2SK1010-01 FUJI

Document overview

  • Manufacturer or author: Provided By digicamel.com
  • PDF pages: 4

Technical content

2S K1 01 0-01 FUJI POWER MOS-FET N-CHANNEL SILICON POWER MOS-FET F tt SERI ES Features Outline Drawings @ High speed switching -_ | @ low on-resistance | spit @ 10 secondary breakdown eae aa se | @1.ow driving power Pst |

9 PI Pog |

®@ High voltage r | Fy @\\/oss= +30V Guarantee lobe / © Avalanche-proof ih. 2 A Applications oH. 2 eae vy . 3: Source @ Switching regulators , | eups ose | | out 2 @()C-DC converters _ @ (General purpose power amplifier JEDEC _ TO-220AB _| EIAL SC-46 | MMax. Ratings and Characteristics MEquivalent Circuit Schematic @,\\bsolute Maximum Ratings(Tc= 25°C) _ Items Symbols Units -— or — Drain-source voltage Vos | 500) SV “Continuous drain current b | 6 A branto) Pulsed drain current | Inoue is | A, __ Continuous reverse drain current] Toe | 6 A ™ Gate-source peak voltage | Voss =30 Vv __. Max. power dissipation Po | 80 |W Gate(G) Operating and storage [To 150 C __ temperature range Toe =55~ +150| °C Source(s) @lectrical Characteristics(Te=25°C) ~~ — _ {tems Symbols [Test Conditions | Min. | Typ. | Max. | Units __ Drain-source breakdown voltage [ Veomss | Io=ImA_Ves=0V a Vv __ Gate threshold voltage Vesan | Ie=1mA__Vos=Vos 25 50 | Vv nie wy a Vs =500V Tn=25C | | 10 | 500 vA _ Zero gate voltage drain current [es Vee=0V Tense [ToL 10 [ma __ Gate-source leakage current_| Toss Voes=+30V__Vos=0V. _ 100 | nA ___ Drain-source on-state resistance | Rosia, | In=3A__Vos=10V. 16 | 0 “Forward transconductance | gis Ip=3A__Vos=25V [40 | __s __ Input capacitance Ciss Vos =25V [| 700 1000 __ Output capacitance: | Cos | Vos=0V 100 | 150 | pF ~~ Reverse transfer capacitance [ Cs ___| ff =IMHz 5 6 | Turn-on time to, teow | ye _ 20 30 (ton toon tte) a Vee=300V Te=6A [507 [80 Turn-off time ton twa | Re ogg 30 | 120 _-_Maorn +t) te ae _ 50_ | 80 Diode forward on-voltage | Vso | ‘dn=2XTor Ves=0V_ Ten=25°C 1.0 15 [| V ~ Reverse recovery time tr Te=Ion d/h =100A/us Ten =25°C ns @“hermal Characteristics a items Symbols | ___Test Conditions | Min. | Typ. | Max. | Units Thermal Resistance Ruwn-»)__{_channel to air [ie | cv _ : Rincen-er | channel to case 1.56_| °C/W A2-82

2SK 1010-01 FUJI POWER MOS-FET Characteristics 6 fo = = - TTT ee Tete LL Ef Rosti=t(Tohy:to=3a.ves=tov |} +] FREE ger Sere cere ean Craaece ASneee num SEU ANEEI Ea sssestes oe 8) 4a COPEEE EE aeee A EEE er a | sammeenenel Besesseseeeeeeeresait

1 H ABGRR0000n Rosom 20 CH EPEC ae

«ERE Ht sat @ FA Red esceescaitecere Cid YZ EEER CEE eH Al rT bebe a oy ADRS 1 BEE eA | Fer PeCERER CREEP AREER HEEEEEEEFEEECEE EE ZCCCOCC DECC EE ° 10 20 w 30 50 ° 50 7 co 150 Vos ren" Typical Output Characteristics On State Resistance vs. Ten oe | eEEEEE HHH Seater ELL S=nencaee FEC Io] RE COPE EEA EEC EE i CI ao FHA ARE EEE fi Rosion eRe Ee FEEH

6 CECT te (a) Ha yov Ld

; meal L | LTTE Tt | CREEPER Eee} VeslV) ° 1o(A) ® Typical Transfer Characteristics Typical Drain-Source on State Resistance vs. |p Th Vosimi=t(Tonto=imavos=ves_| |_| SUUUnAGAUTGRBEEEE “EEEEE EERE BUOEBESURAESGCCEE t aaa Saeee aaeee Ty “AO H [TTT] a EEE Pep eSRe eT e, TET LTA TT 3 [== Poth HACE Pep RRS CTPA [YI TTTy 4 | CTT] Vow pL foo [TTT os [AT TTT TY Ty wy) CA a o PTT Por COE PTT] Ty] ‘ Peer cI Me tH]: COPE rere WAT CTT TT ° a e 12 ° 50 700 150 10(A) Ta) Typical Forward Transconductance vs. lo Gate Threshold Voltage vs. Tcn A2-83

FUJI POWER MOS-FET 2SK 1010-01 500; 20 [PSS SS SiS oss Peet 7 oReeeeHeeeee =, BREE CEE EEE NSemannaa Corer Seeeeen es fae LY NH [PTT TT 300 i [LV veer —H2 NOS SE eA Se © ga LN Upp |! ARE Po wov Se | mi = A la (nF) rn ae a 200A ht OP OT Pesce | =k LZ ri po v. 4 ro ats = ra Vos RR a Lt Tt eh pe EE, SORERREERBRREES he a | fF [| | ACE —88y os 0? ce eee oe ° 10 20 30 ° 20 “40 eo ° Vos(V) “Og(ne) Typical Capacitance vs. Vos Typical Input Charge “TIN TTT rT [Trento ose eet FF EERNEE-H ee HE TPP PEN La eh -SES = ==2===S LETT Xr er EES SSS EE AR ESS CCE CTN so Hy =F CE A CT | i) att es —H rr] Ann PPP er At ee e COS Se (a) ESS Soot | 4 im fA ee PPP ri rt TPP iste I AE cH PH Ltt | tS E LETT TT [| COCA rN ° O64 08 12 i) 50 100 150 VsolV) T.CC) Forward Characteristics of Reverse Diode Allowable Power Dissipation vs. Tc ST: fol scz: EPH ofp —— ft Secnieestag ES ee i ae a NOMI EN (CT ll Lost) NIK. et ae 0.01 . aN E02 ia ee Zan Etna Jp 10° eee oe ¢ LS SLD aii 2H Tt He HSE ® eT SL i A SLL GES oo Hes EArt Ltd O=; Ht } Lad ot [TN CSreatits tire-o2 Hi P rit tl cai iePN AT TT ill . ET 106 ot 10% 10°? 1o7 10° 10 A 10! 17 108 t(S} Vos} Transient Thermal Impedance Safe Operating Area A2-84

~ 3 oe 1. COAF OZONE (MROLM, HE, FF. AB HEC E) ENROUAMEH OAD, SAMOMAI ED KHOP EES BBENSTEMHV EF COAT OAM ENTOSMREMAENSIBSIC 3, TONBO RMR (LM EAE LT F— BEWERL TS ESI,

2 KAR OALML TH SOMA, BLM SRA LARA SME RMNG SEOTHD, HAF OTILCLRAT

HE, FORMER OIG SRL E ASRHMON ETI LOTS DN ZHA, 3. PEMRICATNROBRLAMAMOMLICBS TORT. LAL, MARAIS d SPR CARERS S OTHE A SO ET. PEERED ENR ORM GRE LTAGHM, ARGC SMR SO. HAO IBS 2k 5 CHAT, HLSELILARAT, RADDA ARat & ERED LOO FAME TS BED,

4 BAROAML TSMR, PMO MME ABR ENS PLO LF STAR AMC ASIC ERATION

That. ‘aya + OAR «MASE CRA) + AS + TR (AMF AAC a TRB + REM BATFE ERAT Ky bh aE 5. BAF IAAMOMAE, TROLS OIG SME ODM S SMACK OP ROVERS, WCBAR DS ROL, THEBTC ERD, COA FOFONMEINS OMBICMMT BIDS, CIMA ENA BATA MBL At BML TE, MEMOIR LEOKSIZ So PT aT YAFABE, REMOMOMNSEREMC SIE MRMTH, + GRR (GU, sai E) + FSS At » EME SS + RMT RR OSU + RADA + ROMERO KOO BARE 6. BY TR MMES ERE NSD FRO LIS MBS, AA TOT IIRONMEWHL ETS FEW, + Fae + RACERS RTA BRS RE Ta aR + UGS ARR + BRR

2 BAPATIO-BE RS LMBORARMBUS DTS, KB KS SHULORMLBCH,

8 LOAFOPSONGC CAMO MSO ECAS. REMIT SiH AIS, TOWRA ATEIM LT SEL, AUER & OFAC Md BO ILE Pek ae BATES ELM EZ OMEGA A PEELS EMTS EA, S. 7 -. Bt Seiten DFBREB NDFB RRA SRRERMIEB T (03) 5388-7657 AIKMAN RSS Tm (06) 455-6467 z IER RSE (03) 5388-7681 ALES RR ‘® (0764) 41-1231 mst Weerren oss RARER B (03) 5388-7680 Reese ‘B (0878) 51-0185 (03) 5388-7651 RESRR me (0263) 36-6740 PATRI KMS a (052) 204-0295 SMES B (03) 5388-7685 — AANH ALMA MED BE (092) 733-7192