74HC123 PHILIPS

Document overview

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Technical content

Product specification Supersedes data of September 1993 File under Integrated Circuits, IC06

1998 Jul 08

Dual retriggerable monostable multivibrator with reset For a complete data sheet, please also download:

  • The IC06 74HC/HCT/HCU/HCMOS Logic Family Specifications
  • The IC06 74HC/HCT/HCU/HCMOS Logic Package Information
  • The IC06 74HC/HCT/HCU/HCMOS Logic Package Outlines

1998 Jul 08 2

Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74HC/HCT123

FEATURES

  • DC triggered from active HIGH or active LOW inputs
  • Retriggerable for very long pulses up to 100% duty factor
  • Direct reset terminates output pulse
  • Schmitt-trigger action on all inputs except for the reset input
  • Output capability: standard (except for nREXT /CEXT )
  • ICC category: MSI GENERAL DESCRIPTION The 74HC/HCT123 are high-speed Si-gate CMOS devices and are pin compatible with low power Schottky TTL (LSTTL). They are specified in compliance with JEDEC standard no. 7A. The 74HC/HCT123 are dual retriggerable monostable multivibrators with output pulse width control by three methods. The basic pulse time is programmed by selection of an external resistor EXT ) and capacitor (CEXT ). The external resistor and capacitor are normally connected as shown in Fig.6. Once triggered, the basic output pulse width may be extended by retriggering the gated active LOW-going edge input (n A) or the active HIGH-going edge input (nB). By repeating this process, the output pulse period (nQ = HIGH, n Q = LOW) can be made as long as desired. Alternatively an output delay can be terminated at any time by a LOW-going edge on input n R D , which also inhibits the triggering. An internal connection from nR D to the input gates makes it possible to trigger the circuit by a positive-going signal at input n R D as shown in the function table. Figures 7 and 8 illustrate pulse control by retriggering and early reset. The basic output pulse width is essentially determined by the values of the external timing components R EXT and CEXT . For pulse widths, when CEXT < 10 000 pF, see Fig.9. When C EXT >10 000 pF, the typical output pulse width is defined as: tW = 0.45× R EXT × C EXT (typ.), where: tW = pulse width in ns; R EXT = external resistor in kΩ ; C EXT = external capacitor in pF. Schmitt-trigger action in the nA and nB inputs, makes the circuit highly tolerant to slower input rise and fall times. The ‘123’ is identical to the ‘423’ but can be triggered via the reset input. QUICK REFERENCE DATA GND = 0 V; T amb =2 5°C; tr =tf=6n s Notes 1. C PD is used to determine the dynamic power dissipation (PD inµW): PD =C PD × VCC 2 × fi+ ∑ (CL × VCC 2 × fo) + 0.75× C EXT × VCC 2 × fo + D × 16 × VCC where: fi= input frequency in MHz fo = output frequency in MHz D = duty factor in % C L = output load capacitance in pF VCC = supply voltage in V C EXT = timing capacitance in pF ∑ (CL × VCC 2 × fo) sum of outputs 2. For HC the condition is VI= GND to VCC For HCT the condition is VI= GND to VCC − 1.5 V SYMBOL PARAMETER CONDITIONS TYPICAL UNIT HC HCT tPHL / tPLH propagation delay C L =1 5p F ; VCC =5V ; R EXT =5k Ω ; C EXT =0p F nA, nB to nQ, nQ2 6 2 6 n s nR D to nQ, nQ 20 23 ns C I input capacitance 3.5 3.5 pF C PD power dissipation capacitance per monostable notes 1 and 2 54 56 pF

1998 Jul 08 3

Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74HC/HCT123

ORDERING INFORMATION

74HC123N; 74HCT123N DIP16 plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 74HC123D; 74HCT123D SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1 74HC123DB; 74HCT123DB SSOP16 plastic shrink small outline package; 16 leads; body width 5.3 mm SOT338-1 74HC123PW; 74HCT123PW TSSOP16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 PIN NO. SYMBOL NAME AND FUNCTION 1, 9 1 A, 2A trigger inputs (negative-edge triggered) 2, 10 1B, 2B trigger inputs (positive-edge triggered) 3, 11 1 R D , 2R D direct reset LOW and trigger action at positive edge 4, 12 1 Q, 2Q outputs (active LOW)

72 R EXT /CEXT external resistor/capacitor connection

8 GND ground (0 V)

13, 5 1Q, 2Q outputs (active HIGH) 14, 6 1C EXT , 2CEXT external capacitor connection 15 1R EXT /CEXT external resistor/capacitor connection

16 V CC positive supply voltage

Fig.1 Pin configuration. Fig.2 Logic symbol. Fig.3 IEC logic symbol.

1998 Jul 08 4

Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74HC/HCT123 Fig.4 Functional diagram. FUNCTION TABLE Note 1. If the monostable was triggered before this condition was established, the pulse will continue as programmed. INPUTS OUTPUTS n R D nAn B n Q n Q LXXL H XH X L (1) H (1) XX L L (1) H (1) HL ↑ H ↓ H ↑ LH H = HIGH voltage level L = LOW voltage level X = don’t care ↑ = LOW-to-HIGH transition ↓ = HIGH-to-LOW transition = one HIGH level output pulse = one LOW level output pulse Fig.5 Logic diagram. (1) For minimum noise generation, it is recommended to ground pins 6 (2CEXT ) and 14 (1CEXT ) externally to pin 8 (GND).

1998 Jul 08 5

Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74HC/HCT123 DC CHARACTERISTICS FOR 74HC For the DC characteristics see“74HC/HCT/HCU/HCMOS Logic Family Specifications”. Output capability: standard (except for nREXT /CEXT ) ICC category: MSI Fig.6 Timing component connections.

1998 Jul 08 6

Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74HC/HCT123 AC CHARACTERISTICS FOR 74HC GND = 0 V; tr =tf= 6 ns; CL =5 0p F SYMBOL PARAMETER Tamb (°C) UNIT TEST CONDITIONS 74HC VCC (V) WAVEFORMS/ NOTES+25 −40 to +85 −40 to +125 tPLH propagation delay nR D , nA, nB to nQ 255 320 385 ns 2.0 4.5 6.0 C EXT = 0 pF; R EXT =5k Ω tPLH propagation delay nR D , nA, nB to nQ 255 320 385 ns 2.0 4.5 6.0 C EXT = 0 pF; R EXT =5k Ω tPHL propagation delay nR D to nQ (reset) 215 270 325 ns 2.0 4.5 6.0 C EXT = 0 pF; R EXT =5k Ω tPLH propagation delay nR D to nQ (reset) 215 270 325 ns 2.0 4.5 6.0 C EXT = 0 pF; R EXT =5k Ω tTHL / tTLH output transition time 110 ns 2.0 4.5 6.0 t W trigger pulse width nA = LOW 100 125 150 ns 2.0 4.5 6.0 Fig.7 t W trigger pulse width nB = HIGH 100 125 150 ns 2.0 4.5 6.0 Fig.7 t W reset pulse width nR D = LOW 100 125 150 ns 2.0 4.5 6.0 Fig.8 t W output pulse width nQ = HIGH n Q = LOW 450 −−µ s 5.0 C EXT = 100 nF; R EXT =1 0kΩ ; Figs 7 and 8 tW output pulse width nQ = HIGH n Q = LOW 75 −− ns 5.0 C EXT = 0 pF; R EXT =5k Ω ; note 1; Figs 7 and 8 trt retrigger time nA, nB 110 −− ns 5.0 C EXT = 0 pF; R EXT =5k Ω ; note 2; Fig.7 R EXT external timing resistor 1000 1000 −− kΩ 2.0 5.0 Fig.9 C EXT external timing capacitor no limits pF 5.0 Fig.9; note 3

1998 Jul 08 7

Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74HC/HCT123 DC CHARACTERISTICS FOR 74HCT For the DC characteristics see“74HC/HCT/HCU/HCMOS Logic Family Specifications”. Output capability: standard (except for nREXT / CEXT ) ICC category: MSI Note to HCT types The value of additional quiescent supply current (ΔICC ) for a unit load of 1 is given in the family specifications. To determineΔICC per input, multiply this value by the unit load coefficient shown in the table below. INPUT UNIT LOAD COEFFICIENT nA, nB 0.35 nR D 0.50

1998 Jul 08 8

Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74HC/HCT123 AC CHARACTERISTICS FOR 74HCT GND = 0 V; tr =tf= 6 ns; CL =5 0p F SYMBOL PARAMETER Tamb (°C) UNIT TEST CONDITIONS 74HCT VCC (V) WAVEFORMS/ NOTES+25 −40 to +85 −40 to +125 tPHL propagation delay nR D , nA, nB to nQ 30 51 64 77 ns 4.5 C EXT = 0 pF; R EXT =5k Ω tPLH propagation delay nR D , nA, nB to nQ 28 51 64 77 ns 4.5 C EXT = 0 pF; R EXT =5k Ω tPHL propagation delay nR D to nQ (reset) 27 46 58 69 ns 4.5 C EXT = 0 pF; R EXT =5k Ω tPLH propagation delay nR D to nQ (reset) 23 46 58 69 ns 4.5 C EXT = 0 pF; R EXT =5k Ω tTHL / tTLH output transition time 7 15 19 22 ns 4.5 tW trigger pulse width nA = LOW 20 3 25 30 ns 4.5 Fig.7 tW trigger pulse width nB = HIGH 20 5 25 30 ns 4.5 Fig.7 tW reset pulse width nR D = LOW 20 7 25 30 ns 4.5 Fig.8 tW output pulse width nQ = HIGH n Q = LOW 450 −− µ s 5.0 C EXT = 100 nF; R EXT =1 0kΩ ; Figs 7 and 8 tW output pulse width nQ = HIGH n Q = LOW 75 −− ns 5.0 C EXT = 0 pF; R EXT =5k Ω ; note 1; Figs 7 and 8 trt retrigger time nA, nB 110 −− ns 5.0 C EXT = 0 pF; R EXT =5k Ω ; note 2; Fig.7 R EXT external timing resistor 2 1000 −− kΩ 5.0 Fig.9 C EXT external timing capacitor no limits pF 5.0 Fig.9; note 3

1998 Jul 08 9

Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74HC/HCT123 Notes to AC characteristics 1. For other REXT and CEXT combinations see Fig.9. If CEXT > 10 nF, the next formula is valid: tW =K × R EXT × C EXT (typ.) where: tW = output pulse width in ns; R EXT = external resistor in kΩ ; CEXT = external capacitor in pF; The inherent test jig and pin capacitance at pins 15 and 7 (nREXT / CEXT ) is approximately 7 pF. 2. The time to retrigger the monostable multivibrator depends on the values of REXT and CEXT . The output pulse width will only be extended when the time between the active-going edges of the trigger input pulses meets the minimum retrigger time. If C EXT > 10 pF, the next formula (at VCC = 5.0 V) for the set-up time of a retrigger pulse is valid: trt= 30 + 0.19× R EXT × C EXT 0.9+1 3× R EXT 1.05 (typ.) where: t rt = retrigger time in ns; C EXT = external capacitor in pF; R EXT = external resistor in kΩ . The inherent test jig and pin capacitance at pins 15 and 7 (nREXT / CEXT ) is 7 pF. 3. When the device is powered-up, initiate the device via a reset pulse, when CEXT < 50 pF.

1998 Jul 08 10

Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74HC/HCT123 AC WAVEFORMS Fig.7 Output pulse control using retrigger pulse; nR D = HIGH. Fig.8 Output pulse control using reset input in nR D ; nA = LOW. Fig.9 Typical output pulse width as a function of the external capacitor values at VCC = 5.0 V and Tamb =2 5°C. Fig.10 HCT typical “k” factor as a function of VCC ; C X = 10 nF; RX =1 0kΩ to 100 kΩ .

1998 Jul 08 11

Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74HC/HCT123

APPLICATION INFORMATION

When the monostable is powered-up it may produce an output pulse, with a pulse width defined by the values of RX and CX, this output pulse can be eliminated using the circuit shown in Fig.11. Power-down considerations A large capacitor (CX) may cause problems when powering-down the monostable due to the energy stored in this capacitor. When a system containing this device is powered-down or a rapid decrease of V CC to zero occurs, the monostable may substain damage, due to the capacitor discharging through the input protection diodes. To avoid this possibility, use a damping diode (D preferably a germanium or Schottky type diode able to withstand large current surges and connect as shown in Fig.12 Fig.11 Power-up output pulse elimination circuit. Fig.12 Power-down protection circuit.

1998 Jul 08 12

Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74HC/HCT123 PACKAGE OUTLINES UNIT A max. 1 2 b1 cE e M HL REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm inches DIMENSIONS (inch dimensions are derived from the original mm dimensions) SOT38-1 92-10-02 95-01-19 A min. A max. b max.wM Ee1 1.40 1.14 0.055 0.045 0.53 0.38 0.32 0.23 21.8 21.4 0.86 0.84 6.48 6.20 0.26 0.24 3.9 3.4 0.15 0.13 0.2542.54 7.62 0.30 8.25 7.80 0.32 0.31 9.5 8.3 0.37 0.33 2.2 0.087 4.7 0.51 3.7 0.15 0.021 0.015 0.013 050G09 MO-001AE M H c (e )1 M E A L seating plane w M e D A 2 Z b E pin 1 index 0 5 10 mm scale Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. (1) (1)D (1)Z DIP16: plastic dual in-line package; 16 leads (300 mil); long body SOT38-1

1998 Jul 08 13

Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74HC/HCT123 X w M θ AA 1 A 2 bp D H E Lp Q detail X E Z e c L v M A (A )3 A y pin 1 index UNIT A max. A 1 A 2 A 3 bp cD (1) E (1) (1)eH E LL p QZ ywv θ REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 o o 0.25 0.1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 1.0 0.4 SOT109-1 95-01-23 97-05-22 076E07S MS-012AC 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.39 0.38 0.16 0.15 0.050 1.05 0.0410.244 0.228 0.028 0.020 0.028 0.0120.01 0.25 0.01 0.0040.039 0.016 0 2.5 5 mm scale SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1

1998 Jul 08 14

Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74HC/HCT123 UNIT A 1 A 2 A 3 bp cD (1) E (1) eH E LL p QZ ywv θ REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 6.4 6.0 5.4 5.2 0.65 1.257.9 7.6 1.03 0.63 0.9 0.7 1.00 0.55 o o0.130.2 0.1 DIMENSIONS (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. SOT338-1 94-01-14 95-02-04 (1) w M bp D H E E Z e c v M A X A y 1 8 16 9 θ AA 1 A 2 Lp Q detail X L (A )3 MO-150AC pin 1 index 0 2.5 5 mm scale SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm SOT338-1 A max. 2.0

1998 Jul 08 15

Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74HC/HCT123 UNIT A 1 A 2 A 3 bp cD (1) E (2) (1)eH E LL p QZ ywv θ REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.40 0.06 o o0.13 0.10.21.0 DIMENSIONS (mm are the original dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 SOT403-1 MO-153 94-07-12 95-04-04 w M bp D Z e 0.25 16 9 θ AA 1 A 2 Lp Q detail X L (A )3 H E E c v M A XA y 0 2.5 5 mm scale TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm SOT403-1 A max. 1.10 pin 1 index

1998 Jul 08 16

Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74HC/HCT123 SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (order code 9398 652 90011). DIP SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T stg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. R EPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300°C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400°C, contact may be up to 5 seconds. SO, SSOP and TSSOP R EFLOW SOLDERING Reflow soldering techniques are suitable for all SO, SSOP and TSSOP packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250°C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. W AVE SOLDERING Wave soldering can be used for all SO packages. Wave soldering isnot recommended for SSOP and TSSOP packages, because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices. If wave soldering is used -and cannot be avoided for SSOP and TSSOP packages - the following conditions must be observed:

  • A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used.
  • The longitudinal axis of the package footprint must be parallel to the solder flow and must incorporate solder thieves at the downstream end. Even with these conditions:
  • Only consider wave soldering SSOP packages that have a body width of 4.4 mm, that is SSOP16 (SOT369-1) or SSOP20 (SOT266-1).
  • Do not consider wave soldering TSSOP packages with 48 leads or more, that is TSSOP48 (SOT362-1) and TSSOP56 (SOT364-1). During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260°C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150°C within 6 seconds. Typical dwell time is 4 seconds at 250°C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.

1998 Jul 08 17

Philips Semiconductors Product specification Dual retriggerable monostable multivibrator with reset 74HC/HCT123 R EPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonally- opposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300°C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320°C. DEFINITIONS LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Where application information is given, it is advisory and does not form part of the specification.