74HCT257DB

74HC257 NXP

Document overview

• PDF pages: 17

Technical content

Page 1

1. General description

The 74HC257; 74HCT257 are high-speed Si-gate CMOS devices and are pin compatible with Low-power Schottky TTL (LSTTL).

The 74HC257 and 74HCT257 have four identical 2-input multiplexers with 3-state outputs, which select 4 bits of data from two sources and are controlled by a common data select input (S).

The data inputs from source 0 (1I0 to 4I0) are selected when input S is LOW and the data inputs from source 1 (1I1 to 4I1) are selected when S is HIGH. Data appears at the outputs (1Y to 4Y) in true (non-inverting) form from the selected inputs.

The 74HC257 and 74HCT257 are the logic implementation of a 4-pole, 2-position switch, where the position of the switch is determined by the logic levels applied to S. The outputs are forced to a high-impedance OFF-state when OE is HIGH.

The logic equations for the outputs are:

1Y = OE • (1I1 • S • 1I0 • S)

2Y = OE 2I1 S 2I0 S

• ( • • • )

3Y = OE • (3I1 • S • 3I0 • S)

4Y = OE 4I1 S 4I0 S

• ( • • • )

Except for their non-inverting (true) outputs the 74HC257; 74HCT257 are identical to the 74HC258.

2. Features

„ Non-inverting data path „ 3-state outputs interface directly with system bus „ Complies with JEDEC standard no. 7A „ ESD protection: ‹ HBM JESD22-A114E exceeds 2 000 V ‹ MM JESD22-A115-A exceeds 200 V „ Multiple package options „ Specified from −40 °C to +85 °C and from −40 °C to +125 °C

Page 2

3. Ordering information

Table 1. Ordering information

plastic dual in-line package; 16 leads (300 mil)

74HC257N

−40 °C to +125 °C DIP16

SOT38-4

74HCT257N

plastic small outline package; 16 leads; body width 3.9 mm

74HC257D

−40 °C to +125 °C SO16

SOT109-1

74HCT257D 74HC257DB −40 °C to +125 °C SSOP16 plastic shrink small outline package; 16 leads;

SOT338-1

body width 5.3 mm

74HCT257DB 74HC257PW −40 °C to +125 °C TSSOP16 plastic thin shrink small outline package; 16 leads;

SOT403-1

body width 4.4 mm

74HCT257PW

4. Functional diagram

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Page 4

5. Pinning information

5.1 Pinning

5.2 Pin description

Table 2. Pin description Symbol

Pin

Description

S

1

common data select input

1I0 to 4I0

2, 5, 11, 14

data input from source 0

1I1 to 4I1

3, 6, 10, 13

data input from source 1

1Y to 4Y

4, 7, 9, 12

3-state multiplexer output

GND

8

ground (0 V) 3-state output enable input (active LOW)

OE

15

VCC

16

supply voltage

6. Functional description

6.1 Function table

Table 3. Function table[1]

H

X

X

X

Z

L

H

X

L

L

L

H

X

H

H

L

L

L

X

L

L

L

H

X

H

[1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state.

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Page 5

7. Limiting values

Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol

Parameter

Conditions

Min

Max

Unit

VCC

supply voltage

−0.5

+7

V

IIK

input clamping current

VI < −0.5 V or

-

±20

mA

VI > VCC + 0.5 V

IOK

output clamping current

VO < −0.5 V or

-

±20

mA

VO > VCC + 0.5 V

IO

output current

VO = −0.5 V to VCC + 0.5 V

-

±35

mA

ICC

supply current

-

+70

mA

IGND

ground current

-

−70

mA

Tstg

storage temperature

−65

+150

°C

Ptot

total power dissipation

[1] -

DIP16 package

750

mW

[2] -

SO16 package

500

mW

[3] -

SSOP16 package

500

mW

[3] -

TSSOP16 package

500

mW

[1] For DIP16 packages: above 70 °C, Ptot derates linearly with 12 mW/K. [2] For SO16 packages: above 70 °C, Ptot derates linearly with 8 mW/K. [3] For SSOP16 and TSSOP16 packages: above 60 °C, Ptot derates linearly with 5.5 mW/K.

8. Recommended operating conditions

Table 5. Recommended operating conditions Symbol

Parameter

Conditions

Min Typ Max Unit

Type 74HC257 VCC

supply voltage

2.0 5.0 6.0 V

VI

input voltage

0 - VCC V

VO

output voltage

0 - VCC V

Δt/ΔV

input transition rise and

VCC = 2.0 V

• - 625 ns

fall rates

VCC = 4.5 V

• 1.67 139 ns

VCC = 6.0 V

• - 83 ns

Tamb

ambient temperature

−40 - +125 °C

Type 74HCT257 VCC

supply voltage

4.5 5.0 5.5 V

VI

input voltage

0 - VCC V

VO

output voltage

0 - VCC V

Δt/ΔV

input transition rise and

VCC = 4.5 V

• 1.67 139 ns

fall rates

Tamb

ambient temperature

−40 - +125 °C

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Page 6

9. Static characteristics

Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V).

74HC257 VIH HIGH-level

VCC = 2.0 V

input voltage

VCC = 4.5 V VCC = 6.0 V

VIL LOW-level

VCC = 2.0 V

input voltage

VCC = 4.5 V VCC = 6.0 V

VOH HIGH-level

VI = VIH or VIL

output voltage

IO = −20 μA; VCC = 2.0 V IO = −20 μA; VCC = 4.5 V IO = −20 μA; VCC = 6.0 V IO = −6.0 mA; VCC = 4.5 V IO = −7.8 mA; VCC = 6.0 V

VOL LOW-level

VI = VIH or VIL

output voltage

IO = 20 μA; VCC = 2.0 V IO = 20 μA; VCC = 4.5 V IO = 20 μA; VCC = 6.0 V IO = 6.0 mA; VCC = 4.5 V IO = 7.8 mA; VCC = 6.0 V

II input leakage current

VI = VCC or GND; VCC = 6.0 V

IOZ OFF-state

VI = VIH or VIL;

output current

VO = VCC or GND; VCC = 6.0 V

ICC supply current

VI = VCC or GND; IO = 0 A; VCC = 6.0 V

Ci input capacitance 74HCT257 VIH HIGH-level

VCC = 4.5 V to 5.5 V

input voltage VIL LOW-level

VCC = 4.5 V to 5.5 V

input voltage VOH HIGH-level

VI = VIH or VIL; VCC = 4.5 V

output voltage

IO = −20 μA IO = −6 mA

VOL LOW-level

VI = VIH or VIL; VCC = 4.5 V

output voltage

IO = 20 μA IO = 6.0 mA

II input leakage current

VI = VCC or GND; VCC = 5.5 V

1.5 1.2

• 1.5 - 1.5 - V

3.15 2.4

• 3.15 - 3.15
• V

4.2 3.2

• 4.2 - 4.2 - V
• 0.8 0.5
• 0.5 - 0.5 V
• 2.1 1.35 - 1.35 -

1.35 V

• 2.8 1.8
• 1.8 - 1.8 V

1.9 2.0

• 1.9 - 1.9 - V

4.4 4.5

• 4.4 - 4.4 - V

5.9 6.0

• 5.9 - 5.9 - V

3.98 4.32 - 3.84 -

3.7 - V

5.48 5.81 - 5.34 -

5.2 - V

• 0 0.1 - 0.1 - 0.1 V
• 0 0.1 - 0.1 - 0.1 V
• 0 0.1 - 0.1 - 0.1 V
• 0.15 0.26 - 0.33 -

0.4 V

• 0.16 0.26 - 0.33 -

0.4 V

• - ±0.1 - ±1.0 ±1.0 ±1.0 μA - - ±0.5 - ±5.0 ±10.0 ±10.0 μA
• - 8.0 - 80 160 160 μA
• 3.5 -

pF

2.0 1.6

• 2.0 - 2.0 - V
• 1.2 0.8
• 0.8 - 0.8 V

4.4 4.5

• 4.4 - 4.4 - V

3.98 4.32 - 3.84 -

3.7 - V

• 0.1 - 0.1
• 0 0.1 - 0.33 -

0.4 V

• 0.15 0.26 - ±1.0 -

±1.0 V

• - ±0.1 - ±5.0 -

±10 μA

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Page 7

Table 6. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V).

IOZ OFF-state

VI = VIH or VIL; VCC = 5.5 V;

• - ±0.5 -

80 - 160 μA

output current

VO = VCC or GND per input pin; other inputs at VCC or GND; IO = 0 A

ICC supply current

VI = VCC or GND; IO = 0 A;

• - 8.0

μA

VCC = 5.5 V

ΔICC additional supply

VI = VCC − 2.1 V; other inputs at VCC or GND;

current

VCC = 4.5 V to 5.5 V; IO = 0 A per input pin; nI0, nI1 inputs

• 40 144
• 180 - 196 μA

per input pin; OE input

• 135 486
• 608 - 662 μA

per input pin; S input

• 70 252
• 315 - 343 μA

CI input capacitance

• 3.5 -

pF

10. Dynamic characteristics

Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); For test circuit see Figure 8.

74HC257

[1]

tpd propagation delay

nl0 to nY or nl1 to nY; see Figure 6 VCC = 2.0 V

36 110 140 165 ns

VCC = 4.5 V

13 22 28 33 ns

VCC = 5.0 V; CL = 15 pF

11 - - - ns

VCC = 6.0 V

10 19 24 28 ns

S to nY; see Figure 6 VCC = 2.0 V

47 150 190 225 ns

VCC = 4.5 V

17 30 38 45 ns

VCC = 5.0 V; CL = 15 pF

14 - - - ns

VCC = 6.0 V

14 26 33 38 ns

[2]

ten enable time

OE to nY; see Figure 7 VCC = 2.0 V

33 150 190 225 ns

VCC = 4.5 V

12 30 38 45 ns

VCC = 6.0 V

10 26 33 38 ns

[3]

tdis disable time

OE to nY; see Figure 7 VCC = 2.0 V

41 150 190 225 ns

VCC = 4.5 V

ns

VCC = 6.0 V

ns

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Page 8

Table 7. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V); For test circuit see Figure 8.

[4]

tt transition time

see Figure 6 VCC = 2.0 V

14 60 75 90 ns

VCC = 4.5 V

5 12 15 18 ns

VCC = 6.0 V

4 10 13 15 ns

[5]

CPD power dissipation

per multiplexer;

45 -

pF

capacitance

VI = GND to VCC

74HCT257

[1]

tpd propagation delay

nl0 to nY or nl1 to nY; see Figure 6 VCC = 4.5 V

16 30 38 45 ns

VCC = 5.0 V; CL = 15 pF

13 - -

ns

S to nY; see Figure 6 VCC = 4.5 V

20 35 44 53 ns

VCC = 5.0 V; CL = 15 pF

17 -

ns

[2]

ten enable time

OE to nY; VCC = 4.5 V;

15 30 38 45 ns

see Figure 7

[3]

tdis disable time

OE to nY; VCC = 4.5 V;

16 30 38 45 ns

see Figure 7

[4]

tt transition time

VCC = 4.5 V; see Figure 6

5 12 15 18 ns

[5]

CPD power dissipation

per multiplexer;

45 -

pF

VI = GND to VCC

capacitance

[1] tpd is the same as tPHL, tPLH. [2] ten is the same as tPZH, tPZL. [3] tdis is the same as tPHZ, tPLZ. [4] tt is the same as tTHL, tTLH. [5] CPD is used to determine the dynamic power dissipation (PD in μW). PD = CPD × VCC2 × fi × N + ∑(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; ∑(CL × VCC2 × fo) = sum of outputs.

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Page 9

11. Waveforms

Table 8. Measurement points

74HC257

0.5VCC

0.5VCC

74HCT257

1.3 V

1.3 V

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Page 10

Table 9. Test data

74HC257

VCC

6 ns

50 pF

1 kΩ

open

GND

VCC

74HCT257

3 V

6 ns

50 pF

1 kΩ

open

GND

VCC

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Page 11

12. Package outline

DIP16: plastic dual in-line package; 16 leads (300 mil)

SOT38-4

ME

D

A2 A

A1

L

c

e

w M

Z

b1

(e ) 1

b

b2

MH

9

16

pin 1 index

E

1

8

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

ISSUE DATE

VERSION

PROJECTION

IEC

JEDEC

JEITA

95-01-14

SOT38-4

03-02-13

Fig 9. Package outline SOT38-4 (DIP16)

11 of 17

Page 12

SO16: plastic small outline package; 16 leads; body width 3.9 mm

SOT109-1

D

E

A X

c

y

HE

v M A

Z

16

9

Q

A2

A (A ) 3

A1

pin 1 index

θ Lp L

1

8

e

detail X

w M bp

0 2.5 5 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

ISSUE DATE

VERSION

PROJECTION

IEC

JEDEC

JEITA

99-12-27

SOT109-1

076E07

MS-012

03-02-19

Fig 10. Package outline SOT109-1 (SO16)

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Page 13

SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm

SOT338-1

D

E

A X

c

y

HE

v M A

Z

9

16

Q

A2

A (A )

A1

3

pin 1 index

θ Lp L

8

1

detail X

w M bp

e

0 2.5 5 mm

scale

DIMENSIONS (mm are the original dimensions)

Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

ISSUE DATE

VERSION

PROJECTION

IEC

JEDEC

JEITA

99-12-27

MO-150

SOT338-1

03-02-19

Fig 11. Package outline SOT338-1 (SSOP16)

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Page 14

TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm

SOT403-1

E

A

D

X

c

y

HE

v M A

Z

9

16

Q (A )

A2

3 A

A1

pin 1 index

θ Lp L

1

8

detail X

w M bp

e

0 2.5 5 mm

scale

DIMENSIONS (mm are the original dimensions)

Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

ISSUE DATE

VERSION

PROJECTION

IEC

JEDEC

JEITA

99-12-27

SOT403-1

MO-153

03-02-18

Fig 12. Package outline SOT403-1 (TSSOP16)

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Page 15

13. Revision history

Table 10. Revision history Document ID

Release date Data sheet status

Change notice

20100113

-

• Table 7 “Dynamic characteristics”: changed 3OE to OE

Modifications: 74HC_HCT257_4

20090608

-

74HC_HCT257_3

20050920

-

74HC_HCT257_CNV_2

19980930

Product specification

-

Supersedes 74HC_HCT257_4

74HC_HCT257_3 74HC_HCT257_CNV_2 -

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14. Legal information

14.1 Data sheet status

Document status[1][2]

Product status[3]

Definition This document contains data from the objective specification for product development.

Objective [short] data sheet

Development

This document contains data from the preliminary specification.

Preliminary [short] data sheet Qualification

This document contains the product specification.

Product [short] data sheet

Production

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.

14.2 Definitions

Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.

14.3 Disclaimers

General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental

15. Contact information

For more information, please visit: http://www.nxp.com

damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of

the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail.

No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.

14.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.

For sales office addresses, please send an email to: salesaddresses@nxp.com

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16. Contents

1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 6 Functional description . . . . . . . . . . . . . . . . . . . 4 6.1 Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5

8 Recommended operating conditions. . . . . . . . 5 9 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6 10 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 13 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 15 14 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16 14.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16 14.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 14.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

14.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16 15 Contact information. . . . . . . . . . . . . . . . . . . . . 16 16 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.

© NXP B.V. 2010.

All rights reserved.

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 13 January 2010 Document identifier: 74HC_HCT257_5