2SK3674-01L FUJI
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DWG.NO. Fuji Electric Co.,Ltd. This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. MA4LE Ĕěüčøùýøüççøöû Fuji Power MOSFET SuperFAP-G series Target SpecificationPRELIMINARY 1) Package T-PACK L EEESee Page 2/4 S EEESee Page 3/4 SJ EEESee Page 4/4 2) Absolute Maximum Ratings (Tc=25@unless otherwise specified) Items Units Drain-Source Voltage V Continuous Drain Current A Pulsed Drain Current A Gate-Source Voltage V A mJ *1 Maximum Drain-Source dV/dt dV DS/dt kV/us Peak Diode recovery dV/dt dV/dt kV/us *2 W W Operating and Storage ˆ Temperature range ˆ 3)Electrical Characteristics (Tch=25 unless otherwise specified) Items Symbols Test Conditions min. typ. max. Units Drain-Source Breakdown Voltage BVDSS ID=250uA V GS=0V 900 --- --- V Gate Threshold Voltage VGS(th) I D=250uA V DS=VGS 3.0 --- 5.0 V VDS=900V T ch=25ˆ --- --- 50 µA VGS=0V T ch=125ˆ --- --- 500 µA Gate-Source Leakage Current IGSS VGS=±30V V DS=0V --- --- 100 nA Input Capacitance Ciss VDS=25V --- 980 --- Output Capacitance Coss VGS=0V --- 120 --- pF Reverse Transfer Capacitance Crss f=1MHz --- 6 --- Total Gate ChargeQ g Vcc=450V --- 28 --- Gate to Source Charge Qgs ID=7A --- 9 --- nC Gate to Drain (Miller) Charge Qgd VGS=10V --- 8 --- Avalanche Capability IAV L=10.1mH Tch=25 ˆ 7 --- --- A Diode Forward On-Voltage VSD IF=7A,VGS=0V,Tch=25 --- 1.0 1.5 V 4) Thermal Characteristics Items Symbols Test Conditions min. typ. max. Units Channel to Case Rth (ch-c) 0.56 ˆ/W Channel to Ambient Rth(ch-a) 75.0 ˆ/W *1 L=10.1mH,Vcc=90V *2 IF≤-ID,-di/dt=50A/µs,Vcc≤BV DSS,Tch≤150°C 2SK3674-01L,S,SJ (900V/2.0Ω /7A) VGS IAR EAS Symbols VDS ID ID(pulse) ±30 7Repetitive and Non-Repetitive Maximum Avalanche Current Non-Repetitive Maximum Avalanche Energy Tch Tstg Maximum Power Dissipation PD @Ta=25 Ratings 900 ±28 Ω--- 2.0 269.5 225 1.67 150 -55 \` +150 Zero Gate Voltage Drain Current Drain-Source On-State Resistance VGS=10V --- IDSS RDS(on) I D=3.5A ĚĬķõôø÷ôî÷ù ĚĬķõôø÷ôî÷ù
DWG.NO. Fuji Electric Co.,Ltd. This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. MA4LE Ĕěüčøùýøüççùöû PRE-SOLDER See Note: 1. Trademark Lot No. Type name Note: 1. Guaranteed mark of avalanche ruggedness. CONNECTION GATE DRAIN SOURCE DIMENSIONS ARE IN MILLIMETERS. JEDEC : TO-220AB FUJI POWER MOS FET 123 123 1
DWG.NO. Fuji Electric Co.,Ltd. This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. MA4LE Ĕěüčøùýøüççúöû GATE DRAIN SOURCE See Note: 1. Trademark Lot No. DIMENSIONS ARE IN MILLIMETERS. Type name FUJI POWER MOS FET CONNECTION Notes 1. ( ) : Reference dimensions. Note: 1. Guaranteed mark of avalanche ruggedness. 2. The metal part is covered with the solder plating, part of cutting is without the solder plating. Pre-Solder Fig. 1. Fig. 1. OUT VIEW Solder Plating
DWG.NO. Fuji Electric Co.,Ltd. This material and the information herein is the property of Fuji Electric Co.,Ltd. They shall be neither reproduced, copied, lent, or disclosed in any way whatsoever for the use of any third party nor used for the manufacturing purposes without the express written consent of Fuji Electric Co.,Ltd. MA4LE Ĕěüčøùýøüççûöû GATE DRAIN SOURCE See Note: 1. Trademark Lot No. Type name FUJI POWER MOS FET CONNECTION Notes 1. ( ) : Reference dimensions. Note: 1. Guaranteed mark of avalanche ruggedness. 2. The metal part is covered with the solder plating, part of cutting is without the solder plating. OUT VIEW Fig. 1. Fig. 1. Solder Plating Pre-Solder DIMENSIONS ARE IN MILLIMETERS.