2SD0968A PANASONIC

Document overview

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Technical content

1Publication date: December 2003 SJC00202DED Transistors 2SD0968A (2SD968A) Silicon NPN epitaxial planar type For low-frequency driver amplification Complementary to 2SB0789A (2SB789A) ■ Features

  • High collector-emitter voltage (Base open) VCEO
  • Large collector power dissipation PC
  • Mini power type package, allowing downsizing of the equipment and automatic insertion through the tape packing and the magazine packing ■ Absolute Maximum Ratings Ta = 25°C ■ Electrical Characteristics Ta = 25°C ± 3°C 4.5±0.1 3.0±0.15 45˚ 2.6±0.1 0.4 max. 1.6±0.2 1.5±0.1 4.0 2.5±0.1 +0.25 –0.20 1.0+0.1 12 3 1.5±0.1 1: Base 2: Collector 3: Emitter MiniP3-F1 Package Unit: mm Marking Symbol: V Note) The part numbers in the parenthesis show conventional part number. Note) *: Print circuit board: Copper foil area of 1 cm2 or more, and the board thickness of 1.7 mm for the collector portion. Parameter Symbol Rating Unit Collector-base voltage (Emitter open) V CBO 120 V Collector-emitter voltage (Base open) V CEO 120 V Emitter-base voltage (Collector open) V EBO 5V Peak collector current I CP 1A Collector current I C 0.5 A Collector power dissipation * PC 1W Junction temperature T j 150 °C Storage temperature T stg −55 to +150 °C Parameter Symbol Conditions Min Typ Max Unit Collector-emitter voltage (Base open) V CEO IC = 100 µA, IB = 0 120 V Emitter-base voltage (Collector open) V EBO IE = 10 µA, IC = 05V Forward current transfer ratio *1 hFE1 *2 VCE = 10 V, IC = 150 mA 130 330 hFE2 VCE = 5 V, IC = 500 mA 50 Collector-emitter saturation voltage *1 VCE(sat) IC = 500 mA, IB = 50 mA 0.2 0.6 V Base-emitter saturation voltage *1 VBE(sat) IC = 500 mA, IB = 50 mA 0.85 1.20 V Transition frequency f T VCB = 10 V, IE = −50 mA, f = 200 MHz 120 MHz Collector output capacitance C ob VCB = 10 V, IE = 0, f = 1 MHz 20 pF (Common base, input open circuited) Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors. 2. *1: Pulse measurement *2: Rank classification Rank R S hFE1 130 to 220 185 to 330

2 SJC00202DED

10 −3 10 −2 10 −1

10 IC / IB = 10

25°C −25°C Ta = 75°C Collector-emitter saturation voltage VCE(sat) (V) Collector current IC (mA) PC  Ta IC  VCE IC  IB VCE(sat)  IC VBE(sat)  IC hFE  IC 0 160 40 120 80 1.4 1.2 0.4 1.0 0.8 0.2 0.6 Copper plate at the collector is more than 1 cm2 in area, 1.7 mm in thickness Collector power dissipation PC (W) Ambient temperature Ta (°C) 01 2 10826 4 1.2 1.0 0.8 0.6 0.4 0.2 Ta = 25°C IB = 20 mA 8 mA 10 mA 12 mA 18 mA 16 mA 14 mA 6 mA 4 mA 2 mA Collector current IC (A) Collector-emitter voltage VCE (V) 01 5 105 1.2 1.0 0.8 0.6 0.4 0.2 VCE = 10 V Ta = 25°C Base current IB (mA) Collector current IC (A) 1 10 100 1 000 10 −2 10 −1 102 IC / IB = 10 Ta = −25°C 25°C 75°C Base-emitter saturation voltage VBE(sat) (V) Collector current IC (mA) 1 10 100 1 000 300 250 200 150 100 VCE = 10 V Ta = 75°C 25°C −25°C Forward current transfer ratio hFE Collector current IC (mA) −1 −10 −100 200 160 120 VCB = 10 V Ta = 25°C Transition frequency fT (MHz) Emitter current IE (mA) 1 10 100 IE = 0 f = 1 MHz Ta = 25°C Collector output capacitance (Common base, input open circuited) Cob (pF) Collector-base voltage VCB (V) fT  IE Cob  VCB

Request for your special attention and precautions in using the technical information and semiconductors described in this material (1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technical information described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical information as described in this material. (4) The products described in this material are intended to be used for standard applications or general elec- tronic equipment (such as office equipment, communications equipment, measuring instruments and house- hold appliances). Consult our sales staff in advance for information on the following applications:

  • Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combus- tion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body.
  • Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifica- tions satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rat- ing, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.

2003 SEP