74337 MOLEX
Document overview
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Technical content
FEATURES AND SPECIFICATIONS 0.80mm (.031") Pitch Ultra+ VHDCI Wire-to-Board Receptacle 74337 Stacked, Right Angle Features and Benefits I Conforms to EIA/SFF specifications to ensure intermateability with conforming parts I Gold flash over Palladium Nickel plating for a high durability/reliability interface I Dual-stack, single-piece design provides space savings with one-step PCB processing I Optional cover to protect from contact damage during handling I Available with or without screwlock hardware (71433-0002) I One-piece enhanced face shield for improved EMI/RFI performance and simple ground termination process Reference Information Product Specification: PS-71425-9999 Packaging: Tray UL File No.: E29179 CSA File No.: LR19980-5 Mates With: Ultra+ VHDCI plug kit 71425 Designed In: Millimeters Electrical Voltage: 30V Current: 0.5A Contact Resistance: 50m Ω max. Dielectric Withstanding Voltage: 250V AC Insulation Resistance: 500 M Ω min. Mechanical Mating Force: 0.49N (0.11 lb) Unmating Force: 0.15N (0.03 lb) Durability: 500 cycles Physical Housing: Black, high-temperature thermoplastic, UL 94V-0 Contact: Phosphor Bronze Plating: Gold flash over Palladium Nickel PCB Thickness: 1.57 and 2.36mm (.062 and .093") Operating Temperature: -55 to +85°C CATALOG DRAWING (FOR REFERENCE ONLY) Version 1 footprint shown. Version 4 footprint features two board lock holes for the upper connector and two board lock holes for the lower connector (refer to Sales Drawing for details). ORDERING INFORMATION AND DIMENSIONS * Without enhanced shield and ground tabs Circuits Order No. Footprint Version Dimension PWith Screwlocks With Cover With Screwlocks and Cover Without Screwlocks or Cover 136 74337-0040 74337-0012 74337-0038 74337-0016 1 2.08 (.082) 74337-0064 74337-0051* 74337-0054 74337-0061 4 2.08 (.082) 74337-0039 74337-0011 74337-0037 74337-0015 1 2.30 (.090) 74337-0073 74337-0070 74337-0072 74337-0071 1 3.44 (.135) Americas Headquarters Lisle, Illinois 60532 U.S.A. Tel:1-800-78MOLEX Fax:630-969-1352 Far East North Headquarters Yamato, Kanagawa, Japan Tel:81-462-65-2324 Fax:81-462-65-2366 Far East South Headquarters Jurong, Singapore Tel:65-6-268-6868 Fax:65-6-265-2985 European Headquarters Munich, Germany Tel:49-89-413092-0 Fax:49-89-401527 Corporate Headquarters 2222 Wellington Ct. Lisle, IL 60532 U.S.A. Tel:630-969-4550 Visit our Web site at http://www.molex.com/product/vhdci.html Order No. USA-172 Printed in USA/2.5K/JI/JI/2002.05 2002, Molex
0.80mm (.031") Pitch Ultra+ VHDCI Wire-to-Board Dual Stack Receptacle The new 0.80mm (.031") Pitch Dual Stack Ultra+ VHDCI (Very High Density Cable Interface) connectors from Molex are ideal for demanding next generation SCSI applications. They have been designed to meet ANSI/SFF-8441 and SPI-4 requirements while supporting HBA applications and other equipment requiring high port densities. These space-saving dual-stacked receptacles have 136 circuits in a two-row configuration, providing the most features for maximum performance and reliability. An optional cover is available, eliminating risk of electrical shorts to panels or adjacent printed circuit boards in densely packaged equipment. Panel grounding tabs provide a superior ground path to a panel or bracket for maximum EMI protection. High performance terminals with lead-ins that have a large radius minimize stubbing while improving plug insertion.
APPLICATIONS
I File and Network Servers I RAIDs (Redundant Arrays of Independent Disks) I Network Attached Storage (NAS) devices I PCI Add-In cards I Host Bus Adapter (HBA) cards I Workstations I Other data transfer applications