74HCT273DB

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Document overview

• PDF pages: 21

Technical content

Page 1

1. General description

The 74HC273; 74HCT273 is an octal positive-edge triggered D-type flip-flop. The device features clock (CP) and master reset (MR) inputs. The outputs Qn will assume the state of their corresponding Dn inputs that meet the set-up and hold time requirements on the LOW-to-HIGH clock (CP) transition. A LOW on MR forces the outputs LOW independently of clock and data inputs. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC.

2. Features and benefits

 Input levels:  For 74HC273: CMOS level  For 74HCT273: TTL level  Common clock and master reset  Eight positive edge-triggered D-type flip-flops  Complies with JEDEC standard no. 7A  ESD protection:  HBM JESD22-A114F exceeds 2000 V  MM JESD22-A115-A exceeds 200 V.  Multiple package options  Specified from 40 C to +85 C and from 40 C to +125 C

3. Ordering information

Table 1. Ordering information

plastic dual in-line package; 20 leads (300 mil)

74HC273N

40 C to +125 C DIP20

SOT146-1

74HCT273N

plastic small outline package; 20 leads; body width 7.5 mm SOT163-1

74HC273D

40 C to +125 C SO20

74HCT273D

plastic shrink small outline package; 20 leads; body width

74HC273DB 40 C to +125 C SSOP20

SOT339-1

5.3 mm

74HCT273DB

Page 2

Table 1. Ordering information …continued

74HC273PW 40 C to +125 C TSSOP20 plastic thin shrink small outline package; 20 leads; body

SOT360-1

width 4.4 mm

74HCT273PW 74HC273BQ 40 C to +125 C DHVQFN20 plastic dual in-line compatible thermal enhanced very thin

SOT764-1

quad flat package; no leads; 20 terminals;

74HCT273BQ

body 2.5  4.5  0.85 mm

4. Functional diagram

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Page 4

5. Pinning information

5.1 Pinning

5.2 Pin description

Table 2. Pin description Symbol

Pin 1

MR Q0, Q1, Q2, Q3, Q4, Q5, Q6, Q7

2, 5, 6, 9, 12, 15, 16, 19

D0, D1, D2, D3, D4, D5, D6, D7

3, 4, 7, 8, 13, 14, 17, 18

GND

10

CP

11 20

VCC

Description

master reset input (active LOW) flip-flop output data input ground (0 V) clock input (LOW-to-HIGH, edge-triggered) supply voltage

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Page 5

6. Functional description

Table 3. Function table[1]

reset (clear)

L

X

X

L

load “1”

H

h

H



load “0”

H

l

L



[1] H = HIGH voltage level; h = HIGH voltage level one set-up time prior to the LOW-to-HIGH clock transition; L = LOW voltage level; l = LOW voltage level one set-up time prior to the LOW-to-HIGH clock transition; X = don’t care;  = LOW-to-HIGH clock transition.

7. Limiting values

Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V) Symbol Parameter

Conditions

Min

Max

Unit

supply voltage

0.5

+7

V

VCC

[1] -

input clamping current

VI < 0.5 V or VI > VCC + 0.5 V

20

mA

IIK

[1] -

output clamping current

VO < 0.5 V or VO > VCC + 0.5 V

20

mA

IOK output current

0.5 V < VO < VCC + 0.5 V

-

25

mA

IO supply current

-

50

mA

ICC ground current

50

-

mA

IGND storage temperature

65

+150

C

Tstg total power dissipation

Tamb = 40 C to +125 C

Ptot

[2] -

750

mW

DIP20 package

[3] -

500

mW

SO20, SSOP20, TSSOP20 and DHVQFN20 package

[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] For DIP20 package: above 70 C the value of Ptot derates linearly with 12 mW/K. [3] For SO20 package: above 70 C the value of Ptot derates linearly with 8 mW/K. For SSOP20 and TSSOP20 packages: above 60 C the value of Ptot derates linearly with 5.5 mW/K. For DHVQFN20 packages: Ptot derates linearly with 4.5 mW/K above 60 C.

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Page 6

8. Recommended operating conditions

Table 5. Recommended operating conditions Voltages are referenced to GND (ground = 0 V)

supply voltage

2.0 5.0 6.0 4.5 5.0 5.5 V

VCC input voltage

0 - VCC 0 - VCC V

VI output voltage

0 - VCC 0 - VCC V

VO ambient temperature

40 - +125 40

• +125 C

Tamb

VCC = 2.0 V

• - 625 - - - ns/V

t/V input transition rise and fall rate

VCC = 4.5 V

• 1.67 139 - 1.67 139 ns/V

VCC = 6.0 V

• - 83 - - - ns/V

9. Static characteristics

Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V).

74HC273 HIGH-level

VCC = 2.0 V

1.5 1.2 - 1.5 - 1.5 - V

VIH input voltage

VCC = 4.5 V

3.15 2.4 - 3.15 - 3.15 - V

VCC = 6.0 V

4.2 3.2 - 4.2 - 4.2 - V

LOW-level

VCC = 2.0 V

• 0.8 0.5
• 0.5 - 0.5 V

VIL input voltage

VCC = 4.5 V

• 2.1 1.35
• 1.35 - 1.35 V

VCC = 6.0 V

• 2.8 1.8
• 1.8 - 1.8 V

HIGH-level

VI = VIH or VIL

VOH output voltage

IO = 20 A; VCC = 2.0 V

1.9 2.0 - 1.9 - 1.9 - V

IO = 20 A; VCC = 4.5 V

4.4 4.5 - 4.4 - 4.4 - V

IO = 20 A; VCC = 6.0 V

5.9 6.0 - 5.9 - 5.9 - V

IO = 4.0 mA; VCC = 4.5 V

3.98 4.32 - 3.84 - 3.7 - V

IO = 5.2 mA; VCC = 6.0 V

5.48 5.81 - 5.34 - 5.2 - V

LOW-level

VI = VIH or VIL

VOL output voltage

IO = 20 A; VCC = 2.0 V

• 0 0.1 - 0.1 - 0.1 V

IO = 20 A; VCC = 4.5 V

• 0 0.1 - 0.1 - 0.1 V

IO = 20 A; VCC = 6.0 V

• 0 0.1 - 0.1 - 0.1 V

IO = 4.0 mA; VCC = 4.5 V

• 0.15 0.26
• 0.33 - 0.4 V

IO = 5.2 mA; VCC = 6.0 V

• 0.16 0.26
• 0.33 - 0.4 V
• - 0.1 - 1 - 1 A

input leakage

VI = VCC or GND;

II

VCC = 6.0 V

current

• - 8.0 - 80 - 160 A

supply current

VI = VCC or GND; IO = 0 A;

ICC

VCC = 6.0 V

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Page 7

Table 6. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V).

CI input

• 3.5 - - - - - pF

capacitance 74HCT273 HIGH-level

VCC = 4.5 V to 5.5 V

2.0 1.6 - 2.0 - 2.0 - V

VIH input voltage LOW-level

VCC = 4.5 V to 5.5 V

• 1.2 0.8
• 0.8 - 0.8 V

VIL input voltage VOH HIGH-level

VI = VIH or VIL; VCC = 4.5 V

output voltage

IO = 20 A

4.4 4.5 - 4.4 - 4.4 - V

IO = 4.0 mA

3.98 4.32 - 3.84 - 3.7 - V

LOW-level

VI = VIH or VIL; VCC = 4.5 V

VOL output voltage

IO = 20 A; VCC = 4.5 V

• 0 0.1 - 0.1 - 0.1 V

IO = 5.2 mA; VCC = 5.5 V

• 0.15 0.26
• 0.33 - 0.4 V

input leakage

VI = VCC or GND;

• - 0.1 - 1 - 1 A

II current

VCC = 5.5 V

• - 8.0 - 80 - 160 A

supply current

VI = VCC or GND; IO = 0 A;

ICC

VCC = 5.5 V

additional

per input pin;

ICC supply current VI = VCC  2.1 V;

other inputs at VCC or GND; VCC = 4.5 V to 5.5 V MR input

• 100 360
• 450 - 490 A

CP input

• 175 630
• 787.5 - 857.5 A

Dn input

• 15 54 - 67.5 - 73.5 A

input

• 3.5 - - - - - pF

CI capacitance

10. Dynamic characteristics

Table 7. Dynamic characteristics GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit, see Figure 10

74HC273

[1]

propagation

CP to Qn; see Figure 7

tpd delay

VCC = 2.0 V

• 41 150
• 185 - 225 ns

VCC = 4.5 V

• 15 30
• 37 - 45 ns

VCC = 5.0 V; CL = 15 pF

• 15 - - - - - ns

VCC = 6.0 V

• 13 26
• 31 - 38 ns

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Table 7. Dynamic characteristics …continued GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit, see Figure 10

HIGH to LOW MR to Qn; see Figure 8 tPHL propagation

VCC = 2.0 V

• 44 150
• 185 - 225 ns

delay

VCC = 4.5 V

• 16 30
• 37 - 45 ns

VCC = 5.0 V; CL = 15 pF

• 15 - - - - - ns

VCC = 6.0 V

• 14 26
• 31 - 38 ns

[2]

transition time Qn output; see Figure 7 tt

VCC = 2.0 V

• 19 75
• 95 - 110 ns

VCC = 4.5 V

• 7 15
• 19 - 22 ns

VCC = 6.0 V

• 6 13
• 15 - 19 ns

pulse width

CP input HIGH or LOW;

tW

see Figure 7 VCC = 2.0 V

80 14 - 100 - 120 - ns

VCC = 4.5 V

16 5 - 20 - 24 - ns

VCC = 6.0 V

14 4 - 17 - 20 - ns

MR input LOW; see Figure 8 VCC = 2.0 V

60 17 - 75 - 90 - ns

VCC = 4.5 V

12 6 - 15 - 18 - ns

VCC = 6.0 V

10 5 - 13 - 15 - ns

recovery time MR to CP; see Figure 8 trec

VCC = 2.0 V

50 6 - 65 - 75 - ns

VCC = 4.5 V

10 2 - 13 - 15 - ns

VCC = 6.0 V

9 2 - 11 - 13 - ns

set-up time

Dn to CP; see Figure 9

tsu

VCC = 2.0 V

60 11 - 75 - 90 - ns

VCC = 4.5 V

12 4 - 15 - 18 - ns

VCC = 6.0 V

10 3 - 13 - 15 - ns

hold time

Dn to CP; see Figure 9

th

VCC = 2.0 V

3 6 - 3 - 3 - ns

VCC = 4.5 V

3 2 - 3 - 3 - ns

VCC = 6.0 V

3 2 - 3 - 3 - ns

maximum

CP input; see Figure 7

fmax frequency

VCC = 2.0 V

6 20.6 -

4.8 - 4 - MHz

VCC = 4.5 V

30 103 -

24 - 20 - MHz

VCC = 5.0 V; CL = 15 pF

• 66 - - - - - MHz

VCC = 6.0 V

35 122 -

28 - 24 - MHz

[3]

power

per package;

• 20 - - - - - pF

CPD dissipation

VI = GND to VCC

capacitance

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Page 9

Table 7. Dynamic characteristics …continued GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit, see Figure 10

74HCT273

[1]

propagation

CP to Qn; see Figure 7

tpd delay

VCC = 4.5 V

• 16 30
• 38 - 45 ns

VCC = 5.0 V; CL = 15 pF

• 15 - - - - - ns

HIGH to LOW MR to Qn; see Figure 8 tPHL propagation

VCC = 4.5 V

• 23 34
• 43 - 51 ns

delay

VCC = 5.0 V; CL = 15 pF

• 20 - - - - - ns

[2]

transition time Qn output; see Figure 7 tt

VCC = 4.5 V

• 7 15
• 19 - 22 ns

pulse width

CP input; see Figure 7

tW

VCC = 4.5 V

16 9 - 20 - 24 - ns

MR input LOW; see Figure 8 VCC = 4.5 V

16 8 - 20 - 24 - ns

recovery time MR to CP; see Figure 8 trec

VCC = 4.5 V

10 2 - 13 - 15 - ns

set-up time

Dn to CP; see Figure 9

tsu

VCC = 4.5 V

12 5 - 15 - 18 - ns

hold time

Dn to CP; see Figure 9

th

VCC = 4.5 V

3 4 - 3 - 3 - ns

maximum

CP input; see Figure 7

fmax frequency

VCC = 4.5 V

30 56 - 24 - 20 - MHz

VCC = 5.0 V; CL = 15 pF

• 36 - - - - - MHz

[3]

power

per package;

• 23 - - - - - pF

CPD

VI = GND to VCC  1.5 V

dissipation capacitance

[1] tpd is the same as tPHL and tPLH. [2] tt is the same as tTHL and tTLH. [3] CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD  VCC2  fi + (CL  VCC2  fo) where: fi = input frequency in MHz; fo = output frequency in MHz;  (CL  VCC2  fo) = sum of outputs; CL = output load capacitance in pF; VCC = supply voltage in V.

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Page 10

11. Waveforms

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Table 8. Measurement points

74HC273

VCC

0.5VCC

0.5VCC

74HCT273

3 V

1.3 V

1.3 V

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Table 9. Test data

74HC273

VCC

6 ns

15 pF, 50 pF

1 k

open

74HCT273

3 V

6 ns

15 pF, 50 pF

1 k

open

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12. Package outline

DIP20: plastic dual in-line package; 20 leads (300 mil)

SOT146-1

ME

D

A2 A

A1

L

c

e

w M

Z

b1

(e ) 1

b

MH

11

20

pin 1 index

E

1

10

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

Fig 11. Package outline SOT146-1 (DIP20)

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SO20: plastic small outline package; 20 leads; body width 7.5 mm

SOT163-1

D

E

A X

c

HE

y

v M A

Z

20

11

Q

A2

A (A )

A1

3

pin 1 index

θ Lp L

10

1

detail X

e

w M bp

0

5

10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

Fig 12. Package outline SOT163-1 (SO20)

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SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm

SOT339-1

D

E

A X

c

HE

v M A

y

Z

20

11

Q

A2

A (A )

A1

3

pin 1 index

θ Lp L

1

10

detail X

w M bp

e

0 2.5 5 mm

scale

DIMENSIONS (mm are the original dimensions)

Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

ISSUE DATE

VERSION

PROJECTION

IEC

JEDEC

JEITA

99-12-27

SOT339-1

MO-150

03-02-19

Fig 13. Package outline SOT339-1 (SSOP20)

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TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm

SOT360-1

E

A

D

X

c

HE

v M A

y

Z

11

20

Q

A2

(A ) A 3

A1

pin 1 index

θ Lp L

1

10

detail X

w M bp

e

0 2.5 5 mm

scale

DIMENSIONS (mm are the original dimensions)

Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

ISSUE DATE

VERSION

PROJECTION

IEC

JEDEC

JEITA

99-12-27

SOT360-1

MO-153

03-02-19

Fig 14. Package outline SOT360-1 (TSSOP20)

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DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;

SOT764-1

20 terminals; body 2.5 x 4.5 x 0.85 mm

B A

D

A A1

E

c

detail X

terminal 1 index area

C

terminal 1

e1

index area

y

y1 C

e

v M C A B

b

w M C

2

9

L

1

10

Eh

e

20

11

19

12

Dh

X

0

2.5

5 mm

scale

DIMENSIONS (mm are the original dimensions)

Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

Fig 15. Package outline SOT764-1 (DHVQFN20)

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13. Abbreviations

Table 10. Abbreviations Acronym

Description

CMOS

Complementary Metal-Oxide Semiconductor

DUT

Device Under Test

ESD

ElectroStatic Discharge

HBM

Human Body Model

MM

Machine Model

TTL

Transistor-Transistor Logic

14. Revision history

Table 11. Revision history Document ID

Release date Data sheet status

Change notice

Supersedes

74HC_HCT273 v.4

20130610

-

74HC_HCT273 v.3

• The format of this data sheet has been redesigned to comply with the new identity

Modifications:

guidelines of NXP Semiconductors.

• Legal texts have been adapted to the new company name where appropriate.

74HC_HCT273 v.3

20060124

-

74HC_HCT273_CNV v.2

74HC_HCT273_CNV v.2 19970827

Product specification -

-

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15. Legal information

15.1 Data sheet status

Document status[1][2]

Product status[3]

Definition This document contains data from the objective specification for product development.

Objective [short] data sheet

Development

This document contains data from the preliminary specification.

Preliminary [short] data sheet Qualification

This document contains the product specification.

Product [short] data sheet

Production

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.

15.2 Definitions

Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.

15.3 Disclaimers

Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

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Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in

automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond

16. Contact information

For more information, please visit: http://www.nxp.com

NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions.

15.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.

For sales office addresses, please send an email to: salesaddresses@nxp.com

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17. Contents

1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information. . . . . . . . . . . . . . . . . . . . . 1 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 Functional description . . . . . . . . . . . . . . . . . . . 5 7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 Recommended operating conditions. . . . . . . . 6 9

Static characteristics. . . . . . . . . . . . . . . . . . . . . 6 10 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13 13 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 18 14 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 18 15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 19 15.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 19 15.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 15.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

15.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 20 16 Contact information. . . . . . . . . . . . . . . . . . . . . 20 17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.

© NXP B.V. 2013.

All rights reserved.

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 10 June 2013 Document identifier: 74HC_HCT273