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unit: mm 3SK143 Silicon N-Channel 4-pin MOS FET For UHF high-gain and low-noise amplification n Features l Low noise-figure (NF) l Large power gain PG l Mini-type package, allowing downsizing of the sets and automatic insertion through the tape/magazine packing. 1: Source 2: Drain 3: Gate2 4: Gate1 Mini Type Package (4-pin) n Electrical Characteristics (Ta = 25°C) Parameter Drain to Source cut-off current Gate 1 cut-off current Gate 2 cut-off current Drain to Source voltage Gate 1 to Source cut-off voltage Gate 2 to Source cut-off voltage Forward transfer admittance Input capacitance (Common Source) Output capacitance (Common Source) Reverse transfer capacitance (Common Source) Power gain Noise figure Symbol IDSS *2 IG1SS IG2SS V DSX *1 V G1SC V G2SC | Yfs | C iss C oss C rss PG NF Conditions V DS = 10V, VGS = 0, VG2S = 4V V DS = VG2S = 0, VG1S = ±8V V DS = VG1S = 0, VG2S = ±8V ID = 100mA, VG1S = -5V, VG2S = 0 V DS = 10V, VG2S = 4V, ID = 100mA V DS = 10V, VG2S = 0, ID = 100mA V DS = 10V, ID = 10mA, VG2S = 4V, f = 1kHz V DS = 10V, VG1S = VG2S = -5V f = 1MHz V DS = 8V, ID = 8mA, VG2S = 3V f = 800MHz min 0.2 1.4 0.6 typ 1.9 0.9 0.02 max ±20 ±20 2.4 1.2 Unit mA nA nA V V V mS pF pF pF dB dB n Absolute Maximum Ratings (Ta = 25°C) Parameter Drain to Source voltage Gate 1 to Source voltage Gate 2 to Source voltage Drain current Allowable power dissipation Channel temperature Storage temperature Symbol V DS V G1S V G2S ID PD Tch Tstg Ratings ±30 200 150 -55 to +150 Unit V V V mA mW Marking Symbol: 3D *1 RD = 56W and RS = 270W *2 IDSS rank classification Rank IDSS (mA) Marking Symbol O 0.2 to 1.5 3DO P 0.5 to 4 3DP Q 3 to 13 3DQ 2.8 +0.2 –0.3 1.5 +0.2 –0.3 0.5R 0.950.95 1.9±0.2 2.9±0.2 0.4 +0.1 –0.05 1.1 +0.2 –0.1 0.8 0.4±0.2 0 to 0.1 0.16 +0.1 –0.06 Maintenance/ Discontinued Maintenance/Discontinued includes following four Product lifecycle stage. (planed maintenance type, maintenance type, planed discontinued typed, discontinued type)

PD ¾ Ta I D ¾ VDS ID ¾ VG1S | Yfs | ¾ VG1S C iss, Coss ¾ VDS PG ¾ VG1S NF ¾ VG1S PG ¾ VG2S ID ¾ VG1S 3SK143 0 16040 12080 14020 10060 320 240 200 280 160 120 Ambient temperature Ta (˚C) Allowable power dissipation PD (mW ) 01 210 826 4 VG2S =4V Ta=25˚C VG1S =0.6V 0.4V 0.2V – 0.4V – 0.2V Drain to source voltage VDS (V) Drain current ID (mA ) –2 4 3 2–1 1 0 3VVDS =10V Ta=25˚C VG2S =4V Gate 1 to source voltage VG1S (V) Drain current ID (mA ) –2 3 2–1 1 0 VG2S =5V 3V 4V VDS =10V f=1kHz Ta=25˚C Gate 1 to source voltage VG1S (V) Forward transfer admittance |Yfs| (mS ) 0.1 1 10 1000.3 3 30 2.4 2.0 1.6 1.2 0.8 0.4 VG1S =VG2S =–5V f=1MHz Ta=25˚C C iss C oss Drain to source voltage VDS (V) Input capacitance (Common source), Output capacitance (Common source) Ciss,Coss (pF) –2 3 2–1 1 0 VG2S =4V VDS =8V f=800MHz Ta=25˚C Gate 1 to source voltage VG1S (V) Power gain PG (dB) –2 3 2–1 1 0 VG2S =1V 2V VDS =8V f=800MHz Ta=25˚C Gate 1 to source voltage VG1S (V) Noise figure NF (dB) –2 8 604 2 –30 –10 –20 VDS =8V f=800MHz Ta=25˚C Gate 2 to source voltage VG2S (V) Power gain PG (dB) VDS =10V VG2S =4V Ta=75˚C –25˚C 25˚C Gate 1 to source voltage VG1S (V) Drain current ID (mA ) Maintenance/ Discontinued Maintenance/Discontinued includes following four Product lifecycle stage. (planed maintenance type, maintenance type, planed discontinued typed, discontinued type)

Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod- ucts may directly jeopardize life or harm the human body. – Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or im- provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd. Maintenance/ Discontinued Maintenance/Discontinued includes following four Product lifecycle stage. (planed maintenance type, maintenance type, planed discontinued typed, discontinued type)