74HC238 NXP

Document overview

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Technical content

  1. General description 74HC238 and 74HCT238 are high-speed Si-gate CMOS devices and are pin compatible with Low-Power Schottky TTL (LSTTL). The 74HC238/74HCT238 decoders accept three binary weighted address inputs (A0, A1, A2) and when enabled, provide 8 mutually exclusive active HIGH outputs (Y0 to Y7). The 74HC238/74HCT238 features three enable inputs: two active LOW ( E1 andE2) and one active HIGH (E3). Every output will be LOW unlessE1 andE2 are LOW and E3 is HIGH. This multiple enable function allows easy parallel expansion of the “238” to a 1-to-32 (5 lines to 32 lines) decoder with just four “238” ICs and one inverter. The “238” can be used as an eight output demultiplexer by using one of the active LOW enable inputs as the data input and the remaining enable inputs as strobes. Unused enable inputs must be permanently tied to their appropriate active HIGH or LOW state. The 74HC238/74HCT238 is similar to the 74HC138/74HCT138 but has non-inverting outputs. 2. Features n Demultiplexing capability n Multiple input enable for easy expansion n Ideal for memory chip select decoding n Active HIGH mutually exclusive outputs n Multiple package options n Complies with JEDEC standard no. 7A n ESD protection: u HBM JESD22-A114E exceeds 2000 V u MM JESD22-A115-A exceeds 200 V n Specified from−40 °Ct o+ 8 5°C and from−40 °C to +125°C 74HC238; 74HCT238 3-to-8 line decoder/demultiplexer Rev. 03 — 16 July 2007 Product data sheet

74HC_HCT238_3 © NXP B.V. 2007. All rights reserved. Table 1. Ordering information

3 TO 8

74HC_HCT238_3 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 03 — 16 July 2007 3 of 18 NXP Semiconductors 74HC238; 74HCT238 3-to-8 line decoder/demultiplexer 5. Pinning information

5.1 Pinning

Fig 3. Logic diagram 001aag754 (1) The die substrate is attached to this pad using conductive die attach material. It can not be used as supply pin or input Fig 4. Pin configuration DIP16, SO16, (T)SSOP16 Fig 5. Pin configuration DHVQFN16 74HC238 74HCT238 A0 V CC A1 Y0 A2 Y1 E1 Y2 E2 Y3 E3 Y4 Y7 Y5 GND Y6 001aag755 001aag756 74HC238 74HCT238 Y7 Y5 E3 Y4 E2 Y3 E1 Y2 A2 Y1 A1 Y0 GND GND (1) VCC Transparent top view 7 10 6 11 5 12 4 13 3 14 2 15 terminal 1 index area

74HC_HCT238_3 © NXP B.V. 2007. All rights reserved.

5.2 Pin description

Table 2. Pin description Table 3. Function table[1]

74HC_HCT238_3 © NXP B.V. 2007. All rights reserved. [1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] For DIP16 packages: above 70°C the value of Ptotderates linearly at 12 mW/K. [3] For SO16 packages: above 70°C the value of Ptotderates linearly at 8 mW/K. For SSOP16 and TSSOP16 packages: above 60°C the value of Ptotderates linearly at 5.5 mW/K. For DHVQFN16 packages: above 60°C the value of Ptotderates linearly at 4.5 mW/K.

  1. Recommended operating conditions

Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Table 5. Recommended operating conditions Voltages are referenced to GND (ground = 0 V).

74HC_HCT238_3 © NXP B.V. 2007. All rights reserved. Table 6. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V).

74HC_HCT238_3 © NXP B.V. 2007. All rights reserved. Table 6. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Table 7. Dynamic characteristics GND = 0 V; test circuit seeFigure8.

74HC_HCT238_3 © NXP B.V. 2007. All rights reserved. [1] tpd is the same as tPHL and tPLH . [2] tt is the same as tTHL and tTLH . L × VCC 2 × fo) = sum of outputs. GND = 0 V; test circuit seeFigure8. Measurement points are given inTable8. VOL and VOH are typical voltage output levels that occur with the output load.

74HC_HCT238_3 © NXP B.V. 2007. All rights reserved. Measurement points are given inTable8. VOL and VOH are typical voltage output levels that occur with the output load. Table 8. Measurement points

74HC_HCT238_3 © NXP B.V. 2007. All rights reserved. Test data is given inTable9. T = Termination resistance should be equal to output impedance Zo of the pulse generator. C L = Load capacitance including jig and probe capacitance. Table 9. Test data

74HC_HCT238_3 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 03 — 16 July 2007 11 of 18 NXP Semiconductors 74HC238; 74HCT238 3-to-8 line decoder/demultiplexer 12. Package outline Fig 9. Package outline SOT38-4 (DIP16) REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT38-4 95-01-14 03-02-13 M H c (e )1 M E A L seating plane w M e D A 2 Z E pin 1 index b 0 5 10 mm scale Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. UNIT A max. 12 b1 (1) (1) (1) b2 cD E e M ZHL mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) A min. A max. b max.wM Ee1 1.73 1.30 0.53 0.38 0.36 0.23 19.50 18.55 6.48 6.20 3.60 7.80 10.0 inches 0.068 0.051 0.021 0.015 0.014 0.009 1.25 0.85 0.049 0.033 0.77 0.73 0.26 0.24 0.14 0.31 0.39 DIP16: plastic dual in-line package; 16 leads (300 mil) SOT38-4

74HC_HCT238_3 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 03 — 16 July 2007 12 of 18 NXP Semiconductors 74HC238; 74HCT238 3-to-8 line decoder/demultiplexer Fig 10. Package outline SOT109-1 (SO16) X w M q AA 1 A 2 bp D H E Lp Q detail X E Z e c L v M A (A )3 A y pin 1 index UNIT A max. A 1 A 2 A 3 bp cD (1) E (1) (1)eH E LL p QZ ywv q REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 o o 0.25 0.1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.0 0.4 SOT109-1 99-12-27 03-02-19 076E07 MS-012 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.39 0.38 0.16 0.15 0.05 1.05 0.0410.244 0.228 0.028 0.020 0.028 0.0120.01 0.25 0.01 0.0040.039 0.016 0 2.5 5 mm scale SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1

74HC_HCT238_3 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 03 — 16 July 2007 13 of 18 NXP Semiconductors 74HC238; 74HCT238 3-to-8 line decoder/demultiplexer Fig 11. Package outline SOT338-1 (SSOP16) UNIT A 1 A 2 A 3 bp cD (1) E (1) eH E LL p QZ ywv q REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 6.4 6.0 5.4 5.2 0.65 1.257.9 7.6 1.03 0.63 0.9 0.7 1.00 0.55 o o0.130.2 0.1 DIMENSIONS (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. SOT338-1 99-12-27 03-02-19 (1) w M bp D H E E Z e c v M A X A y 1 8 16 9 q AA 1 A 2 Lp Q detail X L (A )3 MO-150 pin 1 index 0 2.5 5 mm scale SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm SOT338-1 A max.

74HC_HCT238_3 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 03 — 16 July 2007 14 of 18 NXP Semiconductors 74HC238; 74HCT238 3-to-8 line decoder/demultiplexer Fig 12. Package outline SOT403-1 (TSSOP16) UNIT A 1 A 2 A 3 bp cD (1) E (2) (1)eH E LL p QZ ywv q REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.40 0.06 o o0.13 0.10.21 DIMENSIONS (mm are the original dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 SOT403-1 MO-153 99-12-27 03-02-18 w M bp D Z e 0.25 16 9 q AA 1 A 2 Lp Q detail X L (A )3 H E E c v M A XA y 0 2.5 5 mm scale TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 A max. 1.1 pin 1 index

74HC_HCT238_3 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 03 — 16 July 2007 15 of 18 NXP Semiconductors 74HC238; 74HCT238 3-to-8 line decoder/demultiplexer Fig 13. Package outline SOT763-1 (DHVQFN16) terminal 1 index area 0.51 A 1 EhbUNIT ye 0.2 c REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 3.6 3.4 D h 2.15 1.85 2.6 2.4 1.15 0.85 2.50.30 0.18 0.05 0.00 0.05 0.1 DIMENSIONS (mm are the original dimensions) 0.5 0.3 L 0.1 v 0.05 w 0 2.5 5 mm scale SOT763-1 DHVQFN16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 16 terminals; body 2.5 x 3.5 x 0.85 mm A (1) max. A c detail X yy1 Ce L Eh D h e b 15 10 X D E C B A terminal 1 index area AC C Bv M w M E (1) Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. D (1) 02-10-17 03-01-27

74HC_HCT238_3 © NXP B.V. 2007. All rights reserved. Table 10. Abbreviations Table 11. Revision history

  • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors.
  • Legal texts have been adapted to the new company name where appropriate.
  • Added type number 74HC238BQ and 74HCT238BQ (DHVQFN16 package) 74HC_HCT238_CNV_2 19970828 Product specification - -

74HC_HCT238_3 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 03 — 16 July 2007 17 of 18 NXP Semiconductors 74HC238; 74HCT238 3-to-8 line decoder/demultiplexer 15. Legal information

15.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.

15.2 Definitions

Draft —The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet —A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.

15.3 Disclaimers

General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes —NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use —NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications —Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values —Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale —NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license —Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

15.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 16. Contact information For additional information, please visit:http://www.nxp.com For sales office addresses, send an email to:salesaddresses@nxp.com Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.

NXP Semiconductors 74HC238; 74HCT238 3-to-8 line decoder/demultiplexer © NXP B.V. 2007. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 16 July 2007 Document identifier: 74HC_HCT238_3 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 17. Contents