2SK3560 PANASONIC

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Technical content

1Publication date: February 2004 SJG00033AED 2SK3560 Silicon N-channel power MOSFET For PDP/For high-speed switching ■ Features

  • Low on-resistance, low Qg
  • High avalanche resistance ■ Absolute Maximum Ratings TC = 25°C 1: Gate 2: Drain 3: Source Unit: mm Parameter Symbol Conditions Min Typ Max Unit Gate-drain surrender voltage V DSS ID = 1 mA, VGS = 0 230 V Diode forward voltage V DSF IDR = 30 A, VGS = 0 −1.5 V Gate threshold voltage V th VDS = 25 V, ID = 1 mA 2 4 V Drain-source cutoff current I DSS VDS = 184 V, VGS = 0 100 µA Gate-source cutoff currentt I GSS VGS = ±30 V, VDS = 0 ±1 µA Drain-source on resistance R DS(on) VGS = 10 V, ID = 15 A 55 74 m Ω Forward transfer admittance Yfs VDS = 25 V, ID = 15 A 8 19 S Short-circuit forward transfer capacitance C iss VDS = 25 V, VGS = 0, f = 1 MHz 2 330 pF (Common-source) Short-circuit output capacitance C oss 356 pF (Common-source) Reverse transfer capacitance C rss 44 pF (Common-source) Turn-on delay time t d(on) VDD ≈ 100 V, ID = 15 A 39 ns Rise time t r RL ≈ 6.7 Ω, VGS = 10 V 37 ns Turn-off delay time t d(off) 221 ns Fall time t f 46 ns Reverse recovery time t rr L = 230 µH, VDD = 100 V 164 ns Reverse recovery charge Q rr IDR = 15 A, di /dt = 100 A/ µs 853 nC 0 to 0.5 123 (8.9) (10.2) 0 to 0.3 (2.1) (6.4) (1.4) 10.5±0.3 4.6±0.2 1.4±0.1 0.8±0.1 2.5±0.2 1.4±0.1 2.54±0.3 10.1±0.33.0±0.5 (1.4) 1.5±0.3 0.6±0.1 ■ Electrical Characteristics TC = 25°C ± 3°C Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors. Parameter Symbol Rating Unit Drain-source surrender voltage V DSS 230 V Gate-source surrender voltage V GSS ±30 V Drain current ID 30 A Peak drain current I DP 120 A Power PD 50 W dissipation Ta = 25°C3 Channel temperature T ch 150 °C Storage temperature T stg −55 to +150 °C Internal Connection G S D

2 SJG00033AED

Safe operation area P C  Ta Parameter Symbol Conditions Min Typ Max Unit Total gate charge Q g VDD = 100 V, ID = 25 A 51.2 nC Gate-source charge Q gs VGS = 10 V 8.2 nC Gate-drain charge Q gd 19.4 nC Channel-case heat resistance R th(ch-c) 2.5 °C/W Channel-atmosphere heat resistance R th(ch-a) 89.2 °C/W ■ Electrical Characteristics (Continued) TC = 25°C ± 3°C Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors. 11 0 1 0 2 103 10−1 102 103 Non repetitive pulse TC = 25°C ID IDP t = 100 µs 1 ms 10 ms Drain-source voltage VDS (V) Drain current ID (A) 0 50 150 100 Collector power dissipation PC (W) Ambient temperature Ta (°C) (1) TC = Ta (2) Without heat sink (1) (2) 100

Request for your special attention and precautions in using the technical information and semiconductors described in this material (1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technical information described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical information as described in this material. (4) The products described in this material are intended to be used for standard applications or general elec- tronic equipment (such as office equipment, communications equipment, measuring instruments and house- hold appliances). Consult our sales staff in advance for information on the following applications:

  • Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combus- tion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body.
  • Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifica- tions satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rat- ing, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.

2003 SEP