74HCT27DB

74HC27 NXP

Document overview

• PDF pages: 16

Technical content

Page 1

1. General description

The 74HC27; 74HCT27 is a high-speed Si-gate CMOS device and is pin compatible with Low-Power Schottky TTL (LSTTL).

The 74HC27; 74HCT27 provides the 3-input NOR function.

2. Features

I Multiple package options I Complies with JEDEC standard no. 7A I ESD protection: N HBM JESD22-A114E exceeds 2000 V N MM JESD22-A115-A exceeds 200 V I Specified from −40 °C to +85 °C and from −40 °C to +125 °C

3. Ordering information

Table 1. Ordering information

plastic dual in-line package; 14 leads (300 mil)

74HC27N

−40 °C to +125 °C DIP14

SOT27-1

plastic small outline package; 14 leads; body width

74HC27D

−40 °C to +125 °C SO14

SOT108-1

3.9 mm plastic shrink small outline package; 14 leads; body width

74HC27DB

−40 °C to +125 °C SSOP14

SOT337-1

5.3 mm

74HC27PW −40 °C to +125 °C TSSOP14 plastic thin shrink small outline package; 14 leads; body

SOT402-1

width 4.4 mm

−40 °C to +125 °C DHVQFN14 plastic dual in-line compatible thermal enhanced very thin

SOT762-1

74HC27BQ

quad flat package; no leads; 14 terminals; body 2.5 × 3 × 0.85 mm plastic dual in-line package; 14 leads (300 mil)

74HCT27N

−40 °C to +125 °C DIP14

SOT27-1

plastic small outline package; 14 leads; body width

74HCT27D

−40 °C to +125 °C SO14

SOT108-1

3.9 mm

Page 2

Table 1. Ordering information …continued

plastic shrink small outline package; 14 leads; body width

74HCT27DB −40 °C to +125 °C SSOP14

SOT337-1

5.3 mm

74HCT27PW −40 °C to +125 °C TSSOP14 plastic thin shrink small outline package; 14 leads; body

SOT402-1

width 4.4 mm

74HCT27BQ −40 °C to +125 °C DHVQFN14 plastic dual in-line compatible thermal enhanced very thin

SOT762-1

quad flat package; no leads; 14 terminals; body 2.5 × 3 × 0.85 mm

4. Functional diagram

2 of 16

Page 3

5. Pinning information

5.1 Pinning

5.2 Pin description

Table 2. Pin description Symbol

Pin

Description

1A

1

data input

1B

2

data input

2A

3

data input

2B

4

data input

2C

5

data input

2Y

6

data output

GND

7

ground (0 V)

3Y

8

data output

3A

9

data input

3B

10

data input

3C

11

data input

1Y

12

data output

1C

13

data input

14

supply voltage

VCC

3 of 16

Page 4

6. Functional description

Table 3. Function table[1]

L

L

L

H

X

X

H

L

X

H

X

L

H

X

X

L

[1] H = HIGH voltage level; L = LOW voltage level; X = don’t care.

7. Limiting values

Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol

Parameter

Conditions

Min Max Unit

supply voltage

−0.5 +7 V

VCC

[1] -

input clamping current

VI < −0.5 V or VI > VCC + 0.5 V

±20 mA

IIK

[1] -

output clamping current

VO < −0.5 V or VO > VCC + 0.5 V

±20 mA

IOK

output current

−0.5 V < VO < VCC + 0.5 V

• ±25 mA

IO

supply current

• 50 mA

ICC

ground current

−50 - mA

IGND

storage temperature

−65 +150 °C

Tstg

[2]

total power dissipation

Ptot

DIP14 package

• 750 mW

SO14, (T)SSOP14 and

• 500 mW

DHVQFN14 packages

[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] For DIP14 package: Ptot derates linearly with 12 mW/K above 70 °C. For SO14 package: Ptot derates linearly with 8 mW/K above 70 °C. For (T)SSOP14 packages: Ptot derates linearly with 5.5 mW/K above 60 °C. For DHVQFN14 packages: Ptot derates linearly with 4.5 mW/K above 60 °C.

8. Recommended operating conditions

Table 5. Recommended operating conditions Symbol

Parameter

Conditions

Min Typ Max Unit

Type 74HC27

supply voltage

2.0 5.0 6.0 V

VCC

input voltage

0 - VCC V

VI

output voltage

0 - VCC V

VO

4 of 16

Page 5

Table 5. Recommended operating conditions …continued Symbol

Parameter

Conditions

Min Typ Max Unit

tr, tf

input rise and fall times

VCC = 2.0 V

• - 1000 ns

VCC = 4.5 V

• 6.0 500 ns

VCC = 6.0 V

• - 400 ns

ambient temperature

−40 - +125 °C

Tamb Type 74HCT27

supply voltage

4.5 5.0 5.5 V

VCC

input voltage

0 - VCC V

VI

output voltage

0 - VCC V

VO tr, tf

input rise and fall times

VCC = 4.5 V

• 6.0 500 ns

ambient temperature

−40 - +125 °C

Tamb

9. Static characteristics

Table 6. Static characteristics type 74HC27; 74HCT27 At recommended operating conditions; voltages are referenced to GND (ground = 0 V).

74HC27 HIGH-level

VCC = 2.0 V

1.5 1.2 - 1.5 - 1.5 - V

VIH input voltage

VCC = 4.5 V

3.15 2.4 - 3.15 - 3.15 - V

VCC = 6.0 V

4.2 3.2 - 4.2 - 4.2 - V

LOW-level

VCC = 2.0 V

• 0.8 0.5
• 0.5 - 0.5 V

VIL input voltage

VCC = 4.5 V

• 2.1 1.35
• 1.35 - 1.35 V

VCC = 6.0 V

• 2.8 1.8
• 1.8 - 1.8 V

HIGH-level

VI = VIH or VIL

VOH output voltage

IO = −20 µA; VCC = 2.0 V

1.9 2.0 - 1.9 - 1.9 - V

IO = −20 µA; VCC = 4.5 V

4.4 4.5 - 4.4 - 4.4 - V

IO = −20 µA; VCC = 6.0 V

5.9 6.0 - 5.9 - 5.9 - V

IO = −4.0 mA; VCC = 4.5 V

3.98 4.32 -

3.84 - 3.7 - V

IO = −5.2 mA; VCC = 6.0 V

5.48 5.81 -

5.34 - 5.2 - V

LOW-level

VI = VIH or VIL

VOL output voltage

IO = 20 µA; VCC = 2.0 V

• 0 0.1 - 0.1 - 0.1 V

IO = 20 µA; VCC = 4.5 V

• 0 0.1 - 0.1 - 0.1 V

IO = 20 µA; VCC = 6.0 V

• 0 0.1 - 0.1 - 0.1 V

IO = 4.0 mA; VCC = 4.5 V

• 0.15 0.26
• 0.33 - 0.4 V

IO = 5.2 mA; VCC = 6.0 V

• 0.16 0.26
• 0.33 - 0.4 V

input leakage

VI = VCC or GND;

• - ±0.1
• ±1.0 - ±1.0 µA

II current

VCC = 6.0 V

supply current

VI = VCC or GND; IO = 0 A;

• - 2.0 - 20 - 40 µA

ICC

VCC = 6.0 V

input

• 3.5 - - - - - pF

CI capacitance

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Page 6

Table 6. Static characteristics type 74HC27; 74HCT27 …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V).

74HCT27 HIGH-level

VCC = 4.5 V to 5.5 V

2.0 1.6 - 2.0 - 2.0 - V

VIH input voltage LOW-level

VCC = 4.5 V to 5.5 V

• 1.2 0.8
• 0.8 - 0.8 V

VIL input voltage HIGH-level

VI = VIH or VIL; VCC = 4.5 V

VOH output voltage

IO = −20 µA

4.4 4.5 - 4.4 - 4.4 - V

IO = −4.0 mA

3.98 4.32 -

3.84 - 3.7 - V

LOW-level

VI = VIH or VIL; VCC = 4.5 V

VOL output voltage

IO = 20 µA

• 0 0.1 - 0.1 - 0.1 V

IO = 4.0 mA

• 0.16 0.26
• 0.33 - 0.4 V

input leakage

VI = VCC or GND;

• - ±0.1
• ±1.0 - ±1.0 µA

II current

VCC = 5.5 V

supply current

VI = VCC or GND;

• - 2.0 - 20 - 40 µA

ICC

VCC = 5.5 V; IO = 0 A

additional

per input pin;

∆ICC supply current VI = VCC − 2.1 V;

other inputs at VCC or GND; VCC = 4.5 V to 5.5 V; IO = 0 A nA, nB or nC inputs

• 150 540
• 675 - 735 µA

input

• 3.5 - - - - - pF

CI capacitance

10. Dynamic characteristics

Table 7. Dynamic characteristics type 74HC27; 74HCT27 GND = 0 V; for load circuit see Figure 7.

74HC27

[1]

propagation delay nA, nB, nC to nY; see Figure 6 tpd

VCC = 2.0 V

• 28 90 115 135 ns

VCC = 4.5 V

• 10 18 23 27 ns

VCC = 5.0 V; CL = 15 pF

• 8 - - - ns

VCC = 6.0 V

• 8 15 20 23 ns

[2]

transition time

see Figure 6

tt

VCC = 2.0 V

• 19 75 95 110 ns

VCC = 4.5 V

• 7 15 19 22 ns

VCC = 6.0 V

• 6 13 16 19 ns

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Page 7

Table 7. Dynamic characteristics type 74HC27; 74HCT27 GND = 0 V; for load circuit see Figure 7.

[3]

CPD power dissipation

per package; VI = GND to VCC

• 24 - - - pF

capacitance 74HCT27

[1]

propagation delay nA, nB, nC to nY; see Figure 6 tpd

VCC = 4.5 V

• 12 21 26 32 ns

VCC = 5.0 V; CL = 15 pF

• 10 - - - ns

[2]

transition time

VCC = 4.5 V; see Figure 6

• 7 15 19 22 ns

tt

[3]

power dissipation per package;

• 30 - - - pF

CPD capacitance

VI = GND to VCC − 1.5 V

[1] tpd is the same as tPHL and tPLH. [2] tt is the same as tTHL and tTLH. [3] CPD is used to determine the dynamic power dissipation (PD in µW): PD = CPD × VCC2 × fi × N + ∑ (CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; ∑ (CL × VCC2 × fo) = sum of outputs.

11. Waveforms

Table 8. Measurement points

74HC27

0.5VCC

0.5VCC

0.1VCC

0.9VCC

74HCT27

1.3 V

1.3 V

0.1VCC

0.9VCC

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Page 8

Table 9. Test data

74HC27

VCC

6 ns

15 pF, 50 pF

1 kΩ

open

74HCT27

3 V

6 ns

15 pF, 50 pF

1 kΩ

open

8 of 16

Page 9

12. Package outline

DIP14: plastic dual in-line package; 14 leads (300 mil)

SOT27-1

ME

D

A2 A

A1

L

c

e

w M

Z

b1

(e ) 1

b

MH

8

14

pin 1 index

E

1

7

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

Fig 8. Package outline SOT27-1 (DIP14)

9 of 16

Page 10

SO14: plastic small outline package; 14 leads; body width 3.9 mm

SOT108-1

D

E

A X

c

y

HE

v M A

Z

8

14

Q

A2

A (A ) 3

A1

pin 1 index

θ Lp L

1

7

e

detail X

w M bp

0 2.5 5 mm scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

Fig 9. Package outline SOT108-1 (SO14)

10 of 16

Page 11

SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm

SOT337-1

D

E

A X

c

y

HE

v M A

Z

8

14

Q

A2

A (A )

A1

3

pin 1 index

θ Lp L

7

1

detail X

w M bp

e

0 2.5 5 mm scale

DIMENSIONS (mm are the original dimensions)

Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

ISSUE DATE

VERSION

PROJECTION

IEC

JEDEC

JEITA

99-12-27

SOT337-1

MO-150

03-02-19

Fig 10. Package outline SOT337-1 (SSOP14)

11 of 16

Page 12

TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm

SOT402-1

E

A

D

X

c

y

HE

v M A

Z

8

14

Q (A )

A2

3 A

A1

pin 1 index

θ Lp L

1

7

detail X

w M bp

e

0 2.5 5 mm

scale

DIMENSIONS (mm are the original dimensions)

Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

ISSUE DATE

VERSION

PROJECTION

IEC

JEDEC

JEITA

99-12-27

SOT402-1

MO-153

03-02-18

Fig 11. Package outline SOT402-1 (TSSOP14)

12 of 16

Page 13

DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;

SOT762-1

14 terminals; body 2.5 x 3 x 0.85 mm

B A

D

A A1

E

c

detail X

terminal 1 index area

C

terminal 1

e1

index area

y

y1 C

e

v M C A B

b

w M C

2

6

L

1

7

Eh

e

14

8

13

9 Dh

X

0

2.5

5 mm

scale

DIMENSIONS (mm are the original dimensions)

Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

Fig 12. Package outline SOT762-1 (DHVQFN14)

13 of 16

Page 14

13. Abbreviations

Table 10. Abbreviations Acronym

Description

Complementary Metal Oxide Semiconductor

CMOS DUT

Device Under Test

ESD

ElectroStatic Discharge

HBM

Human Body Model

MM

Machine Model

TTL

Transistor-Transistor Logic

14. Revision history

Table 11. Revision history Document ID

Release date Data sheet status

Change notice Supersedes

20080107

-

74HC_HCT27_CNV_2

• The format of this data sheet has been redesigned to comply with the new identity

Modifications:

guidelines of NXP Semiconductors.

• Legal texts have been adapted to the new company name where appropriate.
• Added type number 74HC27BQ and 74HCT27BQ (DHVQFN14 package)

Product specification

74HC_HCT27_CNV_2

19970828

-

-

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Page 15

15. Legal information

15.1 Data sheet status

Document status[1][2]

Product status[3]

Definition This document contains data from the objective specification for product development.

Objective [short] data sheet

Development

This document contains data from the preliminary specification.

Preliminary [short] data sheet Qualification

This document contains the product specification.

Product [short] data sheet

Production

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.

15.2 Definitions

Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.

15.3 Disclaimers

General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or

16. Contact information

For additional information, please visit: http://www.nxp.com

malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of

any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

15.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.

For sales office addresses, send an email to: salesaddresses@nxp.com

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Page 16

17. Contents

1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Functional description . . . . . . . . . . . . . . . . . . . 4 7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Recommended operating conditions. . . . . . . . 4

9 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 10 Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 13 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 14 14 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 14 15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15 15.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15 15.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 15.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

15.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15 16 Contact information. . . . . . . . . . . . . . . . . . . . . 15 17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.

© NXP B.V. 2008.

All rights reserved.

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 7 January 2008 Document identifier: 74HC_HCT27_3