44914-0201 MOLEX

Document overview

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Technical content

FEATURES AND SPECIFICATIONS 3.00mm (.118”) Pitch Micro-Fit 3.0, CPI™ Micro-Fit 3.0, BMI™ CPI Vertical Headers Micro-Fit 3.0 Family Offers Press-Fit Headers For High-Density Power and Signal Applications The Micro-Fit 3.0, CPI (Compliant Pin Interface) and Micro-Fit 3.0, BMI CPI (Blind-Mate version with Compliant Pin Interface) are vertical header product extensions featuring press-fit PC tails. These headers are designed for high- density applications where press-fit terminations are required. The CPI products are appropriate for both power and signal uses as they can carry up to 5.0A of current per circuit. The standard Micro-Fit 3.0, CPI headers incorporate a compact housing that mates with standard wire-mount housings and crimp terminals for wire-to-board applications. The Micro-Fit 3.0, BMI CPI headers feature a funnel entry to guide the mating receptacle into place. Micro-Fit 3.0, BMI headers mate exclusively with BMI components, which include panel-mount receptacles with crimp terminals and PCB receptacles for wire-to-board and board-to-board applications. Features and Benefits CPI style (press-fit) pins require no soldering to the PCB Designed for multiple board thicknesses of 2.36mm (.093”) or greater Dual-row vertical headers available in 2-24 circuits for the standard version and 4-24 circuits for the BMI (blind-mate) version Rated up to 5.0A of current for both power and signal applications in wire-to- board and board-to-board configurations Fully polarized with positive locks for proper mating Fully isolated contacts for electrical and mechanical integrity Reference Information Packaging:Tray UL File No.: E29179 CSA File No.: LR19980 TUV No.: R95107 Designed In: Millimeters Electrical Voltage: 250V Current: 5.0A Contact Resistance: 10 milliohms max. Dielectric Withstanding Voltage: 1500 VAC Insulation Resistance: 1000 Megohms min. Mechanical Insertion Force to PCB: 35.6N (8.0lb) per circuit max. Retention Force to PCB: 106.8N (24.0lb) per circuit min. Mating Force: 8.0N (1.8lb) per circuit max. Unmating Force: 3.6N (0.8lb) per circuit min. Durability: 30 cycles Physical Housing: High-temperature polymer, UL 94V-0 Contact: Brass alloy Plating: Contact area – 5.1µm (200µ") min. Tin, 0.38µm (15µ”) min. select Gold or 0.76µm (30µ”) min. select Gold PC tails – Tin/Lead Underplating: Nickel PCB Thickness: 2.36mm (.093”) min. Operating Temperature: -40 to +105° C

3.00mm (.118”) Pitch Micro-Fit 3.0, CPI™ Micro-Fit 3.0, BMI™ CPI Vertical Headers

Applications

Office Equipment Vending and Gaming Machines

ORDERING INFORMATION

Header Style Circuit Size Contact Plating Micro-Fit 3.0, CPI 2 44914-0201 44914-0202 44914-0203 4 44914-0401 44914-0402 44914-0403 6 44914-0601 44914-0602 44914-0603 8 44914-0801 44914-0802 44914-0803 10 44914-1001 44914-1002 44914-1003 12 44914-1201 44914-1202 44914-1203 14 44914-1401 44914-1402 44914-1403 16 44914-1601 44914-1602 44914-1603 18 44914-1801 44914-1802 44914-1803 20 44914-2001 44914-2002 44914-2003 22 44914-2201 44914-2202 44914-2203 24 44914-2401 44914-2402 44914-2403 Micro-Fit 3.0, BMI CPI 4 45280-0401 45280-0402 45280-0403 6 45280-0601 45280-0602 45280-0603 8 45280-0801 45280-0802 45280-0803 10 45280-1001 45280-1002 45280-1003 12 45280-1201 45280-1202 45280-1203 14 45280-1401 45280-1402 45280-1403 16 45280-1601 45280-1602 45280-1603 18 45280-1801 45280-1802 45280-1803 20 45280-2001 45280-2002 45280-2003 22 45280-2201 45280-2202 45280-2203 24 45280-2401 45280-2402 45280-2403 Americas Headquarters Lisle, Illinois 60532 U.S.A. 1-800-78MOLEX amerinfo@molex.com Far East North Headquarters Yamato, Kanagawa, Japan 81-462-65-2324 feninfo@molex.com Far East South Headquarters Jurong, Singapore 65-6-268-6868 fesinfo@molex.com European Headquarters Munich, Germany 49-89-413092-0 eurinfo@molex.com Corporate Headquarters 2222 Wellington Ct. Lisle, IL 60532 U.S.A. 630-969-4550 Fax:630-969-1352 Visit our Web site at http://www.molex.com/product/pcb/microfit/microfit.html Order No. USA-193 Printed in USA/5K/JI/JI/2006.01 2006, Molex