5406526-1 MACOM
Document overview
- Manufacturer or author: Provided By digicamel.com
- PDF pages: 1
Technical content
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1 MATERIAL:
HOUSING — HIGH TEMPERATURE THERMOPLASTIC, BLACK, UL94V—0; IR REFLOW SOLDERING PROCESS | COMPATIBLE. TERMINALS — .36[.014] THICK PHOS BRONZE PLATED WITH 3.81um[.000150] MINIMUM THICK MATTE TIN IN SOLDER AREA. 1.27 tum [.000050] MINIMUM GOLD IN LOCALIZED PLATE A AREA, ENTIRE TERMINAL PLATED WITH 1.27um D [.000050] MINIMUM THICK NICKEL. D 32.26+0.25 | [1.270+.010] 2. JACK CAVITY CONFORMS TO FCC RULES AND | REGULATIIONS PART 68, SUBPART F. 31.50+0.25 15.24 [1.240+.010] ZA\\ SUGGESTED PANEL OPENING DIMENSIONS. [.600] | a ZA. SUGGESTED CLEARANCE BETWEEN BOTTOM OF CONNECTOR -oI -oI AND BOTTOM PANEL OPENING. | 2.54 e 5 e & | heieal Hawa 4 AH ame 4 A 12.83+0.25 lineminintiaiiet| laserriamieisil 13.59+0.25 338 sooo) | TMT SIT meeepore UII 0 [agi LITT 2 | ; y UTTOTT fr 7 0.38 | ¢ OF ASSEMBLY SISA | 5.08 Cc [.200] C 2.54 2 PLACES L209) PICAL | 4.32 | ~170 | Lb | [-2-] | B B | 79 oo$$ “bodg. TYP | CAL Ty ty ty ry ra’ fay fay fay | Tar VF TO B DETERMINED 100 \\ BY ,CUSTOMER TYPICAL IN 03.2540.08 fo \\ 05.2540 .08 TYPICAL ey 28.45 | 1.120 GO.89+0.08 -035+.003 | 16 PLACES | A 5406526—1 A | SUGGESTED PRINTED CIRCUIT BOARD LAYOUT [ne rne x coon commer FF woo Se | em tm Ses conn | Eecoonts Harrisburg, Pa 17105-3608 TOLERANCES UNLESS: J.WESTMAN Bootronios (COMPONENT SIDE) P| RRR Pe ccucen | INVERTED MOD JACK ASSEMBLY, 1x2 iO PLC te PRODUCT SPEC ~ | oS : eT -
3 PLC £- APPLICATION SPEC
| “ ‘SEE NOTE 1 “ SEE NOTE 1 err AT 00779|G=5406526 _ | | AMP 4805 REV 31MAR2000 7