74HCT594N

74HC594 NXP

Document overview

• PDF pages: 26

Technical content

Page 1

1. General description

The 74HC594; 74HCT594 is a high-speed Si-gate CMOS device and is pin compatible with Low-Power Schottky TTL (LSTTL).

The 74HC594; 74HCT594 is an 8-bit, non-inverting, serial-in, parallel-out shift register that feeds an 8-bit D-type storage register. Separate clocks (SHCP and STCP) and direct overriding clears (SHR and STR) are provided on both the shift and storage registers. A serial output (Q7S) is provided for cascading purposes.

Both the shift and storage register clocks are positive-edge triggered. If the user wishes to connect both clocks together, the shift register will always be one count pulse ahead of the storage register.

2. Features

I Synchronous serial input and output I Complies with JEDEC standard No.7A I 8-bit parallel output I Shift and storage registers have independent direct clear and clocks I Independent clocks for shift and storage registers I 100 MHz (typical) I Multiple package options I Specified from −40 °C to +85 °C and from −40 °C to +125 °C

3. Applications

I Serial-to parallel data conversion I Remote control holding register

Page 2

4. Ordering information

Table 1. Ordering information

plastic small outline package; 16 leads;

74HC594D

−40 °C to +125 °C SO16

SOT109-1

body width 3.9 mm plastic shrink small outline package; 16 leads;

74HC594DB

−40 °C to +125 °C SSOP16

SOT338-1

body width 5.3 mm plastic dual in-line package; 16 leads (300 mil)

74HC594N

−40 °C to +125 °C DIP16

SOT38-4

plastic small outline package; 16 leads;

74HCT594D

−40 °C to +125 °C SO16

SOT109-1

body width 3.9 mm plastic shrink small outline package; 16 leads;

74HCT594DB

−40 °C to +125 °C SSOP16

SOT338-1

body width 5.3 mm plastic dual in-line package; 16 leads (300 mil)

74HCT594N

−40 °C to +125 °C DIP16

SOT38-4

5. Functional diagram

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6. Pinning information

6.1 Pinning

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Page 5

6.2 Pin description

Table 2. Pin description Symbol

Pin

Description

Q1

1

parallel data output 1

Q2

2

parallel data output 2

Q3

3

parallel data output 3

Q4

4

parallel data output 4

Q5

5

parallel data output 5

Q6

6

parallel data output 6

Q7

7

parallel data output 7

GND

8

ground (0 V)

Q7S

9

serial data output shift register reset (active LOW)

SHR

10

SHCP

11

shift register clock input storage register clock input

STCP

12

storage register reset (active LOW)

STR

13

DS

14

serial data input

Q0

15

parallel data output 0

16

supply voltage

VCC

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Page 6

7. Functional description

Table 3. Function table[1]

Clear shift register

L X X X X

Clear storage register

X L X X X

Load DS into shift register stage 0, advance previous stage data to the next stage H

X

X H or L

↑

Transfer shift register data to storage register and outputs Qn

X H X

X ↑

Shift register one count pulse ahead of storage register

H H

X

↑ ↑

[1] H = HIGH voltage level; L = LOW voltage level; ↑ = LOW-to-HIGH transition; X = don’t care.

8. Limiting values

Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol

Parameter

Conditions

Min Max Unit

supply voltage

−0.5 +7.0 V

VCC

[1] -

input clamping current

VI < −0.5 V or VI > VCC + 0.5 V

±20 mA

IIK

[1] -

output clamping current

VO < −0.5 V or VO > VCC + 0.5 V

±20 mA

IOK

output current

VO = −0.5 V to VCC + 0.5 V

IO

Serial data output Q7S

• ±25 mA

Parallel data output

• ±35 mA

supply current

Serial data output Q7S

• 50 mA

ICC

Parallel data output

• 70 mA

ground current

Serial data output Q7S

• −50 mA

IGND

Parallel data output

• −70 mA

storage temperature

−65 +150 °C

Tstg

[2] -

total power dissipation

Tamb = −40 °C to +125 °C

500 mW

Ptot

[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] For DIP16 packages: above 70 °C the value of Ptot derates linearly with 12 mW/K. For SO16 packages: above 70 °C the value of Ptot derates linearly with 8 mW/K. For SSOP16 packages: above 60 °C the value of Ptot derates linearly with 5.5 mW/K.

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Page 7

9. Recommended operating conditions

Table 5. Recommended operating conditions Symbol

Parameter

Conditions

Min Typ Max Unit

Type 74HC594

supply voltage

2.0 5.0 6.0 V

VCC

input voltage

0 - VCC V

VI

output voltage

0 - VCC V

VO

ambient temperature

−40 +25 +125 °C

Tamb

rise time

VCC = 2.0 V

• - 1000 ns

tr

VCC = 4.5 V

• 6.0 500 ns

VCC = 6.0 V

• - 400 ns

fall time

VCC = 2.0 V

• - 1000 ns

tf

VCC = 4.5 V

• 6.0 500 ns

VCC = 6.0 V

• - 400 ns

Type 74HCT594

supply voltage

4.5 5.0 5.5 V

VCC

input voltage

0 - VCC V

VI

output voltage

0 - VCC V

VO

ambient temperature

−40 +25 +125 °C

Tamb

rise time

VCC = 4.5 V

• 6.0 500 ns

tr

fall time

VCC = 4.5 V

• 6.0 500 ns

tf

10. Static characteristics

Table 6. Static characteristics type 74HC594 At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter

Conditions

Min Typ Max Unit

Tamb = 25 °C HIGH-level input voltage

VCC = 2.0 V

1.5 1.2 - V

VIH

VCC = 4.5 V

3.15 2.4 - V

VCC = 6.0 V

4.2 3.2 - V

LOW-level input voltage

VCC = 2.0 V

• 0.8 0.5 V

VIL

VCC = 4.5 V

• 2.1 1.35 V

VCC = 6.0 V

• 2.8 1.8 V

HIGH-level output voltage

VI = VIH or VIL

VOH

Serial data output Q7S IO = −4.0 mA; VCC = 4.5 V

3.98 4.32 - V

IO = −5.2 mA; VCC = 6.0 V

5.48 5.81 - V

Parallel data outputs IO = −6.0 mA; VCC = 4.5 V

3.98 4.32 - V

IO = −7.8 mA; VCC = 6.0 V

5.48 5.81 - V

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Page 8

Table 6. Static characteristics type 74HC594 …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter

Conditions

Min Typ Max Unit

VOL LOW-level output voltage

VI = VIH or VIL Serial data output Q7S IO = 4.0 mA; VCC = 4.5 V

• 0.15 0.26 V

IO = 5.2 mA; VCC = 6.0 V

• 0.16 0.26 V

Parallel data outputs IO = 6.0 mA; VCC = 4.5 V

• 0.15 0.26 V

IO = 7.8 mA; VCC = 6.0 V

• 0.16 0.26 V

input leakage current

VI = VCC or GND; VCC = 6.0 V

• - ±0.1 µA

II

supply current

VI = VCC or GND; IO = 0 A;

• - 8.0 µA

ICC

VCC = 6.0 V

input capacitance

• 3.5 - pF

Ci Tamb = −40 °C to +85 °C

HIGH-level input voltage

VCC = 2.0 V

1.5 - - V

VIH

VCC = 4.5 V

3.15 - - V

VCC = 6.0 V

4.2 - - V

LOW-level input voltage

VCC = 2.0 V

• - 0.5 V

VIL

VCC = 4.5 V

• - 1.35 V

VCC = 6.0 V

• - 1.8 V

HIGH-level output voltage

VI = VIH or VIL

VOH

Serial data output Q7S IO = −4.0 mA; VCC = 4.5 V

3.84 - - V

IO = −5.2 mA; VCC = 6.0 V

5.34 - - V

Parallel data outputs IO = −6.0 mA; VCC = 4.5 V

3.84 - - V

IO = −7.8 mA; VCC = 6.0 V

5.34 - - V

LOW-level output voltage

VI = VIH or VIL

VOL

Serial data output Q7S IO = 4.0 mA; VCC = 4.5 V

• - 0.33 V

IO = 5.2 mA; VCC = 6.0 V

• - 0.33 V

Parallel data outputs IO = 6.0 mA; VCC = 4.5 V

• - 0.33 V

IO = 7.8 mA; VCC = 6.0 V

• - 0.33 V

input leakage current

VI = VCC or GND; VCC = 6.0 V

• - ±1.0 µA

II

supply current

VI = VCC or GND; IO = 0 A;

• - 80 µA

ICC

VCC = 6.0 V

Tamb = −40 °C to +125 °C HIGH-level input voltage

VCC = 2.0 V

1.5 - - V

VIH

VCC = 4.5 V

3.15 - - V

VCC = 6.0 V

4.2 - - V

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Page 9

Table 6. Static characteristics type 74HC594 …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter

Conditions

Min Typ Max Unit

VIL LOW-level input voltage

VCC = 2.0 V

• - 0.5 V

VCC = 4.5 V

• - 1.35 V

VCC = 6.0 V

• - 1.8 V

HIGH-level output voltage

VI = VIH or VIL

VOH

Serial data output Q7S IO = −4.0 mA; VCC = 4.5 V

3.7 - - V

IO = −5.2 mA; VCC = 6.0 V

5.2 - - V

Parallel data outputs IO = −6.0 mA; VCC = 4.5 V

3.7 - - V

IO = −7.8 mA; VCC = 6.0 V

5.2 - - V

LOW-level output voltage

VI = VIH or VIL

VOL

Serial data output Q7S IO = 4.0 mA; VCC = 4.5 V

• - 0.4 V

IO = 5.2 mA; VCC = 6.0 V

• - 0.4 V

Parallel data outputs IO = 6.0 mA; VCC = 4.5 V

• - 0.4 V

IO = 7.8 mA; VCC = 6.0 V

• - 0.4 V

input leakage current

VI = VCC or GND; VCC = 6.0 V

• - ±1.0 µA

II

supply current

VI = VCC or GND; IO = 0 A;

• - 160 µA

ICC

VCC = 6.0 V

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Page 10

Table 7. Static characteristics type 74HCT594 At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter

Conditions

Min Typ Max Unit

Tamb = 25 °C HIGH-level input voltage

VCC = 4.5 V to 5.5 V

2.0 1.6 - V

VIH LOW-level input voltage

VCC = 4.5 V to 5.5 V

• 1.2 0.8 V

VIL HIGH-level output voltage

VI = VIH or VIL

VOH

Serial data output Q7S IO = −4.0 mA; VCC = 4.5 V

3.98 4.32 - V

Parallel data outputs IO = −6.0 mA; VCC = 4.5 V

3.98 4.32 - V

LOW-level output voltage

VI = VIH or VIL

VOL

Serial data output Q7S IO = 4.0 mA; VCC = 4.5 V

• 0.15 0.26 V

Parallel data outputs IO = 6.0 mA; VCC = 4.5 V

• 0.16 0.26 V

input leakage current

VI = VCC or GND; VCC = 5.5 V

• - ±0.1 µA

II

supply current

VI = VCC or GND; IO = 0 A;

• - 8.0 µA

ICC

VCC = 5.5 V

additional supply current

per input pin; VI = VCC − 2.1 V and

∆ICC

other inputs at VCC or GND; IO = 0 A; VCC = 4.5 V to 5.5 V pins SHR, SHCP, STCP, STR

• 150 540 µA

pin DS

• 25 90 µA

input capacitance

• 3.5 - pF

Ci Tamb = −40 °C to +85 °C

HIGH-level input voltage

VCC = 4.5 V to 5.5 V

2.0 - - V

VIH LOW-level input voltage

VCC = 4.5 V to 5.5 V

• - 0.8 V

VIL HIGH-level output voltage

VI = VIH or VIL

VOH

Serial data output Q7S IO = −4.0 mA; VCC = 4.5 V

3.84 - - V

Parallel data outputs IO = −6.0 mA; VCC = 4.5 V

3.84 - - V

LOW-level output voltage

VI = VIH or VIL

VOL

Serial data output IO = 4.0 mA; VCC = 4.5 V

• - 0.33 V

Parallel data outputs IO = 6.0 mA; VCC = 4.5 V

• - 0.33 V

input leakage current

VI = VCC or GND; VCC = 5.5 V

• - ±1.0 µA

II

supply current

VI = VCC or GND; IO = 0 A;

• - 80 µA

ICC

VCC = 5.5 V

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Page 11

Table 7. Static characteristics type 74HCT594 …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter

Conditions

Min Typ Max Unit

∆ICC additional supply current

per input pin; VI = VCC − 2.1 V and other inputs at VCC or GND; IO = 0 A; VCC = 4.5 V to 5.5 V pins SHR, SHCP, STCP, STR

• - 675 µA

pin DS

• - 112.5 µA

Tamb = −40 °C to +125 °C HIGH-level input voltage

VCC = 4.5 V to 5.5 V

2.0 - - V

VIH LOW-level input voltage

VCC = 4.5 V to 5.5 V

• - 0.8 V

VIL HIGH-level output voltage

VI = VIH or VIL

VOH

Serial data output Q7S IO = −4.0 mA; VCC = 4.5 V

3.7 - - V

Parallel data outputs IO = −6.0 mA; VCC = 4.5 V

3.7 - - V

LOW-level output voltage

VI = VIH or VIL

VOL

Serial data output Q7S IO = 4.0 mA; VCC = 4.5 V

• - 0.4 V

Parallel data outputs IO = 6.0 mA; VCC = 4.5 V

• - 0.4 V

input leakage current

VI = VCC or GND; VCC = 5.5 V

• - ±1.0 µA

II

supply current

VI = VCC or GND; IO = 0 A;

• - 160 µA

ICC

VCC = 5.5 V

additional supply current

per input pin; VI = VCC − 2.1 V and

∆ICC

other inputs at VCC or GND; IO = 0 A; VCC = 4.5 V to 5.5 V pins SHR, SHCP, STCP, STR

• - 735 µA

pin DS

• - 122.5 µA

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11. Dynamic characteristics

Table 8. Dynamic characteristics type 74HC594 GND = 0 V; tr = tf = 6 ns; CL = 50 pF; see Figure 15.

[1]

propagation SHCP to Q7S; tpd delay

see Figure 9 VCC = 2.0 V

• 44 150 - 185 - 225 ns

VCC = 4.5 V

• 16 30 - 37 - 45 ns

VCC = 5.0 V;

• 13 - - - - - ns

CL = 15 pF VCC = 6.0 V

• 14 26 - 31 - 38 ns

STCP to Qn; see Figure 10 VCC = 2.0 V

• 44 150 - 185 - 225 ns

VCC = 4.5 V

• 16 30 - 37 - 45 ns

VCC = 5.0 V;

• 13 - - - - - ns

CL = 15 pF VCC = 6.0 V

• 14 26 - 31 - 38 ns

HIGH to

SHR to Q7S; see

tPHL LOW

Figure 13

propagation

VCC = 2.0 V

• 39 150 - 185 - 225 ns

delay

VCC = 4.5 V

• 14 30 - 37 - 45 ns

VCC = 5.0 V;

• 11 - - - - - ns

CL = 15 pF VCC = 6.0 V

• 12 26 - 31 - 38 ns

STR to Qn; see Figure 14 VCC = 2.0 V

• 39 125 - 155 - 185 ns

VCC = 4.5 V

• 14 25 - 31 - 37 ns

VCC = 5.0 V;

• 11 - - - - - ns

CL = 15 pF VCC = 6.0 V

• 12 21 - 26 - 31 ns

see Figure 9

HIGH to tTHL LOW output

Serial data output Q7S

transition

VCC = 2.0 V

• 19 75 - 95 - 110 ns

time

VCC = 4.5 V

• 7 15 - 19 - 22 ns

VCC = 6.0 V

• 6 13 - 16 - 19 ns

Parallel data outputs VCC = 2.0 V

• 14 60 - 75 - 90 ns

VCC = 4.5 V

• 5 12 - 15 - 18 ns

VCC = 6.0 V

• 4 10 - 13 - 15 ns

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Page 13

Table 8. Dynamic characteristics type 74HC594 …continued GND = 0 V; tr = tf = 6 ns; CL = 50 pF; see Figure 15.

see Figure 9

tTLH LOW to HIGH output

Serial data output Q7S

transition

VCC = 2.0 V

• 19 75 - 95 - 110 ns

time

VCC = 4.5 V

• 7 15 - 19 - 22 ns

VCC = 6.0 V

• 6 13 - 16 - 19 ns

Parallel data outputs VCC = 2.0 V

• 14 60 - 75 - 90 ns

VCC = 4.5 V

• 5 12 - 15 - 18 ns

VCC = 6.0 V

• 4 10 - 13 - 15 ns

pulse width SHCP (HIGH or tW

LOW); see Figure 9 VCC = 2.0 V

80 10 - 100 - 120 - ns

VCC = 4.5 V

16 4 - 20 - 24 - ns

VCC = 6.0 V

14 3 - 17 - 20 - ns

STCP (HIGH or LOW); see Figure 10 VCC = 2.0 V

80 10 - 100 - 120 - ns

VCC = 4.5 V

16 4 - 20 - 24 - ns

VCC = 6.0 V

14 3 - 17 - 20 - ns

SHR and STR (HIGH or LOW); see Figure 13 and Figure 14 VCC = 2.0 V

80 14 - 100 - 120 - ns

VCC = 4.5 V

16 5 - 20 - 24 - ns

VCC = 6.0 V

14 4 - 17 - 20 - ns

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Page 14

Table 8. Dynamic characteristics type 74HC594 …continued GND = 0 V; tr = tf = 6 ns; CL = 50 pF; see Figure 15.

tsu set-up time DS to SHCP;

see Figure 11 VCC = 2.0 V

100 10 - 125 - 150 - ns

VCC = 4.5 V

20 4 - 25 - 30 - ns

VCC = 6.0 V

17 3 - 21 - 26 - ns

SHR to STCP; see Figure 12 VCC = 2.0 V

100 14 - 125 - 150 - ns

VCC = 4.5 V

20 5 - 25 - 30 - ns

VCC = 6.0 V

17 4 - 21 - 26 - ns

SHCP to STCP; see Figure 10 VCC = 2.0 V

100 17 - 125 - 150 - ns

VCC = 4.5 V

20 6 - 25 - 30 - ns

VCC = 6.0 V

17 5 - 21 - 26 - ns

hold time

DS to SHCP;

th

see Figure 11 VCC = 2.0 V

25 −8 - 30 - 35 - ns

VCC = 4.5 V

5 −3 - 6 - 7 - ns

VCC = 6.0 V

4 −2 - 5 - 6 - ns

recovery

SHR to SHCP

trec time

and STR to STCP; see Figure 13 and Figure 14 VCC = 2.0 V

50 −14 - 65 - 75 - ns

VCC = 4.5 V

10 −5 - 13 - 15 - ns

VCC = 6.0 V

9 −4 - 11 - 13 - ns

maximum

SHCP or STCP;

fmax frequency

see Figure 9 and Figure 10 VCC = 2.0 V

6.0 30 - 4.8 - 4.0 - MHz

VCC = 4.5 V

30 92 - 24 - 20 - MHz

VCC = 5.0 V;

• 100 - - - - - MHz

CL = 15 pF VCC = 6.0 V

35 109 - 28 - 24 - MHz

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Page 15

Table 8. Dynamic characteristics type 74HC594 …continued GND = 0 V; tr = tf = 6 ns; CL = 50 pF; see Figure 15.

[2]

VI = GND to VCC;

CPD power

• 84 - - - - - pF

dissipation VCC = 5 V; capacitance fi = 1 MHz

[1] tpd is the same as tPHL and tPLH. [2] CPD is used to determine the dynamic power dissipation (PD in µW): PD = CPD × VCC2 × fi × N + ∑(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; ∑(CL × VCC2 × fo) = sum of outputs.

Table 9. Dynamic characteristics type 74HCT594 GND = 0 V; VCC = 4.5 V; tr = tf = 6 ns; CL = 50 pF; see Figure 15.

[1]

propagation SHCP to Q7S;

• 18 32 - 40 - 48 ns

tpd delay

see Figure 9 VCC = 5.0 V;

• 15 - - - - - ns

CL = 15 pF

• 18 32 - 40 - 48 ns

STCP to Qn; see Figure 10 VCC = 5.0 V;

• 15 - - - - - ns

CL = 15 pF

HIGH to

SHR to Q7S; see

• 17 30 - 38 - 45 ns

tPHL LOW

Figure 13

propagation

VCC = 5.0 V;

• 14 - - - - - ns

delay

CL = 15 pF STR to Qn; see

• 17 30 - 38 - 45 ns

Figure 14 VCC = 5.0 V;

• 14 - - - - - ns

CL = 15 pF see Figure 9

HIGH to tTHL LOW output

Serial data output Q7S

transition

VCC = 4.5 V

• 7 15 - 19 - 22 ns

time

Parallel data outputs VCC = 4.5 V

• 5 12 - 15 - 18 ns

see Figure 9

LOW to tTLH HIGH output

Serial data output Q7S

transition

VCC = 4.5 V

• 7 15 - 19 - 22 ns

time

Parallel data outputs VCC = 4.5 V

• 5 12 - 15 - 18 ns

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Table 9. Dynamic characteristics type 74HCT594 …continued GND = 0 V; VCC = 4.5 V; tr = tf = 6 ns; CL = 50 pF; see Figure 15.

16 4 - 20 - 24 - ns

tW pulse width SHCP (HIGH or

LOW); see Figure 9 STCP (HIGH or

16 4 - 20 - 24 - ns

LOW); see Figure 10

16 6 - 20 - 24 - ns

SHR and STR (HIGH or LOW); see Figure 13 and Figure 14

tsu set-up time DS to SHCP;

20 4 - 25 - 30 - ns

see Figure 11 SHR to STCP;

20 6 - 25 - 30 - ns

see Figure 12

20 7 - 25 - 30 - ns

SHCP to STCP; see Figure 10

hold time

DS to SHCP;

5 −3 - 6 - 7 - ns

th

see Figure 11

10 −5 - 13 - 15 - ns

recovery

SHR to SHCP

trec time

and STR to STCP; see Figure 13 and Figure 14

maximum

SHCP or STCP;

fmax

30 92 - 24 - 20 - MHz

frequency

see Figure 9 and Figure 10 VCC = 5.0 V;

• 100 - - - - - MHz

CL = 15 pF

[2]

VI = GND to VCC

power

• 89 - - - - - pF

CPD dissipation − 1.5 V; capacitance VCC = 5 V;

fi = 1 MHz

[1] tpd is the same as tPHL and tPLH. [2] CPD is used to determine the dynamic power dissipation (PD in µW): PD = CPD × VCC2 × fi × N + ∑(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; ∑(CL × VCC2 × fo) = sum of outputs.

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Page 17

12. Waveforms

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Page 18

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Page 19

Table 10. Measurement points

74HC594

0.5 × VCC

0.5 × VCC

74HCT594

1.3 V

1.3 V

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Page 20

Table 11. Test data

74HC594

VCC 6 ns 15 pF, 50 pF

1 kΩ open

GND

VCC

74HCT594

3 V 6 ns 15 pF, 50 pF

1 kΩ open

GND

VCC

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13. Package outline

SO16: plastic small outline package; 16 leads; body width 3.9 mm

SOT109-1

Fig 16. Package outline SOT109-1 (SO16)

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Page 22

SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm

SOT338-1

Fig 17. Package outline SOT338-1 (SSOP16)

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DIP16: plastic dual in-line package; 16 leads (300 mil)

SOT38-4

Fig 18. Package outline SOT38-4 (DIP16)

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14. Abbreviations

Table 12. Abbreviations Acronym

Description

CMOS

Complementary Metal Oxide Semiconductor

DUT

Device Under Test

ESD

ElectroStatic Discharge

HBM

Human Body Model

LSTTL

Low-Power Schottky Transistor-Transistor Logic

MM

Machine Model

TTL

Transistor-Transistor Logic

15. Revision history

Table 13. Revision history Document ID

Release date

Data sheet status

Change notice

Supersedes

20061220

-

74HC_HCT594_CNV_2

• The format of this data sheet has been redesigned to comply with the new identity guidelines

Modifications:

of NXP Semiconductors.

• Legal texts have been adapted to the new company name where appropriate.
• Table 1 “Ordering information” updated.

74HC_HCT594_CNV_2 19970908

Product specification -

74HC_HCT594_CNV_1

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16. Legal information

16.1 Data sheet status

Document status[1][2]

Product status[3]

Definition This document contains data from the objective specification for product development.

Objective [short] data sheet

Development

This document contains data from the preliminary specification.

Preliminary [short] data sheet Qualification

This document contains the product specification.

Product [short] data sheet

Production

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.

16.2 Definitions

Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.

16.3 Disclaimers

General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or

17. Contact information

For additional information, please visit: http://www.nxp.com

malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of

any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

16.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.

For sales office addresses, send an email to: salesaddresses@nxp.com

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18. Contents

1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 7 Functional description . . . . . . . . . . . . . . . . . . . 6 8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6

9 Recommended operating conditions. . . . . . . . 7 10 Static characteristics. . . . . . . . . . . . . . . . . . . . . 7 11 Dynamic characteristics . . . . . . . . . . . . . . . . . 12 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 21 14 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 24 15 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 24 16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 25 16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 25 16.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

16.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 16.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 25 17 Contact information. . . . . . . . . . . . . . . . . . . . . 25 18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.

© NXP B.V. 2006.

All rights reserved.

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 20 December 2006 Document identifier: 74HC_HCT594_3