74HCT2G66

74HC2G66 NXP

Document overview

• PDF pages: 21

Technical content

Page 1

1. General description

74HC2G66 and 74HCT2G66 are high-speed Si-gate CMOS devices. They are dual single-pole single-throw analog switches. Each switch has two input/output pins (nY and nZ) and an active HIGH enable input pin (nE). When pin nE is LOW, the analog switch is turned off.

2. Features and benefits

„ Wide supply voltage range from 2.0 V to 10.0 V for 74HC2G66 „ Very low ON resistance: ‹ 41 Ω (typ.) at VCC = 4.5 V ‹ 30 Ω (typ.) at VCC = 6.0 V ‹ 21 Ω (typ.) at VCC = 9.0 V „ High noise immunity „ Low power dissipation „ 25 mA continuous switch current „ Multiple package options „ ESD protection: ‹ HBM JESD22-A114F exceeds 2000 V ‹ MM JESD22-A115-A exceeds 200 V „ Specified from −40 °C to +85 °C and −40 °C to +125 °C

3. Ordering information

Table 1. Ordering information

74HC2G66DP

−40 °C to +125 °C

TSSOP8

74HCT2G66DP 74HC2G66DC

−40 °C to +125 °C

VSSOP8

74HCT2G66DC 74HC2G66GD

−40 °C to +125 °C

XSON8U

74HCT2G66GD

plastic thin shrink small outline package; 8

SOT505-2

leads; body width 3 mm; lead length 0.5 mm

plastic very thin shrink small outline package; 8 SOT765-1 leads; body width 2.3 mm

plastic extremely thin small outline package; no SOT996-2 leads; 8 terminals; UTLP based; body 3 × 2 × 0.5 mm

Page 2

4. Marking

Table 2. Marking codes Type number

Marking

74HC2G66DP

H66

74HCT2G66DP

T66

74HC2G66DC

H66

74HCT2G66DC

T66

74HC2G66GD

H66

74HCT2G66GD

T66

5. Functional diagram

6. Pinning information

6.1 Pinning

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Page 3

6.2 Pin description

Table 3. Pin description Symbol

Pin

1Y, 2Y

1, 5

1Z, 2Z

2, 6

GND

4

1E, 2E

7, 3 8

VCC

7. Functional description

Table 4. Function table[1] Input nE L H

[1] H = HIGH voltage level; L = LOW voltage level.

8. Limiting values

Table 5. Limiting values

Description

independent input or output independent input or output ground (0 V) enable input (active HIGH) supply voltage

Switch OFF ON

In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol

Parameter

Conditions

Min Max Unit

supply voltage

−0.5 +11.0 V

VCC

[1] -

VI < −0.5 V or VI > VCC + 0.5 V

input clamping current

±20 mA

IIK

[1] -

VI < −0.5 V or VI > VCC + 0.5 V

switch clamping current

±20 mA

ISK

VSW > −0.5 V or VSW < VCC + 0.5 V

switch current

• ±20 mA

ISW

supply current

• 30 mA

ICC

ground current

−30 - mA

IGND

storage temperature

−65 +150 °C

Tstg

Tamb = −40 °C to +125 °C

total power dissipation

Ptot

[2] -

300 mW

per package

[2] -

100 mW

per switch

[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] For TSSOP8 packages above 55 °C the value of Ptot derates linearly with 2.5 mW/K. For VSSOP8 packages above 110 °C the value of Ptot derates linearly with 8.0 mW/K. For XSON8U package: above 118 °C the value of Ptot derates linearly with 7.8 mW/K.

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Page 4

9. Recommended operating conditions

Table 6. Recommended operating conditions Voltages are referenced to GND (ground = 0 V).[1]

supply voltage

2.0 5.0 10.0 4.5 5.0 5.5 V

VCC input voltage

0 - VCC 0 - VCC V

VI output voltage

0 - VCC 0 - VCC V

VO switch voltage

0 - VCC 0 - VCC V

VSW ambient temperature

−40 +25 +125 −40 +25 +125 °C

Tamb

VCC = 2.0 V

• - 625 - - - ns/V

Δt/ΔV input transition rise and fall rate

VCC = 4.5 V

• 1.67 139 - 1.67 139 ns/V

VCC = 6.0 V

• - 83 - - - ns/V

VCC = 10.0 V

• - 35 - - - ns/V

[1] To avoid drawing VCC current out of pin nZ, when switch current flows in pin nY, the voltage drop across the bidirectional switch must not exceed 0.4 V. If the switch current flows into pin nZ, no VCC current will flow out of terminal nY. In this case there is no limit for the voltage drop across the switch, but the voltage at pins nY and nZ may not exceed VCC or GND.

10. Static characteristics

Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V).

74HC2G66 HIGH-level

VCC = 2.0 V

1.5 1.2 - 1.5 - V

VIH input voltage

VCC = 4.5 V

3.15 2.4

• 3.15 - V

VCC = 6.0 V

4.2 3.2 - 4.2 - V

VCC = 9.0 V

6.3 4.7 - 6.3 - V

LOW-level

VCC = 2.0 V

• 0.8 0.5 - 0.5 V

VIL input voltage

VCC = 4.5 V

• 2.1 1.35
• 1.35 V

VCC = 6.0 V

• 2.8 1.8 - 1.8 V

VCC = 9.0 V

• 4.3 2.7 - 2.7 V

input leakage current

nE; VI = VCC or GND

II

VCC = 6.0 V

• - ±0.1 - ±0.1 μA

VCC = 9.0 V

• - ±0.2 - ±0.2 μA

OFF-state

nY or nZ; VCC = 9.0 V; see Figure 5

• 0.1 1.0 - 1.0 μA

IS(OFF) leakage current ON-state

nY or nZ; VCC = 9.0 V; see Figure 6

• 0.1 1.0 - 1.0 μA

IS(ON) leakage current supply current

nE, nY and nZ = VCC or GND

ICC

VCC = 6.0 V

• - 10 - 20 μA

VCC = 9.0 V

• - 20 - 40 μA

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Table 7. Static characteristics …continued Voltages are referenced to GND (ground = 0 V).

CI input capacitance

• 3.5 - - - pF

power dissipation

• 9 - - - pF

CPD capacitance ON-state capacitance

• 8 - - - pF

CS(ON)

74HCT2G66

HIGH-level

VCC = 4.5 V to 5.5 V

2.0 1.6 - 2.0 - V

VIH input voltage LOW-level

VCC = 4.5 V to 5.5 V

• 1.2 0.8 - 0.8 V

VIL input voltage II input leakage current

nE; VI = VCC or GND; VCC = 5.5 V

• - ±1.0 - ±1.0 μA

OFF-state

nY or nZ; VCC = 5.5 V; see Figure 5

• 0.1 1.0 - 1.0 μA

IS(OFF) leakage current ON-state

nY or nZ; VCC = 5.5 V; see Figure 6

• 0.1 1.0 - 1.0 μA

IS(ON) leakage current

• - 10 - 20 μA

supply current

nE, nY and nZ = VCC or GND;

ICC

VCC = 4.5 V to 5.5 V

ΔICC additional supply

nE = VCC − 2.1 V; IO = 0 A;

• - 375 - 410 μA

current

VCC = 4.5 V to 5.5 V;

input capacitance

• 3.5 - - - pF

CI power dissipation

• 9 - - - pF

CPD capacitance CS(ON) ON-state capacitance

• 8 - - - pF

[1] Typical values are measured at Tamb = 25 °C.

10.1 Test circuits

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10.2 ON resistance

Table 8. ON resistance for 74HC2G66 and 74HCT2G66 At recommended operating conditions; voltages are referenced to GND (ground 0 V); for graph see Figure 8.

74HC2G66[1] RON(peak) ON resistance (peak)

VI = GND to VCC; see Figure 7 and 8 ISW = 0.1 mA; VCC = 2.0 V

• 250 - - - Ω

ISW = 1.0 mA; VCC = 4.5 V

• 41 118 - 142 Ω

ISW = 1.0 mA; VCC = 6.0 V

• 30 105 - 126 Ω

ISW = 1.0 mA; VCC = 9.0 V

• 21 88 - 105 Ω

ON resistance (rail)

VI = GND; see Figure 7 and 8

RON(rail)

ISW = 0.1 mA; VCC = 2.0 V

• 65 - - - Ω

ISW = 1.0 mA; VCC = 4.5 V

• 28 95 - 115 Ω

ISW = 1.0 mA; VCC = 6.0 V

• 22 82 - 100 Ω

ISW = 1.0 mA; VCC = 9.0 V

• 18 70 - 80 Ω

VI = VCC; see Figure 7 and 8 ISW = 0.1 mA; VCC = 2.0 V

• 65 - - - Ω

ISW = 1.0 mA; VCC = 4.5 V

• 31 106 - 128 Ω

ISW = 1.0 mA; VCC = 6.0 V

• 23 94 - 113 Ω

ISW = 1.0 mA; VCC = 9.0 V

• 19 78 - 95 Ω

ON resistance mismatch

VI = VCC to GND; see Figure 7 and 8

ΔRON between channels

VCC = 4.5 V

• 5 - - - Ω

VCC = 6.0 V

• 4 - - - Ω

VCC = 9.0 V

• 3 - - - Ω

74HCT2G66

ON resistance (peak)

VI = GND to VCC; see Figure 7 and 8

RON(peak)

ISW = 1.0 mA; VCC = 4.5 V

• 41 118 - 142 Ω

ON resistance (rail)

VI = GND; see Figure 7 and 8

RON(rail)

ISW = 1.0 mA; VCC = 4.5 V

• 28 95 - 115 Ω

VI = VCC; see Figure 7 and 8 ISW = 1.0 mA; VCC = 4.5 V

• 31 106 - 128 Ω

ON resistance mismatch

VI = VCC to GND; see Figure 7 and 8

ΔRON between channels

VCC = 4.5 V

• 5 - - - Ω

[1] At supply voltages approaching 2 V, the ON resistance becomes extremely non-linear. Therefore it is recommended that these devices be used to transmit digital signals only, when using this supply voltage. [2] Typical values are measured at Tamb = 25 °C.

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10.3 ON resistance test circuit and graphs

11. Dynamic characteristics

Table 9. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); For test circuit see Figure 11.

Symbol Parameter

Conditions

Unit

74HC2G66

[2]

propagation delay nY to nZ or nZ to nY; RL = ∞ Ω; tpd

see Figure 9 VCC = 2.0 V

• 6.5 65 - 80 ns

VCC = 4.5 V

• 2 13 - 15 ns

VCC = 6.0 V

• 1.5 11 - 14 ns

VCC = 9.0 V

• 1.2 10 - 12 ns

[2]

enable time

nE to nY or nZ; see Figure 10

ten

VCC = 2.0 V

• 40 125 - 150 ns

VCC = 4.5 V

• 12 29 - 30 ns

VCC = 6.0 V

• 10 21 - 26 ns

VCC = 9.0 V

• 7 16 - 20 ns

[2]

disable time

nE to nY or nZ; see Figure 10

tdis

VCC = 2.0 V

• 21 145 - 175 ns

VCC = 4.5 V

• 12 29 - 35 ns

VCC = 6.0 V

• 11 28 - 33 ns

VCC = 9.0 V

• 10 23 - 27 ns

[3]

power dissipation

VI = GND to VCC

• 9 - - - pF

CPD capacitance

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Page 8

Table 9. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V); For test circuit see Figure 11. Symbol Parameter

Conditions

74HCT2G66

propagation delay nY to nZ or nZ to nY; RL = ∞ Ω; tpd

see Figure 9 VCC = 4.5 V

enable time

nE to nY or nZ; see Figure 10

ten

VCC = 4.5 V

disable time

nE to nY or nZ; see Figure 10

tdis

VCC = 4.5 V

power dissipation

VI = GND to VCC − 1.5 V

CPD capacitance

[1] All typical values are measured at Tamb = 25 °C. [2] tpd is the same as tPLH and tPHL. ten is the same as tPZL and tPZH. tdis is the same as tPLZ and tPHZ. [3] CPD is used to determine the dynamic power dissipation PD (μW). PD = CPD × VCC2 × fi + Σ((CL × CSW) × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; CSW = maximum switch capacitance in pF (see Table 7); VCC = supply voltage in volts; Σ((CL × CSW) × VCC2 × fo) = sum of outputs.

11.1 Waveforms and test circuit

−40 °C to +85 °C

−40 °C to +125 °C Unit

Min Typ[1] Max

Min Max

[2]

• 2 15 - 18 ns

[2]

• 13 30 - 36 ns

[2]

• 13 44 - 53 ns

[3] - 9 - - - pF

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Table 10. Measurement points

74HC2G66

0.5VCC

0.5VCC

VOL + 10 %

VOH − 10 %

VOL + 10 %

VOH − 10 %

74HCT2G66

1.3 V

1.3 V

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Page 10

Table 11. Test data

74HC2G66

GND to VCC

6 ns

50 pF

1 kΩ

open

GND

VCC

74HCT2G66 GND to 3 V 6 ns

50 pF

1 kΩ

open

GND

VCC

[1] There is no constraint on tr, tf with a 50 % duty factor when measuring fmax.

11.2 Additional dynamic characteristics

Table 12. Additional dynamic characteristics for 74HC2G66 and 74HCT2G66 GND = 0 V; tr = tf = 6.0 ns; CL = 50 pF; unless otherwise specified. All typical values are measured at Tamb = 25 °C. Symbol Parameter

Conditions

Min

Typ

Max Unit

fi = 1 kHz; RL = 10 kΩ; see Figure 12

%

THD total harmonic distortion

VCC = 4.5 V; VI = 4.0 V (p-p)

-

0.04

• %

VCC = 9.0 V; VI = 8.0 V (p-p)

-

0.02

• %

fi = 10 kHz; RL = 10 kΩ; see Figure 12 VCC = 4.5 V; VI = 4.0 V (p-p)

-

0.12

• %

VCC = 9.0 V; VI = 8.0 V (p-p)

-

0.06

• %

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Table 12. Additional dynamic characteristics for 74HC2G66 and 74HCT2G66 …continued GND = 0 V; tr = tf = 6.0 ns; CL = 50 pF; unless otherwise specified. All typical values are measured at Tamb = 25 °C. Symbol Parameter

Conditions

Min

Typ

Max Unit

f(−3dB) −3 dB frequency

RL = 50 Ω; CL = 10 pF;

response

see Figure 13 and 14 VCC = 4.5 V

-

180

• MHz

VCC = 9.0 V

-

200

• MHz

isolation (OFF-state)

RL = 600 Ω; fi = 1 MHz;

αiso

see Figure 15 and 16 VCC = 4.5 V

-

−50

• dB

VCC = 9.0 V

-

−50

• dB

crosstalk voltage

between digital input and switch (peak

Vct

to peak value); RL = 600 Ω; fi = 1 MHz; see Figure 17 VCC = 4.5 V

-

110

• mV

VCC = 9.0 V

-

220

• mV

between switches; RL = 600 Ω;

Xtalk crosstalk

fi = 1 MHz; see Figure 18 VCC = 4.5 V

-

−60

• dB

VCC = 9.0 V

-

−60

• dB

11.3 Test circuits and graphs

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12. Package outline

TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm

SOT505-2

D

E

A X

c

HE

v M A

y

Z

5

8

A2 A

(A3)

A1

pin 1 index

θ Lp L

1

4

detail X

w M

e bp

0

2.5

5 mm

scale

DIMENSIONS (mm are the original dimensions)

Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

ISSUE DATE

VERSION

PROJECTION

IEC

JEDEC

JEITA

02-01-16

SOT505-2

• - -

Fig 19. Package outline SOT505-2 (TSSOP8)

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VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm

SOT765-1

D

E

A X

c

y

HE

v M A

Z

5

8

Q

A2 A A1

(A3)

pin 1 index

θ Lp L

1

4

detail X

e

w M bp

0

2.5

5 mm

scale

DIMENSIONS (mm are the original dimensions)

Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

ISSUE DATE

VERSION

PROJECTION

IEC

JEDEC

JEITA

02-06-07

SOT765-1

MO-187

Fig 20. Package outline SOT765-1 (VSSOP8)

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XSON8U: plastic extremely thin small outline package; no leads;

SOT996-2

8 terminals; UTLP based; body 3 x 2 x 0.5 mm

B A

D

A

E

A1

detail X

terminal 1 index area

e1

C

C A B v M b e

L1

y

y1

w M C

C

1

4

L2

L

8

5

X

0 1 2 mm

scale

DIMENSIONS (mm are the original dimensions)

Fig 21. Package outline SOT996-2 (XSON8U)

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13. Abbreviations

Table 13. Abbreviations Acronym

Description

CMOS

Complementary Metal-Oxide Semiconductor

ESD

ElectroStatic Discharge

HBM

Human Body Model

MM

Machine Model

TTL

Transistor-Transistor Logic

DUT

Device Under Test

14. Revision history

Table 14. Revision history Document ID

Release date

Data sheet status

Change notice

Supersedes

20100402

-

74HC_HCT2G66_5

• Added type number 74HC2G66GD and 74HCT2G66GD (XSON8U package)

Modifications: 74HC_HCT2G66_5

20090126

-

74HC_HCT2G66_4

• The format of this data sheet has been redesigned to comply with the new identity

Modifications:

guidelines of NXP Semiconductors.

• Legal texts have been adapted to the new company name where appropriate.
• Table 1 “Ordering information” and Section 12 “Package outline” package SOT765-1 added.
• Quick Reference Data and Soldering sections removed.
• Section 2 “Features and benefits” updated.

74HC_HCT2G66_4

20040519

Product specification

-

74HC_HCT2G66_3

20031126

Product specification

-

74HC_HCT2G66_2

20030808

Product specification

-

74HC_HCT2G66_1

20030625

Product specification

-

74HC_HCT2G66_3 74HC_HCT2G66_2 74HC_HCT2G66_1 -

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15. Legal information

15.1 Data sheet status

Document status[1][2]

Product status[3]

Definition This document contains data from the objective specification for product development.

Objective [short] data sheet

Development

This document contains data from the preliminary specification.

Preliminary [short] data sheet Qualification

This document contains the product specification.

Product [short] data sheet

Production

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.

15.2 Definitions

Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.

15.3 Disclaimers

Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use in automotive applications — This NXP

Semiconductors product has been qualified for use in automotive applications. The product is not designed, authorized or warranted to be

suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the

specified use without further testing or modification. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on a weakness or default in the customer application/use or the application/use of customer’s third party customer(s) (hereinafter both referred to as “Application”). It is customer’s sole responsibility to check whether the NXP Semiconductors product is suitable and fit for the Application planned. Customer has to do all necessary testing for the Application in order to avoid a default of the Application and the product. NXP Semiconductors does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.

15.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.

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16. Contact information

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com

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17. Contents

1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information. . . . . . . . . . . . . . . . . . . . . 1 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 3 8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3

9 Recommended operating conditions. . . . . . . . 4 10 Static characteristics. . . . . . . . . . . . . . . . . . . . . 4 10.1 Test circuits. . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 10.2 ON resistance. . . . . . . . . . . . . . . . . . . . . . . . . . 6 10.3 ON resistance test circuit and graphs. . . . . . . . 7 11 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 11.1 Waveforms and test circuit . . . . . . . . . . . . . . . . 8 11.2 Additional dynamic characteristics . . . . . . . . . 10 11.3 Test circuits and graphs . . . . . . . . . . . . . . . . . 11 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15 13 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 18

14 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 18 15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 19 15.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 19 15.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 15.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 15.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19 16 Contact information. . . . . . . . . . . . . . . . . . . . . 20 17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.

© NXP B.V. 2010.

All rights reserved.

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 2 April 2010 Document identifier: 74HC_HCT2G66_6