring fingers 75640-0001 Yes 75759-0001 2-by-2 No 75714-0001 Yes 75454-0001 2-by-4 No 75450-0001 Yes 75733-0001 2-by-5 No 75734-0001 Yes 75477-0001 2-by-6 No 75451-0001 Yes