74HCT253DB

74HC253 NXP

Document overview

• PDF pages: 17

Technical content

Page 1

1. General description

The 74HC253; 74HCT253 are high-speed Si-gate CMOS devices and are pin compatible with Low-power Schottky TTL (LSTTL).

The 74HC253; 74HCT253 provides a dual 4-input multiplexer with 3-state outputs which selects 2 bits of data from up to four sources selected by common data select inputs (S0, S1). The two 4-input multiplexer circuits have individual active LOW output enable inputs (1OE, 2OE).

The 74HC253 and 74HCT253 are the logic implementation of a 2-pole, 4-position switch, where the position of the switch is determined by the logic levels applied to S0 and S1. The outputs are forced to a high-impedance OFF-state when nOE is HIGH.

The logic equations for the outputs are:

1Y = 1OE 1I0 S1 S0 + 1I1

S1 S0 + 1I2 S1 S0 + 1I3 S1 S0

• ( • •

- -

• •
• • )

2Y = 2OE • (2I0 • S1 • S0 + 2I1 •

S1 • S0 + 2I2 • S1 • S0 + 2I3 • S1 • S0)

2. Features and benefits

„ Non-inverting data path „ 3-state outputs interface directly with system bus „ Complies with JEDEC standard no. 7A „ Common select inputs „ Separate output enable inputs „ Input levels: ‹ For 74HC253: CMOS level ‹ For 74HCT253: TTL level „ ESD protection: ‹ HBM JESD22-A114F exceeds 2000 V ‹ MM JESD22-A115-A exceeds 200 V „ Multiple package options „ Specified from −40 °C to +85 °C and from −40 °C to +125 °C

Page 2

3. Applications

„ Data selectors „ Data multiplexers

4. Ordering information

Table 1. Ordering information

plastic dual in-line package; 16 leads (300 mil)

74HC253N

−40 °C to +125 °C DIP16

SOT38-4

74HCT253N

plastic small outline package; 16 leads; body width

74HC253D

−40 °C to +125 °C SO16

SOT109-1

3.9 mm

74HCT253D

plastic shrink small outline package; 16 leads;

74HC253DB −40 °C to +125 °C SSOP16

SOT338-1

body width 5.3 mm

74HCT253DB

5. Functional diagram

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6. Pinning information

6.1 Pinning

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6.2 Pin description

Table 2. Pin description Symbol

Pin

Description

1OE, 2OE

1, 15

output enable inputs (active LOW)

S0, S1

14, 2

data select inputs

1I0, 1I1, 1I2, 1I3

6, 5, 4, 3

data inputs source 1

1Y

7

multiplexer output source 1

GND

8

ground (0 V)

2Y

9

multiplexer output source 2

2I0, 2I1, 2I2, 2I3

10, 11, 12, 13

data inputs source 2

16

supply voltage

VCC

7. Functional description

Table 3. Function table[1]

X

X

X

X

X

X

H

Z

L

L

L

X

X

X

L

L

L

L

H

X

X

X

L

H

H

L

X

L

X

X

L

L

H

L

X

H

X

X

L

H

L

H

X

X

L

X

L

L

L

H

X

X

H

X

L

H

H

H

X

X

X

L

L

L

H

H

X

X

X

H

L

H

[1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state.

8. Limiting values

Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol

Parameter

Conditions

Min Max Unit

supply voltage

−0.5 +7.0 V

VCC

[1] -

input clamping current

VI < −0.5 V or VI > VCC + 0.5 V

±20 mA

IIK

[1] -

output clamping current

VO < −0.5 V or VO > VCC + 0.5 V

±50 mA

IOK

output current

−0.5 V < VO < VCC + 0.5 V

• ±35 mA

IO

supply current

• 70 mA

ICC

ground current

−70 - mA

IGND

storage temperature

−65 +150 °C

Tstg

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Table 4. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol

Parameter

Conditions

Min Max Unit

Tamb = −40 °C to +125 °C

Ptot

total power dissipation

[2] -

750 mW

DIP16 package

[3] -

500 mW

SO16 package

[4] -

500 mW

SSOP16 package

[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] Ptot derates linearly with 12 mW/K above 70 °C. [3] Ptot derates linearly with 8 mW/K above 70 °C. [4] Ptot derates linearly with 5.5 mW/K above 60 °C.

9. Recommended operating conditions

Table 5. Recommended operating conditions Voltages are referenced to GND (ground = 0 V)

supply voltage

2.0 5.0 6.0 4.5 5.0 5.5 V

VCC input voltage

0 - VCC 0 - VCC V

VI output voltage

0 - VCC 0 - VCC V

VO Tamb ambient temperature

−40 - +125 −40

• +125 °C

VCC = 2.0 V

• - 625 - - - ns/V

Δt/ΔV input transition rise and fall rate

VCC = 4.5 V

• 1.67 139 - 1.67 139 ns/V

VCC = 6.0 V

• - 83 - - - ns/V

10. Static characteristics

Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V).

74HC253 HIGH-level

VCC = 2.0 V

1.5 1.2

• 1.5 - 1.5 - V

VIH input voltage

VCC = 4.5 V

3.15 2.4 - 3.15 - 3.15 - V

VCC = 6.0 V

4.2 3.2

• 4.2 - 4.2 - V

LOW-level

VCC = 2.0 V

• 0.8 0.5
• 0.5 - 0.5 V

VIL input voltage

VCC = 4.5 V

• 2.1 1.35
• 1.35 - 1.35 V

VCC = 6.0 V

• 2.8 1.8
• 1.8 - 1.8 V

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Table 6. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V).

VOH HIGH-level

VI = VIH or VIL

output voltage

IO = −20 μA; VCC = 2.0 V

1.9 2.0 - 1.9 - 1.9 - V

IO = −20 μA; VCC = 4.5 V

4.4 4.5 - 4.4 - 4.4 - V

IO = −20 μA; VCC = 6.0 V

5.9 6.0 - 5.9 - 5.9 - V

IO = −6.0 mA; VCC = 4.5 V

3.98 4.32 - 3.84 - 3.7 - V

IO = −7.8 mA; VCC = 6.0 V

5.48 5.81 - 5.34 - 5.2 - V

LOW-level

VI = VIH or VIL

VOL output voltage

IO = 20 μA; VCC = 2.0 V

• 0 0.1 - 0.1 - 0.1 V

IO = 20 μA; VCC = 4.5 V

• 0 0.1 - 0.1 - 0.1 V

IO = 20 μA; VCC = 6.0 V

• 0 0.1 - 0.1 - 0.1 V

IO = 6.0 mA; VCC = 4.5 V

• 0.15 0.26
• 0.33 - 0.4 V

IO = 7.8 mA; VCC = 6.0 V

• 0.16 0.26
• 0.33 - 0.4 V

input leakage

VI = VCC or GND;

• - ±0.1 - ±1.0 - ±1.0 μA

II current

VCC = 6.0 V

• - ±0.5 - ±5.0 - ±10.0 μA

OFF-state

VI = VIH or VIL;

IOZ output current VO = VCC or GND;

VCC = 6.0 V

ICC supply current

VI = VCC or GND; IO = 0 A;

• - 8.0 - 80 - 160 μA

VCC = 6.0 V

input

• 3.5 -

pF

CI capacitance 74HCT253 VIH HIGH-level

VCC = 4.5 V to 5.5 V

2.0 1.6 - 2.0 - 2.0 - V

input voltage LOW-level

VCC = 4.5 V to 5.5 V

• 1.2 0.8
• 0.8 - 0.8 V

VIL input voltage HIGH-level

VI = VIH or VIL; VCC = 4.5 V

VOH output voltage

IO = −20 μA

4.4 4.5 - 4.4 - 4.4 - V

IO = −6 mA

3.98 4.32 - 3.84 - 3.7 - V

LOW-level

VI = VIH or VIL; VCC = 4.5 V

VOL output voltage

IO = 20 μA

• 0 0.1 - 0.1 - 0.1 V

IO = 6.0 mA

• 0.15 0.26
• 0.33 - 0.4 V
• - ±0.1 - ±1.0 - ±1.0 μA

input leakage

VI = VCC or GND;

II

VCC = 5.5 V

current IOZ

• - ±0.5 - ±5.0 - ±10 μA

OFF-state

VI = VIH or VIL; VCC = 5.5 V;

output current VO = VCC or GND per input

pin; other inputs at VCC or GND; IO = 0 A

ICC supply current

VI = VCC or GND; IO = 0 A;

• - 8.0 - 80 - 160 μA

VCC = 5.5 V

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Table 6. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V).

ΔICC additional

VI = VCC − 2.1 V;

supply current other inputs at VCC or GND;

VCC = 4.5 V to 5.5 V; IO = 0 A per input pin; 1In, 2In

• 40 144
• 180 - 196 μA

inputs per input pin; nOE input

• 110 396
• 495 - 539 μA

per input pin; Sn input

• 110 396
• 495 - 539 μA

input

• 3.5 -

pF

CI capacitance

11. Dynamic characteristics

Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); For test circuit see Figure 8.

74HC253

[1]

propagation delay

1ln to 1Y or 2ln to 2Y;

tpd

see Figure 6 VCC = 2.0 V

55 175 220

265 ns

VCC = 4.5 V

20 35 44

53 ns

VCC = 5.0 V; CL = 15 pF

17 - -

• ns

VCC = 6.0 V

16 30 37

45 ns

Sn to nY; see Figure 6 VCC = 2.0 V

58 175 220

265 ns

VCC = 4.5 V

21 35 44

53 ns

VCC = 5.0 V; CL = 15 pF

18 - -

• ns

VCC = 6.0 V

17 30 37

45 ns

[2]

enable time

nOE to nY; see Figure 7

ten

VCC = 2.0 V

30 100 125

150 ns

VCC = 4.5 V

11 20 25

30 ns

VCC = 6.0 V

9 17 21

26 ns

[3]

disable time

nOE to nY; see Figure 7

tdis

VCC = 2.0 V

41 150 190

225 ns

VCC = 4.5 V

15 30 38

45 ns

VCC = 6.0 V

12 26 33

38 ns

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Table 7. Dynamic characteristics …continued Voltages are referenced to GND (ground = 0 V); For test circuit see Figure 8.

[4]

tt transition time

see Figure 6 VCC = 2.0 V

14 60 75

90 ns

VCC = 4.5 V

5 12 15

18 ns

VCC = 6.0 V

4 10 13

15 ns

[5]

power dissipation

per multiplexer;

55 -

pF

CPD capacitance

VI = GND to VCC

74HCT253

[1]

propagation delay

1ln to 1Y or 2ln to 2Y;

tpd

see Figure 6 VCC = 4.5 V

20 38 48

57 ns

VCC = 5.0 V; CL = 15 pF

17 - -

ns

Sn to nY; see Figure 6 VCC = 4.5 V

22 40 50

60 ns

VCC = 5.0 V; CL = 15 pF

19 -

ns

[2]

enable time

nOE to nY; VCC = 4.5 V; see

14 30 38

45 ns

ten

Figure 7

[3]

disable time

nOE to nY; VCC = 4.5 V;

13 30 38

45 ns

tdis

see Figure 7

tt transition time

VCC = 4.5 V; see Figure 6

5 12 15

18 ns

[5]

power dissipation

per multiplexer;

55 -

pF

CPD

VI = GND to VCC

capacitance

[1] tpd is the same as tPHL, tPLH. [2] ten is the same as tPZH, tPZL. [3] tdis is the same as tPHZ, tPLZ. [4] tt is the same as tTHL, tTLH. [5] CPD is used to determine the dynamic power dissipation (PD in μW). PD = CPD × VCC2 × fi × N + ∑(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; ∑(CL × VCC2 × fo) = sum of outputs.

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12. Waveforms

Table 8. Measurement points

74HC253

0.5VCC

0.5VCC

74HCT253

1.3 V

1.3 V

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Page 10

Table 9. Test data

74HC253

VCC

6 ns

50 pF

1 kΩ

open

GND

VCC

74HCT253

3 V

6 ns

50 pF

1 kΩ

open

GND

VCC

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13. Package outline

DIP16: plastic dual in-line package; 16 leads (300 mil)

SOT38-4

ME

D

A2 A

A1

L

c

e

w M

Z

b1

(e ) 1

b

b2

MH

9

16

pin 1 index

E

1

8

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

ISSUE DATE

VERSION

PROJECTION

IEC

JEDEC

JEITA

95-01-14

SOT38-4

03-02-13

Fig 9. Package outline SOT38-4 (DIP16)

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Page 12

SO16: plastic small outline package; 16 leads; body width 3.9 mm

SOT109-1

D

E

A X

c

y

HE

v M A

Z

16

9

Q

A2

A (A ) 3

A1

pin 1 index

θ Lp L

1

8

e

detail X

w M bp

0 2.5 5 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

ISSUE DATE

VERSION

PROJECTION

IEC

JEDEC

JEITA

99-12-27

SOT109-1

076E07

MS-012

03-02-19

Fig 10. Package outline SOT109-1 (SO16)

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Page 13

SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm

SOT338-1

D

E

A X

c

y

HE

v M A

Z

9

16

Q

A2

A (A )

A1

3

pin 1 index

θ Lp L

8

1

detail X

w M bp

e

0 2.5 5 mm

scale

DIMENSIONS (mm are the original dimensions)

Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

ISSUE DATE

VERSION

PROJECTION

IEC

JEDEC

JEITA

99-12-27

MO-150

SOT338-1

03-02-19

Fig 11. Package outline SOT338-1 (SSOP16)

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Page 14

14. Abbreviations

Table 10. Abbreviations Acronym

Description

CMOS

Complementary Metal Oxide Semiconductor

DUT

Device Under Test

ESD

ElectroStatic Discharge

HBM

Human Body Model

MM

Machine Model

TTL

Transistor-Transistor Logic

15. Revision history

Table 11. Revision history

Data sheet status

Document ID

Release date

Change notice

Supersedes

20100422

-

74HC_HCT253_CNV_2

• The format of this data sheet has been redesigned to comply with the new identity

Modifications:

guidelines of NXP Semiconductors.

• Legal texts have been adapted to the new company name where appropriate.

Product specification

74HC_HCT253_CNV_2 970828

-

-

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16. Legal information

16.1 Data sheet status

Document status[1][2]

Product status[3]

Definition This document contains data from the objective specification for product development.

Objective [short] data sheet

Development

This document contains data from the preliminary specification.

Preliminary [short] data sheet Qualification

This document contains the product specification.

Product [short] data sheet

Production

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.

16.2 Definitions

Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.

16.3 Disclaimers

Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use in automotive applications — This NXP

Semiconductors product has been qualified for use in automotive applications. The product is not designed, authorized or warranted to be

suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the

specified use without further testing or modification. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on a weakness or default in the customer application/use or the application/use of customer’s third party customer(s) (hereinafter both referred to as “Application”). It is customer’s sole responsibility to check whether the NXP Semiconductors product is suitable and fit for the Application planned. Customer has to do all necessary testing for the Application in order to avoid a default of the Application and the product. NXP Semiconductors does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.

16.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.

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17. Contact information

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com

16 of 17

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18. Contents

1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Functional description . . . . . . . . . . . . . . . . . . . 4 8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4

9 Recommended operating conditions. . . . . . . . 5 10 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 11 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 14 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 14 15 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 14 16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15 16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15 16.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

16.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 16.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15 17 Contact information. . . . . . . . . . . . . . . . . . . . . 16 18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’.

© NXP B.V. 2010.

All rights reserved.

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 22 April 2010 Document identifier: 74HC_HCT253_3