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Rev.E Mar.-2016 DATA SHEET http://www.fsbrec.com 1 / 6 SOT-23 塑封封装 N 道 MOS 场效应管。N- CHANNEL MOSFET in a SOT-23 Plastic Package. 低导通电阻,开关速度快,低电压驱动,简化驱动电路和简便平面。 Low on-resistance, fast switching speed, low voltage drive, easily designed drive circuits, easy to parallel. 触摸屏，交换开关。 Interfacing, switching. 内部等效电路 / Equivalent Circuit PIN1：S PIN 2 ：G PIN 3 ：D 印章代码 / M a r k i n g 描述 / D e s c r i p t i o n s 特征 / Features 用途 / Applications 引脚排列 / P i n n i n g Marking KL
Rev.E Mar.-2016 DATA SHEET http://www.fsbrec.com 2 / 6 参数 Parameter 符号 Symbol 数值 Rating 单位 Unit Drain-Source Voltage V DSS 30 V Gate-Source Voltage VGSS ±20 V Drain Current – Continuous I D 100 mA Drain Current- Pulsed I DP *1 200 mA Reverse Drain Current – Continuous I DR 100 mA Reverse Drain Current –Pulsed I DRP *1 200 mA Total Power Dissipation P D *2 250 mW Channel Temperature T ch 150 V Storage Temperature Range T stg -55～150 ℃ *1:Pw≤10μs, Duty cycle≤50% *2:With each pin mounted on the recommended lands 参数 Parameter 符号 Symbol 测试条件 Test Conditions 最小值 Min 典型值 Typ 最大值 Max 单位 Unit Drain–Source Breakdown Voltage V (BR)DSS VGS=0V I D=10μA 30 V Gate Threshold Voltage V GS(th) V DS=3.0V I D=100μA 0.8 1.5 V Static Drain–Source On–Resistance RDS(on)1 VGS=4.0V I D=10mA 5.0 8.0 Ω RDS(on)2 V0047S=2.5V I D=1.0mA 7.0 13 Zero Gate Voltage Drain Current I DSS V DS=30V V GS=0V 1.0 μA Gate–Body Leakage. I GSS VGS=±20V V DS=0V ±1 μA Forward Transconductance g FS VDS=3V I D=10mA 20 mS Input Capacitance C iss VDS=5.0V V GS=0V f=1.0MHz pF Output Capacitance C oss 9.0 Reverse Transfer Capacitance C rss 4.0 Turn–On Delay Time t d(on) ID=10mA V DD≈5.0V VGS=5.0V R L=500Ω RGS=10Ω ns Turn–On Rise Time t r 35 Turn–Off Delay Time t d(off) 80 Turn–Off Fall Time t f 80 极限参数 / Absolute Maximum Ratings(Ta=25 ℃) 电性能参数 / Electrical Characteristics(Ta=25 ℃)
Rev.E Mar.-2016 DATA SHEET http://www.fsbrec.com 3 / 6 电参数曲线图 / Electrical Characteristic Curve
Rev.E Mar.-2016 DATA SHEET http://www.fsbrec.com 4 / 6 外形尺寸图 / Package Dimensions
Rev.E Mar.-2016 DATA SHEET http://www.fsbrec.com 5 / 6 印章说明 / Marking Instructions 说明： KL: 为封装型号 Note: KL： Package Type KL
Rev.E Mar.-2016 DATA SHEET http://www.fsbrec.com 6 / 6 回流焊温度曲线图(无铅) / Temperature Profile for IR Reflow Soldering(Pb-Free) 说明： N o t e : 1、预热温度 25～150℃，时间 60～90sec; 1.Preheating:25~150 ℃, Time:60~90sec. 3、焊接制程冷却速度为 2～10℃/sec. 3. Cooling Speed: 2~10℃/sec. 耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions 温度：260±5℃ 时间：10±1 sec. Temp.:260 ±5℃ Time:10 ±1 sec 包装规格 / Packaging SPEC. 卷盘包装 / R E E L Package Type 封装形式 Units 包装数量 Dimension 包装尺寸 (unit ：mm Units/Reel 只/卷盘 Reels/Inner Box 卷盘/盒 Units/Inner Box 只/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Reel Inner Box 盒 Outer Box 箱 SOT-23 3,000 10 30,000 8 240,000 7〞×8 180×120×180 385×257×392 使用说明 / N o t i c e s