74HCT154N Datasheet PDF & Specifications

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74HC154 NXP

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Manufacturer or author: Provided By digicamel.com
PDF pages: 21

Technical content

with Low-power Schottky TTL (LSTTL). used for the expansion of the decoder. The enable gate has two ANDed inputs which must be LOW to enable the outputs. enable inputs as the multiplexed data input. Table 1. Ordering information

74HC_HCT154_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 12 February 2007 3 of 21 NXP Semiconductors 74HC154; 74HCT154 4-to-16 line decoder/demultiplexer Fig 2. Logic symbol Fig 3. IEC logic symbol 001aab069 Y15 Y14 16 Y1 2 Y0 1 A221 A122 A023 001aab070 DX G 109 1110 1311 1412 1513 1614 1715 EN X/Y 023 109 1110 1311 1412 1513 1614 1715 EN Fig 4. Logic diagram 001aab072 Y0 Y1 Y2 Y3 A0E0 E1 A1 A2 A3 Y4 Y5 Y6 Y7 Y8 Y9 Y10 Y11 Y12 Y13 Y14 Y15

5.1 Pinning

5.2 Pin description

Table 2. Pin description

74HC_HCT154_6 © NXP B.V. 2007. All rights reserved. [1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] For DIP24 packages: Ptot derates linearly at 12 mW/K above 70°C. For SO24 packages: Ptot derates linearly at 8 mW/K above 70°C. For SSOP24 and TSSOP24 packages: Ptot derates linearly at 5.5 mW/K above 60°C. For DHVQFN24 packages: Ptot derates linearly at 4.5 mW/K above 60°C.

Recommended operating conditions

Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Table 5. Operating conditions

74HC_HCT154_6 © NXP B.V. 2007. All rights reserved. Table 6. Static characteristics 74HC154 …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Table 7. Static characteristics 74HCT154 At recommended operating conditions; voltages are referenced to GND (ground = 0 V).

74HC_HCT154_6 © NXP B.V. 2007. All rights reserved. [3] C PD is used to determine the dynamic power dissipation (PD inµW). L × VCC 2 × fo) = sum of the outputs. Table 8. Dynamic characteristics GND (ground = 0 V); CL = 50 pF unless otherwise speciﬁed; for test circuit, seeFigure9.

74HC_HCT154_6 © NXP B.V. 2007. All rights reserved. Test data is given inTable10. T = Termination resistance; should be equal to output impedance Zo of the pulse generator. C L = Load capacitance including jig and probe capacitance. Table 10. Test data

74HC_HCT154_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 12 February 2007 13 of 21 NXP Semiconductors 74HC154; 74HCT154 4-to-16 line decoder/demultiplexer 12. Application information Fig 10. 1-of-16 decoder; LOW level output selected Fig 11. 1-of-16 demultiplexer; logic level on selected outputs follow the logic level on the data input 001aab075 Y15 Y14 strobe E0 001aab076 Y15 Y14 data input E0

74HC_HCT154_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 12 February 2007 14 of 21 NXP Semiconductors 74HC154; 74HCT154 4-to-16 line decoder/demultiplexer 13. Package outline Fig 12. Package outline SOT101-1 (DIP24) UNIT A max. 1 2 b1 cD E e M HL REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm inches DIMENSIONS (inch dimensions are derived from the original mm dimensions) SOT101-1 99-12-27 03-02-13 A min. A max. b wM Ee1 1.7 1.3 0.53 0.38 0.32 0.23 32.0 31.4 14.1 13.7 3.9 15.24 17.15 15.90 2.25.1 0.51 4 0.066 0.051 0.021 0.015 0.013 0.009 1.26 1.24 0.56 0.54 0.15 0.60 0.68 051G02 MO-015 SC-509-24 M H c (e )1 M E A L seating plane w M e D A 2 Z b E pin 1 index 0 5 10 mm scale Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. Z max. (1)(1)(1) DIP24: plastic dual in-line package; 24 leads (600 mil) SOT101-1

74HC_HCT154_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 12 February 2007 15 of 21 NXP Semiconductors 74HC154; 74HCT154 4-to-16 line decoder/demultiplexer Fig 13. Package outline SOT137-1 (SO24) UNIT A max. A 1 A 2 A 3 bp cD (1) E (1) (1)eH E LL p Q Zywv q REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm inches 2.65 0.3 0.1 2.45 2.25 0.49 0.36 0.32 0.23 15.6 15.2 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8 o o 0.25 0.1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.1 0.4 SOT137-1 X w M q AA 1 A 2 bp D H E Lp Q detail X E Z c L v M A (A )3 A y 0.25 075E05 MS-013 pin 1 index 0.1 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.61 0.60 0.30 0.29 0.05 1.4 0.0550.419 0.394 0.043 0.039 0.035 0.0160.01 0.25 0.01 0.0040.043 0.0160.01 e 0 5 10 mm scale SO24: plastic small outline package; 24 leads; body width 7.5 mm SOT137-1 99-12-27 03-02-19

74HC_HCT154_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 12 February 2007 16 of 21 NXP Semiconductors 74HC154; 74HCT154 4-to-16 line decoder/demultiplexer Fig 14. Package outline SOT340-1 (SSOP24) UNIT A 1 A 2 A 3 bp cD (1) E (1) (1)eH E LL p QZ ywv q REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.21 0.05 1.80 1.65 0.38 0.25 0.20 0.09 8.4 8.0 5.4 5.2 0.65 1.257.9 7.6 0.9 0.7 0.8 0.4 o o0.13 0.10.2 DIMENSIONS (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. 1.03 0.63 SOT340-1 MO-150 99-12-27 03-02-19 X w M q A A 1 A 2 bp D H E Lp Q detail X E Z e c L v M A (A )3 A 11 2 24 13 0.25 y pin 1 index 0 2.5 5 mm scale SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm SOT340-1 A max.

74HC_HCT154_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 12 February 2007 17 of 21 NXP Semiconductors 74HC154; 74HCT154 4-to-16 line decoder/demultiplexer Fig 15. Package outline SOT355-1 (TSSOP24) UNIT A 1 A 2 A 3 bp cD (1) E (2) (1)eH E LL p QZ ywv q REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 7.9 7.7 4.5 4.3 0.65 6.6 6.2 0.4 0.3 o o0.13 0.10.21 DIMENSIONS (mm are the original dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 SOT355-1 MO-153 99-12-27 03-02-19 0.25 0.5 0.2 w M bp Z e 11 2 24 13 pin 1 index q AA 1 A 2 Lp Q detail X L (A )3 H E E c v M A XAD y 0 2.5 5 mm scale TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm SOT355-1 A max. 1.1

74HC_HCT154_6 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 06 — 12 February 2007 18 of 21 NXP Semiconductors 74HC154; 74HCT154 4-to-16 line decoder/demultiplexer Fig 16. Package outline SOT815-1 (DHVQFN24) REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. SOT815-1 0 2.5 5 mm scale b yy1 C C AC C Bv M w M terminal 1 index area terminal 1 index area X UNIT A (1) max. A 1 bc e E h Le1 ywv mm 1 0.05 0.00 0.30 0.18 0.5 4.5 1.50.2 2.25 1.95 D h 4.25 3.95 0.05 0.05 0.10.1 DIMENSIONS (mm are the original dimensions) 0.5 0.3 D (1) 5.6 5.4 E (1) 3.6 3.4 D E B A e DHVQFN24: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 24 terminals; body 3.5 x 5.5 x 0.85 mm A A1 c detail X Eh L D h

The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors.
Legal texts have been adapted to the new company name where appropriate.
Table3 on page5: Corrected errors in output information. 74HC_HCT154_5 20041012 Product speciﬁcation - 74HC_HCT154_4 74HC_HCT154_4 20041005 Product speciﬁcation - 74HC_HCT154_3 74HC_HCT154_3 20040601 Product speciﬁcation - 74HC_HCT154_CNV_2

16.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Deﬁnitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.

16.2 Deﬁnitions

Draft —The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modiﬁcations or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet —A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales ofﬁce. In case of any inconsistency or conﬂict with the short data sheet, the full data sheet shall prevail.

16.3 Disclaimers

General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes —NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation speciﬁcations and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use —NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications —Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the speciﬁed use without further testing or modiﬁcation. Limiting values —Stress above one or more limiting values (as deﬁned in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale —NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/proﬁle/terms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conﬂict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license —Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

16.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 17. Contact information For additional information, please visit:http://www.nxp.com For sales ofﬁce addresses, send an email to:salesaddresses@nxp.com Document status[1][2] Product status[3] Deﬁnition Objective [short] data sheet Development This document contains data from the objective speciﬁcation for product development. Preliminary [short] data sheet Qualiﬁcation This document contains data from the preliminary speciﬁcation. Product [short] data sheet Production This document contains the product speciﬁcation.

NXP Semiconductors 74HC154; 74HCT154 4-to-16 line decoder/demultiplexer © NXP B.V. 2007. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 12 February 2007 Document identifier: 74HC_HCT154_6 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 18. Contents

Selected Specification

NXP Semiconductors 74HCT154N overview.

Overview

74HCT154N is listed in the Logic IC category. Available datasheets include documents from NXP Semiconductors. DigiCamel provides a local PDF and searchable HTML technical text for online reference.

Summary

4-to-16 line decoder/demultiplexer Rev. 06-12 February 2007

Description

4-to-16 line decoder/demultiplexer Rev. 06-12 February 2007

Source title 74HCT154N Datasheet(PDF) - NXP Semiconductors

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