6MBP20RY060 FUJI

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3iti DeviceName : — IGBT-IPM nae TypeName : 6MBP20RY060 Hint Spec.No. __:__ MS6M0363 Ean rd Hit E2se8 Fuji Electric Co.,Ltd. Matsumoto Factory ; [NJ pate [Name [arrroven] Fuji Electric Co.,Ltd. omen) 2 Zs Akoya’ MS6IM0363 11 ee ae ee eas FF an H04-004-07

jl. Issued toy 2 ee ed ee Sep-29| Aebtrtom , pecking Spee Kep 24) 5 aye _ ray [Revision Reason. ohne 3/4 | 148 ly A(Yilasl 15. Ebay hav. - 19 | Corecton orrers io writinny ev 1? | ope - 48 Come con Addite platy spec - 148 ly “ AC habit Sik h-23 : : Revisten :Siae of padeng box Feb - >> ; "4 Revision e chan: Errrs Ww uriheg | 44 a Chalacwr SK 23236 . : ant Ey Fuji Electric Co.,Ltd. MS6M0363 ao H04-004-03

  1. Outlines ( +72) Dimensions in mm . -O- § = 2 a 3 i |3 isi ¢@ 2 = : i 13 Ss 5 § : i ° 2.3 .¢ 5 : 1 - ER Ewe Lo ci Syars t i 3 ve 2 —— -gR 2H EF = | @D Reeser = Ta _ = wig eget? 2 @ HoenegMeand fe 3 eal] a Ane. - Fah entgs fal < i 7 Bejececes Si B lle BOR Sc ee isl 2 im) el Burs oUgseé~rRS = 2 lel Base sow ow 7 PI 3 SY lei, z3c5 7 *@ “ 3 eit a332 & 2 =, * £38 He - ee 2558, ° | 25238 : L | lea} — pees f: el seca dj |e a ' fe ged E332 — 2 ' . [sl oa AT i z fe =| 2) | = ee Uy a eS eet PE

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| ig |=) | ef 6g io i a [ed all im 3) tae a : £O\\s ica STE | GE 20S ot 4 _ psd —Ta . 3/1 FE Fuji Electric Co.,Ltd. MS6M0363 Le H04-004-03

  1. Block Diagram ( JOy 7) po oct | Pre-driver 1 OP @vecU C—4 Voc OHO | tC SGNDO Z\\ @endu O Ou | Pre-driver 1 | LY ZX SGNDO | ®vinv O—9IN_ end ouTo | res @«Gnpv CE TI CO) Vv | Pre-driver 1 | @Veew CO—49 Veo OHO | yy Z\\ SGNDO | ®@vinw O—'N end outro | ne 9 23 #2 @enow OC) Ow goo? 2yi3 Pre-driver 2 2328 | | 2hse OHX | 23235 : OUTXO | z 53 ze | OHYO | 22124] @vmnyv Q—dnv — sanovg——# ZN | SEuTt3 Bae a | OUTYO 23322 @vinz Q— nz | | | © N1 | OHZO 2 4 senoz6____3 Z\\ I ®AM © ALM ouTzo | | A id SS he en ae @cndD © | Lo I Pre-driver 1 includes following functions. (P-side) Pre-driver 2 includes following functions. (N-side) @ 7 (1) Amplifier for drive (1) Amplifier for drive (2) Power supply under voltage protection (2) Power supply under voltage protection (3) IGBT chip over heating protection (3) IGBT chip over heating protection (4) Over current protection (5) Alarm signal output i i g ant Ee Fuji Electric Co.,Ltd. 2 MS6M0363 aan rT HO04-004-03
  1. Maximum Ratings ( BX) (Tc=25°C unless otherwise specified) DC Bus Voltage a ee ee Input Voltage of Power Supply for Pre-Driver : -0.3~20 g3) aoe 2322 | |tsolating Voltage (Terminal to base.50/60Hz sine wave 1min.) AC 2500 Vv erie: efeed 38832 fesse 25°te egtee E52 sit Fuji Electric Co.,Ltd. | MS6M0363 e+ 5 ae H04-004-03
  1. Electrical Characteristics ( BAH#t£)

4.1 Electrical Characteristics of Power Circuit ( = EIB Sa tett)

(Tj=Te=25°C, Vec=15V) ee Sir [ns i | [ne [0] Collector Current at off Signal Input| 1GES [vcE=6oov. tinsoma | - | - | 1.0 | ma| Collector-Emitter Saturation vor) fox tmeiona | - | - [27 | v | Voltage

4.2 Electrical Characteristics of Control Circuit ( af 8B ES HOt)

(Tj=Te=25°C, Vec=15V) es Pre-driver (one unit) 'ccp lin=OmA, 20 mA Pre-driver 3¥r% 2328 mA F 3e 5 Current. 52328 2222 | [Over Heating Protection (JA RAPRE) (2238 = = £3225 | [Temperature Level 2538 7 £3254 lover Current Protection (MH RH) d222% He SEE| [Collector Current Protection Level | 100 reside, (N1-N2 open) | 24 | 30 | a6 | a | Power Supply Under Voltage Protection (@M@ EEF Ri) Level a Alarm Signal Output (7I—-LME SHA) . : ett AH Fuji Electric Co.,Ltd. MS6M0363 Ta H04-004-03

  1. Switching Characteristics ( A4» FU 7 tt) (Tj=Te=25°C, Veo=15V) Tre Se [ens Dn [om [| Switching Time (IGBT) Ic=20A, VDC=300V [os | - | - | us | Switching Time (FWD) | tr finductive-Load Fig. 3 | - | - | 05 | us | 6. Thermal Characteristics ( #4#tt) (Tj=To=25°C, Veo=15V) a Gaus to Fir Thermal Reurance wih Conpona | ewe | = [aos | - [rom] - Bi 7. Recommendable Value ( #324) ae0i 2238 | [Range of Pre-drive #5588 8. Weight ( Z#) a a 7 : 71 FE Fuji Electric Co.,Ltd. MS6M0363 aH a H04-004-03

WOOT. Ic H ‘ 1ALM : i toc "+ Fig. 1. Definition of OC protection delay time (_ 18 i fe 3632 4.05 HO FH) _ Soft shutdown 3323 Ic Ic aan cf poo! 2328 : H 38 IALM ALM |ALM PPise Fig. 2. Definition of protection delay time at s! ircuit ( #3 Sic) ) Sut38 E4Rs¢ 223i? last Fessé Input signal (lin) * 90%" fe : : Collector + ' : : current | / : : (re) ' : beer Sees 10% ton toff Fig. 3. Definition of switching time ( 24 vy FY FEM OR) g at Fuji Electric Co.,Ltd. 3| MS6M0363 i H04-004-03

  1. Typical Application Circuit ( @ FEB) IPM Opto-Coupler OF 10yF © 3 Pept 2s ih] [0 - O.AuF 10uF Os apt te Ha TT ° O 4 - O1uF 10uF Os uO apt _ 2) sure —— O7r vO bet: — On 2328 vec] 257 7 they rt : wO ZHI 53232 22558 a--- 2 as Pes >

23323 IF 1 smo ir@)

Pra ' eesa rt Ka n2© O #2s=2 tt O 14 if. at O 15 O 10 O.1uF S3uF - Recommendale condition of Opto-coupler ( #27kb A775 HAH) . . Input Forward Current of , ; ont I Fuji Electric Co.,Ltd. MS6M0363 z+ H04-004-03

  1. Application Guideline ( @HROZB#A) - The wiring between the opto-couplers and the input terminals of the IPM should be as short as possible. The stray capacitance between primary and secondary side of the opto-couplers should not be increased by pattern lay-out of the control circuits. DAK AITEPMOADBFEMRBIS TE SEITE L. DA b DITOR 2 RMORK ARS ME HEIGL LAP DR EL TC RELY - Capacitors should be connected between Vcc and GND terminals of the opto-coupler as closely as possible. Dah AFF OVecGNDAMIDlé, DU FU ECE SEMABL TRY HIT TS ESL. - Each power supplies for drive circuits should not have transient voltage fluctuation. Four power ‘supplies which are isolated should be applied individually. SHALASRBELLHOOGW, BRE NIL OS 4 BRU SAL CK KS. - In order to prevent noise from AC line, connect capacitor (approx. 4.7nF) between three-phase line and earth. ACS LUPE OD/ AXOBAEMC KM. 3 BERT —AMIL4 FBEOAY Fy EK LT< HEL. - Do not connect N2-terminal of main circuit to ground (GND) of the control circuit. AAMBOTS VE GND)& ERBNGAFE RL BUY TK EEL. Beil 11. Heat sink mounting precautions ( | P MOBY ft(t ik) 2 3 3 - A mounting surface of a heat sink should be finished to a roughness below 10um and a flatness : 3 Fe z between screw holes below 100um. If the flatness is below -100um, a thermal resistance between z z= 2s an IPM and a heat sink is increased. If the flatness is over +100um, there is the danger of the $2338 isolation failure. 5323] 1 PMERY HSE hb DUO MOREG IS, BE Wu mUR, ATEN CORO FBE Bett ( RY) W0umBAICL TRE. FBEAHOu MEL FOMA. Eb YU DAO ALE =? 237 PAMWMLET. Hk. FBEMOymMULORA, PRBRE RO TERME EF. = 33 H 3 - Apply a thermal compound between an IPM and a heat sink to reduce a contact thermal resistance. 2225 ARMIEIE DEC TSAI. | PMEER YY 7 OMIZY TIAL NOE EBAL T 237 z 2 - Mount an IPM in parallel with extruded direction of a heat sink to reduce an influence of a change of a heat sink, when a heat sink which is made by an extruder is applied. FLL BIC k 7 TH Nhe bh YU VERA SRA. Eb LU 7 ORBORBE DS < TSMC] PMEE bY OFL ML AME FAIRY HITT RELY | { Ssooum | Heat sink | . | | a na eee | I npn | i <_ Extruded direction Tat) H04-004-03
  1. Packing and indication ( #at 2%) © ig im Material : Corrugated cardbord RTS a] Weight : Approx. 3.1kg (max.) ROY BE £#53.1ke BH) SS or Quantity: 50pes (max.) a 276 383 aE 5048 (RX) PartNo. Lot No. Sx Ovhas £33 — aad AK Quantity 23228 & fii 43. Storage and transportation notes ( ##. ZRLOZESR) Eas ? - The IGBT-IPM should be stored at a standard temperature of 5 to 35°C and humidity of 45 to 75%. Hare SACHERBRAMZELL, ( 5 ~35 °C, 45 ~75 %) zig: H - Store modules in a place with few temperature changes in order to avoid condensation on the 383 2e module surface. Pasi BMEBERMGULE, ( EVa—WRBMBBL ECL) z 32 H 2 - Avoid exposure to corrosive gases and dust. BRKiZOREBM. BKOSUBMLBIS OC. - Avoid excessive external force on the modules. $BAMRICA EADS GSS ICEBTSCE. - Store modules with unprocessed terminals. EVAN OBFISRMLORECREFSCL. - Don't drop and shock the modules during transportation. MRICGRE SALLY BRS tevoe. 14. Operation environment ( 4 FAR) - Avoid exposure to corrosive gases. Rati AZOBAATORASHITSCL. 15. Applicable category ( @FA#GBH) - This specification is applied to the IGBT-IPM named 6MBP20RY060. RHE. IGBT-IPM( 2/3: 6MBP2ORY060) IC@ATS. @ Ter a a H04-004-03