2SK1374G0L PANASONIC

Document overview

  • Manufacturer or author: Provided By digicamel.com
  • PDF pages: 4

Technical content

Silicon MOSFETs (Small Signal) 1Publication date:June 2007 SJF00063AED This product complies with the RoHS Directive (EU 2002/95/EC). 2SK1374G Silicon N-channel MOSFET For switching circuits ■ Features

  • High-speed switching
  • Wide frequency band
  • Incorporating a built-in gate protection-diode
  • Allowing 2.5 V drive ■ Absolute Maximum Ratings Ta = 25°C Parameter Symbol Rating Unit Drain-source voltage V DS 50 V Gate-source voltage (Drain open) V GSO 10 V Drain current I D 50 mA Peak drain current I DP 100 mA Power dissipation P D 150 mW Channel temperature T ch 150 °C Storage temperature T stg −55 to +150 °C Parameter Symbol Conditions Min Typ Max Unit Drain-source surrender voltage V DSS ID = 10 µA, VGS = 0 50 100 V Drain-source cutoff current I DSS VDS = 20 V, VGS = 0 1.0 µA Gate-source cutoff current I GSS VGS = 10 V, VDS = 0 1.0 µA Gate threshold voltage V th ID = 100 µA, VDS = 5 V 0.5 0.8 1.1 V Forward transfer admittance Yfs ID = 10 mA, VDS = 5 V, f = 1 kHz 20 39 mS Drain-source ON resistance R DS(on) ID = 10 mA, VGS = 2.5 V 27 50 Ω Short-circuit forward transfer capacitance Ciss VDS = 5 V, VGS = 0, f = 1 MHz 4.5 pF (Common source) Short-circuit output capacitance Coss 4.1 pF (Common source) Reverse transfer capacitance Crss 1.2 pF (Common source) Turn-on time *1, 2 ton VDD = 5 V, RL = 470 Ω, VGS = 0 V to 2.5 V 0.2 µs Turn-off time *1, 2 toff VDD = 5 V, RL = 470 Ω, VGS = 2.5 V to 0 V 0.2 µs ■ Electrical Characteristics Ta = 25°C Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors. 2. *1: Pulse measurement *2: ton , toff test circuit VDD = 5 V100 µF VGS = 2.5 V VOUT 50 Ω 470 Ω VIN 90% 10% 10% 90% VOUT ton toff ■ Package
  • Code SMini3-F2
  • Marking Symbol: 4V
  • Pin Name 1: Gate 2: Source 3: Drain Maintenance/ Discontinued Maintenance/Discontinued includes following four Product lifecycle stage. planed maintenance type maintenance type planed discontinued typed discontinued type Please visit following URL about latest information. http://www.semicon.panasonic.co.jp/en/

2 SJF00063AED

This product complies with the RoHS Directive (EU 2002/95/EC). VIN  IO Ciss , Coss , Crss  VDS ID  VGS RDS(on)  VGS PD  Ta ID  VDS Yfs  VGS 0 160 40 120 80 240 200 160 120 Power dissipation PD (mW) Ambient temperature Ta (°C) 01 2 10826 4 VGS = 1.8 V 1.6 V 1.4 V 1.0 V 1.2 V Ta = 25°C Drain-source voltage VDS (V) Drain current ID (mA) 06 5413 2 VDS = 5 V f = 1 kHz Ta = 25°C Gate-source voltage VGS (V) Forward transfer admittance Yfs (mS) 1 10 100 1 000 Ciss Coss Crss Drain-source voltage VDS (V) Short-circuit forward transfer capacitance (Common-source) Ciss , Short-circuit output capacitance (Common-source) Coss , Reverse transfer capacitance (Common-source) Crss (pF) 06 5413 2 120 100 Ta = −25°C 25°C 75°C VDS = 5 V Gate-source voltage VGS (V) Drain current ID (mA) 06 5413 2 120 100 ID = 10 mA Ta = 75°C 25°C −25°C Drain-source ON resistance RDS(on) (Ω) Gate-source voltage VGS (V) 0.1 1 10 100 0.01 0.1

100 VO = 5 V

Ta = 25°C Input voltage VIN (V) Output current IO (mA) Maintenance/ Discontinued Maintenance/Discontinued includes following four Product lifecycle stage. planed maintenance type maintenance type planed discontinued typed discontinued type Please visit following URL about latest information. http://www.semicon.panasonic.co.jp/en/

This product complies with the RoHS Directive (EU 2002/95/EC). SMini3-F2 Unit: mm 0.30 +0.05 −0.02 0.13 +0.05 −0.02 2.00 ±0.20 (0.89) 0.90 ±0.10 (0.65)(0.65) 1.30 ±0.10 1.25 ±0.10 2.10 ±0.10 0.425 ±0.050 (0.49) 0 to 0.10 (5°) (5°) Maintenance/ Discontinued Maintenance/Discontinued includes following four Product lifecycle stage. planed maintenance type maintenance type planed discontinued typed discontinued type Please visit following URL about latest information. http://www.semicon.panasonic.co.jp/en/

Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: – Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod- ucts may directly jeopardize life or harm the human body. – Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or im- provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd. Maintenance/ Discontinued Maintenance/Discontinued includes following four Product lifecycle stage. planed maintenance type maintenance type planed discontinued typed discontinued type Please visit following URL about latest information. http://www.semicon.panasonic.co.jp/en/