2SK3596-01L FUJI

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UPS (Uninterruptible Power Supply) DC-DC converters Maximum ratings and characteristicAbsolute maximum ratings (Tc=25°C unless otherwise specified) Item Symbol Test Conditions Zero gate voltage drain current IDSS VDS=200V V GS=0V VDS=160V V GS=0V VGS=±30V ID=15A VGS=10V ID=15A VDS=25V VCC=48V ID=15A VGS=10V RGS=10 Ω Min. Typ. Max. Units V V µA nA mΩ S pF nC A V µs µC ns Min. Typ. Max. Units Thermal resistance Rth(ch-c) channel to case Rth(ch-a) channel to ambient 0.926 75.0 °C/W °C/W Symbol V(BR)DSS VGS(th) IGSS RDS(on) gfs Ciss Coss Crss td(on) tr td(off) tf QG QGS QGD IAV VSD trr Qrr Item Drain-source breakdown voltaget Gate threshold voltage Gate-source leakage current Drain-source on-state resistance Forward transcondutance Input capacitance Output capacitance Reverse transfer capacitance Turn-on time t on Turn-off time toff Total Gate Charge Gate-Source Charge Gate-Drain Charge Avalanche capability Diode forward on-voltage Reverse recovery time Reverse recovery charge Test Conditions I D= 250µA VGS=0V ID= 250µA VDS=VGS Tch=25°C Tch=125°C VDS=0V VDS=75V VGS=0V f=1MHz VCC=100V ID=30A VGS=10V L=100µH Tch=25°C IF=30A VGS=0V Tch=25°C IF=30A VGS=0V -di/dt=100A/µs Tch=25°C V V A A V A mJ kV/µs kV/µs W 200 3.0 5.0 250 10 100 50 66 12.5 25 1960 2940 260 390 18 27 20 30 17 26 53 80 19 29 51 76.5 15 22.5 16 24 1.10 1.65 0.19 1.4 -55 to +150 Outline Drawings (mm) Equivalent circuit schematic Gate(G) Source(S) Drain(D) Super FAP-G Series *3 IF -ID, -di/dt=50A/µs, Vcc BVDSS, Tch 150°C=< =< =<*1 L=689µH, Vcc=48V *2 Tch 150°C=< *4 VDS 200V<= www.fujielectric.co.jp/denshi/scd *5 VGS=-30V

2SK3596-01L,S,SJ FUJI POWER MOSFET ID=f(VGS):80µs Pulse test, VDS=25V,Tch=25°CID=f(VDS):80µs Pulse test,Tch=25°C gfs=f(ID):80µs Pulse test, VDS=25V,Tch=25°C RDS(on)=f(ID):80µs Pulse test, Tch=25°C 0 25 50 75 100 125 150 100 200 300 400

500 EAV [mJ]

starting Tch [°C] Maximum Avalanche Energy vs. starting Tch E(AV)=f(starting Tch):Vcc=48V,I(AV)<=30A 02468 1 0 1 2 100 120 20V 7.0V 10V 6.5V 7.5V 6.0V ID [A] VDS [V] Typical Output Characteristics VGS=5.5V 0123456789 1 0 0.1 100 ID[A] VGS[V] Typical Transfer Characteristic 0.1 1 10 100 0.1 100gfs [S] ID [A] Typical Transconductance 0 20 40 60 80 100 120 0.00 0.05 0.10 0.15 0.20 7.0V6.5V RDS(on) [ Ω ] ID [A] Typical Drain-Source on-state Resistance 10V 20V 7.5V 6.0VVGS= 5.5V 0 25 50 75 100 125 150 100 125 150 175 200 Allowable Power Dissipation PD=f(Tc) PD [W] Tc [°C]

2SK3596-01L,S,SJ FUJI POWER MOSFET VGS=f(Qg):ID=30A, Tch=25°C IF=f(VSD):80µs Pulse test,Tch=25°C t=f(ID):Vcc=48V, VGS=10V, RG=10Ω -50 -25 0 25 50 75 100 125 150 100 120 140 160 180 200 RDS(on) [ m Ω ] Tch [°C] typ. max. Drain-Source On-state Resistance RDS(on)=f(Tch):ID=15A,VGS=10V -50 -25 0 25 50 75 100 125 150 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 max. min. Gate Threshold Voltage vs. Tch VGS(th)=f(Tch):VDS=VGS,ID=250µA VGS(th) [V] Tch [°C] 0 1 02 03 04 05 06 07 08 0 Qg [nC] Typical Gate Charge Characteristics VGS [V] Vcc= 100V C [nF] VDS [V] Typical Capacitance C=f(VDS):VGS=0V,f=1MHz Crss Coss Ciss 0.1 100IF [A] VSD [V] Typical Forward Characteristics of Reverse Diode Typical Switching Characteristics vs. ID td(on) tr tf td(off) t [ns] ID [A]

2SK3596-01L,S,SJ FUJI POWER MOSFET IAV=f(tAV):starting Tch=25°C. Vcc=48V Avalanche current I AV [A] Single Pulse Maximum Avalanche Current Pulsewidth tAV [sec] GATE DRAIN SOURCE See Note: 1. Trademark Lot No. DIMENSIONS ARE IN MILLIMETERS. Type name FUJI POWER MOS FET CONNECTION Notes 1. ( ) : Reference dimensions. Note: 1. Guaranteed mark of avalanche ruggedness. 2. The metal part is covered with the solder plating, part of cutting is without the solder plating. Pre-Solder Fig. 1. Fig. 1. OUT VIEW Solder Plating GATE DRAIN SOURCE See Note: 1. Trademark Lot No. Type name FUJI POWER MOS FET CONNECTION Notes 1. ( ) : Reference dimensions. Note: 1. Guaranteed mark of avalanche ruggedness. 2. The metal part is covered with the solder plating, part of cutting is without the solder plating. OUT VIEW Fig. 1. Fig. 1. Solder Plating Pre-Solder DIMENSIONS ARE IN MILLIMETERS. PRE-SOLDER See Note: 1. Trademark Lot No. Type name Note: 1. Guaranteed mark of avalanche ruggedness. CONNECTION GATE DRAIN SOURCE DIMENSIONS ARE IN MILLIMETERS. FUJI POWER MOS FET 123 1 Outline Drawings (mm) Transient Thermal Impedance Zth(ch-c)=f(t):D=0 Zth(ch-c) [°C/W] t [sec]