505110MB005XX06XX SUYIN-USA
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Technical content
— ; x . a A z q A . i eld =] Dimensional Information SUYIN P/NO. SUYIN P/NO.(OLD.) DIM.D 1 F ——— 5051 10MBO02Xx00ZU | 5010A—O2GXx. — a } } a 5051 10MBO03XX00ZU | 5010A—O03GXX 5.0 F) | / / + 505110MB004Xx002U | 5010A—04GXx 10.0 4 qe ( { 5 505 110MB005xx002U | 5010A—O5GXx 15.0 | \\ | 505110MB006xxX00ZU | 5010A-06GXx. 20.0 “| 505110MBOO7XX00ZU | 5010A—O07GXX 25.0 S| 5051 10MBOO8XXO0ZU | 5010A-OBGXXx 30.0 q \\{l] be 5051 10MBOO9XXO0ZU | 5010A-O9GXX 35.0 | 505110MB010Xx00ZU | 5010A—10GXx 40.0 1.50 A+0.3 o q a = @ NOTE(!) 40.15 505 rowspa0 soy 5.00 1.96 1. No. of pins J a 2. Plating FT > 'G1,-05u” gold over nickel \\ | 'G2,-Indicate gold flash | | 'G3,-10u” gold over nickel
4 J | 2 'G4,-15u” gold over nickel
i a Fa] = °G5,-30u” gold over nickel | 5 sl 4 $1,-05u" Min. gold in contact areo/ I | +—-€ 100u” Min. Tin in solder area d | ao~% 'S2,-Gold flash in contact area/ ap bet 4 100u" Min. Tin in solder area | "S3,-10u" Min. gold in contact area/ - 5 a 100u” Min. Tin in solder area 3 0.80 ° 4 a 00.86 . || 0.50 "$4,-15u" Min. gold in contact area/ D+0.1 100u" Min. Tin in solder area $5,-30u" Min. gold in contact area/ Recommended P.C.B Layout 100u" Min. Tin in solder area y 5.00 1.20 91.0 Zl / | Bo BB AS Aaa - rT i =F Jel ji 4 4 c a Vert 4 of 4 i NO[DESCRIPTION|MATERIAL|COLOR| REMARK ht it it Mt ht uu uu uu uu uh yj SUYIN d D+0.1 ——— CONNECTOR C+0.1 ISTON cussowee ii BATTERY CONN. SPRING S.M.T TYPE ie 2 ra || 2870875 @ S051 TonBReRKOONU Be a oR] a a a [fo = aa sos 0 _|98/06/25) NEW ~ 10 |+0.15] CHECK BAR 98/06/25 JDRAWiNG nof 2 5051 10MBXXXXXO0ZU ECN oe 5 SHANGEI AP Geneat TOLERANCE Suse on = = Pocny © Rev) pare | DESCRIPTION [chance] aPPRO snes omerene woreo| APPRO.| RAE 98/06/25 |scate] 4:1 | uniT{ mm | a4 | Ot L 980625-03 |