75117-0118 MOLEX

Document overview

  • Manufacturer or author: Provided By digicamel.com
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Technical content

2.00 by 2.25mm (.079 by .089”) Pitch VHDM 8-Row Stacking System 75117 Board-to-Board Connector System VHDM® Board-to-Board 8-Row Stacker System Connects High Speed, High Density for Mezzanine Boards Molex’s 8-Row VHDM Stacker system allows for 2.5 Gbps data rates with high densities on mezzanine style board-to-board applications, offering 100 real circuits per inch of connector. The VHDM Stacker system offers the flexibility of a parallel board connection using the same proven wafer design, separable interface and press-fit compliant pins as the standard VHDM connector family, with less than 5% crosstalk. VHDM Stackers are ideal for both single-ended and differential signaling. Reference Information Packaging: Tube UL File No.: E29179 CSA File No.: 152514 (LR19980) Mates With: 74060 Designed In: Millimeters Electrical Voltage: 250V Current: 1.0A Contact Resistance: 13.5m Ω max. Dielectric Withstanding Voltage: 750VAC Insulation Resistance: 500VDC Mechanical Contact Insertion Force: 45N max. per press-fit pin Contact Retention to Housing: 9N min. per press-fit pin Mating Force: 0.40N nominal per pin Unmating Force: 0.15N min. per pin Durability: 200 cycles Physical Housing: Liquid crystal polymer, UL 94V-0 Contact: Copper Alloy Plating: Selective Gold 30µ" min. with Tin/Lead on the tails Operating Temperature: -55 to +105° C SPECIFICATIONS Features and Benefits High speed, high density mezzanine design enables up to 2.5 Gbps bandwidth per signal pair 2.00 by 2.25 mm (0.79 by 0.89”) pitch provides 40 contacts per centimeter Wafer construction permits very accurate location of ground planes relative to the signal contacts for improved impedance control Eye-of-the-needle press-fit receptacles and headers allow tight spacing without solder bridging between contact tails, repair ability and a highly reliable termination to the PCB Ground planes between signal columns provide: - Tightly controlled impedance for rise times down to 200 picoseconds -Very low cross talk between signals within a column -Extremely low cross talk between signal columns Mates with VHDM open headers permitting utilization of existing standard backplane headers

APPLICATIONS

ORDERING INFORMATION

Order No. Description Circuits Number of Wafers Gold Plating Thickness Stack Heights 75117-0118 VHDM 8-Row Stacker Receptacle 80 10 0.76µm (30µ") 18.00mm (.709") 75117-1118 VHDM 8-Row Stacker Receptacle 80 10 1.27µm (50µ") 75117-0218 VHDM 8-Row Stacker Receptacle 200 25 0.76µm (30µ") 75117-1218 VHDM 8-Row Stacker Receptacle 200 25 1.27µm (50µ") 75117-0018 VHDM 8-Row Stacker Receptacle 400 50 0.76µm (30µ") 75117-1018 VHDM 8-Row Stacker Receptacle 400 50 1.27µm (50µ") Order No. Description Circuits Module Length Signal Pin Length 74060-1001 VHDM 8-Row Signal Module 80 20.00mm (.787”) 4.75mm (.187”) 74060-1002 VHDM 8-Row Signal Module 80 20.00mm (.787”) 6.25mm (.246”) 74060-2501 VHDM 8-Row Signal Module 200 50.00mm (1.969”) 4.75mm (.187”) 74060-2502 VHDM 8-Row Signal Module 200 50.00mm (1.969”) 6.25mm (.246”) 74060-2602 VHDM 8-Row Signal Module 200 50.00mm (1.969”) 6.25mm (.246”) Americas Headquarters Lisle, Illinois 60532 U.S.A. 1-800-78MOLEX amerinfo@molex.com Far East North Headquarters Yamato, Kanagawa, Japan 81-462-65-2324 feninfo@molex.com Far East South Headquarters Jurong, Singapore 65-6-268-6868 fesinfo@molex.com European Headquarters Munich, Germany 49-89-413092-0 eurinfo@molex.com Corporate Headquarters 2222 Wellington Ct. Lisle, IL 60532 U.S.A. 630-969-4550 Fax:630-969-1352 Visit our Web site at www.molex.com/product/backplan/vhdm/vhdm.html Order No. USA-232 Printed in USA/3K/JI/JI/2004.03 2004, Molex Telecommunication Equipment Test Systems High End Servers Memory Storage Systems Cellular Base Stations 2.00 by 2.25mm (.079 by .089”) Pitch VHDM 8-Row Stacking System 75117 Board-to-Board Connector System