55900000001 LITTELFUSE
Document overview
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Technical content
© 2021 Littelfuse, Inc. Specifications are subject to change without notice. Revised: GD. 05/17/21 559/560 Series Fuse Blocks for TE5/TR5 Type Fuses RoHS Dimensions (Units in mm) R0.75 1.4 5.08 Ø 9.5 Ø 0.5 A 1.3 3.03 Ø 1 Ø 10 7. 1 8 1.2 R0.33.8 0.9 5.2±0.1 1±0.1 0.5 7. 1 8 1.3±0.1 5.08 1±0.1 A
559 Series
560 Series
559 Series 560 Series
Application testing is strongly recommended. Resources
559 Series Holder 560 Series Holder
559 Series (Lead Free) 560 Series
Holder: Black Thermoplastic, UL94 V-0 Holder: Thermoplastic, UL 94 V-0 Metal Parts: Copper alloy; solderable tinned Electrical Data (23ºC) Rated Voltage: 250V Max. Current/Power: 6.3 A /1 .6 W Mounting PC Board, 7 .18 mm pin spacing PC Board, 5.08 mm pin spacing Solderability max. 260 ºC, 10 s (Wave) Minimum Cross Section Conducting path - 0.1 mm2 Unit Weight 0.63 g 0.4 g Ambient T emperature -40 °C to +85 °C
Ordering Information
Ordering Number “ A” Height Options Packaging 55900000001 6.5 mm (code 0001) 1000 Pcs Bulk 55900008011 10 mm (code 8011) 100 Pcs Bulk 56000001319 3.0 mm (code 1319) 500 Pcs Bulk 56000001009 4.3 mm (code 1009) 500 Pcs Bulk 56000001019 4.3 mm (code 1019) 1000 Pcs Bulk
© 2021 Littelfuse, Inc. Specifications are subject to change without notice. Revised: GD. 05/17/21 559/560 Series Fuse Blocks for TE5/TR5 Type Fuses Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at: www.littelfuse.com/disclaimer-electronics. Soldering Parameters - Wave Soldering Dwell Time 100 120 140 160 180 200 220 240 260 280 300 100 110 120 130 140 150 160 170 180 190 200 210 220 230 240 Time (Seconds) Temperature (°C) - Measured on bottom side of board Cooling TimePreheat Time Wave Parameter Lead-Free Recommendation Preheat: (Depends on Flux Activation Temperature) (Typical Industry Recommendation) Temperature Minimum: 100° C Temperature Maximum: 150° C Preheat Time: 60-180 seconds Solder Pot Temperature: 280° C Maximum Solder Dwell Time: 2-5 seconds Recommended Process Parameters: Solder Iron Temperature: 350° C +/- 5°C Heating Time: 5 seconds max. Note: These devices are not recommended for IR or Convection Reflow process. Recommended Hand-Solder Parameters: