74HCT7540N

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Technical content

Page 1

1. General description

The 74HC7540; 74HCT7540 is a high-speed Si-gate CMOS device and is pin compatible with Low-power Schottky TTL (LSTTL). It is specified in compliance with JEDEC standard No. 7A.

The 74HC7540; 74HCT7540 provides eight inverting buffer/line drivers with 3-state outputs and Schmitt-trigger action. The 3-state outputs are controlled by the output enable inputs OE1 and OE2. A HIGH on OEn causes the outputs to assume a high-impedance OFF-state. Schmitt trigger action on the data inputs transforms slowly changing input signals into sharply defined, jitter-free output signals.

The 74HC7540; 74HCT7540 is identical to the 74HC540; 74HCT540 but has hysteresis on the data inputs.

2. Features and benefits

 Inverting outputs  Low-power dissipation  ESD protection:  HBM JESD22-A114F exceeds 2000 V  MM JESD22-A115-A exceeds 200 V  Multiple package options  Specified from 40 C to +85 C and from 40 C to +125 C

3. Ordering information

Table 1. Ordering information

plastic dual in-line package; 20 leads (300 mil)

74HC7540N

40 C to +125 C

DIP20

SOT146-1

74HCT7540N

plastic small outline package; 20 leads;

74HC7540D

40 C to +125 C

SO20

SOT163-1

body width 7.5 mm

74HCT7540D

plastic shrink small outline package; 20 leads;

74HC7540DB 40 C to +125 C

SSOP20

SOT339-1

body width 5.3 mm

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4. Functional diagram

5. Pinning information

5.1 Pinning

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Page 3

5.2 Pin description

Table 2. Pin description Symbol

Pin

Description

OE1

1

output enable input (active LOW)

A0 to A7

2, 3, 4, 5, 6, 7, 8, 9

data input

GND

10

ground (0 V)

Y0 to Y7

18, 17, 16, 15, 14, 13, 12, 11 data output

OE2

19

output enable input (active LOW)

20

supply voltage

VCC

6. Functional description

Table 3. Functional table[1]

L

L

L

H

L

L

H

L

X

H

X

Z

H

X

X

Z

[1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state.

7. Limiting values

Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol

Parameter

Conditions

Min Max Unit

supply voltage

0.5 +7 V

VCC

[1] -

input clamping current

VI < 0.5 V or VI > VCC + 0.5 V

20 mA

IIK

[1] -

output clamping current

VO < 0.5 V or VO > VCC + 0.5 V

20 mA

IOK

output current

0.5 V < VO < VCC + 0.5 V

• 35 mA

IO

supply current

• 70 mA

ICC

ground current

70 - mA

IGND

storage temperature

65 +150 C

Tstg

[2]

total power dissipation

Ptot

DIP20

• 750 mW

SO20, SSOP20

• 500 mW

[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] For DIP20 packages: above 70 C the value of Ptot derates linearly with 12 mW/K. For SO20 packages: above 70 C the value of Ptot derates linearly with 8 mW/K. For SSOP20 packages: above 60 C the value of Ptot derates linearly with 5.5 mW/K.

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8. Recommended operating conditions

Table 5. Recommended operating conditions Voltages are referenced to GND (ground = 0 V)

supply voltage

2.0 5.0 6.0 4.5 5.0 5.5 V

VCC input voltage

0 - VCC 0 - VCC V

VI output voltage

0 - VCC 0 - VCC V

VO ambient temperature

40 +25 +125 40

+25 +125 C

Tamb

9. Static characteristics

Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V).

74HC7540 HIGH-level

VI = VT+ or VT

VOH output voltage

IO = 20 A; VCC = 2.0 V

1.9 2.0 - 1.9 - 1.9 - V

IO = 20 A; VCC = 4.5 V

4.4 4.5 - 4.4 - 4.4 - V

IO = 20 A; VCC = 6.0 V

5.9 6.0 - 5.9 - 5.9 - V

IO = 6.0 mA; VCC = 4.5 V

3.98 4.32 -

3.84 - 3.7 - V

IO = 7.8 mA; VCC = 6.0 V

5.48 5.81 -

5.34 - 5.2 - V

LOW-level

VI = VT+ or VT

VOL output voltage

IO = 20 A; VCC = 2.0 V

• 0 0.1 - 0.1 - 0.1 V

IO = 20 A; VCC = 4.5 V

• 0 0.1 - 0.1 - 0.1 V

IO = 20 A; VCC = 6.0 V

• 0 0.1 - 0.1 - 0.1 V

IO = 6.0 mA; VCC = 4.5 V

• 0.15 0.26
• 0.33 - 0.4 V

IO = 7.8 mA; VCC = 6.0 V

• 0.16 0.26
• 0.33 - 0.4 V

input leakage

VI = VCC or GND; VCC = 6.0 V

• - 0.1
• 1.0 - 1.0 A

II current IOZ

• - 0.5
• 5.0 - 10 A

OFF-state

per input pin; VI = VT+ or VT;

output current VO = VCC or GND;

other inputs at VCC or GND; VCC = 6.0 V; IO = 0 A

ICC supply current

VI = VCC or GND; IO = 0 A;

• - 8.0 - 80 - 160 A

VCC = 6.0 V

input

• 3.5 - - - - - pF

CI capacitance 74HCT7540 HIGH-level

VI = VT+ or VT; VCC = 4.5 V

VOH output voltage

IO = 20 A

4.4 4.5 - 4.4 - 4.4 - V

IO = 6.0 mA

3.98 4.32 -

3.84 - 3.7 - V

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Page 5

Table 6. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V).

VOL LOW-level

VI = VT+ or VT; VCC = 4.5 V

output voltage

IO = 20 A;

-

IO = 6.0 mA;

-

input leakage

VI = VCC or GND; VCC = 5.5 V

-

II current

-

OFF-state

per input pin; VI = VT+ or VT;

IOZ output current VO = VCC or GND;

other inputs at VCC or GND; VCC = 5.5 V; IO = 0 A

ICC

-

supply current

VI = VCC or GND; IO = 0 A; VCC = 5.5 V

ICC additional

per input pin; IO = 0 A;

supply current VI = VCC  2.1 V;

other inputs at VCC or GND; VCC = 4.5 V to 5.5 V An input

-

OEn input

-

input

-

CI capacitance

10. Dynamic characteristics

Table 7. Dynamic characteristics GND = 0 V; CL = 50 pF; for test circuit see Figure 7. Symbol Parameter

Conditions

74HC7540 propagation delay An to Yn; see Figure 5 tpd

VCC = 2.0 V VCC = 4.5 V VCC = 5.0 V; CL = 15 pF VCC = 6.0 V

enable time

OEn to Yn; see Figure 6

ten

VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V

disable time

OEn to Yn; see Figure 6

tdis

VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V

0 0.1 - 0.1 - 0.1 V

0.15 0.26

• 0.33 - 0.4 V
• 0.1
• 1.0 - 1.0 A
• 0.5
• 5.0 - 10 A
• 8.0 - 80 - 160 A

20 72 - 90 - 98 A

130 468

• 585 - 637 A

3.5 - - - - - pF

Tamb = 25 C

Tamb = 40 C to +125 C

Unit

Min Typ Max Max (85 C) Max (125 C)

[1]

• 39 120

150

180 ns

• 14 24 30

36 ns

• 11 - -
• ns
• 11 20 26

31 ns

[1]

• 41 150

190

225 ns

• 15 30 38

45 ns

• 12 26 33

38 ns

[1]

• 52 150

190

225 ns

• 19 30 38

45 ns

• 15 26 33

38 ns

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Table 7. Dynamic characteristics GND = 0 V; CL = 50 pF; for test circuit see Figure 7.

[2]

tt transition time

see Figure 5 VCC = 2.0 V

• 14 60 75

90 ns

VCC = 4.5 V

• 5 12 15

18 ns

VCC = 6.0 V

• 4 10 13

15 ns

[3]

power dissipation per package;

• 29 - -
• pF

CPD capacitance

VI = GND to VCC

74HCT7540

[1]

propagation delay An to Yn; see Figure 5 tpd

VCC = 4.5 V

• 19 32 40

48 ns

VCC = 5.0 V; CL = 15 pF

• 16 - -
• ns

[1]

enable time

OEn to Yn; see Figure 6

ten

VCC = 4.5 V

• 19 32 40

48 ns

[1]

disable time

OEn to Yn; see Figure 6

tdis

VCC = 4.5 V

• 20 32 40

48 ns

[2]

transition time

VCC = 4.5 V; see Figure 5

• 5 12 15

18 ns

tt

[3]

power dissipation per package;

• 31 - -
• pF

CPD

VI = GND to VCC  1.5 V

capacitance

[1] tpd is the same as tPLH and tPHL. ten is the same as tPZL and tPZH. tdis is the same as tPLZ and tPHZ. [2] tt is the same as tTHL and tTLH. [3] CPD is used to determine the dynamic power dissipation (PD in W): PD = CPD  VCC2  fi  N +  (CL  VCC2  fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching;  (CL  VCC2  fo) = sum of outputs.

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11. Waveforms

Table 8. Measurement points

74HC7540

0.5VCC

0.5VCC

0.1VCC

0.9VCC

74HCT7540

1.3 V

1.3 V

0.1VCC

0.9VCC

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Page 8

Table 9. Test data

74HC7540

VCC

6 ns

15 pF, 50 pF

1 k

open

GND

VCC

74HCT7540

3 V

6 ns

15 pF, 50 pF

1 k

open

GND

VCC

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Page 9

12. Transfer characteristics

Table 10. Transfer characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V); see Figure 8 and Figure 9.

74HC7540

VCC = 2.0 V

positive-going

• - 1.5 - 1.5 - 1.5 V

VT+ threshold

VCC = 4.5 V

• - 3.15
• 3.15 - 3.15 V

voltage

VCC = 6.0 V

• - 4.2 - 4.2 - 4.2 V

VCC = 2.0 V

negative-going

0.3 - - 0.3 - 0.3 - V

VT threshold

VCC = 4.5 V

1.35 - - 1.35 - 1.35 - V

voltage

VCC = 6.0 V

1.8 - - 1.8 - 1.8 - V

hysteresis

VCC = 2.0 V

0.1 0.20 -

0.1 - 0.1 - V

VH voltage

VCC = 4.5 V

0.25 0.40 -

0.25 - 0.25 - V

VCC = 6.0 V

0.3 0.5 - 0.3 - 0.3 - V

74HCT7540 positive-going

VCC = 4.5 V

• - 2.0 - 2.0 - 2.0 V

VT+ threshold

VCC = 5.5 V

• - 2.1 - 2.1 - 2.1 V

voltage negative-going

VCC = 4.5 V

0.7 - - 0.64 - 0.6 - V

VT threshold

VCC = 5.5 V

0.8 - - 0.74 - 0.7 - V

voltage VH hysteresis

VCC = 4.5 V

0.17 0.23 -

• - - - V

voltage

VCC = 5.5 V

0.17 0.23 -

• - - - V

13. Transfer characteristics waveforms

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Page 10

14. Package outline

DIP20: plastic dual in-line package; 20 leads (300 mil)

SOT146-1

Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

Fig 10. Package outline SOT146-1 (DIP20)

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SO20: plastic small outline package; 20 leads; body width 7.5 mm

SOT163-1

Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

Fig 11. Package outline SOT163-1 (SO20)

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Page 12

SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm

SOT339-1

Fig 12. Package outline SOT339-1 (SSOP20)

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15. Abbreviations

Table 11. Abbreviations Acronym

Description

CMOS

Complementary Metal-Oxide Semiconductor

DUT

Device Under Test

ESD

ElectroStatic Discharge

HBM

Human Body Model

LSTTL

Low-power Schottky Transistor-Transistor Logic

MM

Machine Model

16. Revision history

Table 12. Revision history

Change notice

Document ID

Release date

Data sheet status

74HC_HCT7540 v.4

20121231

-

• IOZ added to static characteristics table.

Modifications: 74HC_HCT7540 v.3

20120827

-

Supersedes 74HC_HCT7540 v.3

74HC_HCT7540_CNV v.2

• The format of this data sheet has been redesigned to comply with the new identity

Modifications:

guidelines of NXP Semiconductors.

• Legal texts have been adapted to the new company name where appropriate.

74HC_HCT7540_CNV v.2 19970917

Product specification

-

-

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17. Legal information

17.1 Data sheet status

Document status[1][2]

Product status[3]

Definition This document contains data from the objective specification for product development.

Objective [short] data sheet

Development

This document contains data from the preliminary specification.

Preliminary [short] data sheet Qualification

This document contains the product specification.

Product [short] data sheet

Production

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.

17.2 Definitions

Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.

17.3 Disclaimers

Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

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Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in

automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond

18. Contact information

For more information, please visit: http://www.nxp.com

NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions.

17.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.

For sales office addresses, please send an email to: salesaddresses@nxp.com

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19. Contents

1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information. . . . . . . . . . . . . . . . . . . . . 1 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Functional description . . . . . . . . . . . . . . . . . . . 3 7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Recommended operating conditions. . . . . . . . 4 9

Static characteristics. . . . . . . . . . . . . . . . . . . . . 4 10 Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 Transfer characteristics . . . . . . . . . . . . . . . . . . 9 13 Transfer characteristics waveforms. . . . . . . . . 9 14 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 15 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 13 16 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 13 17 Legal information. . . . . . . . . . . . . . . . . . . . . . . 14 17.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14

17.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 17.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 17.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15 18 Contact information. . . . . . . . . . . . . . . . . . . . . 15 19 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.

© NXP B.V. 2012.

All rights reserved.

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 31 December 2012 Document identifier: 74HC_HCT7540