74HC4040 PHILIPS
Document overview
- PDF pages: 24
Technical content
Page 1
1. General description
The 74HC4040; 74HCT4040 are high-speed Si-gate CMOS devices and are pin compatible with the HEF4040B series. They are specified in compliance with JEDEC standard no. 7A.
The 74HC4040; 74HCT4040 are 12-stage binary ripple counters with a clock input (CP), an overriding asynchronous master reset input (MR) and twelve parallel outputs (Q0 to Q11). The counter advances on the HIGH-to-LOW transition of CP.
A HIGH on MR clears all counter stages and forces all outputs LOW, independent of the state of CP.
Each counter stage is a static toggle flip-flop.
2. Features
I Multiple package options I Complies with JEDEC standard no. 7A I ESD protection: N HBM JESD22-A114-C exceeds 2000 V N MM JESD22-A115-A exceeds 200 V I Specified from −40 °C to +85 °C and from −40 °C to +125 °C
3. Applications
I Frequency dividing circuits I Time delay circuits I Control counters
4. Quick reference data
Table 1: Quick reference data GND = 0 V; Tamb = 25 °C; tr = tf = 6 ns. Symbol
Parameter
Type 74HC4040 tPHL, tPLH
propagation delay CP to Q0 Qn to Qn+1
Conditions
Min Typ Max Unit
CL = 15 pF; VCC = 5 V
- 14 -
ns
CL = 15 pF; VCC = 5 V
- 8 - ns

Page 2
Table 1: Quick reference data …continued GND = 0 V; Tamb = 25 °C; tr = tf = 6 ns. Symbol
Parameter
fmax
maximum operating frequency input capacitance
Ci
power dissipation
CPD
capacitance
Type 74HCT4040 tPHL, tPLH
propagation delay CP to Q0 Qn to Qn+1 maximum operating
fmax
frequency input capacitance
Ci
power dissipation
CPD
capacitance
Conditions
Min Typ Max Unit
CL = 15 pF; VCC = 5 V
- 90 -
MHz
- 3.5 -
pF
VI = GND to VCC
- 20 -
pF
CL = 15 pF; VCC = 5 V
- 16 -
ns
CL = 15 pF; VCC = 5 V
- 8 - ns
CL = 15 pF; VCC = 5 V
- 79 -
MHz
- 3.5 -
pF
VI = GND to VCC − 1.5 V
- 20 -
pF
[1] CPD is used to determine the dynamic power dissipation (PD in µW): PD = CPD × VCC2 × fi + ∑(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; ∑(CL × VCC2 × fo) = sum of outputs; CL = output load capacitance in pF; VCC = supply voltage in V.
5. Ordering information
Table 2: Ordering information
| Type number | Package | |||
|---|---|---|---|---|
| Temperature range | Name | Description | Version |
74HC4040N
−40 °C to +125 °C
DIP16
long body
74HC4040D
−40 °C to +125 °C
SO16
74HC4040DB −40 °C to +125 °C
SSOP16
plastic dual in-line package; 16 leads (300 mil);
SOT38-1
plastic small outline package; 16 leads; body
SOT109-1
width 3.9 mm plastic shrink small outline package; 16 leads; body
SOT338-1
width 5.3 mm
TSSOP16 plastic thin shrink small outline package; 16 leads;
74HC4040PW −40 °C to +125 °C
SOT403-1
body width 4.4 mm
DHVQFN16 plastic dual in-line compatible thermal enhanced
74HC4040BQ −40 °C to +125 °C
74HCT4040N −40 °C to +125 °C
DIP16
long body
74HCT4040D −40 °C to +125 °C
SO16
SOT763-1
very thin quad flat package; no leads; 16 terminals; body 2.5 × 3.5 × 0.85 mm plastic dual in-line package; 16 leads (300 mil);
SOT38-1
plastic small outline package; 16 leads; body
SOT109-1
width 3.9 mm
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Page 3
Table 2: Ordering information …continued
| Type number | Package | |||
|---|---|---|---|---|
| Temperature range | Name | Description | Version |
74HCT4040DB −40 °C to +125 °C
SSOP16
plastic shrink small outline package; 16 leads; body
SOT338-1
width 5.3 mm
TSSOP16 plastic thin shrink small outline package; 16 leads;
74HCT4040PW −40 °C to +125 °C
SOT403-1
body width 4.4 mm
DHVQFN16 plastic dual in-line compatible thermal enhanced
74HCT4040BQ −40 °C to +125 °C
SOT763-1
very thin quad flat package; no leads; 16 terminals; body 2.5 × 3.5 × 0.85 mm
6. Functional diagram


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Page 4

7. Pinning information
7.1 Pinning
| Column 1 | Column 2 | Column 3 |
|---|---|---|
| 4040 | ||
| 7 | 10 | |
| 8 | 9 |
Q11 Q5 Q4 Q6 Q3 Q2 Q1 GND
001aad583
Fig 5. Pin configuration DIP16, SO16, SSOP16 and TSSOP16
terminal 1 index area
VCC
Q5 2
15 Q10
Q10
Q4 3
14 Q9
Q9
4
13
Q6
Q7
Q7
4040 Q3 5
12 Q8
Q8 MR
Q2 6
11 MR GND(1)
CP
Q1 7
10 CP
Q0
001aad584
Transparent top view
(1) The substrate is attached to this pad using conductive die attach material. It can not be used as supply pin or input Fig 6. Pin configuration DHVQFN16
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Page 5
7.2 Pin description
Table 3: Pin description Symbol
Pin
Q11
1
output 11
Q5
2
output 5
Q4
3
output 4
Q6
4
output 6
Q3
5
output 3
Q2
6
output 2
Q1
7
output 1
GND
8
Q0
9
output 0
CP
10
MR
11
Q8
12
output 8
Q7
13
output 7
Q9
14
output 9
Q10
15
output 10
16
VCC
8. Functional description
8.1 Function table
Table 4: Function table
Description
ground (0 V)
clock input (HIGH-to-LOW, edge-triggered) master reset input (active HIGH)
positive supply voltage
| Column 1 | Column 2 | Column 3 |
|---|---|---|
| Input | Output | |
| CP | MR | Q0 to Q11 |
L
no change
↑
L
count
↓ X
H
L
[1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; ↑ = LOW-to-HIGH clock transition; ↓ = HIGH-to-LOW clock transition.
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Page 6
8.2 Timing diagram

9. Limiting values
Table 5: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter
Conditions
Min Max Unit
supply voltage
−0.5 +7
V
VCC input diode current
VI < −0.5 V or VI > VCC + 0.5 V
- ±20 mA
IIK output diode current
VI < −0.5 V or VI > VCC + 0.5 V
- ±20 mA
IOK output source or sink current
−0.5 V < VO < VCC + 0.5 V
- ±25 mA
IO quiescent supply current
- ±50 mA
ICC ground current
- ±50 mA
IGND storage temperature
−65 +150 °C
Tstg
[1]
power dissipation
Tamb = −40 °C to +125 °C
Ptot
DIP16 package
- 750 mW
SO16, SSOP16, TSSOP16 and
- 500 mW
DHVQFN16 packages
[1] For DIP16 packages: above 70 °C, Ptot derates linearly with 12 mW/K. For SO16, SSOP16, TSSOP16 and DHVQFN16 packages, above 70 °C, Ptot derates linearly with 8 mW/K.
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Page 7
10. Recommended operating conditions
Table 6: Recommended operating conditions Symbol
Parameter
Conditions
Min Typ Max Unit
type 74HC4040
supply voltage
2.0 5.0 6.0 V
VCC
input voltage
0 - VCC V
VI
output voltage
0 - VCC V
VO
see Section 11 and 12 per device
ambient temperature
−40 -
+125 °C
Tamb
except for Schmitt-trigger inputs
tr, tf
input rise and fall times
VCC = 2.0 V
- - 1000 ns
VCC = 4.5 V
- 6.0 500 ns
VCC = 6.0 V
- - 400 ns
type 74HCT4040
supply voltage
4.5 5.0 5.5 V
VCC
input voltage
0 - VCC V
VI
output voltage
0 - VCC V
VO
see Section 11 and 12 per device
ambient temperature
−40 -
+125 °C
Tamb
except for Schmitt-trigger inputs
tr, tf
input rise and fall times
VCC = 2.0 V
- - - ns
VCC = 4.5 V
- 6.0 500 ns
VCC = 6.0 V
- - - ns
11. Static characteristics
Table 7: Static characteristics for 74HC4040 Voltages are referenced to GND (ground = 0 V). Symbol
Parameter
Conditions
Min Typ Max Unit
Tamb = 25 °C
HIGH-level input voltage
VCC = 2.0 V
1.5 1.2 - V
VIH
VCC = 4.5 V
3.15 2.4 - V
VCC = 6.0 V
4.2 3.2 - V
LOW-level input voltage
VCC = 2.0 V
- 0.8 0.5 V
VIL
VCC = 4.5 V
- 2.1 1.35 V
VCC = 6.0 V
- 2.8 1.8 V
HIGH-level output voltage
VI = VIH or VIL
VOH
IO = −20 µA; VCC = 2.0 V
1.9 2.0 - V
IO = −20 µA; VCC = 4.5 V
4.4 4.5 - V
IO = −20 µA; VCC = 6.0 V
5.9 6.0 - V
IO = −4.0 mA; VCC = 4.5 V
3.98 4.32 - V
IO = −5.2 mA; VCC = 6.0 V
5.48 5.81 - V
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Page 8
Table 7: Static characteristics for 74HC4040 …continued Voltages are referenced to GND (ground = 0 V). Symbol
Parameter
Conditions
Min Typ Max Unit
VOL
LOW-level output voltage
VI = VIH or VIL IO = 20 µA; VCC = 2.0 V
- 0 0.1 V
IO = 20 µA; VCC = 4.5 V
- 0 0.1 V
IO = 20 µA; VCC = 6.0 V
- 0 0.1 V
IO = 4.0 mA; VCC = 4.5 V
- 0.15 0.26 V
IO = 5.2 mA; VCC = 6.0 V
- 0.16 0.26 V
input leakage current
VI = VCC or GND; VCC = 6.0 V
- - 0.1 µA
ILl
quiescent supply current
VI = VCC or GND; IO = 0 A;
ICC
- - 8.0 µA
VCC = 6.0 V
input capacitance
- 3.5 - pF
CI Tamb = −40 °C to +85 °C
HIGH-level input voltage
VCC = 2.0 V
1.5 - - V
VIH
VCC = 4.5 V
3.15 - - V
VCC = 6.0 V
4.2 - - V
LOW-level input voltage
VCC = 2.0 V
- - 0.5 V
VIL
VCC = 4.5 V
- - 1.35 V
VCC = 6.0 V
- - 1.8 V
HIGH-level output voltage
VI = VIH or VIL
VOH
IO = −20 µA; VCC = 2.0 V
1.9 - - V
IO = −20 µA; VCC = 4.5 V
4.4 - - V
IO = −20 µA; VCC = 6.0 V
5.9 - - V
IO = −4.0 mA; VCC = 4.5 V
3.84 - - V
IO = −5.2 mA; VCC = 6.0 V;
5.34 - - V
LOW-level output voltage
VI = VIH or VIL
VOL
IO = 20 µA; VCC = 2.0 V
- - 0.1 V
IO = 20 µA; VCC = 4.5 V
- - 0.1 V
IO = 20 µA; VCC = 6.0 V
- - 0.1 V
IO = 4.0 mA; VCC = 4.5 V
- - 0.33 V
IO = 5.2 mA; VCC = 6.0 V
- - 0.33 V
input leakage current
VI = VCC or GND; VCC = 6.0 V
- - 1.0 µA
ILl
- - 80.0 µA
quiescent supply current
VI = VCC or GND; IO = 0 A;
ICC
VCC = 6.0 V
Tamb = −40 °C to +125 °C
HIGH-level input voltage
VCC = 2.0 V
1.5 - - V
VIH
VCC = 4.5 V
3.15 - - V
VCC = 6.0 V
4.2 - - V
LOW-level input voltage
VCC = 2.0 V
- - 0.5 V
VIL
VCC = 4.5 V
- - 1.35 V
VCC = 6.0 V
- - 1.8 V
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Page 9
Table 7: Static characteristics for 74HC4040 …continued Voltages are referenced to GND (ground = 0 V). Symbol
Parameter
Conditions
Min Typ Max Unit
VOH
HIGH-level output voltage
VI = VIH or VIL IO = −20 µA; VCC = 2.0 V
1.9 - - V
IO = −20 µA; VCC = 4.5 V
4.4 - - V
IO = −20 µA; VCC = 6.0 V
5.9 - - V
IO = −4.0 mA; VCC = 4.5 V
3.7 - - V
IO = −5.2 mA; VCC = 6.0 V;
5.2 - - V
LOW-level output voltage
VI = VIH or VIL
VOL
IO = 20 µA; VCC = 2.0 V
- - 0.1 V
IO = 20 µA; VCC = 4.5 V
- - 0.1 V
IO = 20 µA; VCC = 6.0 V
- - 0.1 V
IO = 4.0 mA; VCC = 4.5 V
- - 0.4 V
IO = 5.2 mA; VCC = 6.0 V
- - 0.4 V
input leakage current
VI = VCC or GND; VCC = 6.0 V
- - 1.0 µA
ILl
quiescent supply current
VI = VCC or GND; IO = 0 A;
- - 160.0 µA
ICC
VCC = 6.0 V
Table 8: Static characteristics for 74HCT4040 Voltages are referenced to GND (ground = 0 V). Symbol
Parameter
Conditions
Min Typ Max Unit
Tamb = 25 °C
HIGH-level input voltage
VCC = 4.5 V to 5.5 V
2.0 1.6 - V
VIH
LOW-level input voltage
VCC = 4.5 V to 5.5 V
- 1.2 0.8 V
VIL
HIGH-level output voltage
VI = VIH or VIL
VOH
IO = −20 µA; VCC = 4.5 V
4.4 4.5 - V
IO = −4.0 mA; VCC = 4.5 V
3.98 4.32 - V
LOW-level output voltage
VI = VIH or VIL
VOL
IO = 20 µA; VCC = 4.5 V
- 0 0.1 V
IO = 4.0 mA; VCC = 4.5 V
- 0.15 0.26 V
input leakage current
VI = VCC or GND; VCC = 5.5 V
- - 0.1 µA
ILl
quiescent supply current
VI = VCC or GND; IO = 0 A;
- - 8.0 µA
ICC
VCC = 5.5 V
additional quiescent supply
VI = VCC − 2.1 V; VCC = 4.5 V
∆ICC
current
to 5.5 V; IO = 0 A CP
- 85 306 µA
MR
- 110 396 µA
input capacitance
- 3.5 - pF
CI Tamb = −40 °C to +85 °C
HIGH-level input voltage
VCC = 4.5 V to 5.5 V
2.0 - - V
VIH
LOW-level input voltage
VCC = 4.5 V to 5.5 V
- - 0.8 V
VIL
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Page 10
Table 8: Static characteristics for 74HCT4040 …continued Voltages are referenced to GND (ground = 0 V). Symbol
Parameter
Conditions
Min Typ Max Unit
VOH
HIGH-level output voltage
VI = VIH or VIL IO = −20 µA; VCC = 4.5 V
4.4 - - V
IO = −4.0 mA; VCC = 4.5 V
3.84 - - V
LOW-level output voltage
VI = VIH or VIL
VOL
IO = 20 µA; VCC = 4.5 V
- - 0.1 V
IO = 4.0 mA; VCC = 4.5 V
- - 0.33 V
input leakage current
VI = VCC or GND; VCC = 5.5 V
- - 1.0 µA
ILl
quiescent supply current
VI = VCC or GND; IO = 0 A;
- - 80.0 µA
ICC
VCC = 5.5 V
additional quiescent supply
VI = VCC − 2.1 V; VCC = 4.5 V
∆ICC
current
to 5.5 V; IO = 0 A CP
- - 383 µA
MR
- - 495 µA
Tamb = −40 °C to +125 °C
HIGH-level input voltage
VCC = 4.5 V to 5.5 V
2.0 - - V
VIH
LOW-level input voltage
VCC = 4.5 V to 5.5 V
- - 0.8 V
VIL
HIGH-level output voltage
VI = VIH or VIL
VOH
IO = −20 µA; VCC = 4.5 V
4.4 - - V
IO = −4.0 mA; VCC = 4.5 V
3.7 - - V
LOW-level output voltage
VI = VIH or VIL
VOL
IO = 20 µA; VCC = 4.5 V
- - 0.1 V
IO = 4.0 mA; VCC = 4.5 V
- - 0.4 V
input leakage current
VI = VCC or GND; VCC = 5.5 V
- - 1.0 µA
ILl
quiescent supply current
VI = VCC or GND; IO = 0 A;
- - 160.0 µA
ICC
VCC = 5.5 V
additional quiescent supply
VI = VCC − 2.1 V; VCC = 4.5 V
∆ICC
current
to 5.5 V; IO = 0 A CP
- - 417 µA
MR
- - 539 µA
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Page 11
12. Dynamic characteristics
Table 9: Dynamic characteristics for type 74HC4040 GND = 0 V; tr = tf = 6 ns. For test circuit see Figure 9. Symbol
Parameter
Conditions
Min Typ Max Unit
Tamb = 25 °C tPHL, tPLH
propagation delay CP to Q0
see Figure 8 VCC = 2.0 V; CL = 50 pF
- 47 150 ns
VCC = 4.5 V; CL = 50 pF
- 17 30 ns
VCC = 5.0 V; CL = 15 pF
- 14 - ns
VCC = 6.0 V; CL = 50 pF
- 14 26 ns
see Figure 8
propagation delay Qn to Qn+1
VCC = 2.0 V; CL = 50 pF
- 28 100 ns
VCC = 4.5 V; CL = 50 pF
- 10 20 ns
VCC = 5.0 V; CL = 15 pF
- 8 - ns
VCC = 6.0 V; CL = 50 pF
- 8 17 ns
propagation delay MR to Qn
see Figure 8
tPHL
VCC =2.0 V; CL = 50 pF
- 61 185 ns
VCC = 4.5 V; CL = 50 pF
- 22 37 ns
VCC = 6.0 V; CL = 50 pF
- 18 31 ns
tTHL, tTLH
output transition time
see Figure 8 VCC = 2.0 V; CL = 50 pF
- 19 75 ns
VCC = 4.5 V; CL = 50 pF
- 7 15 ns
VCC = 6.0 V; CL = 50 pF
- 6 13 ns
clock pulse width HIGH or LOW
see Figure 8
tW
VCC = 2.0 V; CL = 50 pF
80 14 - ns
VCC = 4.5 V; CL = 50 pF
16 5 - ns
VCC = 6.0 V; CL = 50 pF
14 4 - ns
see Figure 8
master reset pulse width; HIGH
VCC = 2.0 V; CL = 50 pF
80 22 - ns
VCC = 4.5 V; CL = 50 pF
16 8 - ns
VCC = 6.0 V; CL = 50 pF
14 6 - ns
recovery time MR to CP
see Figure 8
trec
VCC = 2.0 V; CL = 50 pF
50 8 - ns
VCC = 4.5 V; CL = 50 pF
10 3 - ns
VCC = 6.0 V; CL = 50 pF
9 2 - ns
maximum operating frequency
see Figure 8
fmax
VCC = 2.0 V; CL = 50 pF
6.0 27 - MHz
VCC = 4.5 V; CL = 50 pF
30 82 - MHz
VCC = 5.0 V; CL = 15 pF
- 90 - MHz
VCC = 6.0 V; CL = 50 pF
35 98 - MHz
power dissipation capacitance
- 20 - pF
CPD
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Page 12
Table 9: Dynamic characteristics for type 74HC4040 …continued GND = 0 V; tr = tf = 6 ns. For test circuit see Figure 9. Symbol
Parameter
Conditions
Min Typ Max Unit
Tamb = −40 °C to +85 °C tPHL, tPLH
propagation delay CP to Q0
see Figure 8 VCC = 2.0 V; CL = 50 pF
- - 190 ns
VCC = 4.5 V; CL = 50 pF
- - 38 ns
VCC = 6.0 V; CL = 50 pF
- - 33 ns
see Figure 8
propagation delay Qn to Qn+1
VCC = 2.0 V; CL = 50 pF
- - 125 ns
VCC = 4.5 V; CL = 50 pF
- - 25 ns
VCC = 6.0 V; CL = 50 pF
- - 21 ns
propagation delay MR to Qn
see Figure 8
tPHL
VCC = 2.0 V; CL = 50 pF
- - 230 ns
VCC = 4.5 V; CL = 50 pF
- - 46 ns
VCC = 6.0 V; CL = 50 pF
- - 39 ns
tTHL, tTLH
output transition time
see Figure 8 VCC = 2.0 V; CL = 50 pF
- - 95 ns
VCC = 4.5 V; CL = 50 pF
- - 19 ns
VCC = 6.0 V; CL = 50 pF
- - 16 ns
clock pulse width HIGH or LOW
see Figure 8
tW
VCC = 2.0 V; CL = 50 pF
100 - - ns
VCC = 4.5 V; CL = 50 pF
20 - - ns
VCC = 6.0 V; CL = 50 pF
17 - - ns
see Figure 8
master reset pulse width; HIGH
VCC = 2.0 V; CL = 50 pF
100 - - ns
VCC = 4.5 V; CL = 50 pF
20 - - ns
VCC = 6.0 V; CL = 50 pF
17 - - ns
recovery time MR to CP
see Figure 8
trec
VCC = 2.0 V; CL = 50 pF
65 - - ns
VCC = 4.5 V; CL = 50 pF
13 - - ns
VCC = 6.0 V; CL = 50 pF
11 - - ns
maximum operating frequency
see Figure 8
fmax
VCC = 2.0 V; CL = 50 pF
4.8 - - MHz
VCC = 4.5 V; CL = 50 pF
24 - - MHz
VCC = 6.0 V; CL = 50 pF
28 - - MHz
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Page 13
Table 9: Dynamic characteristics for type 74HC4040 …continued GND = 0 V; tr = tf = 6 ns. For test circuit see Figure 9. Symbol
Parameter
Conditions
Min Typ Max Unit
Tamb = −40 °C to +125 °C tPHL, tPLH
propagation delay CP to Q0
see Figure 8 VCC = 2.0 V; CL = 50 pF
- - 225 ns
VCC = 4.5 V; CL = 50 pF
- - 45 ns
VCC = 6.0 V; CL = 50 pF
- - 38 ns
see Figure 8
propagation delay Qn to Qn+1
VCC = 2.0 V; CL = 50 pF
- - 150 ns
VCC = 4.5 V; CL = 50 pF
- - 30 ns
VCC = 6.0 V; CL = 50 pF
- - 26 ns
propagation delay MR to Qn
see Figure 8
tPHL
VCC = 2.0 V; CL = 50 pF
- - 280 ns
VCC = 4.5 V; CL = 50 pF
- - 56 ns
VCC = 6.0 V; CL = 50 pF
- - 48 ns
tTHL, tTLH
output transition time
see Figure 8 VCC = 2.0 V; CL = 50 pF
- - 110 ns
VCC = 4.5 V; CL = 50 pF
- - 22 ns
VCC = 6.0 V; CL = 50 pF
- - 19 ns
clock pulse width HIGH or LOW
see Figure 8
tW
VCC = 2.0 V; CL = 50 pF
120 - - ns
VCC = 4.5 V; CL = 50 pF
24 - - ns
VCC = 6.0 V; CL = 50 pF
20 - - ns
see Figure 8
master reset pulse width; HIGH
VCC = 2.0 V; CL = 50 pF
120 - - ns
VCC = 4.5 V; CL = 50 pF
24 - - ns
VCC = 6.0 V; CL = 50 pF
20 - - ns
recovery time MR to CP
see Figure 8
trec
VCC = 2.0 V; CL = 50 pF
75 - - ns
VCC = 4.5 V; CL = 50 pF
15 - - ns
VCC = 6.0 V; CL = 50 pF
13 - - ns
maximum operating frequency
see Figure 8
fmax
VCC = 2.0 V; CL = 50 pF
4.0 - - MHz
VCC = 4.5 V; CL = 50 pF
20 - - MHz
VCC = 6.0 V; CL = 50 pF
24 - - MHz
[1] CPD is used to determine the dynamic power dissipation (PD in µW): PD = CPD × VCC2 × fi + ∑(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; ∑(CL × VCC2 × fo) = sum of outputs; CL = output load capacitance in pF; VCC = supply voltage in V.
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Page 14
Table 10: Dynamic characteristics for type 74HCT4040 GND = 0 V; tr = tf = 6 ns. For test circuit see Figure 9. Symbol
Parameter
Conditions
Min Typ Max Unit
Tamb = 25 °C tPHL, tPLH
propagation delay CP to Q0
see Figure 8 VCC = 4.5 V; CL = 50 pF
- 19 40 ns
VCC = 5.0 V; CL = 15 pF
- 16 - ns
see Figure 8
propagation delay Qn to Qn+1
VCC = 4.5 V; CL = 50 pF
- 10 20 ns
VCC = 5.0 V; CL = 15 pF
- 8 - ns
propagation delay MR to Qn
VCC = 4.5 V; CL = 50 pF;
- 23 45 ns
tPHL
see Figure 8;
tTHL, tTLH
output transition time
VCC = 4.5 V; CL = 50 pF;
- 7 15 ns
see Figure 8;
clock pulse width HIGH or LOW
VCC = 4.5 V; CL = 50 pF;
16 7 - ns
tW
see Figure 8; VCC = 4.5 V; CL = 50 pF;
16 6 - ns
master reset pulse width; HIGH
see Figure 8;
recovery time MR to CP
VCC = 4.5 V; CL = 50 pF;
10 2 - ns
trec
see Figure 8;
maximum operating frequency
see Figure 8
fmax
VCC = 4.5 V; CL = 50 pF
30 72 - MHz
VCC = 5.0 V; CL = 15 pF
- 79 - MHz
[1] -
power dissipation capacitance
20 - pF
CPD
per package
Tamb = −40 °C to +85 °C tPHL, tPLH
propagation delay CP to Q0
VCC = 4.5 V; CL = 50 pF;
- - 50 ns
see Figure 8; VCC = 4.5 V; CL = 50 pF;
- - 25 ns
propagation delay Qn to Qn+1
see Figure 8;
propagation delay MR to Qn
VCC = 4.5 V; CL = 50 pF;
- - 56 ns
tPHL
see Figure 8;
tTHL, tTLH
output transition time
VCC = 4.5 V; CL = 50 pF;
- - 19 ns
see Figure 8;
clock pulse width HIGH or LOW
VCC = 4.5 V; CL = 50 pF;
20 - - ns
tW
see Figure 8; VCC = 4.5 V; CL = 50 pF;
20 - - ns
master reset pulse width; HIGH
see Figure 8;
recovery time MR to CP
VCC = 4.5 V; CL = 50 pF;
13 - - ns
trec
see Figure 8;
maximum operating frequency
VCC = 4.5 V; CL = 50 pF;
24 - - MHz
fmax
see Figure 8;
Tamb = −40 °C to +125 °C tPHL, tPLH
propagation delay CP to Q0
VCC = 4.5 V; CL = 50 pF;
- - 60 ns
see Figure 8; VCC = 4.5 V; CL = 50 pF;
- - 30 ns
propagation delay Qn to Qn+1
see Figure 8
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Page 15
Table 10: Dynamic characteristics for type 74HCT4040 …continued GND = 0 V; tr = tf = 6 ns. For test circuit see Figure 9. Symbol
Parameter
Conditions
Min Typ Max Unit
tPHL
propagation delay MR to Qn
VCC = 4.5 V; CL = 50 pF;
- - 68 ns
see Figure 8
tTHL, tTLH
output transition time
VCC = 4.5 V; CL = 50 pF;
- - 22 ns
see Figure 8
clock pulse width HIGH or LOW
VCC = 4.5 V; CL = 50 pF;
24 - - ns
tW
see Figure 8 VCC = 4.5 V; CL = 50 pF;
24 - - ns
master reset pulse width; HIGH
see Figure 8
recovery time MR to CP
VCC = 4.5 V; CL = 50 pF;
15 - - ns
trec
see Figure 8
maximum operating frequency
VCC = 4.5 V; CL = 50 pF;
20 - - MHz
fmax
see Figure 8
[1] CPD is used to determine the dynamic power dissipation (PD in µW): PD = CPD × VCC2 × fi + ∑(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; ∑(CL × VCC2 × fo) = sum of outputs; CL = output load capacitance in pF; VCC = supply voltage in V.
13. Waveforms

15 of 24
Page 16

16 of 24
Page 17
14. Package outline
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
SOT38-1
ME
D
A2 A
A1
L
c
e
w M
Z
b1
(e ) 1
b
MH
9
16
pin 1 index
E
1
8
0 5 10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
| UNIT | A max. | A 1 min. | A 2 max. | b | b1 | c | D(1) | E(1) | e | e1 | L | ME | MH | w | Z(1) max. |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| mm | 4.7 | 0.51 | 3.7 | 1.40 1.14 | 0.53 0.38 | 0.32 0.23 | 21.8 21.4 | 6.48 6.20 | 2.54 | 7.62 | 3.9 3.4 | 8.25 7.80 | 9.5 8.3 | 0.254 | 2.2 |
| inches | 0.19 | 0.02 | 0.15 | 0.055 0.045 | 0.021 0.015 | 0.013 0.009 | 0.86 0.84 | 0.26 0.24 | 0.1 | 0.3 | 0.15 0.13 | 0.32 0.31 | 0.37 0.33 | 0.01 | 0.087 |
Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
ISSUE DATE
VERSION
PROJECTION
IEC
JEDEC
JEITA
99-12-27
050G09
MO-001
SC-503-16
SOT38-1
03-02-13
Fig 10. Package outline SOT38-1 (DIP16)
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Page 18
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A X
c
y
HE
v M A
Z
16
9
Q
A2
A (A ) 3
A1
pin 1 index
θ Lp L
1
8
e
detail X
w M bp
0 2.5 5 mm scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
| UNIT | A max. | A1 | A2 | A3 | bp | c | D(1) | E(1) | e | HE | L | Lp | Q | v | w | y | Z(1) | θ |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| mm | 1.75 | 0.25 0.10 | 1.45 1.25 | 0.25 | 0.49 0.36 | 0.25 0.19 | 10.0 9.8 | 4.0 3.8 | 1.27 | 6.2 5.8 | 1.05 | 1.0 0.4 | 0.7 0.6 | 0.25 | 0.25 | 0.1 | 0.7 0.3 | 8o 0o |
| inches | 0 0.069 0 | .010 .004 | 0.057 0.049 | 0.01 | 0.019 0.014 | 0.0100 0.0075 | 0.39 0.38 | 0.16 0.15 | 0.05 | 0.244 0.228 | 0.041 | 0.039 0.016 | 0.028 0.020 | 0.01 | 0.01 | 0.004 | 0.028 0.012 |
Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
ISSUE DATE
VERSION
PROJECTION
IEC
JEDEC
JEITA
99-12-27
SOT109-1
076E07
MS-012
03-02-19
Fig 11. Package outline SOT109-1 (SO16)
18 of 24
Page 19
SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm
SOT338-1
D
E
A X
c
y
HE
v M A
Z
9
16
Q
A2
A (A )
A1
3
pin 1 index
θ Lp L
8
1
detail X
w M bp
e
0 2.5 5 mm scale
DIMENSIONS (mm are the original dimensions)
| UNIT | A max. | A 1 | A 2 | A 3 | bp | c | D(1) | E (1) | e | H E | L | Lp | Q | v | w | y | Z(1) | θ |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| mm | 2 | 0.21 1 0.05 1 | .80 .65 | 0.25 | 0.38 0.25 | 0.20 0.09 | 6.4 6.0 | 5.4 5.2 | 0.65 | 7.9 7.6 | 1.25 | 1.03 0.63 | 0.9 0.7 | 0.2 | 0.13 | 0.1 | 1.00 0.55 | 8o 0o |
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
ISSUE DATE
VERSION
PROJECTION
IEC
JEDEC
JEITA
99-12-27
SOT338-1
MO-150
03-02-19
Fig 12. Package outline SOT338-1 (SSOP16)
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Page 20
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
E
A
D
X
c
y
HE
v M A
Z
9
16
Q (A )
A2
3 A
A1
pin 1 index
θ Lp L
1
8
detail X
w M bp
e
0 2.5 5 mm
scale
DIMENSIONS (mm are the original dimensions)
| UNIT | A max. | A1 | A2 | A3 | bp | c | D (1) | E (2) | e | HE | L | Lp | Q | v | w | y | Z(1) | θ |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| mm | 1.1 | 0.15 0.05 | 0.95 0.80 | 0.25 | 0.30 0.19 | 0.2 0.1 | 5.1 4.9 | 4.5 4.3 | 0.65 | 6.6 6.2 | 1 | 0.75 0.50 | 0.4 0.3 | 0.2 | 0.13 | 0.1 | 0.40 0.06 | 8o 0o |
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
ISSUE DATE
VERSION
PROJECTION
IEC
JEDEC
JEITA
99-12-27
SOT403-1
MO-153
03-02-18
Fig 13. Package outline SOT403-1 (TSSOP16)
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Page 21
DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
SOT763-1
16 terminals; body 2.5 x 3.5 x 0.85 mm
A B
D
A A1
E
c
detail X
terminal 1 index area
C
terminal 1
e1
index area
y
y1 C
e
v M C A B
b
w M C
2
7
L
1
8
Eh
e
16
9
15
10
Dh
X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
| UNIT | A(1) max. | A1 | b | c | D(1) | Dh | E(1) | Eh | e | e1 | L | v | w | y | y1 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| mm | 1 | 0.05 0.00 | 0.30 0.18 | 0.2 | 3.6 3.4 | 2.15 1.85 | 2.6 2.4 | 1.15 0.85 | 0.5 | 2.5 | 0.5 0.3 | 0.1 | 0.05 | 0.05 | 0.1 |
Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
| Column 1 | Column 2 | Column 3 | Column 4 | Column 5 | Column 6 | Column 7 | Column 8 |
|---|---|---|---|---|---|---|---|
| OUTLINE VERSION | REFERENCES | EUROPEAN PROJECTION | ISSUE DATE | ||||
| IEC | JEDEC | JEITA | |||||
| SOT763-1 | - - - | MO-241 | - - - | 02-10-17 03-01-27 |
Fig 14. Package outline SOT763-1 (DHVQFN16)
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Page 22
15. Revision history
Table 11: Revision history Document ID
Release date
Data sheet
Change Doc.
Supersedes
status
notice number
20050914
Product data
- -
74HC_HCT4040_CNV_2
sheet
- The format of this data sheet has been redesigned to comply with the new presentation and
Modifications:
information standard of Philips Semiconductors
- Reference to family specifications is replaced by the actual information: Section 5 “Ordering information”, Section 7 “Pinning information”, Section 9 “Limiting values”, Section 10 “Recommended operating conditions”, Section 11 “Static characteristics”, Figure 9 “Test circuit”
- Section 14 “Package outline” (DHVQFN16) added
74HC_HCT4040_CNV_2 19901231
Product
- -
-
specification
22 of 24
Page 23
16. Data sheet status
Level Data sheet status [1] Product status [2] [3] Definition
This data sheet contains data from the objective specification for product development. Philips
I Objective data
Development
Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published
II Preliminary data
Qualification
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the
III Product data
Production
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. [3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
17. Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
18. Disclaimers
Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors
20. Contact information
customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes — Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
19. Trademarks
Notice — All referenced brands, product names, service names and trademarks are the property of their respective owners.
For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
23 of 24
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21. Contents
1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 1 5 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 6 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4 7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 Functional description . . . . . . . . . . . . . . . . . . . 5
8.1 Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8.2 Timing diagram. . . . . . . . . . . . . . . . . . . . . . . . . 6 9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6 10 Recommended operating conditions. . . . . . . . 7 11 Static characteristics. . . . . . . . . . . . . . . . . . . . . 7 12 Dynamic characteristics . . . . . . . . . . . . . . . . . 11 13 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 14 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 17 15 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 22 16 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 23
17 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 18 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 19 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 20 Contact information . . . . . . . . . . . . . . . . . . . . 23

© Koninklijke Philips Electronics N.V. 2005 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Date of release: 14 September 2005 Document number: 74HC_HCT4040_3
Published in The Netherlands